ES8506109A1 - Un procedimiento para depositar quimicamente niquel sobre un substrato - Google Patents
Un procedimiento para depositar quimicamente niquel sobre un substratoInfo
- Publication number
- ES8506109A1 ES8506109A1 ES534703A ES534703A ES8506109A1 ES 8506109 A1 ES8506109 A1 ES 8506109A1 ES 534703 A ES534703 A ES 534703A ES 534703 A ES534703 A ES 534703A ES 8506109 A1 ES8506109 A1 ES 8506109A1
- Authority
- ES
- Spain
- Prior art keywords
- nickel
- sulphonium
- electroless nickel
- bath
- effective amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract 10
- 229910052759 nickel Inorganic materials 0.000 title abstract 5
- 238000007747 plating Methods 0.000 title abstract 3
- -1 hypophosphite ions Chemical class 0.000 abstract 4
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 abstract 2
- 229960003237 betaine Drugs 0.000 abstract 2
- 239000003381 stabilizer Substances 0.000 abstract 2
- 230000000153 supplemental effect Effects 0.000 abstract 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- 239000006172 buffering agent Substances 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910001453 nickel ion Inorganic materials 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000011574 phosphorus Substances 0.000 abstract 1
- 230000003716 rejuvenation Effects 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
METODO DE DEPOSICION QUIMICA DE NIQUEL SOBRE UN SUSTRATO.COMPRENDE LA INTRODUCCION DEL SUSTRATO LIMPIO Y ADECUADAMENTE PREPARADO EN UN BAN/O DE NIQUEL SIN ELECTRODOS QUE CONTIENE IONES NIQUEL E HIPOFOSFITO, UN COMPUESTO DE SULFONIO-BETAINA EN CANTIDAD SUFICIENTE PARA CONTROLAR LA VELOCIDAD DE DEPOSICION Y LA CONCENTRACION DE FOSFORO EN EL DEPOSITO, Y EVENTUALMENTE AGENTES COMPLEJANTES, TAMPONANTES Y ESTABILIZANTES.TIENE APLICACIONES PARA EL DEPOSITO DE CHAPAS DE NIQUEL-FOSFORO.-
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/583,759 US4483711A (en) | 1983-06-17 | 1984-03-05 | Aqueous electroless nickel plating bath and process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES8506109A1 true ES8506109A1 (es) | 1985-06-16 |
| ES534703A0 ES534703A0 (es) | 1985-06-16 |
Family
ID=24334446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES534703A Granted ES534703A0 (es) | 1984-03-05 | 1984-07-27 | Un procedimiento para depositar quimicamente niquel sobre un substrato |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JPS6141774A (es) |
| AU (1) | AU555641B2 (es) |
| CA (1) | CA1225501A (es) |
| DE (1) | DE3421646A1 (es) |
| ES (1) | ES534703A0 (es) |
| FR (1) | FR2560609B1 (es) |
| GB (1) | GB2155041B (es) |
| IT (1) | IT1181810B (es) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4983428A (en) * | 1988-06-09 | 1991-01-08 | United Technologies Corporation | Ethylenethiourea wear resistant electroless nickel-boron coating compositions |
| ES2027496A6 (es) * | 1989-10-12 | 1992-06-01 | Enthone | Metodo para precipitar una capa metalica no electrica lisa sobre un substrato de aluminio. |
| DE102004047423C5 (de) * | 2004-09-28 | 2011-04-21 | AHC-Oberflächentechnik GmbH & Co. OHG | Außenstromlos aufgebrachte Nickellegierung und ihre Verwendung |
| KR101310256B1 (ko) | 2011-06-28 | 2013-09-23 | 삼성전기주식회사 | 인쇄회로기판의 무전해 표면처리 도금층 및 이의 제조방법 |
| EP2551375A1 (en) * | 2011-07-26 | 2013-01-30 | Atotech Deutschland GmbH | Electroless nickel plating bath composition |
| US11685999B2 (en) | 2014-06-02 | 2023-06-27 | Macdermid Acumen, Inc. | Aqueous electroless nickel plating bath and method of using the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1001078B (de) * | 1953-08-13 | 1957-01-17 | Dehydag Gmbh | Galvanische Baeder zur Herstellung von Metallueberzuegen |
| US3489576A (en) * | 1966-08-04 | 1970-01-13 | Gen Motors Corp | Chemical nickel plating |
| US3515564A (en) * | 1968-05-27 | 1970-06-02 | Allied Res Prod Inc | Stabilization of electroless plating solutions |
-
1984
- 1984-06-04 AU AU29035/84A patent/AU555641B2/en not_active Ceased
- 1984-06-08 GB GB08414601A patent/GB2155041B/en not_active Expired
- 1984-06-09 DE DE19843421646 patent/DE3421646A1/de active Granted
- 1984-06-18 JP JP12499584A patent/JPS6141774A/ja active Granted
- 1984-07-09 CA CA000458433A patent/CA1225501A/en not_active Expired
- 1984-07-10 FR FR8410971A patent/FR2560609B1/fr not_active Expired
- 1984-07-27 IT IT48657/84A patent/IT1181810B/it active
- 1984-07-27 ES ES534703A patent/ES534703A0/es active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0144790B2 (es) | 1989-09-29 |
| DE3421646A1 (de) | 1985-09-05 |
| CA1225501A (en) | 1987-08-18 |
| IT1181810B (it) | 1987-09-30 |
| AU2903584A (en) | 1985-09-12 |
| IT8448657A0 (it) | 1984-07-27 |
| FR2560609B1 (fr) | 1987-03-27 |
| FR2560609A1 (fr) | 1985-09-06 |
| GB2155041B (en) | 1987-06-03 |
| GB8414601D0 (en) | 1984-07-11 |
| AU555641B2 (en) | 1986-10-02 |
| GB2155041A (en) | 1985-09-18 |
| JPS6141774A (ja) | 1986-02-28 |
| ES534703A0 (es) | 1985-06-16 |
| DE3421646C2 (es) | 1987-01-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Patent lapsed |
Effective date: 19960506 |