FI113937B - Tryckt kretskort och sätt för dess framställing - Google Patents

Tryckt kretskort och sätt för dess framställing Download PDF

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Publication number
FI113937B
FI113937B FI900580A FI900580A FI113937B FI 113937 B FI113937 B FI 113937B FI 900580 A FI900580 A FI 900580A FI 900580 A FI900580 A FI 900580A FI 113937 B FI113937 B FI 113937B
Authority
FI
Finland
Prior art keywords
pattern
printed circuit
circuit board
conductive layer
layer
Prior art date
Application number
FI900580A
Other languages
English (en)
Finnish (fi)
Other versions
FI900580A0 (fi
Inventor
Fumio Nakatani
Shinichi Wakita
Hisatoshi Murakami
Tsunehiko Terada
Shohei Morimoto
Original Assignee
Tatsuta Electric Wire & Gable
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire & Gable filed Critical Tatsuta Electric Wire & Gable
Publication of FI900580A0 publication Critical patent/FI900580A0/fi
Application granted granted Critical
Publication of FI113937B publication Critical patent/FI113937B/sv

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09272—Layout details of angles or corners
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Claims (5)

1. Tryckt kretskort innefattande: 5 ett underlag (1); ett kretsmönster (2) som är framställt pä underlaget (1) och som inkluderar ett sig-nalledningsmönster (20) och ett ytterligare mönster som är ett strömtillförselled-ningsmönster (22) eller ett jordledningsmönster (21); ett isolerande skikt (4) som är framställt pä underlaget (1) över kretsmönstret (2); 10 och ett ledande skikt (5) för anslutning tili jord- eller en strömtillförselpotential samt framställt pä det isolerande skiktet (4); kännetecknat av att: det isolerande skiktet (4) är framställt för att övertäcka kretsmönstret (2) med undantag för ätminstone en del av det ytterligare mönstret och med undantag för ett 15 parti (23, 25) i kretsmönstret (2) för en IC-stiftanslutning för strömkällan eller för jord; och det ledande skiktet (5) är framställt för att förbindas med en icke-isolerad del av det ytterligare mönstret och med partiet för nämnda IC-stiftanslutning.
2. Kretskort enligt patentkrav 1, kännetecknat av att ytan av IC-stiftanslutnings- !*! 20 partiet (23, 25) är vidare än ett signalparti (24) för en IC-signalstiftanslutning. ; j I
3. Kretskort enligt patentkrav 1 eller 2, kännetecknat av att det ledande skiktet : ‘: (5) täcker i huvudsak hela det isolerande skiktet (4).
• * · * · · ;;; 4. Sätt att framställa ett tryckt kretskort, vilket inbegriper stegen: * · » • - att try eka en krets pä ett under lag (1); • · 25 - att framställa ett isolerande skikt (4) pä den tryekta kretsen; och ; . - att framställa ett ledande skikt (5) pä det isolerande skiktet (4), kännetecknat av att ; t (’ den tryekta kretsen (2) har en ledande del (23, 25) för kontakt med ett jordstift eller ett strömtillförselstift av en kretskomponent som skall monteras pä kortet, att det 30 isolerande skiktet inte är framställt vid den ledande delen (23, 25) av den tryekta .1. kretsen (2) och att det ledande skiktet (5) kontaktar den tryekta kretsen (2) vid den ledande delen (23, 25). 113937 9
5. Sätt enligt patentkrav 4, kännetecknat av att det isolerande skiktet (4) inte heller är framställt över ätminstone en del av en jordledning (21) eller en ström-förselledning (2), och att det ledande skiktet (5) även kontaktar jordledningen (21) eller strömförselledningen (22) separat frän sin kontakt med den ledande delen (23, 5 25). f I • ·
FI900580A 1989-02-21 1990-02-06 Tryckt kretskort och sätt för dess framställing FI113937B (sv)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP4083889 1989-02-21
JP1922089 1989-02-21
JP4083789 1989-02-21
JP1922089 1989-02-21
JP1921989 1989-02-21
JP1921989 1989-02-21
JP4083889 1989-02-21
JP4083689 1989-02-21
JP4083789 1989-02-21
JP4083689 1989-02-21
JP1921889 1989-02-21
JP1921889 1989-02-21

Publications (2)

Publication Number Publication Date
FI900580A0 FI900580A0 (fi) 1990-02-06
FI113937B true FI113937B (sv) 2004-06-30

Family

ID=27548844

Family Applications (1)

Application Number Title Priority Date Filing Date
FI900580A FI113937B (sv) 1989-02-21 1990-02-06 Tryckt kretskort och sätt för dess framställing

Country Status (7)

Country Link
US (2) US5341274A (sv)
EP (3) EP0633715B1 (sv)
KR (1) KR0123805B1 (sv)
AU (1) AU636129B2 (sv)
CA (1) CA2010128C (sv)
DE (3) DE69033522T2 (sv)
FI (1) FI113937B (sv)

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Also Published As

Publication number Publication date
US5341274A (en) 1994-08-23
CA2010128A1 (en) 1990-08-21
EP0633715B1 (en) 2001-08-29
AU636129B2 (en) 1993-04-22
EP0633715A3 (en) 1995-07-26
DE69019030D1 (de) 1995-06-08
EP0631460A2 (en) 1994-12-28
EP0631460A3 (en) 1995-07-26
EP0631460B1 (en) 2000-04-26
EP0633715A2 (en) 1995-01-11
DE69033522D1 (de) 2000-05-31
CA2010128C (en) 1996-03-19
KR900013820A (ko) 1990-09-06
DE69019030T2 (de) 1995-12-21
DE69033784T2 (de) 2002-07-04
US5449863A (en) 1995-09-12
AU4920090A (en) 1990-08-30
FI900580A0 (fi) 1990-02-06
EP0384644B1 (en) 1995-05-03
KR0123805B1 (ko) 1997-12-04
DE69033784D1 (de) 2001-10-04
DE69033522T2 (de) 2000-12-21
EP0384644A1 (en) 1990-08-29

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Owner name: TATSUTA ELECTRIC WIRE & GABLE CO., LTD

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