IT7950227A0 - Senza elettricita' aventi ritmi piu processi per la deposizione di rame veloci di placcatura - Google Patents
Senza elettricita' aventi ritmi piu processi per la deposizione di rame veloci di placcaturaInfo
- Publication number
- IT7950227A0 IT7950227A0 IT7950227A IT5022779A IT7950227A0 IT 7950227 A0 IT7950227 A0 IT 7950227A0 IT 7950227 A IT7950227 A IT 7950227A IT 5022779 A IT5022779 A IT 5022779A IT 7950227 A0 IT7950227 A0 IT 7950227A0
- Authority
- IT
- Italy
- Prior art keywords
- rhythm
- deposition
- electricity
- processes
- copper plating
- Prior art date
Links
- 230000008021 deposition Effects 0.000 title 1
- 230000005611 electricity Effects 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
- 230000033764 rhythmic process Effects 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US94191278A | 1978-09-13 | 1978-09-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7950227A0 true IT7950227A0 (it) | 1979-09-11 |
IT1162420B IT1162420B (it) | 1987-04-01 |
Family
ID=25477278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT50227/79A IT1162420B (it) | 1978-09-13 | 1979-09-11 | Processi per la deposizione di ramesenza elettrica' aventi ritmi piu veloci di placcatura |
Country Status (17)
Country | Link |
---|---|
JP (2) | JPS5927379B2 (it) |
AT (1) | AT366105B (it) |
AU (1) | AU532144B2 (it) |
BR (1) | BR7905066A (it) |
CA (1) | CA1135903A (it) |
CH (1) | CH646200A5 (it) |
DE (1) | DE2937297C2 (it) |
DK (1) | DK148920C (it) |
ES (1) | ES484158A1 (it) |
FR (1) | FR2436192A1 (it) |
GB (1) | GB2032462B (it) |
IL (1) | IL58202A (it) |
IT (1) | IT1162420B (it) |
MX (1) | MX152657A (it) |
NL (1) | NL189523C (it) |
SE (1) | SE7907531L (it) |
ZA (1) | ZA793786B (it) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8005024A (nl) * | 1980-09-05 | 1982-04-01 | Philips Nv | Werkwijze voor de vervaardiging van koperlegeringslagen en -patronen op substraten en de aldus vervaardigde produkten. |
EP0179212B1 (en) * | 1984-09-27 | 1991-12-27 | Kabushiki Kaisha Toshiba | Chemical copper plating solution |
ES2039403T3 (es) * | 1986-10-31 | 1993-10-01 | Amp-Akzo Corporation (A Delaware Corp.) | Metodo para depositar sin electricidad cobre de alta calidad. |
JPH0723539B2 (ja) * | 1986-11-06 | 1995-03-15 | 日本電装株式会社 | 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法 |
US4814009A (en) * | 1986-11-14 | 1989-03-21 | Nippondenso Co., Ltd. | Electroless copper plating solution |
JP2615682B2 (ja) * | 1986-11-14 | 1997-06-04 | 株式会社デンソー | 化学銅めっき液 |
AU3304389A (en) * | 1988-04-29 | 1989-11-02 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
JP2595319B2 (ja) * | 1988-07-20 | 1997-04-02 | 日本電装株式会社 | 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法 |
JPH036383A (ja) * | 1989-06-02 | 1991-01-11 | Nippondenso Co Ltd | 化学銅めっき液 |
JPH0448100A (ja) * | 1990-06-15 | 1992-02-18 | Nkk Corp | 洗浄設備 |
US7905994B2 (en) | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
JP5255015B2 (ja) * | 2010-04-28 | 2013-08-07 | 名古屋メッキ工業株式会社 | 高分子繊維の無電解銅めっき方法 |
JP5780920B2 (ja) * | 2011-10-31 | 2015-09-16 | 新光電気工業株式会社 | 無電解銅めっき浴 |
US20190382901A1 (en) * | 2018-06-15 | 2019-12-19 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions and methods for electroless plating copper on substrates |
US10590541B2 (en) * | 2018-06-15 | 2020-03-17 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions and methods for electroless plating copper on substrates |
CN113881984B (zh) * | 2021-10-21 | 2022-09-16 | 深圳市励高表面处理材料有限公司 | 一种脉冲电镀整平剂及制备方法和应用该整平液的电镀液 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3222195A (en) * | 1962-02-23 | 1965-12-07 | Pearlstein Fred | Stabilized electroless copper solution |
US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
US3377174A (en) * | 1963-10-24 | 1968-04-09 | Torigai Eiichi | Method and bath for chemically plating copper |
CH491206A (de) * | 1966-02-01 | 1970-05-31 | Photocircuits Corp | Badlösung zum stromlosen Abscheiden von Metallschichten |
US3720525A (en) * | 1971-08-16 | 1973-03-13 | Rca Corp | Electroless copper plating solutions with accelerated plating rates |
US3708329A (en) * | 1971-09-10 | 1973-01-02 | Bell Telephone Labor Inc | Electroless copper plating |
US3915718A (en) * | 1972-10-04 | 1975-10-28 | Schering Ag | Chemical silver bath |
US3793038A (en) * | 1973-01-02 | 1974-02-19 | Crown City Plating Co | Process for electroless plating |
JPS5173933A (ja) * | 1974-12-25 | 1976-06-26 | Mitsubishi Rayon Co | Mudenkaidometsukyoku |
JPS5746448B2 (it) * | 1975-03-14 | 1982-10-04 | ||
JPS5217335A (en) * | 1975-08-01 | 1977-02-09 | Hitachi Ltd | Chemical copper plating solution |
JPS5288227A (en) * | 1976-01-19 | 1977-07-23 | Hitachi Ltd | Chemical copper plating solution |
IT1059950B (it) * | 1976-04-30 | 1982-06-21 | Alfachimici Spa | Composizione per la ramatura anelettrica autocatalitica |
JPS56156749A (en) * | 1980-05-08 | 1981-12-03 | Toshiba Corp | Chemical copper plating solution |
-
1979
- 1979-07-12 CA CA000331706A patent/CA1135903A/en not_active Expired
- 1979-07-24 ZA ZA00793786A patent/ZA793786B/xx unknown
- 1979-08-01 MX MX178747A patent/MX152657A/es unknown
- 1979-08-03 AU AU49567/79A patent/AU532144B2/en not_active Ceased
- 1979-08-07 BR BR7905066A patent/BR7905066A/pt not_active IP Right Cessation
- 1979-09-05 GB GB7930740A patent/GB2032462B/en not_active Expired
- 1979-09-07 IL IL58202A patent/IL58202A/xx unknown
- 1979-09-11 SE SE7907531A patent/SE7907531L/ unknown
- 1979-09-11 IT IT50227/79A patent/IT1162420B/it active
- 1979-09-12 CH CH826779A patent/CH646200A5/de not_active IP Right Cessation
- 1979-09-12 DK DK381979A patent/DK148920C/da not_active IP Right Cessation
- 1979-09-12 DE DE2937297A patent/DE2937297C2/de not_active Expired
- 1979-09-12 AT AT0600879A patent/AT366105B/de not_active IP Right Cessation
- 1979-09-13 ES ES484158A patent/ES484158A1/es not_active Expired
- 1979-09-13 NL NLAANVRAGE7906856,A patent/NL189523C/xx not_active IP Right Cessation
- 1979-09-13 FR FR7922867A patent/FR2436192A1/fr active Granted
- 1979-09-13 JP JP54118651A patent/JPS5927379B2/ja not_active Expired
-
1983
- 1983-06-21 JP JP58112590A patent/JPS5915981B2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2032462A (en) | 1980-05-08 |
MX152657A (es) | 1985-10-07 |
JPS5925965A (ja) | 1984-02-10 |
ATA600879A (de) | 1981-07-15 |
GB2032462B (en) | 1983-05-18 |
ZA793786B (en) | 1980-07-30 |
DK148920B (da) | 1985-11-18 |
SE7907531L (sv) | 1980-03-14 |
DK148920C (da) | 1986-05-05 |
ES484158A1 (es) | 1980-09-01 |
IL58202A0 (en) | 1979-12-30 |
NL189523C (nl) | 1993-05-03 |
DE2937297A1 (de) | 1980-03-20 |
BR7905066A (pt) | 1980-04-29 |
JPS5927379B2 (ja) | 1984-07-05 |
FR2436192A1 (fr) | 1980-04-11 |
JPS5565355A (en) | 1980-05-16 |
CA1135903A (en) | 1982-11-23 |
NL7906856A (nl) | 1980-03-17 |
IL58202A (en) | 1982-08-31 |
AU4956779A (en) | 1980-03-20 |
AU532144B2 (en) | 1983-09-22 |
CH646200A5 (de) | 1984-11-15 |
DE2937297C2 (de) | 1982-04-08 |
AT366105B (de) | 1982-03-10 |
IT1162420B (it) | 1987-04-01 |
DK381979A (da) | 1980-03-14 |
JPS5915981B2 (ja) | 1984-04-12 |
FR2436192B1 (it) | 1983-08-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT7950227A0 (it) | Senza elettricita' aventi ritmi piu processi per la deposizione di rame veloci di placcatura | |
AU2225477A (en) | Acid copper plating baths | |
AT378540B (de) | Stromloses goldplattierungsbad | |
IT1126457B (it) | Bagno per deposizione senza impiego di corrente elettrica di stagno su substrati | |
AT380902B (de) | Goldplattierungsbad | |
IT7950987A0 (it) | Un ricoprimento di piombo-stagno procedimento per elettrodepositare allontanando ioni rame dal bagno | |
KR890700908A (ko) | 도전성 피막형성용 도포액 | |
IT1095088B (it) | Generatore per la produzione d'impulsi per la lavorazione di metalli per elettroasportazione | |
IT1115850B (it) | Placcatura rame senza elettricita' | |
FR2316035A1 (fr) | Installation d'usinage sous vide par faisceau electronique | |
IT7909451A0 (it) | Bagno elettrogalvanico per stagnatura brillante | |
FR2468663B1 (fr) | Bains d'enlevement electrolytique de depots metalliques a partir d'un metal de base different | |
IT1125361B (it) | Miglioramenti della conduttivita' elettrica di leghe di alluminio per aggiunta di ittrio | |
GB2094836B (en) | A bath for the electrolytic deposition of a palladium-nickel alloy | |
KR880701688A (ko) | 코팅액 | |
ZA821368B (en) | A bath for the electrolytic deposition of a palladium-nickel alloy | |
GB2013719B (en) | Electro plating fixture | |
BE876363A (fr) | Systeme d'eclairage de bicyclette | |
IT7950176A0 (it) | Procedimento per la pulitura superficiale di leghe di rame | |
ZA821366B (en) | A bath for the electrolytic deposition of a palladium-nickel alloy | |
IT1206252B (it) | Elettrolita per l'elettrodeposizione di leghe di zinco | |
JPS54157742A (en) | Recovering plating solution from mterial to be plated | |
GB2021646B (en) | Aluminium electroplating solution | |
JPS54155131A (en) | Preparing zinc electroplating bath | |
BE874719A (fr) | Procede de deposition electrolytique pour la preparation d'elements de structure semi-conducteurs a grande surface |