IT1226470B - Apparecchio per raccogliere wafer - Google Patents

Apparecchio per raccogliere wafer

Info

Publication number
IT1226470B
IT1226470B IT8821523A IT2152388A IT1226470B IT 1226470 B IT1226470 B IT 1226470B IT 8821523 A IT8821523 A IT 8821523A IT 2152388 A IT2152388 A IT 2152388A IT 1226470 B IT1226470 B IT 1226470B
Authority
IT
Italy
Prior art keywords
collect wafer
wafer
collect
Prior art date
Application number
IT8821523A
Other languages
English (en)
Other versions
IT8821523A0 (it
Inventor
Seiichi Abe
Yoshitaka Shiratori
Tomoyoshi Sakamoto
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62192480A external-priority patent/JPS6436411A/ja
Priority claimed from JP62192479A external-priority patent/JPS6436044A/ja
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Publication of IT8821523A0 publication Critical patent/IT8821523A0/it
Application granted granted Critical
Publication of IT1226470B publication Critical patent/IT1226470B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
IT8821523A 1987-07-31 1988-07-27 Apparecchio per raccogliere wafer IT1226470B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62192480A JPS6436411A (en) 1987-07-31 1987-07-31 Recovery device of wafer
JP62192479A JPS6436044A (en) 1987-07-31 1987-07-31 Device for recovery of wafer block

Publications (2)

Publication Number Publication Date
IT8821523A0 IT8821523A0 (it) 1988-07-27
IT1226470B true IT1226470B (it) 1991-01-16

Family

ID=26507337

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8821523A IT1226470B (it) 1987-07-31 1988-07-27 Apparecchio per raccogliere wafer

Country Status (2)

Country Link
US (2) US4899719A (it)
IT (1) IT1226470B (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0695504B2 (ja) * 1989-10-31 1994-11-24 直江津電子工業株式会社 ウエハ枚葉式内周刃２分割切断装置におけるウエハ供給回収装置
DE4134110A1 (de) * 1991-10-15 1993-04-22 Wacker Chemitronic Verfahren zum rotationssaegen sproedharter werkstoffe, insbesondere solcher mit durchmessern ueber 200 mm in duenne scheiben vermittels innenlochsaege und vorrichtung zur durchfuehrung des verfahrens
US20040099375A1 (en) * 2002-11-21 2004-05-27 Yanghua He Edge-contact ring for a wafer pedestal
TWI713140B (zh) * 2019-08-29 2020-12-11 環球晶圓股份有限公司 晶棒固定治具
CN114701084A (zh) * 2022-02-22 2022-07-05 福州天瑞线锯科技有限公司 翻转式取片截断机
CN218314487U (zh) * 2022-09-02 2023-01-17 宁夏中环光伏材料有限公司 一种切片下料收样装置及设有该收样装置的截料机

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3039235A (en) * 1961-01-31 1962-06-19 Hamco Mach & Elect Co Cutting apparatus
US3577861A (en) * 1969-04-07 1971-05-11 Kayex Corp Transfer device for cutting apparatus
DE2451549A1 (de) * 1974-10-30 1976-08-12 Mueller Georg Kugellager Belade- und entladevorrichtung fuer plattenfoermige halbleitermaterialien
US4227348A (en) * 1978-12-26 1980-10-14 Rca Corporation Method of slicing a wafer
US4420909B2 (en) * 1981-11-10 1997-06-10 Silicon Technology Wafering system
DE3680205D1 (de) * 1986-04-17 1991-08-14 Meyer & Burger Ag Maschf Verfahren zum trennen eines stabes in teilstuecke, trennschleifmaschine zur durchfuehrung dieses verfahrens und verwendung dieser trennschleifmaschine.

Also Published As

Publication number Publication date
US4899719A (en) 1990-02-13
IT8821523A0 (it) 1988-07-27
US4974577A (en) 1990-12-04

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970731