IT1226469B - Apparecchio per tagliare cristallo semiconduttore - Google Patents

Apparecchio per tagliare cristallo semiconduttore

Info

Publication number
IT1226469B
IT1226469B IT2152288A IT2152288A IT1226469B IT 1226469 B IT1226469 B IT 1226469B IT 2152288 A IT2152288 A IT 2152288A IT 2152288 A IT2152288 A IT 2152288A IT 1226469 B IT1226469 B IT 1226469B
Authority
IT
Italy
Prior art keywords
semiconductor crystal
cut semiconductor
cut
crystal
semiconductor
Prior art date
Application number
IT2152288A
Other languages
English (en)
Other versions
IT8821522A0 (it
Inventor
Yutaka Kubotera
Kazunari Akiyama
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62192472A external-priority patent/JPS6436406A/ja
Priority claimed from JP62192474A external-priority patent/JPS6436408A/ja
Priority claimed from JP62192473A external-priority patent/JPS6436407A/ja
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Publication of IT8821522A0 publication Critical patent/IT8821522A0/it
Application granted granted Critical
Publication of IT1226469B publication Critical patent/IT1226469B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D47/00—Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
    • B23D47/005—Vibration-damping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/849—With signal, scale, or indicator
    • Y10T83/853—Indicates tool position
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/849—With signal, scale, or indicator
    • Y10T83/853—Indicates tool position
    • Y10T83/855—Relative to another element

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
IT2152288A 1987-07-31 1988-07-27 Apparecchio per tagliare cristallo semiconduttore IT1226469B (it)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62192472A JPS6436406A (en) 1987-07-31 1987-07-31 Cutter for semiconductor single-crystalline bar
JP62192474A JPS6436408A (en) 1987-07-31 1987-07-31 Cutter for semiconductor single-crystalline bar
JP62192473A JPS6436407A (en) 1987-07-31 1987-07-31 Cutter for semiconductor single-crystalline bar

Publications (2)

Publication Number Publication Date
IT8821522A0 IT8821522A0 (it) 1988-07-27
IT1226469B true IT1226469B (it) 1991-01-16

Family

ID=27326618

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2152288A IT1226469B (it) 1987-07-31 1988-07-27 Apparecchio per tagliare cristallo semiconduttore

Country Status (3)

Country Link
US (1) US4971021A (it)
KR (1) KR940011179B1 (it)
IT (1) IT1226469B (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107443600A (zh) * 2017-08-25 2017-12-08 芜湖长润特种铜线有限公司 一种铜材切割加工设备

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3941038A1 (de) * 1989-12-12 1991-06-13 Wacker Chemitronic Vorrichtung zum nachschaerfen der schneidkante von trennwerkzeugen beim abtrennen von scheiben von stab- oder blockfoermigen werkstuecken, insbesondere aus halbleitermaterial, ihre verwendung und saegeverfahren
JPH05116138A (ja) * 1991-09-30 1993-05-14 Mitsubishi Materials Corp スライシングマシン
ES2092706T3 (es) * 1992-02-08 1996-12-01 Hoechst Ag Procedimiento y dispositivo para cortar continuamente material en forma de banda o de cuerda.
US5351444A (en) * 1992-09-25 1994-10-04 Silicon Technology Corporation Blade track control system
US5613350A (en) * 1992-12-24 1997-03-25 Boucher; John N. Method for packaging and handling fragile dicing blade
US5632666A (en) * 1994-10-28 1997-05-27 Memc Electronic Materials, Inc. Method and apparatus for automated quality control in wafer slicing
JP3195504B2 (ja) * 1994-11-24 2001-08-06 トーヨーエイテック株式会社 スライシング装置のブレード変位検出装置
US6152803A (en) * 1995-10-20 2000-11-28 Boucher; John N. Substrate dicing method
US5718615A (en) * 1995-10-20 1998-02-17 Boucher; John N. Semiconductor wafer dicing method
JP2943673B2 (ja) * 1995-10-31 1999-08-30 日本電気株式会社 半導体基板の製造装置及び製造方法
US6142046A (en) * 1996-08-06 2000-11-07 Cae Machinery Ltd. Knife projection sensing system
US6493934B2 (en) 1996-11-12 2002-12-17 Salman Akram Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
US6250192B1 (en) * 1996-11-12 2001-06-26 Micron Technology, Inc. Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
US20040112360A1 (en) * 1998-02-12 2004-06-17 Boucher John N. Substrate dicing method
US6033288A (en) * 1998-10-29 2000-03-07 Kulicke & Soffa Investments, Inc. Monitoring system for dicing saws
US6165051A (en) * 1998-10-29 2000-12-26 Kulicke & Soffa Investments, Inc. Monitoring system for dicing saws
US6612901B1 (en) 2000-06-07 2003-09-02 Micron Technology, Inc. Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6609947B1 (en) 2000-08-30 2003-08-26 Micron Technology, Inc. Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates
KR100414890B1 (ko) * 2001-05-10 2004-01-13 삼성전자주식회사 웨이퍼 절삭 장치
US20020185121A1 (en) * 2001-06-06 2002-12-12 Farnworth Warren M. Group encapsulated dicing chuck
SG118084A1 (en) * 2001-08-24 2006-01-27 Micron Technology Inc Method and apparatus for cutting semiconductor wafers
US7131889B1 (en) 2002-03-04 2006-11-07 Micron Technology, Inc. Method for planarizing microelectronic workpieces
US7341502B2 (en) 2002-07-18 2008-03-11 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US6872132B2 (en) 2003-03-03 2005-03-29 Micron Technology, Inc. Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
US7131891B2 (en) 2003-04-28 2006-11-07 Micron Technology, Inc. Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
US6939211B2 (en) * 2003-10-09 2005-09-06 Micron Technology, Inc. Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions
US7086927B2 (en) 2004-03-09 2006-08-08 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US20060127179A1 (en) * 2004-06-10 2006-06-15 Nadler Donald S System and method for concrete slab connection
ITMI20041269A1 (it) 2004-06-24 2004-09-24 Paper Converting Machine Co Sistema di controllo della lama di taglio particolarmente per macchine troncatrici per il taglio di log di materiale in foglio

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3681978A (en) * 1971-02-23 1972-08-08 Cincinnati Milacron Inc Method and apparatus for automatically balancing deflection sensors on rotating equipment
US3986010A (en) * 1973-08-23 1976-10-12 International Business Machines Corporation Automatic tool deflection calibration system
US3895358A (en) * 1973-10-17 1975-07-15 Gerber Garment Technology Inc Method of reproducing a marker
US4498345A (en) * 1982-10-04 1985-02-12 Texas Instruments Incorporated Method for measuring saw blade flexure
GB8314768D0 (en) * 1983-05-27 1983-07-06 Thurne Eng Co Ltd Slicing machine
DE3469498D1 (en) * 1984-06-27 1988-04-07 Meyer & Burger Ag Maschf Cutting machine with measuring device and utilization of this measuring device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107443600A (zh) * 2017-08-25 2017-12-08 芜湖长润特种铜线有限公司 一种铜材切割加工设备

Also Published As

Publication number Publication date
KR940011179B1 (ko) 1994-11-26
US4971021A (en) 1990-11-20
IT8821522A0 (it) 1988-07-27
KR890002988A (ko) 1989-04-12

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970731