ES484158A1 - Procedimiento para la deposicion de cobre por via quimica a alta velocidad - Google Patents

Procedimiento para la deposicion de cobre por via quimica a alta velocidad

Info

Publication number
ES484158A1
ES484158A1 ES484158A ES484158A ES484158A1 ES 484158 A1 ES484158 A1 ES 484158A1 ES 484158 A ES484158 A ES 484158A ES 484158 A ES484158 A ES 484158A ES 484158 A1 ES484158 A1 ES 484158A1
Authority
ES
Spain
Prior art keywords
plating rate
accelerating
electroless copper
copper deposition
delocalized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES484158A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of ES484158A1 publication Critical patent/ES484158A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Procedimiento para la deposición de cobre por vía química a alta velocidad, caracterizado porque en una solución de iones cobre, un agente reductor y un regulador de ph la velocidad de recubrimiento primeramente aumenta pasa a través de una velocidad de recubrimiento aumenta pasa a través de una velocidad de recubrimiento máximo y después disminuye en función de un ph superior a 10 incluyendo en la solución de deposición de cobre un agente de aceleración que contiene un enlace pi no localizado seleccionado entre ( a) compuestos sulfurados y nitrogenados aromáticos que tienen por lo menos un enlace pi no localizado ( c ) eminas aromáticas ( d) mezcla de los anteriores , y haciendo actuar la solución de deposición en presencia del agente de aceleración al mismo ph.
ES484158A 1978-09-13 1979-09-13 Procedimiento para la deposicion de cobre por via quimica a alta velocidad Expired ES484158A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94191278A 1978-09-13 1978-09-13

Publications (1)

Publication Number Publication Date
ES484158A1 true ES484158A1 (es) 1980-09-01

Family

ID=25477278

Family Applications (1)

Application Number Title Priority Date Filing Date
ES484158A Expired ES484158A1 (es) 1978-09-13 1979-09-13 Procedimiento para la deposicion de cobre por via quimica a alta velocidad

Country Status (17)

Country Link
JP (2) JPS5927379B2 (es)
AT (1) AT366105B (es)
AU (1) AU532144B2 (es)
BR (1) BR7905066A (es)
CA (1) CA1135903A (es)
CH (1) CH646200A5 (es)
DE (1) DE2937297C2 (es)
DK (1) DK148920C (es)
ES (1) ES484158A1 (es)
FR (1) FR2436192A1 (es)
GB (1) GB2032462B (es)
IL (1) IL58202A (es)
IT (1) IT1162420B (es)
MX (1) MX152657A (es)
NL (1) NL189523C (es)
SE (1) SE7907531L (es)
ZA (1) ZA793786B (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8005024A (nl) * 1980-09-05 1982-04-01 Philips Nv Werkwijze voor de vervaardiging van koperlegeringslagen en -patronen op substraten en de aldus vervaardigde produkten.
EP0179212B1 (en) * 1984-09-27 1991-12-27 Kabushiki Kaisha Toshiba Chemical copper plating solution
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
JPH0723539B2 (ja) * 1986-11-06 1995-03-15 日本電装株式会社 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
JP2615682B2 (ja) * 1986-11-14 1997-06-04 株式会社デンソー 化学銅めっき液
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2595319B2 (ja) * 1988-07-20 1997-04-02 日本電装株式会社 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法
JPH036383A (ja) * 1989-06-02 1991-01-11 Nippondenso Co Ltd 化学銅めっき液
JPH0448100A (ja) * 1990-06-15 1992-02-18 Nkk Corp 洗浄設備
US7905994B2 (en) 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
JP5255015B2 (ja) * 2010-04-28 2013-08-07 名古屋メッキ工業株式会社 高分子繊維の無電解銅めっき方法
JP5780920B2 (ja) * 2011-10-31 2015-09-16 新光電気工業株式会社 無電解銅めっき浴
US20190382901A1 (en) * 2018-06-15 2019-12-19 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
US10590541B2 (en) * 2018-06-15 2020-03-17 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
CN113881984B (zh) * 2021-10-21 2022-09-16 深圳市励高表面处理材料有限公司 一种脉冲电镀整平剂及制备方法和应用该整平液的电镀液

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3222195A (en) * 1962-02-23 1965-12-07 Pearlstein Fred Stabilized electroless copper solution
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
US3377174A (en) * 1963-10-24 1968-04-09 Torigai Eiichi Method and bath for chemically plating copper
DE1621307B2 (de) * 1966-02-01 1972-01-05 Photocircuits Corp , Glen Cove, N Y (V St A ) Reduktives metallisierungsbad insbesondere verkupferungsbad
US3720525A (en) * 1971-08-16 1973-03-13 Rca Corp Electroless copper plating solutions with accelerated plating rates
US3708329A (en) * 1971-09-10 1973-01-02 Bell Telephone Labor Inc Electroless copper plating
US3915718A (en) * 1972-10-04 1975-10-28 Schering Ag Chemical silver bath
US3793038A (en) * 1973-01-02 1974-02-19 Crown City Plating Co Process for electroless plating
JPS5173933A (ja) * 1974-12-25 1976-06-26 Mitsubishi Rayon Co Mudenkaidometsukyoku
JPS5746448B2 (es) * 1975-03-14 1982-10-04
JPS5217335A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Chemical copper plating solution
JPS5288227A (en) * 1976-01-19 1977-07-23 Hitachi Ltd Chemical copper plating solution
IT1059950B (it) * 1976-04-30 1982-06-21 Alfachimici Spa Composizione per la ramatura anelettrica autocatalitica
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution

Also Published As

Publication number Publication date
IT7950227A0 (it) 1979-09-11
IL58202A (en) 1982-08-31
SE7907531L (sv) 1980-03-14
JPS5915981B2 (ja) 1984-04-12
GB2032462A (en) 1980-05-08
FR2436192A1 (fr) 1980-04-11
IT1162420B (it) 1987-04-01
DK148920C (da) 1986-05-05
NL189523C (nl) 1993-05-03
ZA793786B (en) 1980-07-30
IL58202A0 (en) 1979-12-30
AU4956779A (en) 1980-03-20
DK148920B (da) 1985-11-18
CH646200A5 (de) 1984-11-15
DE2937297C2 (de) 1982-04-08
DE2937297A1 (de) 1980-03-20
FR2436192B1 (es) 1983-08-26
GB2032462B (en) 1983-05-18
ATA600879A (de) 1981-07-15
DK381979A (da) 1980-03-14
AU532144B2 (en) 1983-09-22
NL7906856A (nl) 1980-03-17
AT366105B (de) 1982-03-10
BR7905066A (pt) 1980-04-29
MX152657A (es) 1985-10-07
JPS5565355A (en) 1980-05-16
JPS5925965A (ja) 1984-02-10
JPS5927379B2 (ja) 1984-07-05
CA1135903A (en) 1982-11-23

Similar Documents

Publication Publication Date Title
ES484158A1 (es) Procedimiento para la deposicion de cobre por via quimica a alta velocidad
ATE25196T1 (de) Stabilisierung von 1-substituierten imidazolderivaten in talk.
ES8206440A1 (es) Un procedimiento para la preparacion del enantiomero (-) de la n-metil-3-(2metilfenoxi)-3-fenilpropilamina.
CA2222158A1 (en) Self accelerating and replenishing non-formaldehyde immersion coating method and composition
SE7907373L (sv) Forfaringssett for kontinuerlig elektrofri kopparnedfellning under nyttjande av ett hypofosfitreduktionsmedel i nervaro av kobolk- och nickeljoner samt komposition for utovande av forfaringssettet
SE8206447L (sv) Avmetalliseringskomposition och -forfarande
ES8702518A1 (es) Un metodo de electrodepositar una pelicula de hg1 x cd x te sobre un substrato conductor con estequiometria de hg con- trolada
ES485980A1 (es) Procedimiento para el deposito quimico de oro por reduccion autocatalitica
ES8606536A1 (es) Un procedimiento para electrodepositar cinc y una aleacion de cinc que contiene niquel y-o cobalto sobre un sustrato conductor.
SE8000645L (sv) Vattenhaltigt bad for elektroutfellning av nickel/jern-skikt samt sett att fella ut sadana skikt med anvendning av badet
JPS5743995A (en) Silver plating liquid and silver plating method
ES8300883A1 (es) Procedimiento para separar electroliticamente depositos metalicos.
KR900004960A (ko) 구리 또는 구리합금 표면상의 전환피막 형성방법
JPS6452150A (en) Composition containing ferric complex salt
ES327089A1 (es) Un metodo para preparar alfa-ditiosemicarbazonas.
ES375824A1 (es) Mejoras en la deposicion electrolitica del cobre.
SE7703989L (sv) Forfarande vid stromlos avsettning av kopparbeleggnigar
RU94045889A (ru) Композиция для торможения или регулирования нитрификации аммониевого азота в почве и субстрате
ES8506109A1 (es) Un procedimiento para depositar quimicamente niquel sobre un substrato
JPS57140891A (en) Pretreating solution for silver plating
ES463734A1 (es) Un metodo para tratar un sistema acuoso y flocular de este selectivamente los iones de hierro.
GB1498533A (en) Trivalent chromium plating baths
GB1498532A (en) Trivalent chromium plating baths
ES8106023A1 (es) Un metodo para la electrodeposicion de un deposito de niquelsustancialmente negro sobre un sustrato.
JPS5419430A (en) Chemical copper plating solution

Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970203