IT1226470B - Apparecchio per raccogliere wafer - Google Patents
Apparecchio per raccogliere waferInfo
- Publication number
- IT1226470B IT1226470B IT8821523A IT2152388A IT1226470B IT 1226470 B IT1226470 B IT 1226470B IT 8821523 A IT8821523 A IT 8821523A IT 2152388 A IT2152388 A IT 2152388A IT 1226470 B IT1226470 B IT 1226470B
- Authority
- IT
- Italy
- Prior art keywords
- collect wafer
- wafer
- collect
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62192480A JPS6436411A (en) | 1987-07-31 | 1987-07-31 | Recovery device of wafer |
JP62192479A JPS6436044A (en) | 1987-07-31 | 1987-07-31 | Device for recovery of wafer block |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8821523A0 IT8821523A0 (it) | 1988-07-27 |
IT1226470B true IT1226470B (it) | 1991-01-16 |
Family
ID=26507337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT8821523A IT1226470B (it) | 1987-07-31 | 1988-07-27 | Apparecchio per raccogliere wafer |
Country Status (2)
Country | Link |
---|---|
US (2) | US4899719A (it) |
IT (1) | IT1226470B (it) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0695504B2 (ja) * | 1989-10-31 | 1994-11-24 | 直江津電子工業株式会社 | ウエハ枚葉式内周刃2分割切断装置におけるウエハ供給回収装置 |
DE4134110A1 (de) * | 1991-10-15 | 1993-04-22 | Wacker Chemitronic | Verfahren zum rotationssaegen sproedharter werkstoffe, insbesondere solcher mit durchmessern ueber 200 mm in duenne scheiben vermittels innenlochsaege und vorrichtung zur durchfuehrung des verfahrens |
US20040099375A1 (en) * | 2002-11-21 | 2004-05-27 | Yanghua He | Edge-contact ring for a wafer pedestal |
TWI713140B (zh) * | 2019-08-29 | 2020-12-11 | 環球晶圓股份有限公司 | 晶棒固定治具 |
CN114701084A (zh) * | 2022-02-22 | 2022-07-05 | 福州天瑞线锯科技有限公司 | 翻转式取片截断机 |
CN218314487U (zh) * | 2022-09-02 | 2023-01-17 | 宁夏中环光伏材料有限公司 | 一种切片下料收样装置及设有该收样装置的截料机 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3039235A (en) * | 1961-01-31 | 1962-06-19 | Hamco Mach & Elect Co | Cutting apparatus |
US3577861A (en) * | 1969-04-07 | 1971-05-11 | Kayex Corp | Transfer device for cutting apparatus |
DE2451549A1 (de) * | 1974-10-30 | 1976-08-12 | Mueller Georg Kugellager | Belade- und entladevorrichtung fuer plattenfoermige halbleitermaterialien |
US4227348A (en) * | 1978-12-26 | 1980-10-14 | Rca Corporation | Method of slicing a wafer |
US4420909B2 (en) * | 1981-11-10 | 1997-06-10 | Silicon Technology | Wafering system |
EP0242489B1 (de) * | 1986-04-17 | 1991-07-10 | Maschinenfabrik Meyer & Burger AG | Verfahren zum Trennen eines Stabes in Teilstücke, Trennschleifmaschine zur Durchführung dieses Verfahrens und Verwendung dieser Trennschleifmaschine |
-
1988
- 1988-07-22 US US07/223,512 patent/US4899719A/en not_active Expired - Fee Related
- 1988-07-27 IT IT8821523A patent/IT1226470B/it active
-
1990
- 1990-01-03 US US07/460,403 patent/US4974577A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4974577A (en) | 1990-12-04 |
IT8821523A0 (it) | 1988-07-27 |
US4899719A (en) | 1990-02-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT1222544B (it) | Dispositivo vibrator per blocchiere | |
DE3661492D1 (de) | Decropping apparatus | |
DK63787D0 (da) | Massestroemmaaleapparat | |
IT1226469B (it) | Apparecchio per tagliare cristallo semiconduttore | |
IT1224290B (it) | Apparecchiatura per produrre filato | |
IT1206892B (it) | Apparecchio per eseguire piegature | |
IT1202060B (it) | Dispositivo per stomizzazione | |
DK297187A (da) | Regnbuedannende anordning | |
KR880008807U (ko) | 브러시 장치 | |
IT1182133B (it) | Apparecchio per trasportare bobine | |
IT1204325B (it) | Apparecchio estrusore-turbomescolatore | |
IT1226470B (it) | Apparecchio per raccogliere wafer | |
FR2564287B1 (fr) | Appareil de deratisation | |
BR8703368A (pt) | Dispositivo vibro-estimulador | |
DK360387A (da) | Bestraalingsanordning | |
FI882767A (fi) | Poistolaite | |
IT1204324B (it) | Apparecchio estrusore-turbomescolatore | |
IT1160548B (it) | Dispositivo per la filatura-ritorcitura | |
IT208171Z2 (it) | Dispositivo seguicamma | |
FR2570215B1 (fr) | Appareil supraconducteur | |
DK230888D0 (da) | Anordning for konventionelle traedoerers | |
IT1202575B (it) | Dispositivo per la rimozione di un isolante | |
AT385885B (de) | Tragvorrichtung | |
MX160170A (es) | Dispositivo taquimetrico | |
ATA121086A (de) | Iontophoresegeraet |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970731 |