Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
  • G03B21/00—Projectors or projection-type viewers; Accessories therefor
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
  • G02B1/08—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of polarising materials
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
  • G02B1/02—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of crystals, e.g. rock-salt, semi-conductors
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/30—Polarising elements
  • G02B5/3083—Birefringent or phase retarding elements
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70216—Mask projection systems
  • G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
  • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
  • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
  • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
  • G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
  • G03F7/70966—Birefringence

Definitions

• the invention relates to a projection exposure system of microlithography according to the preamble of claims 1 and 41, an optical system, in particular a microlithographic projection objective, according to the preamble of claims 9 and 12, a manufacturing method of a microlithography projection object according to the preamble of claim 42 as well as a microlithographic structuring method according to the preamble of claim 44.
• a lens which, however, can also be designed as a plane plate, for example an end plate, filter), which is oriented symmetrically about the (111) crystal axis, the birefringence when a light beam passes perpendicularly is minimal.
• the object of the invention is therefore to provide a compensation of this disturbance by direction-dependent birefringence, with which even high-aperture projection lenses can be operated optimally.
• the invention is based on the knowledge that, on the one hand, the interference caused by birefringence at the value of approx. 6 nm per cm with a possible light path of around 10 cm in lenses at the high angles predominantly a phase shift of up to approximately lambda quarters for two mutually polarized beams, that the high beam angles also occur in near-field (field-near) elements whose Beam-angle distributions are present as local distributions in a pupil plane transformed to it by Fourier.
• the disturbance can thus be surprisingly corrected by a location-dependent polarization-rotating or location-dependent different birefringent optical element (correction element) near a pupil plane.
• correction element a location-dependent polarization-rotating or location-dependent different birefringent optical element
• Such elements and their manufacture by local polishing, in particular by ion beam polishing are known as indicated above and are also available in this new context.
• the position "close" to a pupil plane is a practical approximation to the position in which the local distribution of polarization and phase at the correction element is transformed sufficiently into its angular distribution at the angle-dependent birefringent element. This must be coordinated in particular with the optical design of the projection lens.
• the embodiment according to claim 8 provides for a conversion from radial to tangential polarization with an optically active element in the projection objective.
• Thickness distribution can also achieve a desired compensation effect of the correction element by introducing z. B. of tensile or compressive stresses by means of a force application device according to claim 14 and a stress birefringence caused thereby.
• Piezo actuators can also be other active actuators, e.g. B. pneumatic actuators, or passive manipulators, z. B. adjusting screws or preloaded springs can be used.
• Claim 17 can provide a defined introduction of force in the direction of the neutral surface of the optical element.
• a movable body according to Claim 18 ensures a subsequent fine adjustment of the force application.
• a spring according to claim 19 prevents the contact body from tilting with respect to the correction element.
• Claim 20 prevents the contact body from tilting with respect to the correction element by creating a defined mobility of the contact body relative to the correction element.
• a solid-state joint according to claim 21 is wear-free and can be produced in a compact manner.
• Claim 22 can initiate a defined force distribution in the correction element.
• a first can be done by the expansion or the offset of the force application locations
• Claim 23 can be a Realize progressively variable distribution of force transmission in the circumferential direction.
• Claim 25 offers an easy-to-implement possibility of applying force along the neutral surface of the correction element, since the forces which can be introduced via the two places of introduction of force can be correspondingly coordinated with one another.
• Claim 26 offers the possibility of fine adjustment of the force distribution between the two force introduction bodies to generate a total force along the neutral surface of the correction element.
• Claim 29 enables a design of a force introduction device that is flat in the direction of the optical axis of the optical system.
• Claim 30 can the introduction of force on the arrangement and Design the force introduction component specifically to generate a total force in the direction of the neutral surface of the correction element.
• Claim 31 can be done particularly easily.
• a ring acc. Claim 32 is a particularly simple counter support body for a force introduction device, which can then also be designed as a component carried by the correction element itself.
• a support ring which surrounds the correction element, can be used, on which the actuator acting on the correction element, which itself does not have to be annular, is supported. The use of such rings also enables a force application device in which no lateral displacement of the correction element can occur when the force is applied.
• a force introduction device leads to a maximization of the corrective effect for a given application of force.
• a projection exposure system according to claim 36 with the introduction of force coordinated with the emission of the projection light bundle leads to the fact that the compensation is always achieved exactly when the projection optics are illuminated with projection light. At the same time, the load on the correction element is reduced.
• a control device ensures simple timing.
• Claim 38 When using a force application device acc. Claim 38 generates a refractive index profile via the sound wave profile, which has a similar spatial distribution as the sound wave profile.
• the sound wave profiles can be analogous to optical ones
• a standing sound wave acc. Claim 39 leads to a static aberration correction.
• dynamic imaging error correction This makes it z. B. possible to change the imaging properties of the lens during the projection in a targeted manner with an intermittent projection light bundle, so that at the time of influencing the light bundle by the optical element, optimal imaging conditions for the projection prevail.
• Time scale of light exposure a slow, e.g. in the order of 1/100 s, to generate variable force distribution in the optical element, e.g. optimize the correction effect on the lighting distribution used or on the reticle structure just shown.
• Figure 1 schematically shows a projection exposure system according to the invention, partly in meridional section
• FIG. 2 shows an optical correction element which is alternative to that which is integrated in the projection exposure system according to FIG. 1;
• FIG. 3 shows a meridional section of half of a further alternative optical correction element
• Figure 4 shows a detail of a movable
• FIG. 3 shows a cooperating force introduction device which, according to FIG. Figure 3 is;
• FIG. 5 shows an illustration of an optical correction element similar to FIG. 3 with an alternative force introduction device;
• Figure 6 is a plan view of the embodiment according to. Figure 5;
• FIG. 7 shows a representation, similar to FIGS. 3 and 5, of an alternative optical correction element with an alternative force introduction device
• Figure 8 is a plan view of the embodiment according to. Figure 7; such as
• FIG. 1 shows a light source 1, which is preferably a laser emitting at narrow band at 157 nm or 193 nm. Their light is fed to an illumination system 2 which, as a special feature, can contain means 21 for generating radial polarization, as are known from DE 195 35 392 A1.
• This illuminates a microlithographic reticle 3, which is connected to a reticle holding and positioning system 31.
• the following projection objective 4 images the reticle 3 onto the object 5 arranged in the image plane - typically the wafer.
• the object 5 is provided with an object holding and positioning system 51.
• the projection lens 4 comprises a group 41 with lenses and, if necessary, also one or more mirror apply, a pupil plane or system aperture plane P and between this plane P and the plane of the object 5 lenses 42, 43, the passage angle a of which is characterized by the numerical aperture NA of the projection objective on the image side.
• At least one of the lenses 42, 43 consists of a material with angle-dependent birefringence, for example calcium fluoride, the (111) orientation of which coincides with the optical axis 0 or deviates by up to approximately 5.
• a material with angle-dependent birefringence for example calcium fluoride, the (111) orientation of which coincides with the optical axis 0 or deviates by up to approximately 5.
• both of the lenses 42, 43 shown are preferably installed rotated relative to one another by the azimuth angle, that is, around the optical axis O.
• the correction element 44 made of birefringent, stress birefringent or optically active material, which is arranged there according to the invention, can therefore have a distance from the optical axis O and with the
• the means 21 and the correction element t 44 can generate radial polarization on the object 5, the correction element 44 also compensating for the angle-dependent birefringence in the sense of the invention. If the projection objective has 4 further pupil planes, which is the case, for example, in versions with an intermediate image, a correction element can also be arranged there.
• lens surfaces e.g. can be reshaped by on-beam etching.
• the described effect of the angle-dependent birefringence of the fluoride crystals can be taken into account in the optical design of high-projection lenses. For this, the variation over the azimuth angle must be taken into account.
• the design or the effect of the correction element 44 can then be predetermined by the design.
• the disturbance of the image due to the angle-dependent birefringence can also be measured and converted into a post-processing of the correction element 44 provided. This way, a specimen-specific birefringence distribution can be corrected at the same time.
• FIGS. 2 to 12 Components which correspond to those which have already been described with reference to FIG. 1 have the same reference numerals in these further variants and are not explained again in detail.
• FIG. 2 shows an alternative correction element on an enlarged scale.
• ment 144 in the disassembled state, that is, not in a projection lens integrated state in supervision.
• the correction element 144 is a CaF "plate with three-fold symmetry, ie it consists of a material with stress-birefringent properties.
• Its circumferential surface 161 has essentially the shape of an equilateral triangle with rounded corners and side surfaces which are arched slightly in the direction of the center of the triangle (penetration point of the optical axis O).
• the correction element 144 is mounted in a round socket 150 and is connected via a section at each of the rounded corners of the circumferential surface 161 to a respective piezo actuator 151 to 153.
• Each piezo actuator 151 to 153 is embedded in the socket 150 on the side facing away from the correction element 144.
• the piezo actuators 151 to 153 are connected to a piezo control unit 157 via signal lines 154 to 156, which are led to the outside through corresponding bores in the holder 150.
• the latter is connected via a signal line 158 to a synchronization unit 159, which in turn is connected to the light source 101 via a signal line 160.
• the correction element 144 When used, the correction element 144 is integrated in the projection objective (cf. objective 4 in FIG. 1), it being possible for projection light to pass through it in a circular passage area 162, which is shown in broken lines in FIG.
• the correction element 144 then works as follows:
• the light source 101 is an excimer laser which, by means of a quasi-cw projection light pulse train with individual pulses, has a short pulse duration (approximately 10 ns) and a relatively low repetition rate in the range of 10 kHz is characterized.
• the piezo actuators 151 to 153 are controlled by the piezo control unit 157 such that the correction element 144 is set into radial density vibrations.
• the frequency of these vibrations is tuned to the repetition rate of the light source 101 with the aid of the synchronization unit 159, so that during the laser pulse a maximum of the piezo actuators 151 to 153 e.g. Compressive stress generated in a sinsus shape is achieved in the correction element 144.
• the short pulse duration of the individual light pulses which is only approx.
• One ten thousandth of the repetition period of the light source 101 and the duration of the force introduction into the correction element 144 the instantaneous force introduced into the correction element is constant to a good approximation. Therefore, no significant changes in the birefringence state of the correction element 144 occur during the pulse duration of the individual light pulses, regardless of the phase relationship between the laser pulse and the introduction of force.
• the voltage birefringence can be set by means of the piezo control unit 157.
• the geometry of the correction element 144 is such the geometry of the force application by the piezo actuators 151 to 153 and adapted to the force application frequency such that a natural vibration of the correction element 144 is in resonance with the force application frequency. This ensures a maximum force effect and thus a maximum stress birefringence generated for a given amount of force. In addition to compressive stresses, this version also creates tensile stresses due to the resonant oscillation of the solid, which significantly increases the variety of birefringence distributions possible.
• the piezo actuators 151 to 153 With the aid of the piezo actuators 151 to 153 (cf. FIG. 2), provided that a corresponding actuation frequency of the piezo actuators 151 to 153 is used, a standing or a running sound wave can be generated in the correction element 144. To generate a standing sound wave, the control frequency for the piezo actuators 151 to 153 is adapted accordingly to the geometry and the material of the correction element 144. According to the
• a number of the piezo actuators acting on the correction element 144 via the circumferential surface 161 can generate a corresponding count of the sound wave that arises.
• n piezo actuators With n piezo actuators, a standing sound wave with up to n / 2-fold symmetry can be generated.
• superimpositions of sound waves with different numbers can be generated. This leads to a refractive index profile in the correction element 14 that can be predetermined in a controlled manner via the sound wave profile.
• a corresponding superposition of refractive index profiles can be set as a superposition, which can be used for the independent correction of a plurality of imaging errors, since e.g. B. about the Different refractive index contributions of sound wave profiles of different counts, the coefficients describing the imaging properties of Zernike functions are influenced in a predetermined manner.
• the projection light beam passing through the correction element 144 is influenced in such a way that the other birefringence effects in the projection optics are compensated for, as explained in connection with FIG. 1.
• piezo actuators As an alternative to piezo actuators, other pressure or traction devices can also be used to apply the force.
• FIG. 3 shows, in a meridional section, a further variant of an optical correction element with a force introduction device, which is alternative to that which was described in connection with FIG. 2.
• the optical correction element 244 is a symmetrically biconcave lens made of CaF_, on which a force introduction device, designated overall by 270, acts on the edge.
• the optical correction element 244 and the force introduction device 270 3 are rotationally symmetrical in multiple numerals about an optical axis 271 shown in broken lines in FIG. 3, so that the illustration in FIG. 3 is limited to the right half as seen from the optical axis 271.
• the edge of the correction element 244 is chamfered at the top and bottom, so that the circumferential surface 272 of the correction element 244 merges into the convex optical surfaces of the correction element 244 via an annular chamfer surface 273, 274 in each case. Since the chamfer surfaces 273, 274 are not part of the optical surfaces of the correction element 244, they can be regarded as part of the entire circumferential surface thereof.
• the lower chamfer surface 274 in FIG. 3 rests on a base body 277, which forms the holder of the correction element 244, via a contact tip 275 of a contact body 276.
• the contact body 276 and the base body 277 are connected to one another in a planar manner, for. B. glued together.
• the base body 277 has a plurality of edge-side bores 278, which are made parallel to the optical axis 271 through the base body 277 and serve to fasten the base body 277 to a holding frame (not shown) for the correction element 244.
• a plurality of lever bodies 279 are attached to the base body 277 in an articulated manner.
• the number of lever bodies 279 specifies the count of the rotational symmetry of the force introduction device 270. Only one of the lever bodies 279 is shown in FIG.
• the lever bodies 279 all have the same structure, so that it suffices below, the lever body shown in Figure 3 279 to describe. This is articulated on the base body 277 via a joint 280.
• the joint 280 like the other joints which connect the other lever bodies 279 to the base body 277, has an axis of articulation which runs parallel to a tangent to the next point on the circumferential surface 272 of the correction element 244.
• the joints (cf. joint 280) are arranged at a height that corresponds to the position of the central plane of the correction element 244 perpendicular to the optical axis 271.
• the base body 277 and the lever body 279 have step-shaped recesses facing one another, so that a total of one adjacent to the joint 280
• Receiving recess 281 is formed.
• a piezo actuator 282 is inserted into this and can be changed in length in the direction parallel to the optical axis 271.
• the piezo actuator 282 is connected to a control device 284 by a control line 283 indicated in FIG.
• the lever body 279 bears against the chamfer surface 273 in FIG. 3, so that the lever body 279 with the section of the base body 277 assigned to it over the
• Contact body 285, 276 acts like a pair of pliers on the chamfer surfaces 273, 274 of the correction element 244.
• the correction element 244 coupled to the force introduction device 270 is used as follows:
• the control device 284 calculates a voltage distribution which is to be set in the correction element 244, and thus by the voltage distribution caused by this Changes in the optical properties of the correction element 244 compensation of the aberration is achieved. From the calculated voltage distribution, the control device 284 determines deflection values that the piezo actuators 282 of the force introduction device 270 have to transmit to the respective lever bodies 279, so that the resulting forceps effect between the base body 277 (cf. contact tip 275) and the lever bodies 279 the contact tips 286 on the chamfer surfaces 273, 274 results in an introduction of force which leads to the formation of the calculated stress distribution.
• the system tips 275, 286 ensure a defined application of force without tilting.
• FIG. 4 shows an alternative contact body 385 in a detail section which corresponds to that which is marked by a solid circle in FIG. 3.
• the contact body 385 is articulated on the lever body 379 via two articulated connections 387, 388. These are arranged on the "roof edges" of two triangular brackets of the lever body 379, between which the lever body 379 is set back, so that it is spaced from the contact body 385 between the articulated connections 387, 388.
• the contact body 385 is made of resilient material. On its side facing away from the lever body 379, the contact body 385 has a contact nose 389, which on the Chamfer surface 373 of the correction element 344 rests.
• Figure 3 can according to the type of investment body 385.
• Fig. 4 be executed.
• the contact body 385 works as follows:
• the contact body 385 As long as no force is applied, is arranged either parallel to the chamfer surface 273 or at a certain angle to it.
• the spring action of the contact body 385 and the articulated connections 378, 388 ensure that, regardless of the presence of such an angle, the contact nose 389 always acts on the chamfer surface 373 when the force is applied without tilting.
• the articulated connections 387, 388 can be designed as conventional articulated connections or as solid-state joints.
• An alternative force introduction device 470 having a three-fold rotational symmetry for the
• Correction element 444 is shown in FIGS. 5 and 6.
• the base body 477 with the bores 478 is designed as a ring surrounding the circumferential surface 472 of the correction element 444, which is also shown only in part in FIG. 6.
• the force introduction device 470 is also mirror-symmetrical with respect to the central plane of the correction element 444, which is perpendicular to the optical axis 471, so that in the following it will suffice to use only the upper half of FIG To describe force introduction device 470 in detail.
• a plurality of shear piezo actuators 490 are connected flat to the base body 470, two of which are shown in FIG. 5 and lie opposite one another on both sides of the base body 477.
• the shear piezo actuators 490 are connected to the control device 484 via control lines 483.
• the shear piezo actuators 490 are connected flatly to thrust bodies 491, which rest against the chamfer surfaces 473, 474 of the correction element 444 via contact bodies 476, 485 with contact tips 475, 486.
• the force introduction device 470 is formed by three pairs of thrust bodies 491 lying opposite one another with respect to the base body 477 with associated shear piezo actuators 490, which are each offset by 120 ° around the circumferential surface 472 of the correction element 444.
• the correction element 444 with the force introduction device 470 is used as follows:
• control device 484 analogous to that described in connection with FIG. 3, a calculation of setpoints for the introduction of force of the thrust body 491 or the associated deflections of the shear piezo actuators 490 takes place. Actuators 490 are converted via control lines 483 into the desired voltage distribution in correction element 444.
• Partial forces acting on the system tips 475 on the one hand and 486 on the other are dimensioned such that they add up to a total force in the neutral surface of the correction element 444. Analogous to that described above in connection with the force introduction device 270, no bending moments are thus exerted on the correction element 444.
• FIGS. 7 and 8 show a further alternative of a correction element 544, in which a defined voltage distribution is generated by means of a force introduction device 570.
• the correction element 544 is an asymmetrically biconcave lens with an upper chamfer surface 573 and a lower chamfer surface 574 in the edge region. This is held by a plurality of spring arms 592 which are flexible in the direction of the optical axis 571 of the correction element 544.
• the lower chamfer surface 574 bears against a correspondingly beveled support surface of the spring arms 592.
• the spring arms 592 each have a spring arm section which adjoins this support surface perpendicular to the optical axis 571 and a second spring arm section which bends at right angles thereto in the direction of the optical axis 571. This second
• Federarma section merges into a connecting ring carrying the second spring arm sections of all spring arms 592, the inside diameter of which is larger than the outside diameter of the correction element 544.
• the connecting ring merges in one piece into a spring ring 593 coaxially surrounding the connecting ring.
• the latter has a smaller material thickness compared to the connecting ring parallel to the optical axis.
• the spring ring 593 connects the connecting ring in one piece with the annular base body 577, which in turn surrounds the spring ring 593 coaxially on the outside.
• FIG. 7 shows a section of the spring arm holder of the correction element 544, a total of six spring arms 592 being visible in this illustration, two spring arms 592 of which are each half.
• the spring arm holder according to FIGS. 7 and 8 thus has twenty spring arms 592, which are integrally formed on the circumference of the base body 577 and whose inner spring arm sections, which have the support surfaces for the correction element 544, extend radially inward similarly to wheel spokes ,
• the force introduction device 570 has a support ring 594, which is arranged coaxially with respect to the optical axis 571 around the peripheral surface 572 of the correction element 544.
• a plurality of piezo actuators 595 which are variable in length in the radial direction with respect to the optical axis 571, are supported on the inner lateral surface of the support ring 594.
• the piezo actuators 595 are connected to the control device 584 via control lines 583.
• the piezo actuators 595 are supported between the support ring 594 and bearing bodies 576 which bear against the circumferential surface 572 of the correction element 544 and are arranged between the piezo actuators 595 and the correction element 544.
• the contact bodies 576 each have two hemispherical contact projections 596, 597 which are offset parallel to the direction of the optical axis 571.
• twenty are the same in the circumferential direction of the support ring 594 distributed piezo actuators 595 with associated contact bodies 576.
• the arrangement of the piezo actuators 595 in the circumferential direction of the correction element 544 is such that, as the top view in FIG. 8 shows, one piezo actuator 595 is located in the circumferential direction of the support ring 594 between two spring arms 592.
• the piezo actuators 595 By supporting the piezo actuators 595 on the support ring 594 on the one hand and via the contact bodies 576 on the correction element 544 on the other hand, there is a self-supporting mounting of the force introduction device 570, carried only by the correction element 544.
• the piezo actuators 595 are parallel to the direction of the optical axis
• the force introduction device 570 is installed as follows and used to generate a stress distribution in the correction element 544:
• the auxiliary fixing elements for. B. on adjacent spring arms 592 holding elements, temporarily fixed.
• the support ring 594 is then brought into position around the circumferential surface 572 and is also temporarily fixed by means of auxiliary fixing elements.
• the piezo actuators 595 are now inserted between the contact bodies 576 and the support ring 594.
• the piezo actuators 595 are dimensioned such that there is a snug fit between the contact bodies 576 and the support ring 594.
• the auxiliary fixing elements can then be removed.
• the piezo actuators 595 are adjusted in such a way that their change in length and the force effect of the respective piezo actuators exerted on the correction element 544 result in a total force of the respective piezo actuator 595 via the contact projections 596, 597 the correction element 544 results, which runs along its neutral surface, so that no bending moments are exerted on the correction element 544 by the piezo actuators 595.
• a voltage calculated by the control device 584 is transmitted to the piezo actuators 595 via the control lines 583, so that a predetermined voltage distribution is generated.
• a contact ring which is coaxial with the support ring 594 can also be used instead.
• FIGS. 9 to 12 show further variants of contact bodies that can be used in connection with the force introduction devices, which were described above with reference to FIGS. 2 to 8.
• the contact body 676 in FIG. 9 is opposed by a length-adjustable piezo actuator 695 in the radial direction to the optical axis of the correction element 644
• the contact body 676 is a total of 5 engaging projections 697 ', 697 Y 697, / 697'''',697''''', on the circumferential surface 672 at.
• the contact body 697 'to 697''''' are formed on a contact bar 698, which is in a to the optical axis of the
• FIG. 11 shows a further variant of an abutment body 876.
• the abutment bar 898 is there via a central one
• the contact bar 898 has a cross-sectional design similar to the contact bar 698 according to FIG. 9, that is to say with respect to the sectional planes parallel to the drawing plane in FIG. 11 in the region of the middle contact projection
• a pressure distribution on the correction element 844 by means of the piezo actuator 895 results in a predetermined pressure distribution which 'on the circumferential surface 872 of the correction element 844.
• FIG. 12 also shows an embodiment of an abutment body 976. It also lies flat on the piezo actuator 995 on its side facing away from the correction element 944. On the surface facing away from the piezo actuator 995 and facing the circumferential surface 972 of the correction element 944, four pressure springs 967 ′ to 967 ′′ ′′ are attached to the contact body 976, which bear against the circumferential surface 972 of the correction element 944 via hemispherical contact sections.
• the compression springs 967 'to 967 1 ''' point different predetermined spring constants. For example, the two central compression springs 967 '', 967 '''have a higher spring hardness than the two external compression springs 967', 967 ''''.
• the cross-sectional surface shapes of the contact strips 698 to 898 or the spring constants of the compression springs 967 'to 967' '' 'can also have other shapes or value distributions.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Public Health (AREA)
• Environmental & Geological Engineering (AREA)
• Epidemiology (AREA)
• Engineering & Computer Science (AREA)
• Health & Medical Sciences (AREA)
• Chemical & Material Sciences (AREA)
• Crystallography & Structural Chemistry (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Lenses (AREA)
• Lens Barrels (AREA)

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• 2001
  • 2001-05-15 DE DE10123725A patent/DE10123725A1/de not_active Withdrawn
• 2002
  • 2002-04-29 TW TW091108888A patent/TWI266149B/zh not_active IP Right Cessation
  • 2002-05-04 EP EP02769464A patent/EP1390813A2/de not_active Withdrawn
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