EP1276827A2 - Dispositif de fixation - Google Patents
Dispositif de fixationInfo
- Publication number
- EP1276827A2 EP1276827A2 EP20010930753 EP01930753A EP1276827A2 EP 1276827 A2 EP1276827 A2 EP 1276827A2 EP 20010930753 EP20010930753 EP 20010930753 EP 01930753 A EP01930753 A EP 01930753A EP 1276827 A2 EP1276827 A2 EP 1276827A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- adhesive
- susceptor
- fastening device
- contact
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
- B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
- B29C65/3672—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint
- B29C65/3676—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint being metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
- B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
- B29C65/3604—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint
- B29C65/3608—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements
- B29C65/3612—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements comprising fillers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
- B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
- B29C65/3604—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint
- B29C65/3644—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint being a ribbon, band or strip
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
- B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
- B29C65/3672—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint
- B29C65/3676—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint being metallic
- B29C65/368—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint being metallic with a polymer coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
- B29C65/36—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
- B29C65/3672—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint
- B29C65/3684—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint being non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
- B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
- B29C65/5007—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the structure of said adhesive tape, threads or the like
- B29C65/5035—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the structure of said adhesive tape, threads or the like being in thread form, i.e. in the form of a single filament, e.g. in the form of a single coated filament
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
- B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/727—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being porous, e.g. foam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/729—Textile or other fibrous material made from plastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/84—Specific machine types or machines suitable for specific applications
- B29C66/861—Hand-held tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/02—Aluminium
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1043—Subsequent to assembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2813—Heat or solvent activated or sealable
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2813—Heat or solvent activated or sealable
- Y10T428/2817—Heat sealable
- Y10T428/2826—Synthetic resin or polymer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/31692—Next to addition polymer from unsaturated monomers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/31725—Of polyamide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Definitions
- the disclosed invention relates to an electromagnetically-activateable fastening device which may be used, for example, to fasten decorative materials, such as moldings, laminates and wall coverings, to surfaces, such as wood, concrete, plaster or wallboard.
- the fastening device disclosed may be used in a wide variety of building applications, including structural applications.
- the fastening device is heat-activated, for example, by exposure to electromagnetic waves, and possesses improved heating efficiencies which allow activating using hand-held and low- powered induction heating devices.
- the fastening device of the present invention may be reversible in that it may be removed without significantly damaging the surface to which it was fastened.
- Glues or other adhesives can be messy, difficult to apply to surfaces and tend not to be reversible, as anyone who has ever tried to strip wallpaper from a wall can readily attest. It would be highly desirable, therefore, to have a fastener which is not only strong and easy to use, but which does not significantly mar either of the surfaces being fastened and which, if desired, can be readily reversed allowing the fastened surfaces to be easily separated. That is what the present invention accomplishes.
- the bond strengths do not have to exceed 2,500 psi, or in many cases, 1,000 psi. Furthermore, the bond strengths do not have to be stringently uniform or as tightly repeatable. Finally, and importantly, it is highly desirable that the bond times be very fast, less than one minute, usually less than ten seconds, and frequently even less than two seconds. This is also what the present invention accomplishes.
- microwave heating with hysterectically activateable magnetic particles is a solution in many respects to the above-described problem, microwave heating may be unsafe for use in a human environment and must be used in a highly controlled environment to minimize these safety concerns.
- the present invention permits such fastening to be carried out both in a controlled manufacturing plant environment and in a much less controlled construction site environment.
- thermoplastic welds to join metal surfaces for example in the aircraft industry, is disclosed in a number of patents. Some of these patents utilize structural susceptors which provide a vehicle for carrying the thermoplastic adhesive resin and for reinforcing the bond formed.
- thermoplastic welds based on induction heating are also known. See, for example, U.S. Patent 4,017,701, Mittelmann, issued April 12, 1977; U.S. Patent 5,266,764, Fox, et al, issued November 30, 1993; U.S. Patent 5,350,902, Fox, et al., issued September 27, 1994; U.S. Patent 5,374,808, Coultrip, et al., issued December 20, 1994; U.S. Patent 5,374,809, Fox, et al., issued December 20, 1994; U.S. Patent 5,874,713, Cydzik, et al., issued February 23, 1999; and U.S. Patent 5,378,879, Monovoukas, issued January 3, 1995.
- U.S. Patent 4,038,120, Russell, issued July 26, 1977 describes the use of an energized heating element or wire to heat a hot melt glue resulting in adhesion between contiguously assembled panels.
- the disclosed method involves heating a glue-coated wire to liquefy the glue, producing a cohesive state and facilitating the assembly of panels. This method is said to be useful for introducing a cohesive material (glue) to an area of limited accessibility (groove).
- the use of the heating element (wire) requires the direct application of energy (electricity) to provide the heat to melt the glue.
- U.S. Patent 3,996,402, Sindt, issued December 7, 1976 relates to the assembly of sheet materials by the use of a fastening device utilizing an apertured sheet of any current-conducting material sandwiched between coatings of hot melt glue.
- An induction heating system is activated causing eddy current heating in the current- conducting material with consequent melting of the hot melt glue, thus resulting in fusion and bonding of the sheet materials.
- the susceptor sealant is characterized by having particles, heatable by induction, dielectric or radiant energy, dispersed in a thermoplastic carrier compatible with the thermoplastic sheets to be welded.
- the welding of the thermoplastic sheets takes place by exposing the susceptor sealant to heat energy, softening the carrier material and joining all thermoplastic materials.
- Patent 3,612,803, Klaas, issued October 12, 1971 discloses a fastening device which consists of a quantity of heat-activateable adhesive containing a closed electrically-conductive loop and a ferromagnetic material insulated from said closed loop.
- the fastening device is activated by a solenoid coil energized with alternating electrical current.
- the current emitted from the solenoid is transferred to the fastening device where a current of large amperage and low voltage is generated in the loop enveloped by the heat-activateable adhesive.
- the current produces heat that causes the adhesive to become sticky.
- the efficiency of the disclosed device is improved by fitting it with a ferromagnetic core enclosed within the closed loop.
- U.S. Patent 5,770,296, Remerowski, et al., issued June 23, 1998 describes a fastening device which is useful in facilitating the assembly of associated parts by employing a heat-activated assembly element, such as dowel or a disk or a strip constructed to include a target material, and a solid substance which will exhibit adhesive and expansive properties on exposure to heat. The heat is generated in the target material by exposing the target material to electromagnetic waves. See also, U.S. Patent 5,935,369, Remerowski, et al., issued August 10, 1999; U.S. Patent 5,932,057, Remerowski, et al., issued August 3, 1999; and U.S. Patent 5,938,386, Remerowski, et al., issued August 17, 1999.
- the present invention relates to a fastening device for promoting the assembly and adherence of associated pieces upon exposure to electromagnetic energy, comprising a susceptor sheet, preferably having a thickness of no greater than about 2 mils, and a heat-activateable adhesive on at least one surface of said susceptor.
- the adhesive is placed on the susceptor such that where a test surface congruent in shape to the susceptor surface is placed on the outward side of the adhesive: (a) at least about 35% of the area of adhesive in contact with said test surface can have inscribed within it circles having a diameter of about V" or less (preferably l A" or less); and, preferably,
- At least about 35% of the area of adhesive in contact with said test surface can have inscribed within it circles having a diameter of about l A" or less (preferably V" or less); and preferably
- the contact area represented by conditions (a) and (b) is less than the contact area represented by conditions (c)
- the preferred susceptor is a metal foil and the adhesive may be placed on the susceptor either in a continuous or a discontinuous manner, either randomly or in a pattern, as long as the coverage conditions defined above are met.
- the first condition is essential to obtaining the required holding strength and speed of binding from the adhesive article (conditions (a) through (d)), while the second condition (condition (e)) is necessary to permit the bond to be reversed without significant adverse effects to the surfaces being bonded.
- Preferred susceptors are those activateable by induction heating, most preferred are those activated by frequencies of about 1,000 kHz or less.
- the present invention encompasses a method for bonding surfaces together.
- the adhesive portion of the fastening devices described above is placed against the surface (or surfaces) to be bonded and the device is activated to heat the adhesive, such that no more than about 65% of the surface area of each surface to be bonded is in contact with the adhesive after heating.
- components of the device can also be placed individually in the appropriate configuration against the surfaces to be bonded, rather than placing them together as a single fastening device.
- Figure 1 is a perspective top view of a fastening device of the present invention.
- Figure 2 is a cross-sectional view of the fastening device illustrated in Figure 1.
- Figure 3 is an alternative embodiment, shown in cross-section, of the fastening device illustrated in Figure 1.
- Figure 4 is a perspective top view of another embodiment of the fastening device of the present invention.
- Figure 5 is a side view illustrating the use of the fastening device of the present invention.
- Figure 6 is a side view of the embodiment described in Example 1.
- Figure 7 is a top view of a random web adhesive pattern in that embodiment.
- Figure 8 is a cross-sectional side view of another embodiment of the fastening device of the present invention.
- Figure 9 is an enlarged perspective top view of the present invention illustrating how the adhesive configuration on the product is defined.
- Figure 10 is a side view of the embodiment described in Example 2.
- Figures 11, 12 and 13 show side views of two embodiments described in
- Figures 14 and 15 show top views of adhesive placement patterns which exemplify those used in such embodiments.
- the present invention relates to a fastening device which very effectively, efficiently and quickly fastens materials, such as roll goods or millwork, to a variety of work surfaces.
- Preferred fastening devices of the present invention form a bond which can be reversed.
- the basic elements of the fastening device include a susceptor sheet and a heat-activateable adhesive placed on that susceptor sheet in a specifically-defined configuration.
- the fastening device may also optionally include other components, such as a supplemental structural layer and/or a primer. All of these components will be discussed in detail herein.
- the fastening devices of the present invention are particularly useful for fastening roll goods or millwork onto surfaces in the course of the construction process.
- Roll goods for example, comprise linoleum, tar paper, interior wall coverings, wood and metal veneers, vinyls (such as Naugahide), polyesters, synthetic fabrics (such as nylon, rayon and the like), plastic laminates, roofing base, intermediate and finished plies.
- the present invention is particularly useful for fastening materials with linear profiles, such as millwork. Millwork is the term used to describe products which are primarily manufactured from lumber in a planing mill or woodworking plant, such as moldings, door frames and entrances, blinds and shutters, sash and window units, doors, stair work, mantels and porch work.
- Millwork also includes shelf edge banding, toe boards, trim panels, scribe molding, chair front panels, and bead molding, which serve both a decorative and functional purpose. While adding visual appeal, contrast and style, they also provide a seamless continuity to adjoining parts, provide a wear surface, act as drawer handle pulls or door pulls, and affix upholstery and fabric.
- the present invention is particularly useful for attaching moldings onto surfaces such as drywall, gypsum board, plaster, plywood, oriented strand board, or particle board.
- Moldings are decorative strips of wood or plastic that are designed to perform useful functions as well as visual enhancements to a work surface.
- window and door casings cover the gap between the jamb and the wall covering, and they also make the installation more rigid.
- moldings include bed and cove moldings, door and window stops, mullion casings, battens, glass beads, drip caps, apron and stool moldings, and picture and screen moldings.
- One of the real advantages of the present invention is that it can be effectively used to fasten together painted and other finished surfaces without causing damage (e.g., nail holes) to those surfaces. All of these moldings, as well as other forms of millwork and roll goods, can easily and securely be affixed to a work surface using the fastening device of the present invention.
- the fastening devices of the present invention are particularly useful for home construction, they may also be used in cabinet assembly, automotive assembly, boat assembly, aircraft manufacture, or any other manufacturing or construction-based industries where parts need to be fastened together in a strong and convenient manner.
- the fastening device of the present invention is utilized by placing it between the two surfaces to be fastened and then activating the adhesive on the device, for example with electromagnetic waves, to adhesively join the surfaces.
- the fastening device is placed adjacent to the back surface of the roll goods and the top surface of the work surface to be covered.
- the fastening device of the present invention may be fashioned such that it actually can be purchased as a part of the roll goods or mill work, for example, attached to the back surface of a wall covering or the back surface of a molding, so that all that needs to be done is to position the covering or molding at the appropriate point on the work surface and activate the adhesive.
- the key elements of the fastening device of the present invention include the susceptor sheet and a heat-activateable adhesive placed on the susceptor sheet in a specifically-defined configuration.
- the susceptor layer will generally be made from a material which is activateable by induction heating (i.e., one which will generate heat in the presence of alternating current electromagnetic waves), most particularly those which may be activated by a hand-held induction heating tool, for example, materials and configurations which are activateable by frequencies of about 1,000 kHz or less, preferably about 500 kHz or less.
- the susceptor is in the form of a sheet or tape, particularly a foil, preferably having a thickness of no greater than about 2 mils, more preferably no greater than about 1 mil.
- the preferred thicknesses of the susceptor tape or foil will necessarily vary due to differences in heating efficiency of foils of different thicknesses or compositions.
- susceptors made of 0.25 mil to 0.50 mil aluminum are typical because heat generation is rapid in the thinner susceptor.
- a thicker susceptor, 2 mils or thicker will be used for slower heating where a relatively long time chemical reaction or adhesion flow mechanism must occur.
- the susceptor may be present in the form of a continuous sheet (e.g., a foil), but can also comprise a discontinuous sheet such as one made from interconnected particles or interwoven fibers, as long as it is activateable by induction heating (as used herein, "susceptor sheet” is intended to encompass all such embodiments). It is preferred that the susceptor be substantially planar in configuration.
- Preferred susceptors are made from metallic foils or non-metallic foils, with metallic foils being particularly preferred.
- metallic foils include those made from metallic fibrous materials, conductive metal materials and conductive magnetic materials.
- Preferred metallic materials include steel, iron, aluminum, copper, nickel, tin or amalgams thereof, with aluminum being particularly preferred.
- a non-metallic material useful in the present invention as the susceptor includes carbon.
- the surface of a susceptor may be smooth or textured (for example, grooved, cross-hatched, roughened, pitted or stamped). A textured surface frequently can provide better gripping of the adhesive material and, therefore, better holding capacity. It can also provide for discontinuous contact between the susceptor and the adhesive, helping to determine the melt speed of the adhesive.
- the surface of the susceptor may also be solid or perforated.
- a perforated susceptor is useful in certain embodiments because it can provide concentrations of heat at specific points and can also allow the fastening device of the present invention to be easily adjusted to the size required for a specific fastening operation.
- the color of the susceptor can also be varied (e.g., silver or black) to provide particular heating properties to particular areas of the substrate.
- the shape or perimeter of the susceptor sheet may have an impact on the ability of the fastening devices of the present invention to effect optimal bonding.
- a mathematically smooth perimeter i.e, a simple closed curve without angles
- Departures from a mathematically smooth perimeter for example the presence of sharp internal angles in the perimeter, can result in spots which become very highly heated during exposure to electromagnetic radiation, while larger external angles can result in points which are not as highly heated.
- the outer (edge) shape of the susceptor can be used to bring the greatest heating to specific points where it is most greatly needed.
- the edge effect By using the fact that the greatest heating generally takes place at the edges of the susceptor (the so-called “edge effect”), greater heating efficiency can be achieved in the article of the present invention.
- the adhesive is concentrated close to the susceptor edges, it can be heated and melted more quickly, using a lesser amount of energy, because of the edge effect. This is in sharp contrast to the prior art where the edge effect is treated generally as something to be avoided.
- the second required component in the present invention is the heat-activateable adhesive which is placed on one or both surfaces (faces) of the susceptor sheet.
- the adhesives utilized in the present invention are heat-activated, i.e., ones in which the addition of heat either melts the adhesive rendering it capable of bonding, or triggers a chemical reaction, such as a cross-linking reaction, causing the adhesive to bond.
- Such adhesives are well-known in the art, and are disclosed, for example, in Adhesives and Sealants, Engineered Materials Handbook, Volume 3, ASM International, 1990, inco ⁇ orated herein by reference.
- Preferred adhesives include hot melt adhesives, curable adhesives, and mixtures thereof.
- hot melt adhesives are solid at temperatures below about 60°C. As the temperature increases beyond this point, the material rapidly melts to a fluid which forms a bond after cooling and setting in a solid state. Because hot melt adhesives are thermoplastic, the melting-resolidification process is repeatable with the addition and removal of heat.
- hot melt adhesives examples include ethylene and vinyl acetate copolymers (EN A), polyvinyl acetates (PVA), polyethylene (PE), amophorus polypropylene block copolymers such as those based on styrene and elastomeric segments or ether and amide segments, polyesters and polyamides, with polyamides, polyolefins and ethylene/vinyl acetate copolymers being particularly preferred.
- Foamable hot melt adhesives are also particularly preferred for use in the present invention. These materials are intended to encompass adhesives which are prefoamed, as well as those which foam when heat is added to them. In the former, either nitrogen or carbon dioxide is introduced into the hot melt, resulting in a 20% to 70% increase in adhesive volume.
- the foaming increases hot melt spreading and open time. This method is frequently used with polyethylene hot melt adhesives.
- curable adhesives include urethanes, epoxies, acrylics and phenolics, with acrylics and phenolics being particularly preferred because of their fast cure times.
- the physical and chemical properties of various adhesives are well-known in the art. The particular application for which a fastening device of the present invention is to be used will define the particular adhesive which is optimal for inclusion in that device.
- heat-activateable adhesives are a required element of the present invention
- other types of adhesives may additionally be included as optional components.
- areas of pressure-activated adhesives may be included on the susceptor together with the heat-activated adhesives. This embodiment permits the article to be placed at its desired location and held there temporarily by the pressure-sensitive adhesive while the heat-activated adhesive is utilized to provide the more permanent bonding. This would be a significant help to the user of the invention in locating and lining-up the object to be fastened.
- a preferred method for fastening an object to a work surface has been developed wherein a certain portion of the surface of an induction-activatable adhesive system is coated with an additional adhesive system that, among its other properties, is pressure-sensitive to an object, the work surface, or both, for most applications, at all temperatures from the coldest storage temperature to which the fastening system can be exposed, to the highest temperature of application of the adhesive system.
- the method involves placing the adhesive system onto the object, the work surface, or both, in any of several preferred positions, prior to induction activation by electromagnetic means.
- This preferred innovative method is particularly useful where pre-positioning, prior to bonding, allows changes to be made that can be readily appreciated prior to the permanent, or stronger bond created by the induction process. This is especially true where more than one object is being applied to a work surface, or work surfaces, especially where the objects must be in close proximity, as is the case when one is trimming-out a door or window for a house, a boat, or a car.
- the assembly of more complex structures, such as windows or doors can be adapted to this method with the same thoughts in mind.
- a pressure-sensitive adhesive employed in these induction adhesive systems can be the only adhesive element employed, or it can be one of several adhesive elements.
- the pressure-sensitive adhesive component may cover 100% or less of the surface of either the object or the work surface. Where less than 100% of the surface area contacting the substrate, the work surface, or both, is composed of the tacky, pressure-sensitive adhesive component, that component is not required to undergo a change in chemical or physical disposition as long as the other adhesive element or elements flow around it, or contact sufficient surface area, after induction, to provide an adequate bond.
- the pressure sensitive adhesive used is the sole adhesive component and is one which converts to an adhesive providing a stronger, more permanent bond upon the application of heat energy.
- the addition of electromagnetic energy, particularly in the form of heat converts the pressure sensitive adhesive to one with increased strength, particularly one which exhibits substantially no creep under conditions of use. Creep is measured using ASTM test method D4680-92. This conversion may take place, for example, by a chemical reaction, a phase change or even a physical change (e.g., a change in crystalline structure or a mixing of physically-separated components).
- the reinforcing materials can be any that provide improved strength to the new susceptor structure while not being substantially electro-magnetically activatable to produce heat.
- Thermoplastic and thermoset polymer structures are typically utilized, optionally with some kind of reinforcement that is isotropically strong. Isotropically strong materials may also be utilized alone as the form of reinforcement. Examples of such an isotropic reinforcement include continuous or discontinuous fibers, flakes, and the like, typically carbon, glass, olefinic, aramid, boron, nylon, polyester, cellulosic, and the like, or combinations of these.
- the reinforcement may be in a continuous or discontinuous structure and may be ordered (knit, cast, welded, etc ..) or random (i.e., spun bonded).
- This reinforcement layer is preferably less than 10 mils, more preferably less than 2 mils, and most preferably less than 1 mil in thickness.
- Optional insulative materials and/or layers may be added to restrict thermal losses through the reinforcing layer.
- the overall adhesive/susceptor-system structures or the individual components may be flat, textured, perforated, or any combination thereof. Either a portion or all of the adhesive/susceptor structure may be reinforced. The reinforcement may vary in strength from one section to another. Changes are meant to facilitate handling and/or the assembly and/or disassembly of objects.
- the structures may be utilized as particles, chips, flakes, sheets, discs, strips and so on, and stored as rolls, coils, or flat stacks where possible.
- Discontinuous or continuous adhesive coatings, and controlled substrate and/or susceptor contact are also be advantageously combined with this invention.
- the adhesive systems employed may be thermoset, thermoplastic, or a combination of these.
- the adhesives may be foaming, reversibly polymerizable, have expansion or contraction properties, and so on.
- the adhesives may be coated, or may contact all or part of the susceptor structure, either before or after bonding.
- the adhesives and/or the susceptor structure also may be reinforced by fibers, flakes, or other fillers, depending upon the desired physical or chemical effect, either before or after bonding.
- Such structures can be utilized either reversibly or irreversibly. These structures are particularly useful improved regarding reversibility since it permits removeability and reuse of expensive materials, such as exotic woods.
- the susceptor sheets or sections within the structures themselves can be composed of various metals and alloys or other magnetically activateable materials.
- the sheets can either be perforated, textured, or otherwise modified, as well, to achieve a preferred bond, heating profile.
- the adhesive utilized in the present invention may be in solid, semi-solid, liquid or viscous liquid form at room temperature. However, solid or semi-solid form adhesives are preferred, with solid form adhesives being particularly preferred, since they are easiest to handle. It is preferred that the adhesives utilized in the present invention soften at a temperature greater than about 60°C, preferably at a temperature greater than about 70°C, and most preferably at a temperature greater than about 80°C.
- the pattern in which the adhesive is applied to the face (or faces) of the susceptor sheet constitutes an important part of the present invention.
- the adhesive may be applied to one or both sides (faces) of the susceptor sheet. This will depend on whether the fastening device of the present invention is to be used to fasten together two surfaces of the consumer's choice or whether the fastening device of the present invention is to come pre-attached to a surface (such as a wall covering or molding) which is then bonded in place by the consumer.
- the adhesive may be applied to the susceptor sheet in a random manner or in an ordered pattern, as well as in a continuous or a discontinuous manner, as long as the limitations on coverage discussed below are met.
- the adhesive may be placed on the susceptor sheet as an "elongated bead" in the form of a web, such as a random web or an ordered web. In either case, this would be an example of a continuous application onto the susceptor.
- a particularly preferred device of the present invention has the adhesive placed on the susceptor sheet in a random overlapping web (i.e., a random web of overlapping loops). See Figure 7.
- the adhesive may also be applied in a discontinuous manner, such as in spots or lines on the susceptor sheet surface. See Figure 1.
- spots or lines may be of any shape, either flat on the sheet, for example, circular, triangular or square, or in three dimensions, for example, spherical, pyramidal, conical, cylindrical, cubic, donuts (tauric) or stars, and may be placed either in a regular pattern across the susceptor sheet surface or randomly across the susceptor sheet surface.
- the adhesive may be placed on the susceptor using conventional equipment, such as the Nordson Model 3400, commercially available from Nordson Co ⁇ oration, Norcross, Georgia.
- a preferred embodiment is a continuous web made up of overlapping swirls of adhesive. This adhesive configuration not only provides efficient bonding, but also increases the durability of the susceptor/adhesive article. See Figure 7.
- the adhesive used in the present invention may be prepared in situ. For example, a liquid mixture of monomers, resins and other necessary ingredients can be printed or otherwise transferred or placed onto both or either the substrate and the susceptor. This mixture can then be polymerized, either wholly or partially, either linearly or cross-linked, by, for example, UV, visible light, moisture, or thermally, to very efficiently produce a device of the present invention.
- a critical aspect of the placement of the adhesive on the susceptor sheet surface is the amount of coverage by the adhesive of the sheet's surface (and the surface to be bonded) before a bond is formed. If the adhesive covers too much of the susceptor surface relative to the total susceptor surface available, then heat transfer to the surface will be too rapid, and heat accumulation will not occur. Further, if the adhesive covers too much of the surface to be bonded, then heat accumulation will also be compromised and the bond formed will be so strong that it will not be reversible without damaging the surface to which the bond is made. As discussed above, reversibility of the bond is an important preferred element of the present invention.
- the amount of contact between the adhesive and the susceptor and the adhesive and the surface to be bonded must be carefully balanced to achieve appropriate heat accumulation (and therefore speed of heating), strength of bonding and, if desired, bond reversibility.
- adhesive is placed on the susceptor surface such that when a test surface congruent in shape to the susceptor is placed on the outward side of the adhesive (i.e., the side which contacts the surface to be bonded):
- At least about 35% (and preferably at least about 50%, more preferably at least about 75%, and most preferably at least about 90%) of the area of adhesive in contact with said test surface can have inscribed within it circles having a diameter of about l ⁇ " (preferably about l A", more preferably about 3/16", still more preferably about 1/8", and most preferably about 3/32") or less (these inscribed circles are generally at least about 0.001" in diameter, and preferably have diameters between about 0.05" and about 0.001"); and preferably
- the contact between the adhesive and the susceptor may be either continuous or discontinuous. Discontinuous contact between the adhesive and the susceptor is preferred. In fact, it is preferred that if a test surface congruent in shape to the susceptor is placed against the inward side of the adhesive (i.e., the side which contacts with the susceptor), the following conditions are met:
- At least about 35% (and preferably at least about 50%, more preferably at least about 75%, and most preferably at least about 90%) of the area of adhesive in contact with said test surface can have inscribed within it circles having a diameter of about V" (preferably about V", more preferably about 3/16", still more preferably about 1/8", and most preferably about 3/32") or less; and preferably (d) from about 0.001% to about 65% (preferably from about 0.001% to about
- Conditions (a) and (c) are important because they require that before bonding, the adhesive be spread out over the surface of the susceptor and that there not be large contiguous areas, within the areas covered by adhesive, which are completely covered by adhesive. Such large areas not only lead to ineffectively long bonding times, but also lead to premature or excessive heat loss to the substrate and/or substrate damage.
- Conditions (b) and (d) are important because the extent of contact between the susceptor, the adhesive and the substrate will help govern the extent of heat flow between them.
- Condition (e) which defines conditions after bonding, not only helps assure that the bond is reversible, but it also helps assure effective heat transfer in the fastening device.
- test surface utilized in the above criteria is congruent in shape with the susceptor sheet surface, such that (in the absence of adhesive), if the test surface was laid on top of the susceptor sheet, the two surfaces would touch at substantially all points (i.e., at least about 80%, preferably at least about 95%, of the surface area of the surfaces will be in contact with each other).
- the susceptor and, therefore, the test surface will be substantially flat (i.e., substantially planar), but that will not necessarily always be the case.
- test procedure Post-Bonding Adhered Area (PBAA) Test
- PBAA Post-Bonding Adhered Area
- the adhesive side of a fastening device is placed under a glass plate which is generally congruent in shape to the device (generally, this will mean substantially flat).
- a weight is placed on the glass plate to produce a force of about 5 psi (based on the area of adhesive coverage).
- the device and plate are then placed in a forced air oven at a temperature 10°C above the melting point of the particular adhesive being used for a time sufficient to allow melting and flow of the adhesive (usually not more than about 5 minutes).
- the device and plate are then removed from the oven and allowed to cool to air temperature. The area of the test surface in contact with the adhesive is then measured.
- the adhesives placed on the susceptor sheet may have a variety of configurations.
- adhesive may be placed on the susceptor sheet such that it is flat or relatively flat in terms of its height.
- it may also be placed such that it has height and the shape of the adhesive along the axis of its height may have an effect both on the bond formed and the speed with which the adhesive heats up and melts.
- those sheets may provide for very efficient heat transfer from the susceptor to the adhesive and, therefore, may be activated using a smaller amount of applied energy than if the apex of the adhesive spot had a larger surface area.
- the article of the present invention contacts the surface to be bonded at the small apexes, rather than the larger bases, the area of contact is smaller.
- the pre-bonding area of contact between the adhesive and the substrate to be bonded be relatively small (see condition (b)), while the post-bonding area of contact may be somewhat larger (see condition (e)).
- the lower limit of conditions (b) and (d) is "about 0.001%", since contact between adhesive and surface to be bonded may be effected through point contacts (e.g., the apex of a pyramid of adhesive) contact areas even smaller than this lower limit may be operable and are intended to be encompassed herein.
- FIG. 9 An example of how condition (a) is applied is shown in Figure 9. That figure shows a close-up view of an area of adhesive (outward side) on the susceptor which contacts the test surface. Also shown are circles inscribed within the area of adhesive contact. In order to satisfy condition (a), at least about 35% of that adhesive area of contact must be able to have inscribed within it circles having a diameter of no greater than about V". As used herein, "inscribed” has its usual mathematical definition, i.e., the circle is drawn within the adhesive area such that it is tangent to both the top and bottom edges of that area.
- a number of optional components may be included in the fastening devices of the present invention.
- a precoat, a coupling agent, and/or a primer may be applied between the susceptor sheet and the adhesive or between the substrate (discussed below) and the susceptor sheet.
- These treatments be they physical (e.g., surface treatment) or chemical (e.g., precoats, primers or coupling agents), act to enhance the strength of bonding between adjacent layers of the fastening device.
- primers for example, silanes
- Adhesives and Sealants Engineered Materials Handbook, Volume 3, ASM International, 1990, pages 254-258, inco ⁇ orated herein by reference
- a primer is a coating applied to a surface, prior to application of an adhesive, to improve the performance of the bond (see ASTM D907).
- the coating can be a low viscosity fluid that is typically a 10% solution of the adhesive in an organic solvent, which can wet out the adhered surface to leave a coating over which the adhesive can readily flow.
- the fastening devices of the present invention may include a supplemental (structural) layer between the susceptor and the adhesive, on the side of the susceptor opposite the adhesive, or both.
- the supplemental layer can have a thickness of up to about 10 mils (preferably no greater than about 5 mils, more preferably no greater than about 1 mil, more preferably no greater than about 0.5 mil, and most preferably no greater than about 0.1 mil and can serve a number of functional pu ⁇ oses.
- the supplemental layer can be comprised of insulation (e.g., glass batt - to direct heat transfer), foams (thermoplastic, thermoset, open cell or closed cell - to direct heat transfer), scrim (to provide structural integrity to the fastening device of the present invention, as well as to the bond formed), a continuous layer of adhesive, a thermoplastic material, a paper material, a fiber material (in a regular or random pattern), and mixtures of those materials.
- the supplemental layer may be continuous or discontinuous and is fastened to the susceptor by conventional means, such as spraying, roll coating, dip coating, melt application, laminating or printing.
- the adhesive When a supplemental layer is utilized, the adhesive will generally be placed on its upper surface (i.e., the face which is opposite that bonded to the susceptor), and all conditions regarding distribution of the adhesives, described above with regard to placement on the susceptor surface, apply.
- heat transfer within aluminum is 3-5 times that within most organic plastics and resins.
- heat can be effectively "stored” in the system for small bursts of time. This stored energy can then transfer to those parts of the system in contact with the substrate only after most of the adhesive has already been melted, reacted, or softened with lower amounts of total delivered power.
- more even heating is optionally achieved without complex perforation patterns or other susceptor treatments or preparations that are expensive, complex, and difficult to handle or prepare.
- thermally insulative layer may be placed between the substrate and the system. In all likelihood, this insulative layer will be attached by some other adhesive and mechanical means not meant for activation by this invention.
- the insulative layer could be a thin plastic sheet, a layer of foam, a plastic sheet filled with gas filled spheres, and so on.
- heat transfer to the insulative layer should, by definition, be lower than within the invention's adhesive system.
- a piece of thermally insulative scrim may be laminated to the foil with or without an adhesive and then the scrim-coated sided would be adhesively bonded to the trim, for example with a moisture cured urethane or a water-based urethane emulsion.
- the thermally activateable system would then be placed on the exposed side of the foil.
- the insulative layer may be pre-applied, and then itself act as the substrate to be bonded to.
- the susceptor sheet may also be placed on a substrate.
- This substrate may be the backside of one of the surfaces to be bonded.
- the substrate can be a molding, a wall covering, or wallboard.
- the susceptor is fastened to the substrate by conventional means, such as spraying, roll coating, dip coating, melt application, laminating or printing.
- heat preferably electromagnetic energy
- the adhesives bonding the parts of the fastening device of the present invention together must have different bonding/melting characteristics than the adhesive bonding the device to the surface. Specifically, it is important (e.g., through control of chemistry or thermal resistance) that those auxiliary adhesives do not soften and come apart when the main adhesive is activated by induction heating.
- the present invention is manufactured as a nestable tape.
- the fastening device is made as a strip of reinforced susceptor having adhesive on both sides (or a long substrate tape having susceptors and adhesive on both sides). If this tape is folded accordion style or rolled up, a large number of these tapes can be nested together for sale or convenient storage.
- the fastening device of the present invention When desirably situated at the appropriate point for bonding, the fastening device of the present invention is ready to be exposed to electromagnetic waves, produced by and emanating from a generator powered by a source of alternating current.
- the generator can be held in a fixed position for assembly line production or designed to be hand-held and manipulated so as to quickly and easily pass over, around or near the strategically hidden device while emitting electromagnetic waves which will penetrate the transparent associated pieces, be absorbed by the susceptor sheet, be converted to heat energy, activate the adhesive material and bond together the associated pieces.
- the frequencies of the electromagnetic waves can range from about 1 kHz to about 1,000 kHz, preferably about 500 kHz or less, with from about 50 kHz to about 300 kHz, being particularly preferred.
- Eddy current resistive heating applies to all susceptor materials and is produced in the susceptor by the electromagnetic waves emanating from the generator.
- the heat resulting from magnetic hysteresis is observed only in magnetic materials.
- the electromagnetic field produced by the generator reverses polarity, the magnetized atoms or molecules in the susceptor also reverse.
- This energy loss is magnetic hysteresis. The lost energy is quickly converted to heat and conducted by the susceptor to the contiguous and heat-activateable adhesive material to initiate adhesion.
- Electromagnetic wave generators for use in induction heating are well-known in the art and, for example " , are disclosed in U.S. Patent 4,017,701, Mittelmann, issued April 12, 1977; U.S. Patent 5,266,764, Fox, et al, issued November 30, 1993; and U.S. Patent 5,374,808, Coultrip, et al., issued December 20, 1994, all of which are inco ⁇ orated by reference.
- a preferred device is disclosed in U.S. Provisional Patent Application 60/163,301, Riess, filed November 3, 1999.
- FIG. 1 denotes an example of the fastening device of the present invention.
- This example comprises a substrate (1), for example a piece of wallpaper or molding, which (on its reverse side) has fastened to it a susceptor sheet (2) which carries on its surface a heat-activateable adhesive (3) which is arranged on the susceptor sheet in a regular pattern.
- the adhesive is arranged on the susceptor such that it satisfies the distribution criteria described above.
- the susceptor is aluminum foil having a thickness of 1 mil and the adhesive is a polyamide.
- Figure 2 shows a side cross-sectional view of the device shown in Figure 1, taken along the indicated line.
- the individual spots of adhesive (3) while having a square base, are pyramidal in shape, coming to a point at their apex.
- This embodiment provides for very efficient and effective heating because of the very small cross-sectional area found at the top of each adhesive spot.
- Figure 3 shows another embodiment of the present invention, in cross-section, essentially identical to that shown in Figure 1, except that the adhesive spots (3) are spherical, rather than pyramidal.
- Figure 4 shows another embodiment of the present invention (10) which is very similar to the one shown in Figure 1 except that, rather than having the adhesive (3) arranged in a regular (discontinuous) pattern across susceptor sheet (2), the adhesive (3) is arranged in a (continuous) random overlapping web.
- This configuration not only provides for efficient bonding, but it also reinforces the susceptor.
- the adhesive in both Figures 1 and 4 is arranged such that it meets the requirements defined in the present application for adhesive distribution across the susceptor sheet.
- Figure 5 illustrates the actual use of the fastening devices of the present invention (10).
- 5 denotes a wall on which a piece of molding is to be fastened; 1 denotes the substrate portion of the present invention which, in this case, is a piece of molding.
- Adhered to this molding is the susceptor sheet (2) and, on the surface of the susceptor sheet, are two types of adhesives: a heat-activateable adhesive (3), denoted by the triangular shapes, and a pressure-sensitive adhesive (4), denoted by the square shapes.
- a heat-activateable adhesive (3) denoted by the triangular shapes
- a pressure-sensitive adhesive (4) denoted by the square shapes.
- the molding is located on the wall at the point at which it is to be fastened. It is temporarily held in place by the pressure-sensitive adhesive by pushing onto the wall. This temporary placement can be adjusted, if desired.
- a hand-held electromagnetic generator (6) is then used to activate the fastening device of the present invention and thereby fasten the molding onto the wall at its desired location.
- FIG. 8 exemplifies another preferred embodiment of the fastening devices of the present invention (10).
- the substrate consists of a wood molding (1) which is to be adhered to a wall.
- the back surface of the molding is covered with a layer of primer (8) to which is glued the susceptor sheet (2).
- a supplementary layer (9) which in this case is a polymeric scrim which adds strength to the bond formed.
- the surface of supplemental layer carries the heat-activated adhesive (3) in the form of spherical dots across the surface.
- the present invention relates to a method for bonding surfaces together comprising placing the adhesive portion of one of the fastening devices described above against the surface to be bonded and heating the device to activate the adhesive.
- the surfaces being bonded together may include, for example, plaster, gypsum board, batten, plywood, fabric, wall coverings, vinyl and other polymeric materials, paper, and natural materials, such as wood and grass.
- the heating is preferably carried out by induction heating, preferably when using a hand-held apparatus, at a frequency of about 1,000 kHz or less, and more preferably at a frequency of about 500 kHz or less.
- induction heating can be carried out in a manufacturing operation using an assembly line and appropriate machinery to create the electromagnetic energy, it is also usefully handled using a hand-held tool which provides the electromagnetic energy.
- fastening devices of the present invention such that they include hot spots, for example, near the edges of the fastening device, in order to enable melting of the adhesive more quickly and with the application of less electromagnetic energy. This is not only more energy efficient, but also provides for faster bonding. Thus, it is useful to include higher concentrations of adhesive near to those hot spots, such as near the edges of the susceptor. This configuration is better suited to a quick bonding operation using a hand-held induction heating tool. This is in stark contrast to the prior art use of magnetic "welding", which goes to great lengths to eliminate hot spots and make sure that the heating of the adhesive is uniform throughout.
- the fastening devices of the present invention have adhesive on either one or both sides of the susceptor.
- the susceptor carries adhesive on both sides, the device is placed between the surfaces to be bonded and is heated.
- the surfaces which may be bonded together using the method of the present invention include, for example, wood, plaster, gypsum board, plywood, batten, fabric, wall coverings, vinyl and other polymeric materials, paper, and combinations thereof.
- the fastening device of the present invention may be made available to the user completely disassembled, partially assembled or completely assembled prior to the bonding process.
- foil may be prelaminated to a strip of material, but the adhesive layer is added immediately before activation.
- the adhesive may or may not be integrally connected to one or both sides of the susceptor or substrate prior to use.
- the adhesive layer may be preapplied to the surface to be bonded and the susceptor and other surface to be bonded are added just prior to bonding.
- two webs of spun bonded adhesive are assembled with foil in-line, but are not bonded to each other beyond mere physical contact.
- adhesive particles may be sprinkled onto a substrate, with foil preattached to another substrate; the two are brought together in any manner prior to activation.
- the assembly, held together by pressure and/or aligning implements, can then be activated.
- the actual embodiment of the device used for a particular application will be highly dependent on the requirement of that application, with specific attention being paid to product requirements, assembly requirements, sales, technology use and distribution.
- [082] Take a substrate (1), and attach the susceptor (2) with a liquid or semi-solid adhesive system (6) employing either a brush, roller, or other equipment to sufficiently spread the adhesive, reactive or unreactive, immediately or latently, and allow the volatiles, if any, to evaporate until the adhesive reaches a tacky state.
- a liquid or semi-solid adhesive system (6) employing either a brush, roller, or other equipment to sufficiently spread the adhesive, reactive or unreactive, immediately or latently, and allow the volatiles, if any, to evaporate until the adhesive reaches a tacky state.
- Examples of such processes include, but are not limited to, extrusion coating, knife over roll coating, and airless spray coating. Recognized process equipment manufacturers for this type of coating are represented by Nordson Co ⁇ oration, May Coatings and Rototherm.
- one side could be a continuous or discontinuous susceptor contact pressure sensitive adhesive that for the pu ⁇ oses of the bonding method is not adversely affected by the heating during the fastening process.
- the susceptor may be pre-coated with a pressure sensitive adhesive on one side and then be pre-applied by a hand-held or automated roller or unwinding system with or without pressure.
- a heat-curable component or element could then be inco ⁇ orated chemically or by formulation to convert the pressure sensitive adhesive during the bonding process.
- Insulating agents may be optionally added to this continuous layer to eliminate thermal losses without impairing desired ultimate strength in tension, shear, or peel under specific environmental conditions. Examples of insulating agents include, but are not limited to, air, nitrogen, argon, other gases, and micro-balloons. Fillers and/or reinforcing agents may also be added.
- the susceptor may be itself textured.
- the susceptor may also optionally contain holes or perforations to facilitate adhesive flow through the susceptor or to facilitate adhesive system separation, as with a postage stamp.
- the susceptor may also have its outer edges follow a geometric pattern, particularly mathematically smooth ones that facilitate edge heating without localized run-away heating.
- the susceptor may also have on one or both sides a reinforcing layer composed of a thin (less than 5 mils) plastic or reinforced plastic to facilitate susceptor handling and tear resistance.
- a primer such as a silane
- an aluminum surface pretreatment including, but not limited to, anodization, plasma treatment, or acid etching may also be optionally conducted on either or both sides of the susceptor, continuously or discontinuously.
- the discontinuous adhesive layer (3) is applied as per the definition in this application in the form of dots, lines, or a complex network of lines.
- a polyester or polyamide adhesive may be used for wooden trim.
- the adhesive pattern may be ordered, random, or a combination of both. It should be noted that in many cases where bond speed is critical (less than 0.5 seconds), adhesive placement may be biased to the edges of the susceptor, where heat will build up most rapidly. Curable adhesives, particularly latent or heat activateable ones, may be used where environmental durability or creep resistance is important. Fillers and/or reinforcing agents may also be added to achieve a desired performance effect.
- a supplemental adhesive may be over-applied or simultaneously applied to provide additional properties useful during a fastening process.
- a supplemental pressure sensitive adhesive layer of low to high tack discretely applied, coated, sprayed or printed can support at low overall bond strength the positioning of the trim for measurement or application prior to bonding.
- the discontinuous adhesive layer is produced utilizing any number of the various commercially available coating, spraying, printing and/or laminating processes. Again, examples of such processes are extrusion coating, knife over roll coating, airless spray, gravure printing and hot melt gravure printing.
- a continuous pattern adhesive can be applied via any standard coating technique such as rolling, spray, film lamination, and aqueous emulsion.
- Lamination can be utilized for spun or extruded adhesive webs, such as Bostik's Sharnet adhesives. This is an example of a three dimensional web where contact on one or both sides (susceptor, substrate) of the individual adhesive layer is minimized, but the overall surface area shadowed by the adhesive layer may border on 100%.
- Muliple layers of discontinuous adhesive that may be spun bonded are illustrated in Figure 7.
- the attachment and/or bonding adhesive materials can optionally be foamed during or after the manufacturing process, depending upon the specific application requirements. Adhesives that foam during bonding are meant to fill gaps. When prefoamed, the foam adhesives can be in a continuous layer. In this case, the continuous layer in contact with the susceptor is considered the supplemental layer.
- Foaming may occur by the use of chemical blowing agents, as well as the use of dissolving inert gases in the adhesive (e.g., Nordson Foam Melt System).
- the specific requirements might be viscosity during or after processing, mechanical properties of the adhesive, gap filling specifications and/or environmental performance needs.
- foaming should generally produce a foam density of no more than 65% of the density of the base unblown adhesive in order to maintain major performance characteristics, such as strength. It is further possible to bias the foaming to those portions of the target substrate adhesive layer that are actually in contact with either the susceptor and/or the substrate.
- the specific components used in making the described fastening devices are as follows:
- Target Substrate Paper or Acrylic Emulsion Coated Drywall Attachment Adhesive: Water-Based Emulsion Laminating Adhesive, 40% Solids
- Susceptor 0.50 mil aluminum foil Bonding
- Adhesive Polyamide, 190°C Melt Point Bonding
- Adhesive Form Three dimensional overlapping 3 /" diameter circular swirl, 1/16" wide bead
- Susceptor 0.50 mil aluminum foil Bonding
- Adhesive Ethylene Vinyl Acetate, 90°C Melt Point Bonding
- Adhesive Form Three dimensional overlapping 3 /" diameter circular swirl, 1/16" wide bead
- Susceptor Pretreatment Anodized Aluminum Surface, both sides
- Target Substrate Wood Attachment Adhesive: Water-Based Emulsion Laminating Adhesive, 40% Solids
- Susceptor 0.50 mil aluminum foil Bonding
- Adhesive Polyamide, 150°C Melt Point Bonding
- Adhesive Form 1/16" average width dots or geometric shapes gravure printed to 2-3 mil average height in a diamond array where each dot or shape has an average of 1/8" between them in any direction.
- Bonding Adhesive Form 1/16" average width dots or geometric shapes gravure printed to 2-3.5 mil average height in a diamond array where each dot or shape has an average of 1/8" between them in any direction. Patterns printed such that supplemental adhesive dots replace 15% of the bonding adhesive dots.
- Bonding Adhesive A Polyamide, 190°C Melt Point
- Bonding Adhesive B Moisture Curable Blocked Urethane Adhesive, 80°C Melt Point, 100°C De-blocking Temperature. Encapsulated organic liquid as an Internal Foaming Agent. Bonding Adhesive B Form: Three dimensional overlapping 3 /" by 1.25" oval swirl, 1/32" wide bead
- Susceptor Pretreatment Anodized Aluminum Surface, both sides
- Target Substrate Wood Attachment
- Adhesive Moisture Cured Urethane, 90°C Melt Point
- Susceptor 0.50 mil aluminum foil Bonding
- Adhesive A Compounded Urethane hot melt adhesive, 190°C Melt Point
- Bonding Adhesive B Moisture Curable Blocked Urethane Adhesive, 80°C Melt Point, 100°C De-blocking Temperature. Encapsulated organic liquid as an Internal Foaming Agent.
- Adhesive B Form Three dimensional overlapping V" by 1.25" oval swirl, 1/32" wide bead
- Susceptor Pretreatment Anodized Aluminum Surface, both sides
- the susceptor is generally flat (out-of- plane distortions are less than 10% or if greater than 10% cover less than 10% of the susceptor), generally a total layer thickness variation of at least 10% is the desired difference between the low points to the high points, with 25% or greater more preferred, and at least 50% or greater being the most preferred.
- a total layer adhesive and susceptor thickness variation of at least 10% is the desired difference between the low points to the high points, with 25% or greater more preferred, and at least 50% or greater being the most preferred.
- coating techniques provide for the impression or creation of texture, either randomly, ordered or both at the top of the adhesive layer, while still maintaining the continuous layer below.
- the discontinuous substrate contact adhesive layer may be applied as in Example 1 over a previously applied layer of adhesive which may or may not be the same.
- One or more adhesives can be used in this layer or the continuous susceptor contact layer.
- the texture may be introduced through embossing or any similar technique that accomplishes the same or similar result.
- a modified spray or roll technique may also be utilized, such a notched or grooved knife or spray nozzles that deliver varying amounts of adhesive to different locations over time.
- Specific methods and equipment include gravure printing, hot melt gravure printing, knife over roll, roll coating and any variety of adhesive stripping, stitching, printing or spraying techniques.
- the adhesive may or may not be foamed on all or part of the adhesive layers. Manufacturers of the equipment are as cited above. Preferred geometric patterns and shapes will vary based upon the individual needs of the application.
- Wood Target Substrate Wood Target Substrate: Paper or Acrylic Emulsion Coated Drywall Attachment Adhesive: Water-Based Emulsion Laminating Adhesive, 40% Solids
- Susceptor 0.50 mil aluminum foil Bonding
- Adhesive Polyamide, 190°C Melt Point Bonding
- Adhesive Form 1.5 mil continuous coat over entire susceptor or portions of the susceptor in the form of larger geometric shapes or stripes, straight or wavy.
- a heated embossing die follows after initial cooling to a solid state to impress 0.75 mil high pyramids for a total final layer thickness of about 2.0 mils.
- Susceptor Pretreatment Anodized Aluminum Surface, both sides; texturing, rounded, on all or part of the susceptor.
- Target Substrate Paper or Acrylic Emulsion Coated Drywall Attachment Adhesive: Water-Based Emulsion Laminating Adhesive, 40% Solids
- Susceptor 0.50 mil aluminum foil Bonding
- Adhesive EVA, 180°C Melt Point Bonding
- Adhesive Form Inert gas pre-foamed adhesive, which is continuous to the susceptor, and discontinuous to the target substrate due to the irregular surface caused by inert gas.
- Susceptor Pretreatment Anodized Aluminum Surface, both sides; texturing, rounded, on all or part of the susceptor.
- Example 1 and Example 2 All of the variations discussed for Example 1 and Example 2 are relevant, except that the target substrate adhesive layers are on both sides and are interchangeable to accommodate two or more different substrates. Also, as already noted, one side may have a pressure sensitive coating with all of the above-mentioned qualities, including, but not limited to, being continuous or discontinuous with respect to either the susceptor or the substrate and being optionally reactive.
- any of the above examples can be utilized with a solid, semi-solid, or liquid adhesive system when the adhesive device is constructed in-line virtually simultaneously.
- the main key is that with a semi-solid or liquid adhesive involved, the bonding or heating step will occur almost immediately after the device is constructed, with some predetermined amount of pressure, for example 5 psi, per unit area of minimum adhesive contact.
- Parts of the device construction may be partially prepared beforehand or not, as in a partially constructed tape form where all the solid components are pre-applied, but the final liquid layer is added in-line.
- Adhesive Spunfab web adhesive
- Adhesive Form Spun adhesive web, open weave, with a weight of 27 grams per square meter or 0.8 oz per square yard
- Susceptor Pretreatment Anodized Aluminum Surface, both sides Primer Layer: Silane Coupling Agent Pretreatment, both sides
- the adhesive web can be pre-applied or laminated to the susceptor, on one or both sides of the susceptor.
- the susceptor is then positioned between the substrate and target substrate for bonding with the induction tool.
- An alternative method would be to use a hand lay-up method.
- the adhesive web can be cut and properly sized, then placed on the target substrate.
- the susceptor also properly sized, is then placed on top of the web adhesive.
- a second layer of web adhesive, properly sized, is then placed on top of the susceptor.
- the substrate is placed on top of the second adhesive web layer.
- the bond is then formed by applying slight pressure, compressing all layers to ensure intimate contact, then activating the induction tool forming the bond.
- Substrate Cotton fabric Target Substrate: Cotton fabric Attachment
- Adhesive Spunfab web adhesive
- PA1541 Susceptor 0.50 mil aluminum foil Bonding
- Adhesive Spunfab web adhesive
- Adhesive Form Spun adhesive web, open weave, with a weight of 27 grams per square meter or 0.8 oz per square yard
- the adhesive web can be pre-applied or laminated to the susceptor, on one or both sides of the susceptor.
- the susceptor is then positioned, automatically or by hand, between the substrate and target substrate for bonding with the induction tool.
- An alternative method would be to use a hand lay-up method.
- the adhesive web can be cut and properly sized, then placed on the target substrate.
- the susceptor also properly sized, is then placed on top of the web adhesive.
- a second layer of web adhesive, properly sized, is then placed on top of the susceptor.
- the substrate is placed on top of the second adhesive web layer.
- the bond is then formed by applying slight pressure, compressing all layers to ensure intimate contact, then activating the induction tool forming the bond.
- Adhesive Spunfab web adhesive PA1541 Bonding Adhesive Form: Spun adhesive web, open weave, with a weight of 27 grams per square meter or 0.8 oz per square yard
- the adhesive web can be pre-applied or laminated to the susceptor, on one or both sides of the susceptor.
- the susceptor is then positioned, automatically or by hand, between the substrate and target substrate for bonding with the induction tool.
- An alternative method would be to use a hand lay-up method.
- the adhesive web can be cut and properly sized, then placed on the target substrate.
- the susceptor also properly sized, is then placed on top of the web adhesive.
- a second layer of web adhesive, properly sized, is then placed on top of the susceptor.
- the substrate is placed on top of the second adhesive web layer.
- the bond is then formed by applying slight pressure, compressing all layers to ensure intimate contact, then activating the induction tool forming the bond.
- [Oioo] Take a substrate, and attach the susceptor with a liquid or semi-solid adhesive system employing either a brush, roller, or other equipment to sufficiently spread the adhesive, reactive or unreactive, immediately or latently, and allow the volatiles, if any, to evaporate until the adhesive reaches a tacky state.
- a brush, roller, or other equipment to sufficiently spread the adhesive, reactive or unreactive, immediately or latently, and allow the volatiles, if any, to evaporate until the adhesive reaches a tacky state.
- Representative process equipment manufacturers include Nordson Co ⁇ oration, May Coatings or Rototherm. It is possible that one side could be a continuous or discontinuous susceptor contact pressure sensitive adhesive that for the pu ⁇ oses of the bonding method is not adversely effected by the heating during the fastening process.
- the susceptor may be pre- coated with the pressure sensitive adhesive on one side and then be pre-applied by a hand-held or automated roller or unwinding system with or without pressure.
- a heat curable component or element could then be inco ⁇ orated chemically or by formulation to convert the pressure sensitive adhesive during the bonding process.
- Insulating agents may be optionally added to this continuous layer to obviate thermal losses without impairing desired ultimate strength in tension, shear, or peel under specific environmental conditions. Examples of insulating agents include, but are not limited to, air, nitrogen, argon, other gases, and micro-balloons. Fillers and/or reinforcing agents may also be added. Either before, after, or during this phase, the susceptor may be itself textured.
- the susceptor may also optionally contain holes or perforations to facilitate adhesive flow through the susceptor or to facilitate adhesive system separation, as with a postage stamp.
- the susceptor may also have its outer edges follow a geometric pattern, particularly mathematically smooth ones that facilitate edge heating without localized run-away heating.
- the susceptor may also have on one or both sides a reinforcing layer composed of a thin (less than 5 mils) plastic or reinforced plastic to facilitate susceptor handling and tear resistance.
- a primer such as a silane
- an aluminum surface pretreatment including, but not limited to, anodization, plasma treatment, acid etching may also be optionally conducted on either or both sides of the susceptor, continuously or discontinuously.
- a pressure sensitive peroxide-initiated reactive acrylic functional polyester or polyamide adhesive may be used for wooden trim.
- solid phenolic adhesives such as those used for electric lead frames may be used.
- the continuous adhesive film may be flat or alternatively may be impressed with a pattern for discontinuous substrate contact. It should be noted that in many cases where speed of bond formation is critical (less than 0.5 seconds), adhesive placement will be biased toward the edges, where heat will build up the most rapidly.
- the curable, adhesives used here are typically used where environmental durability or creep resistance is important. Fillers and/or reinforcing agents may also be added to achieve a desired performance effect.
- examples include extrusion coating, knife over roll coating, airless spray, gravure printing and hot melt gravure printing.
- a continuous pattern adhesive can be applied via any standard coating technique such as rolling, spray, film lamination, and aqueous emulsion. Representative process equipment manufactures include Nordson Co ⁇ oration, May Coatings or Rototherm. For highly pattern specific technologies, one skilled in the art will be able to utilize many of the advancements in nozzle and micro nozzle technologies for liquids and hot melt adhesives.
- the attachment and/or bonding adhesive materials can be foamed during or after the manufacturing process, depending upon the specific application requirements. Adhesives that foam during bonding are meant to fill gaps. When prefoamed, the foam adhesives can be in a continuous layer. In this case, the continuous layer in contact with the susceptor is considered the very thin supplemental layer.
- Foaming may occur by the use of chemical blowing agents, as well as the use of dissolving inert gases in the adhesive (Nordson Foam Melt System).
- the specific requirements might be viscosity during or after processing, mechanical properties of the adhesive, gap filling specifications and/or environmental performance needs.
- foaming should generally produce a foam density of no more than 65% of the density of the base unblown adhesive in order to maintain major performance characteristics, such as strength. It is further possible to bias the foaming under any circumstance to those portions of the target substrate adhesive layer that are actually in contact with either the susceptor and/or the substrate.
- Example 8 A - Interior Wood Moldings
- Target Substrate Paper or acrylic emulsion coated drywall
- Bonding Adhesive Polyamide, 190°C Melt Point
- Bonding Adhesive Form Continuous film, flat, uniform thickness over the entire susceptor or only the edges to about 0.25 inches wide at each edge.
- Attachment Adhesive As above for the bonding adhesive, in varying forms:
- Two to twelve linear, hemispherical stripes about 0.1 inch in width and 0.5 inch in length on each edge of the susceptor, about 0.1 inch from the edge and about 0.1 inch apart.
- Susceptor Pretreatment Anodized aluminum surface, both sides, or equivalent porosity producing treatment.
- Discontinuous Adhesive Forms Two or three linear, hemispherical stripes about 0.1 inch in width and 0.5 inch in length on each edge of the susceptor, about 0.1 inch from the edge and about 0.1 inch apart.
- Example 8B Wood Cabinetry and Furniture Structural Elements (Cases, Face Frames, Doors)
- Substrate Wood Target Substrate: Wood Attachment Adhesive: Pressure-sensitive reactive urethane-based acrylic adhesive, moderate tack, 90° C melt point Susceptor: 0.50 mil aluminum foil
- Bonding Adhesive Pressure-sensitive reactive urethane-based acrylic adhesive, moderate tack, 90° C melt point
- Bonding Adhesive Form 1/16 inch average width dots or geometric shapes gravure printed to 2-3 mil average height in a diamond array where each dot or shape has an average of 1/8 inch between them in any direction.
- Optional components Susceptor Pretreatment Anodized aluminum surface, both sides, or equivalent porosity producing treatment.
- Bonding Adhesive Form 1/16 inch average width dots or geometric shapes gravure printed to 2-3.5 mil average height in a diamond array where each dot or shape has an average of 1/8 inch between them in any direction. Patterns printed such that supplemental adhesive dots replace 15% of the bonding adhesive dots.
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- Engineering & Computer Science (AREA)
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Connection Of Plates (AREA)
- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
- Adhesive Tapes (AREA)
Abstract
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US20107800P | 2000-04-28 | 2000-04-28 | |
US201078P | 2000-04-28 | ||
US09/840,859 US7141768B2 (en) | 2000-04-28 | 2001-04-24 | Fastening device |
PCT/US2001/013347 WO2001083184A2 (fr) | 2000-04-28 | 2001-04-25 | Dispositif de fixation |
US840859 | 2004-05-07 |
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EP1276827A2 true EP1276827A2 (fr) | 2003-01-22 |
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EP20010930753 Withdrawn EP1276827A2 (fr) | 2000-04-28 | 2001-04-25 | Dispositif de fixation |
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US (1) | US7141768B2 (fr) |
EP (1) | EP1276827A2 (fr) |
AU (1) | AU2001257258A1 (fr) |
CA (1) | CA2407206A1 (fr) |
WO (1) | WO2001083184A2 (fr) |
Families Citing this family (352)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2744156C (fr) | 2002-05-30 | 2013-04-09 | Senco Brands, Inc. | Rubans de jonction par induction et systemes et procedes associes |
US7132144B2 (en) * | 2003-02-28 | 2006-11-07 | Velcro Industries B.V. | Fastener tapes |
US6887328B1 (en) * | 2003-11-18 | 2005-05-03 | Eastman Kodak Company | Induction splicing of photographic film strips |
TWI278694B (en) * | 2005-09-20 | 2007-04-11 | Ind Tech Res Inst | Method for supporting a flexible substrate and method for manufacturing a flexible display |
IL188311A (en) * | 2007-01-22 | 2011-05-31 | Erowa Ag | System and method for joining non-transparent parts by means of a radiation curable adhesive |
US20080203871A1 (en) * | 2007-02-28 | 2008-08-28 | Michael Robinson | Door Insert Spacer |
CN101303463A (zh) * | 2007-05-11 | 2008-11-12 | 群康科技(深圳)有限公司 | 触摸屏显示装置及其制作方法 |
US20090294411A1 (en) * | 2007-11-09 | 2009-12-03 | Khakhalev Alexander D | System for and method of projection weld-bonding workpieces |
US20090220766A1 (en) * | 2008-03-03 | 2009-09-03 | L & P Property Management Company | Lightweight composite panel |
US20100103060A1 (en) * | 2008-10-23 | 2010-04-29 | Chad Au | Flat panel antenna, such as for use in a cellular telephone site of a wireless telecommunications system |
US10378106B2 (en) | 2008-11-14 | 2019-08-13 | Asm Ip Holding B.V. | Method of forming insulation film by modified PEALD |
JP5853257B2 (ja) * | 2009-01-29 | 2016-02-09 | コクヨ株式会社 | 粘着製品、転写具 |
US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
US8802201B2 (en) | 2009-08-14 | 2014-08-12 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
US20110274921A1 (en) * | 2010-05-05 | 2011-11-10 | Ford Global Technologies, Llc | Trim component and method of edge folding |
US8263906B2 (en) | 2010-05-11 | 2012-09-11 | Cambro Manufacturing Company | Food warming system |
IL212205A0 (en) | 2011-04-07 | 2011-06-30 | Huliot A C S Ltd | Pipe connectors for use in plastic pipe systems |
WO2012149391A1 (fr) | 2011-04-28 | 2012-11-01 | Adherent Laboratories, Inc. | Composition adhésive à chaud à base de polyoléfine |
EP3106497A1 (fr) | 2011-06-01 | 2016-12-21 | Saint-Gobain ADFORS Canada, Ltd. | Bande de cloison sèche de renfort multidirectionnelle |
US9312155B2 (en) | 2011-06-06 | 2016-04-12 | Asm Japan K.K. | High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules |
US10364496B2 (en) | 2011-06-27 | 2019-07-30 | Asm Ip Holding B.V. | Dual section module having shared and unshared mass flow controllers |
US10854498B2 (en) * | 2011-07-15 | 2020-12-01 | Asm Ip Holding B.V. | Wafer-supporting device and method for producing same |
US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
US8608896B2 (en) * | 2011-09-13 | 2013-12-17 | Apple Inc. | Liquid adhesive lamination for precision adhesive control |
US9017481B1 (en) | 2011-10-28 | 2015-04-28 | Asm America, Inc. | Process feed management for semiconductor substrate processing |
GB201121246D0 (en) * | 2011-12-12 | 2012-01-18 | Saint Gobain Placo Sas | Construction panel and manufacture thereof |
US9659799B2 (en) | 2012-08-28 | 2017-05-23 | Asm Ip Holding B.V. | Systems and methods for dynamic semiconductor process scheduling |
US9021985B2 (en) | 2012-09-12 | 2015-05-05 | Asm Ip Holdings B.V. | Process gas management for an inductively-coupled plasma deposition reactor |
US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
CN104756202B (zh) | 2012-10-25 | 2016-12-14 | Adc电信股份有限公司 | 用于把涂覆有粘合剂的电缆施加到表面的系统和方法 |
USD719596S1 (en) | 2012-12-20 | 2014-12-16 | Sfs Intec Holding Ag | Induction apparatus |
US20160376700A1 (en) | 2013-02-01 | 2016-12-29 | Asm Ip Holding B.V. | System for treatment of deposition reactor |
US9484191B2 (en) | 2013-03-08 | 2016-11-01 | Asm Ip Holding B.V. | Pulsed remote plasma method and system |
US9589770B2 (en) | 2013-03-08 | 2017-03-07 | Asm Ip Holding B.V. | Method and systems for in-situ formation of intermediate reactive species |
US9635715B1 (en) * | 2013-05-08 | 2017-04-25 | The Boeing Company | Smart susceptor radiant heater |
US9240412B2 (en) | 2013-09-27 | 2016-01-19 | Asm Ip Holding B.V. | Semiconductor structure and device and methods of forming same using selective epitaxial process |
US10174223B2 (en) | 2013-11-30 | 2019-01-08 | Hrl Laboratories, Llc | Formulations, methods, and apparatus for remote triggering of frontally cured polymers |
US10683571B2 (en) | 2014-02-25 | 2020-06-16 | Asm Ip Holding B.V. | Gas supply manifold and method of supplying gases to chamber using same |
IL231306A0 (en) | 2014-03-04 | 2014-08-31 | Huliot A C S Ltd | Electromagnetic induction welding of liquid distribution systems |
US10167557B2 (en) | 2014-03-18 | 2019-01-01 | Asm Ip Holding B.V. | Gas distribution system, reactor including the system, and methods of using the same |
US11015245B2 (en) | 2014-03-19 | 2021-05-25 | Asm Ip Holding B.V. | Gas-phase reactor and system having exhaust plenum and components thereof |
US10858737B2 (en) | 2014-07-28 | 2020-12-08 | Asm Ip Holding B.V. | Showerhead assembly and components thereof |
US9890456B2 (en) | 2014-08-21 | 2018-02-13 | Asm Ip Holding B.V. | Method and system for in situ formation of gas-phase compounds |
US10941490B2 (en) | 2014-10-07 | 2021-03-09 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
US9657845B2 (en) | 2014-10-07 | 2017-05-23 | Asm Ip Holding B.V. | Variable conductance gas distribution apparatus and method |
KR102263121B1 (ko) | 2014-12-22 | 2021-06-09 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자 및 그 제조 방법 |
US10529542B2 (en) | 2015-03-11 | 2020-01-07 | Asm Ip Holdings B.V. | Cross-flow reactor and method |
US10276355B2 (en) | 2015-03-12 | 2019-04-30 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
US10458018B2 (en) | 2015-06-26 | 2019-10-29 | Asm Ip Holding B.V. | Structures including metal carbide material, devices including the structures, and methods of forming same |
US10600673B2 (en) | 2015-07-07 | 2020-03-24 | Asm Ip Holding B.V. | Magnetic susceptor to baseplate seal |
US10083836B2 (en) | 2015-07-24 | 2018-09-25 | Asm Ip Holding B.V. | Formation of boron-doped titanium metal films with high work function |
US9960072B2 (en) | 2015-09-29 | 2018-05-01 | Asm Ip Holding B.V. | Variable adjustment for precise matching of multiple chamber cavity housings |
US10211308B2 (en) | 2015-10-21 | 2019-02-19 | Asm Ip Holding B.V. | NbMC layers |
US10322384B2 (en) | 2015-11-09 | 2019-06-18 | Asm Ip Holding B.V. | Counter flow mixer for process chamber |
US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
US10468251B2 (en) | 2016-02-19 | 2019-11-05 | Asm Ip Holding B.V. | Method for forming spacers using silicon nitride film for spacer-defined multiple patterning |
US10529554B2 (en) | 2016-02-19 | 2020-01-07 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
US10501866B2 (en) | 2016-03-09 | 2019-12-10 | Asm Ip Holding B.V. | Gas distribution apparatus for improved film uniformity in an epitaxial system |
US10343920B2 (en) | 2016-03-18 | 2019-07-09 | Asm Ip Holding B.V. | Aligned carbon nanotubes |
US9892913B2 (en) | 2016-03-24 | 2018-02-13 | Asm Ip Holding B.V. | Radial and thickness control via biased multi-port injection settings |
US10865475B2 (en) | 2016-04-21 | 2020-12-15 | Asm Ip Holding B.V. | Deposition of metal borides and silicides |
US10190213B2 (en) | 2016-04-21 | 2019-01-29 | Asm Ip Holding B.V. | Deposition of metal borides |
US10032628B2 (en) | 2016-05-02 | 2018-07-24 | Asm Ip Holding B.V. | Source/drain performance through conformal solid state doping |
US10367080B2 (en) | 2016-05-02 | 2019-07-30 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
KR102592471B1 (ko) | 2016-05-17 | 2023-10-20 | 에이에스엠 아이피 홀딩 비.브이. | 금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법 |
US11453943B2 (en) | 2016-05-25 | 2022-09-27 | Asm Ip Holding B.V. | Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor |
US10388509B2 (en) | 2016-06-28 | 2019-08-20 | Asm Ip Holding B.V. | Formation of epitaxial layers via dislocation filtering |
US9859151B1 (en) | 2016-07-08 | 2018-01-02 | Asm Ip Holding B.V. | Selective film deposition method to form air gaps |
US10612137B2 (en) | 2016-07-08 | 2020-04-07 | Asm Ip Holdings B.V. | Organic reactants for atomic layer deposition |
US10714385B2 (en) | 2016-07-19 | 2020-07-14 | Asm Ip Holding B.V. | Selective deposition of tungsten |
KR102354490B1 (ko) | 2016-07-27 | 2022-01-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
US9887082B1 (en) | 2016-07-28 | 2018-02-06 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US9812320B1 (en) | 2016-07-28 | 2017-11-07 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
KR102532607B1 (ko) | 2016-07-28 | 2023-05-15 | 에이에스엠 아이피 홀딩 비.브이. | 기판 가공 장치 및 그 동작 방법 |
US10395919B2 (en) | 2016-07-28 | 2019-08-27 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US10410943B2 (en) | 2016-10-13 | 2019-09-10 | Asm Ip Holding B.V. | Method for passivating a surface of a semiconductor and related systems |
US10643826B2 (en) | 2016-10-26 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for thermally calibrating reaction chambers |
US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
US10435790B2 (en) | 2016-11-01 | 2019-10-08 | Asm Ip Holding B.V. | Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap |
US10714350B2 (en) | 2016-11-01 | 2020-07-14 | ASM IP Holdings, B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10229833B2 (en) | 2016-11-01 | 2019-03-12 | Asm Ip Holding B.V. | Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10643904B2 (en) | 2016-11-01 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for forming a semiconductor device and related semiconductor device structures |
US10134757B2 (en) | 2016-11-07 | 2018-11-20 | Asm Ip Holding B.V. | Method of processing a substrate and a device manufactured by using the method |
KR102546317B1 (ko) | 2016-11-15 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기체 공급 유닛 및 이를 포함하는 기판 처리 장치 |
US10340135B2 (en) | 2016-11-28 | 2019-07-02 | Asm Ip Holding B.V. | Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride |
KR20180068582A (ko) | 2016-12-14 | 2018-06-22 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11581186B2 (en) | 2016-12-15 | 2023-02-14 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
KR102700194B1 (ko) | 2016-12-19 | 2024-08-28 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US10269558B2 (en) | 2016-12-22 | 2019-04-23 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10867788B2 (en) | 2016-12-28 | 2020-12-15 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US11390950B2 (en) | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
US10655221B2 (en) | 2017-02-09 | 2020-05-19 | Asm Ip Holding B.V. | Method for depositing oxide film by thermal ALD and PEALD |
US10468261B2 (en) | 2017-02-15 | 2019-11-05 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
EP3580046B1 (fr) | 2017-03-13 | 2022-01-19 | Huliot Agricultural Cooperative Society Ltd | Raccord de tuyau soudable par induction ayant des rebords d'embouchure isolés thermiquement et soudables par induction |
US10283353B2 (en) | 2017-03-29 | 2019-05-07 | Asm Ip Holding B.V. | Method of reforming insulating film deposited on substrate with recess pattern |
US10529563B2 (en) | 2017-03-29 | 2020-01-07 | Asm Ip Holdings B.V. | Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures |
KR102457289B1 (ko) | 2017-04-25 | 2022-10-21 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 및 반도체 장치의 제조 방법 |
US10892156B2 (en) | 2017-05-08 | 2021-01-12 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film on a substrate and related semiconductor device structures |
US10770286B2 (en) | 2017-05-08 | 2020-09-08 | Asm Ip Holdings B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
US10446393B2 (en) | 2017-05-08 | 2019-10-15 | Asm Ip Holding B.V. | Methods for forming silicon-containing epitaxial layers and related semiconductor device structures |
US10504742B2 (en) | 2017-05-31 | 2019-12-10 | Asm Ip Holding B.V. | Method of atomic layer etching using hydrogen plasma |
US10886123B2 (en) | 2017-06-02 | 2021-01-05 | Asm Ip Holding B.V. | Methods for forming low temperature semiconductor layers and related semiconductor device structures |
US12040200B2 (en) | 2017-06-20 | 2024-07-16 | Asm Ip Holding B.V. | Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus |
US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
US10685834B2 (en) | 2017-07-05 | 2020-06-16 | Asm Ip Holdings B.V. | Methods for forming a silicon germanium tin layer and related semiconductor device structures |
KR20190009245A (ko) | 2017-07-18 | 2019-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물 |
US11374112B2 (en) | 2017-07-19 | 2022-06-28 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US10541333B2 (en) | 2017-07-19 | 2020-01-21 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US11018002B2 (en) | 2017-07-19 | 2021-05-25 | Asm Ip Holding B.V. | Method for selectively depositing a Group IV semiconductor and related semiconductor device structures |
US10605530B2 (en) | 2017-07-26 | 2020-03-31 | Asm Ip Holding B.V. | Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace |
US10590535B2 (en) | 2017-07-26 | 2020-03-17 | Asm Ip Holdings B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US10312055B2 (en) | 2017-07-26 | 2019-06-04 | Asm Ip Holding B.V. | Method of depositing film by PEALD using negative bias |
US10770336B2 (en) | 2017-08-08 | 2020-09-08 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
US10692741B2 (en) | 2017-08-08 | 2020-06-23 | Asm Ip Holdings B.V. | Radiation shield |
US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US10249524B2 (en) | 2017-08-09 | 2019-04-02 | Asm Ip Holding B.V. | Cassette holder assembly for a substrate cassette and holding member for use in such assembly |
US10236177B1 (en) | 2017-08-22 | 2019-03-19 | ASM IP Holding B.V.. | Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures |
USD900036S1 (en) | 2017-08-24 | 2020-10-27 | Asm Ip Holding B.V. | Heater electrical connector and adapter |
US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
US11056344B2 (en) | 2017-08-30 | 2021-07-06 | Asm Ip Holding B.V. | Layer forming method |
KR102491945B1 (ko) | 2017-08-30 | 2023-01-26 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
KR102401446B1 (ko) | 2017-08-31 | 2022-05-24 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US10607895B2 (en) | 2017-09-18 | 2020-03-31 | Asm Ip Holdings B.V. | Method for forming a semiconductor device structure comprising a gate fill metal |
KR102630301B1 (ko) | 2017-09-21 | 2024-01-29 | 에이에스엠 아이피 홀딩 비.브이. | 침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치 |
US10844484B2 (en) | 2017-09-22 | 2020-11-24 | Asm Ip Holding B.V. | Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US10658205B2 (en) | 2017-09-28 | 2020-05-19 | Asm Ip Holdings B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US10403504B2 (en) | 2017-10-05 | 2019-09-03 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US10319588B2 (en) | 2017-10-10 | 2019-06-11 | Asm Ip Holding B.V. | Method for depositing a metal chalcogenide on a substrate by cyclical deposition |
US10923344B2 (en) | 2017-10-30 | 2021-02-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
KR102443047B1 (ko) | 2017-11-16 | 2022-09-14 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 방법 및 그에 의해 제조된 장치 |
US10910262B2 (en) | 2017-11-16 | 2021-02-02 | Asm Ip Holding B.V. | Method of selectively depositing a capping layer structure on a semiconductor device structure |
US11022879B2 (en) | 2017-11-24 | 2021-06-01 | Asm Ip Holding B.V. | Method of forming an enhanced unexposed photoresist layer |
CN111316417B (zh) | 2017-11-27 | 2023-12-22 | 阿斯莫Ip控股公司 | 与批式炉偕同使用的用于储存晶圆匣的储存装置 |
JP7206265B2 (ja) | 2017-11-27 | 2023-01-17 | エーエスエム アイピー ホールディング ビー.ブイ. | クリーン・ミニエンバイロメントを備える装置 |
US10290508B1 (en) | 2017-12-05 | 2019-05-14 | Asm Ip Holding B.V. | Method for forming vertical spacers for spacer-defined patterning |
US10872771B2 (en) | 2018-01-16 | 2020-12-22 | Asm Ip Holding B. V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
TWI799494B (zh) | 2018-01-19 | 2023-04-21 | 荷蘭商Asm 智慧財產控股公司 | 沈積方法 |
CN111630203A (zh) | 2018-01-19 | 2020-09-04 | Asm Ip私人控股有限公司 | 通过等离子体辅助沉积来沉积间隙填充层的方法 |
USD903477S1 (en) | 2018-01-24 | 2020-12-01 | Asm Ip Holdings B.V. | Metal clamp |
US11018047B2 (en) | 2018-01-25 | 2021-05-25 | Asm Ip Holding B.V. | Hybrid lift pin |
USD880437S1 (en) | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
US10535516B2 (en) | 2018-02-01 | 2020-01-14 | Asm Ip Holdings B.V. | Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures |
US11081345B2 (en) | 2018-02-06 | 2021-08-03 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
CN116732497A (zh) | 2018-02-14 | 2023-09-12 | Asm Ip私人控股有限公司 | 通过循环沉积工艺在衬底上沉积含钌膜的方法 |
US10896820B2 (en) | 2018-02-14 | 2021-01-19 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US10731249B2 (en) | 2018-02-15 | 2020-08-04 | Asm Ip Holding B.V. | Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus |
US10658181B2 (en) | 2018-02-20 | 2020-05-19 | Asm Ip Holding B.V. | Method of spacer-defined direct patterning in semiconductor fabrication |
KR102636427B1 (ko) | 2018-02-20 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 및 장치 |
US10975470B2 (en) | 2018-02-23 | 2021-04-13 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
US11629406B2 (en) | 2018-03-09 | 2023-04-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate |
US11114283B2 (en) | 2018-03-16 | 2021-09-07 | Asm Ip Holding B.V. | Reactor, system including the reactor, and methods of manufacturing and using same |
KR102646467B1 (ko) | 2018-03-27 | 2024-03-11 | 에이에스엠 아이피 홀딩 비.브이. | 기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조 |
US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US10510536B2 (en) | 2018-03-29 | 2019-12-17 | Asm Ip Holding B.V. | Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber |
US11088002B2 (en) | 2018-03-29 | 2021-08-10 | Asm Ip Holding B.V. | Substrate rack and a substrate processing system and method |
KR102501472B1 (ko) | 2018-03-30 | 2023-02-20 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
KR102709511B1 (ko) | 2018-05-08 | 2024-09-24 | 에이에스엠 아이피 홀딩 비.브이. | 기판 상에 산화물 막을 주기적 증착 공정에 의해 증착하기 위한 방법 및 관련 소자 구조 |
US12025484B2 (en) | 2018-05-08 | 2024-07-02 | Asm Ip Holding B.V. | Thin film forming method |
TW202349473A (zh) | 2018-05-11 | 2023-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 用於基板上形成摻雜金屬碳化物薄膜之方法及相關半導體元件結構 |
KR102596988B1 (ko) | 2018-05-28 | 2023-10-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 및 그에 의해 제조된 장치 |
US10808336B2 (en) | 2018-05-31 | 2020-10-20 | GM Global Technology Operations LLC | Vehicle seat trim covers with knitted attachment structures formed with heat-activated yarns |
US10532675B2 (en) | 2018-05-31 | 2020-01-14 | GM Global Technology Operations LLC | Vehicle seat trim cover with integrally knitted attachment features |
TWI840362B (zh) | 2018-06-04 | 2024-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 水氣降低的晶圓處置腔室 |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
US10797133B2 (en) | 2018-06-21 | 2020-10-06 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
KR102568797B1 (ko) | 2018-06-21 | 2023-08-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 시스템 |
JP2021529254A (ja) | 2018-06-27 | 2021-10-28 | エーエスエム・アイピー・ホールディング・ベー・フェー | 金属含有材料ならびに金属含有材料を含む膜および構造体を形成するための周期的堆積方法 |
TW202405221A (zh) | 2018-06-27 | 2024-02-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於形成含金屬材料及包含含金屬材料的膜及結構之循環沉積方法 |
US10612136B2 (en) | 2018-06-29 | 2020-04-07 | ASM IP Holding, B.V. | Temperature-controlled flange and reactor system including same |
KR102686758B1 (ko) | 2018-06-29 | 2024-07-18 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 및 반도체 장치의 제조 방법 |
US10755922B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10388513B1 (en) | 2018-07-03 | 2019-08-20 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10843600B2 (en) | 2018-07-12 | 2020-11-24 | GM Global Technology Operations LLC | Vehicle seat trim covers including integrally-knit backing materials and methods of manufacturing vehicle seat trim covers |
US10767789B2 (en) | 2018-07-16 | 2020-09-08 | Asm Ip Holding B.V. | Diaphragm valves, valve components, and methods for forming valve components |
US10483099B1 (en) | 2018-07-26 | 2019-11-19 | Asm Ip Holding B.V. | Method for forming thermally stable organosilicon polymer film |
US11053591B2 (en) | 2018-08-06 | 2021-07-06 | Asm Ip Holding B.V. | Multi-port gas injection system and reactor system including same |
US10883175B2 (en) | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
US10829852B2 (en) | 2018-08-16 | 2020-11-10 | Asm Ip Holding B.V. | Gas distribution device for a wafer processing apparatus |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
KR102707956B1 (ko) | 2018-09-11 | 2024-09-19 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 |
US11024523B2 (en) | 2018-09-11 | 2021-06-01 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11049751B2 (en) | 2018-09-14 | 2021-06-29 | Asm Ip Holding B.V. | Cassette supply system to store and handle cassettes and processing apparatus equipped therewith |
CN110970344B (zh) | 2018-10-01 | 2024-10-25 | Asmip控股有限公司 | 衬底保持设备、包含所述设备的系统及其使用方法 |
EP3633186A1 (fr) * | 2018-10-01 | 2020-04-08 | Siemens Gamesa Renewable Energy A/S | Feuille adhésive pour le montage d'une enveloppe protectrice sur une pale d'éolienne et procédé de montage d'une enveloppe protectrice sur une pale d'éolienne |
US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR102592699B1 (ko) | 2018-10-08 | 2023-10-23 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치 |
US10847365B2 (en) | 2018-10-11 | 2020-11-24 | Asm Ip Holding B.V. | Method of forming conformal silicon carbide film by cyclic CVD |
US10811256B2 (en) | 2018-10-16 | 2020-10-20 | Asm Ip Holding B.V. | Method for etching a carbon-containing feature |
KR102546322B1 (ko) | 2018-10-19 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
KR102605121B1 (ko) | 2018-10-19 | 2023-11-23 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
USD948463S1 (en) | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
US10381219B1 (en) | 2018-10-25 | 2019-08-13 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film |
US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
KR20200051105A (ko) | 2018-11-02 | 2020-05-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 유닛 및 이를 포함하는 기판 처리 장치 |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
US11031242B2 (en) | 2018-11-07 | 2021-06-08 | Asm Ip Holding B.V. | Methods for depositing a boron doped silicon germanium film |
US10818758B2 (en) | 2018-11-16 | 2020-10-27 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US10847366B2 (en) | 2018-11-16 | 2020-11-24 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
US10559458B1 (en) | 2018-11-26 | 2020-02-11 | Asm Ip Holding B.V. | Method of forming oxynitride film |
US12040199B2 (en) | 2018-11-28 | 2024-07-16 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
KR102636428B1 (ko) | 2018-12-04 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치를 세정하는 방법 |
US11970313B2 (en) | 2018-12-12 | 2024-04-30 | Yeti Coolers, Llc | Insulating container |
US10766672B2 (en) | 2018-12-12 | 2020-09-08 | Yeti Coolers, Llc | Insulating container |
US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
JP7504584B2 (ja) | 2018-12-14 | 2024-06-24 | エーエスエム・アイピー・ホールディング・ベー・フェー | 窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム |
TW202405220A (zh) | 2019-01-17 | 2024-02-01 | 荷蘭商Asm Ip 私人控股有限公司 | 藉由循環沈積製程於基板上形成含過渡金屬膜之方法 |
TWI756590B (zh) | 2019-01-22 | 2022-03-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理裝置 |
CN111524788B (zh) | 2019-02-01 | 2023-11-24 | Asm Ip私人控股有限公司 | 氧化硅的拓扑选择性膜形成的方法 |
TW202044325A (zh) | 2019-02-20 | 2020-12-01 | 荷蘭商Asm Ip私人控股有限公司 | 填充一基板之一表面內所形成的一凹槽的方法、根據其所形成之半導體結構、及半導體處理設備 |
TWI845607B (zh) | 2019-02-20 | 2024-06-21 | 荷蘭商Asm Ip私人控股有限公司 | 用來填充形成於基材表面內之凹部的循環沉積方法及設備 |
US11482533B2 (en) | 2019-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Apparatus and methods for plug fill deposition in 3-D NAND applications |
KR102626263B1 (ko) | 2019-02-20 | 2024-01-16 | 에이에스엠 아이피 홀딩 비.브이. | 처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치 |
TWI842826B (zh) | 2019-02-22 | 2024-05-21 | 荷蘭商Asm Ip私人控股有限公司 | 基材處理設備及處理基材之方法 |
KR20200108242A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체 |
KR20200108243A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | SiOC 층을 포함한 구조체 및 이의 형성 방법 |
KR20200108248A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | SiOCN 층을 포함한 구조체 및 이의 형성 방법 |
JP2020167398A (ja) | 2019-03-28 | 2020-10-08 | エーエスエム・アイピー・ホールディング・ベー・フェー | ドアオープナーおよびドアオープナーが提供される基材処理装置 |
KR20200116855A (ko) | 2019-04-01 | 2020-10-13 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자를 제조하는 방법 |
US11447864B2 (en) | 2019-04-19 | 2022-09-20 | Asm Ip Holding B.V. | Layer forming method and apparatus |
KR20200125453A (ko) | 2019-04-24 | 2020-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 기상 반응기 시스템 및 이를 사용하는 방법 |
KR20200130121A (ko) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | 딥 튜브가 있는 화학물질 공급원 용기 |
KR20200130118A (ko) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | 비정질 탄소 중합체 막을 개질하는 방법 |
KR20200130652A (ko) | 2019-05-10 | 2020-11-19 | 에이에스엠 아이피 홀딩 비.브이. | 표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조 |
JP2020188254A (ja) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | ウェハボートハンドリング装置、縦型バッチ炉および方法 |
JP2020188255A (ja) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | ウェハボートハンドリング装置、縦型バッチ炉および方法 |
USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
USD922229S1 (en) | 2019-06-05 | 2021-06-15 | Asm Ip Holding B.V. | Device for controlling a temperature of a gas supply unit |
KR20200141003A (ko) | 2019-06-06 | 2020-12-17 | 에이에스엠 아이피 홀딩 비.브이. | 가스 감지기를 포함하는 기상 반응기 시스템 |
KR20200143254A (ko) | 2019-06-11 | 2020-12-23 | 에이에스엠 아이피 홀딩 비.브이. | 개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조 |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
KR20210005515A (ko) | 2019-07-03 | 2021-01-14 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법 |
JP7499079B2 (ja) | 2019-07-09 | 2024-06-13 | エーエスエム・アイピー・ホールディング・ベー・フェー | 同軸導波管を用いたプラズマ装置、基板処理方法 |
CN112216646A (zh) | 2019-07-10 | 2021-01-12 | Asm Ip私人控股有限公司 | 基板支撑组件及包括其的基板处理装置 |
KR20210010307A (ko) | 2019-07-16 | 2021-01-27 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
KR20210010820A (ko) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 게르마늄 구조를 형성하는 방법 |
KR20210010816A (ko) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 라디칼 보조 점화 플라즈마 시스템 및 방법 |
US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
TWI839544B (zh) | 2019-07-19 | 2024-04-21 | 荷蘭商Asm Ip私人控股有限公司 | 形成形貌受控的非晶碳聚合物膜之方法 |
KR20210010817A (ko) | 2019-07-19 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 토폴로지-제어된 비정질 탄소 중합체 막을 형성하는 방법 |
CN112309843A (zh) | 2019-07-29 | 2021-02-02 | Asm Ip私人控股有限公司 | 实现高掺杂剂掺入的选择性沉积方法 |
CN112309899A (zh) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112309900A (zh) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | 基板处理设备 |
US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
CA3148931A1 (fr) * | 2019-08-03 | 2021-02-11 | Mishko Teodorovich | Appareil et procede destines a un panneau mural isolant apparent a recouvrir |
CN112323048B (zh) | 2019-08-05 | 2024-02-09 | Asm Ip私人控股有限公司 | 用于化学源容器的液位传感器 |
USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
JP2021031769A (ja) | 2019-08-21 | 2021-03-01 | エーエスエム アイピー ホールディング ビー.ブイ. | 成膜原料混合ガス生成装置及び成膜装置 |
USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
KR20210024423A (ko) | 2019-08-22 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 홀을 구비한 구조체를 형성하기 위한 방법 |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
KR20210024420A (ko) | 2019-08-23 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 비스(디에틸아미노)실란을 사용하여 peald에 의해 개선된 품질을 갖는 실리콘 산화물 막을 증착하기 위한 방법 |
US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
KR20210029090A (ko) | 2019-09-04 | 2021-03-15 | 에이에스엠 아이피 홀딩 비.브이. | 희생 캡핑 층을 이용한 선택적 증착 방법 |
KR20210029663A (ko) | 2019-09-05 | 2021-03-16 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
CN112593212B (zh) | 2019-10-02 | 2023-12-22 | Asm Ip私人控股有限公司 | 通过循环等离子体增强沉积工艺形成拓扑选择性氧化硅膜的方法 |
KR20210042810A (ko) | 2019-10-08 | 2021-04-20 | 에이에스엠 아이피 홀딩 비.브이. | 활성 종을 이용하기 위한 가스 분배 어셈블리를 포함한 반응기 시스템 및 이를 사용하는 방법 |
TWI846953B (zh) | 2019-10-08 | 2024-07-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理裝置 |
KR20210043460A (ko) | 2019-10-10 | 2021-04-21 | 에이에스엠 아이피 홀딩 비.브이. | 포토레지스트 하부층을 형성하기 위한 방법 및 이를 포함한 구조체 |
US12009241B2 (en) | 2019-10-14 | 2024-06-11 | Asm Ip Holding B.V. | Vertical batch furnace assembly with detector to detect cassette |
TWI834919B (zh) | 2019-10-16 | 2024-03-11 | 荷蘭商Asm Ip私人控股有限公司 | 氧化矽之拓撲選擇性膜形成之方法 |
US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
KR20210047808A (ko) | 2019-10-21 | 2021-04-30 | 에이에스엠 아이피 홀딩 비.브이. | 막을 선택적으로 에칭하기 위한 장치 및 방법 |
KR20210050453A (ko) | 2019-10-25 | 2021-05-07 | 에이에스엠 아이피 홀딩 비.브이. | 기판 표면 상의 갭 피처를 충진하는 방법 및 이와 관련된 반도체 소자 구조 |
US11646205B2 (en) | 2019-10-29 | 2023-05-09 | Asm Ip Holding B.V. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
KR20210054983A (ko) | 2019-11-05 | 2021-05-14 | 에이에스엠 아이피 홀딩 비.브이. | 도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템 |
US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
KR20210062561A (ko) | 2019-11-20 | 2021-05-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템 |
US11450529B2 (en) | 2019-11-26 | 2022-09-20 | Asm Ip Holding B.V. | Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface |
CN112951697A (zh) | 2019-11-26 | 2021-06-11 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112885692A (zh) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112885693A (zh) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | 基板处理设备 |
JP7527928B2 (ja) | 2019-12-02 | 2024-08-05 | エーエスエム・アイピー・ホールディング・ベー・フェー | 基板処理装置、基板処理方法 |
KR20210070898A (ko) | 2019-12-04 | 2021-06-15 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
KR20210078405A (ko) | 2019-12-17 | 2021-06-28 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐 나이트라이드 층을 형성하는 방법 및 바나듐 나이트라이드 층을 포함하는 구조 |
US11527403B2 (en) | 2019-12-19 | 2022-12-13 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
JP2021109175A (ja) | 2020-01-06 | 2021-08-02 | エーエスエム・アイピー・ホールディング・ベー・フェー | ガス供給アセンブリ、その構成要素、およびこれを含む反応器システム |
JP2021111783A (ja) | 2020-01-06 | 2021-08-02 | エーエスエム・アイピー・ホールディング・ベー・フェー | チャネル付きリフトピン |
US11993847B2 (en) | 2020-01-08 | 2024-05-28 | Asm Ip Holding B.V. | Injector |
KR20210093163A (ko) | 2020-01-16 | 2021-07-27 | 에이에스엠 아이피 홀딩 비.브이. | 고 종횡비 피처를 형성하는 방법 |
KR102675856B1 (ko) | 2020-01-20 | 2024-06-17 | 에이에스엠 아이피 홀딩 비.브이. | 박막 형성 방법 및 박막 표면 개질 방법 |
TW202130846A (zh) | 2020-02-03 | 2021-08-16 | 荷蘭商Asm Ip私人控股有限公司 | 形成包括釩或銦層的結構之方法 |
TW202146882A (zh) | 2020-02-04 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 驗證一物品之方法、用於驗證一物品之設備、及用於驗證一反應室之系統 |
US11776846B2 (en) | 2020-02-07 | 2023-10-03 | Asm Ip Holding B.V. | Methods for depositing gap filling fluids and related systems and devices |
US11781243B2 (en) | 2020-02-17 | 2023-10-10 | Asm Ip Holding B.V. | Method for depositing low temperature phosphorous-doped silicon |
TW202203344A (zh) | 2020-02-28 | 2022-01-16 | 荷蘭商Asm Ip控股公司 | 專用於零件清潔的系統 |
KR20210116249A (ko) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | 록아웃 태그아웃 어셈블리 및 시스템 그리고 이의 사용 방법 |
KR20210116240A (ko) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | 조절성 접합부를 갖는 기판 핸들링 장치 |
KR20210117157A (ko) | 2020-03-12 | 2021-09-28 | 에이에스엠 아이피 홀딩 비.브이. | 타겟 토폴로지 프로파일을 갖는 층 구조를 제조하기 위한 방법 |
KR20210124042A (ko) | 2020-04-02 | 2021-10-14 | 에이에스엠 아이피 홀딩 비.브이. | 박막 형성 방법 |
TW202146689A (zh) | 2020-04-03 | 2021-12-16 | 荷蘭商Asm Ip控股公司 | 阻障層形成方法及半導體裝置的製造方法 |
TW202145344A (zh) | 2020-04-08 | 2021-12-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於選擇性蝕刻氧化矽膜之設備及方法 |
US11821078B2 (en) | 2020-04-15 | 2023-11-21 | Asm Ip Holding B.V. | Method for forming precoat film and method for forming silicon-containing film |
KR20210128343A (ko) | 2020-04-15 | 2021-10-26 | 에이에스엠 아이피 홀딩 비.브이. | 크롬 나이트라이드 층을 형성하는 방법 및 크롬 나이트라이드 층을 포함하는 구조 |
US11996289B2 (en) | 2020-04-16 | 2024-05-28 | Asm Ip Holding B.V. | Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods |
JP2021172884A (ja) | 2020-04-24 | 2021-11-01 | エーエスエム・アイピー・ホールディング・ベー・フェー | 窒化バナジウム含有層を形成する方法および窒化バナジウム含有層を含む構造体 |
KR20210132600A (ko) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐, 질소 및 추가 원소를 포함한 층을 증착하기 위한 방법 및 시스템 |
KR20210132605A (ko) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 냉각 가스 공급부를 포함한 수직형 배치 퍼니스 어셈블리 |
KR20210134226A (ko) | 2020-04-29 | 2021-11-09 | 에이에스엠 아이피 홀딩 비.브이. | 고체 소스 전구체 용기 |
KR20210134869A (ko) | 2020-05-01 | 2021-11-11 | 에이에스엠 아이피 홀딩 비.브이. | Foup 핸들러를 이용한 foup의 빠른 교환 |
TW202147543A (zh) | 2020-05-04 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 半導體處理系統 |
KR20210141379A (ko) | 2020-05-13 | 2021-11-23 | 에이에스엠 아이피 홀딩 비.브이. | 반응기 시스템용 레이저 정렬 고정구 |
TW202146699A (zh) | 2020-05-15 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 形成矽鍺層之方法、半導體結構、半導體裝置、形成沉積層之方法、及沉積系統 |
TW202147383A (zh) | 2020-05-19 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 基材處理設備 |
KR20210145078A (ko) | 2020-05-21 | 2021-12-01 | 에이에스엠 아이피 홀딩 비.브이. | 다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법 |
TW202200837A (zh) | 2020-05-22 | 2022-01-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於在基材上形成薄膜之反應系統 |
TW202201602A (zh) | 2020-05-29 | 2022-01-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
TW202212620A (zh) | 2020-06-02 | 2022-04-01 | 荷蘭商Asm Ip私人控股有限公司 | 處理基板之設備、形成膜之方法、及控制用於處理基板之設備之方法 |
TW202218133A (zh) | 2020-06-24 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 形成含矽層之方法 |
TW202217953A (zh) | 2020-06-30 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
TW202202649A (zh) | 2020-07-08 | 2022-01-16 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
TW202219628A (zh) | 2020-07-17 | 2022-05-16 | 荷蘭商Asm Ip私人控股有限公司 | 用於光微影之結構與方法 |
TW202204662A (zh) | 2020-07-20 | 2022-02-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於沉積鉬層之方法及系統 |
US12040177B2 (en) | 2020-08-18 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a laminate film by cyclical plasma-enhanced deposition processes |
US11725280B2 (en) | 2020-08-26 | 2023-08-15 | Asm Ip Holding B.V. | Method for forming metal silicon oxide and metal silicon oxynitride layers |
TW202229601A (zh) | 2020-08-27 | 2022-08-01 | 荷蘭商Asm Ip私人控股有限公司 | 形成圖案化結構的方法、操控機械特性的方法、裝置結構、及基板處理系統 |
USD990534S1 (en) | 2020-09-11 | 2023-06-27 | Asm Ip Holding B.V. | Weighted lift pin |
USD1012873S1 (en) | 2020-09-24 | 2024-01-30 | Asm Ip Holding B.V. | Electrode for semiconductor processing apparatus |
US12009224B2 (en) | 2020-09-29 | 2024-06-11 | Asm Ip Holding B.V. | Apparatus and method for etching metal nitrides |
KR20220045900A (ko) | 2020-10-06 | 2022-04-13 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 함유 재료를 증착하기 위한 증착 방법 및 장치 |
CN114293174A (zh) | 2020-10-07 | 2022-04-08 | Asm Ip私人控股有限公司 | 气体供应单元和包括气体供应单元的衬底处理设备 |
TW202229613A (zh) | 2020-10-14 | 2022-08-01 | 荷蘭商Asm Ip私人控股有限公司 | 於階梯式結構上沉積材料的方法 |
TW202217037A (zh) | 2020-10-22 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 沉積釩金屬的方法、結構、裝置及沉積總成 |
TW202223136A (zh) | 2020-10-28 | 2022-06-16 | 荷蘭商Asm Ip私人控股有限公司 | 用於在基板上形成層之方法、及半導體處理系統 |
TW202235649A (zh) | 2020-11-24 | 2022-09-16 | 荷蘭商Asm Ip私人控股有限公司 | 填充間隙之方法與相關之系統及裝置 |
KR20220076343A (ko) | 2020-11-30 | 2022-06-08 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치의 반응 챔버 내에 배열되도록 구성된 인젝터 |
US11946137B2 (en) | 2020-12-16 | 2024-04-02 | Asm Ip Holding B.V. | Runout and wobble measurement fixtures |
TW202242184A (zh) | 2020-12-22 | 2022-11-01 | 荷蘭商Asm Ip私人控股有限公司 | 前驅物膠囊、前驅物容器、氣相沉積總成、及將固態前驅物裝載至前驅物容器中之方法 |
TW202226899A (zh) | 2020-12-22 | 2022-07-01 | 荷蘭商Asm Ip私人控股有限公司 | 具匹配器的電漿處理裝置 |
TW202231903A (zh) | 2020-12-22 | 2022-08-16 | 荷蘭商Asm Ip私人控股有限公司 | 過渡金屬沉積方法、過渡金屬層、用於沉積過渡金屬於基板上的沉積總成 |
US20220314851A1 (en) * | 2021-03-31 | 2022-10-06 | Lear Corporation | Seat support |
US20220314854A1 (en) * | 2021-03-31 | 2022-10-06 | Lear Corporation | Seat support |
USD981973S1 (en) | 2021-05-11 | 2023-03-28 | Asm Ip Holding B.V. | Reactor wall for substrate processing apparatus |
USD1023959S1 (en) | 2021-05-11 | 2024-04-23 | Asm Ip Holding B.V. | Electrode for substrate processing apparatus |
USD980813S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
USD980814S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD990441S1 (en) | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
USD1040617S1 (en) | 2022-05-12 | 2024-09-03 | Yeti Coolers, Llc | Insulating container |
Family Cites Families (103)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2378801A (en) | 1941-08-28 | 1945-06-19 | Outboard Marine & Mfg Co | Method and product of joining preformed plastic members |
US2393541A (en) | 1943-05-21 | 1946-01-22 | Induction Heating Corp | Composition adapted for inductive heating and method for using same |
US3391846A (en) | 1963-08-08 | 1968-07-09 | Du Pont | Heating with antiferromagnetic particles in a high frequency magnetic field |
GB1135803A (en) | 1964-12-11 | 1968-12-04 | E M A Corp | Electromagnetic adhesive and method of joining materials thereby |
US3510619A (en) | 1965-10-18 | 1970-05-05 | Heller William C Jun | Apparatus for induction heating |
US3395261A (en) | 1965-10-19 | 1968-07-30 | Heller | Apparatus and process for induction heating |
NO130126B (fr) | 1966-09-07 | 1974-07-08 | Ironflex Ag | |
US3574031A (en) | 1967-03-24 | 1971-04-06 | Heller William C Jun | Method of heat welding thermoplastic bodies using a stratum of susceptor material |
US3612803A (en) | 1968-02-29 | 1971-10-12 | Ruth Elizabeth Barry Klaas | Fastening device |
US3657038A (en) | 1968-07-31 | 1972-04-18 | Grace W R & Co | Method of bonding employing high frequency alternating magnetic field |
US3620876A (en) | 1969-07-28 | 1971-11-16 | Richard J Guglielmo Sr | Liquid electromagnetic adhesive and method of joining materials thereby |
US3902940A (en) | 1969-12-08 | 1975-09-02 | Heller William C Jun | Art of joining foamed members |
US3750728A (en) | 1971-05-28 | 1973-08-07 | Chippewa Lumber Ind Inc | Installation of wood millwork with pre-applied adhesive |
US3733231A (en) | 1971-06-16 | 1973-05-15 | Nat Gypsum Co | Wallboard attachment |
US4017701A (en) | 1972-02-29 | 1977-04-12 | Illinois Tool Works Inc. | Induction heating unit with combined tank circuit and heating coil |
US3727022A (en) | 1972-07-17 | 1973-04-10 | Procter & Gamble | Electromagnetic heating and sealing |
US3833439A (en) | 1972-07-24 | 1974-09-03 | Gen Motors Corp | Method of dielectrically embossing risers in a trim assembly |
US4038120A (en) | 1972-11-09 | 1977-07-26 | Russell Carl D | Electric heat bonding tape method for construction panels |
US3907733A (en) * | 1974-01-08 | 1975-09-23 | Eastman Kodak Co | Hot melt adhesive compositions |
US3996402A (en) | 1974-03-04 | 1976-12-07 | The Boeing Company | Fastening device for use with induction heater apparatus and system for holding together two nonmetal surfaces |
US4120712A (en) | 1975-03-17 | 1978-10-17 | The Boeing Company | Method of securing two non-metal surfaces together using a hot melt type fastener heatable by induction heating |
US4029837A (en) | 1975-08-14 | 1977-06-14 | William C. Heller, Jr. | Composite plastic-metallic bonding means and method |
FR2348957A1 (fr) | 1976-04-21 | 1977-11-18 | Weber & Broutin Sa | Procede,appareil et produit a base de colle thermofusible pour l'assemblage d'un element de revetement a un support |
US4164599A (en) | 1977-07-25 | 1979-08-14 | Milton Kessler | Weather strip and method of its manufacture |
AU5728880A (en) * | 1979-05-18 | 1980-11-20 | Ronald Brian Baxter | Carpet joining tape |
US4461661A (en) | 1980-03-21 | 1984-07-24 | Fabel Warren M | Non-tenting business form assemblies and method and apparatus for making the same |
US4416713A (en) | 1980-07-24 | 1983-11-22 | Brooks Ronald H | Method and apparatus for joining abutting edges of sheet material |
JPS5773064A (en) * | 1980-10-27 | 1982-05-07 | Yoshida Kogyo Kk <Ykk> | Bonding method and bonded product |
US4418260A (en) | 1981-10-19 | 1983-11-29 | Detrick Jeffrey C | Wood treating method and apparatus for facilitating removal of ferrous materials therefrom |
US4710539A (en) | 1981-11-02 | 1987-12-01 | W. R. Grace & Co. | Heat activatable adhesive or sealant compositions |
US4514243A (en) | 1982-07-09 | 1985-04-30 | Dan T. Moore Co. | Tire for wheelchairs and the like |
US4483896A (en) | 1983-02-04 | 1984-11-20 | Seam Team | Carpet seaming tape with separate heating circuits |
US4420352A (en) | 1983-02-10 | 1983-12-13 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Absorbable-susceptor joining of ceramic surfaces |
EP0147409A4 (fr) | 1983-05-06 | 1987-01-10 | Brooks Elect Seaming Syst Pty | Rubans de jonction de tapis. |
CA1268107A (fr) | 1984-07-19 | 1990-04-24 | Alfred Fuller Leatherman | Adhesif thermodurcissable pour l'assemblage sans distorsion d'elements thermodurcissables autostables |
EP0237657A1 (fr) * | 1986-03-13 | 1987-09-23 | Tsugo Nakano | Procédé pour relier des bandes de tapis et ruban à cet effet |
US4650947A (en) | 1985-02-18 | 1987-03-17 | Hutton Roger L | Induction tacking method and apparatus |
US4602139A (en) | 1984-09-28 | 1986-07-22 | Hutton Roger L | Induction bonding method and apparatus |
JPS61214953A (ja) | 1985-03-15 | 1986-09-24 | Dai Showa Seiki Kk | 工具とワ−クの接触検知装置 |
GB8517311D0 (en) | 1985-07-09 | 1985-08-14 | Heath C A | Filtercloths |
US4846916A (en) | 1985-12-27 | 1989-07-11 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing electric carpet via induction heating |
US4762864A (en) | 1986-06-19 | 1988-08-09 | Ashland Oil Inc. | High performance induction curable two-component structural adhesive with nonsagging behavior |
US4878978A (en) | 1986-06-19 | 1989-11-07 | Ashland Oil, Inc. | Bonding method employing high performance induction curable two-component structural adhesive with nonsagging behavior |
US4853510A (en) | 1987-01-02 | 1989-08-01 | Continental Can Company, Inc. | Induction heating coil |
GB8704852D0 (en) | 1987-03-02 | 1987-04-08 | Welding Inst | Bonding thermoplastic layers |
US4749833A (en) | 1987-08-07 | 1988-06-07 | Tocco, Inc. | Induction heating for adhesive bonding |
DE3802881A1 (de) | 1987-11-16 | 1989-05-24 | Utz Ag Georg | Mikrowellenaktivierbarer schmelzklebstoff |
US4841706A (en) | 1987-11-18 | 1989-06-27 | Carlisle Corporation | Non-penetrating fastener for affixing elastomeric sheeting to a roof |
US4941936A (en) | 1988-04-28 | 1990-07-17 | The Budd Company | Method for bonding FRP members via dielectric heating |
US4969968A (en) | 1988-07-22 | 1990-11-13 | William C. Heller, Jr. | Method of inductive heating with an integrated multiple particle agent |
US5198053A (en) | 1988-10-18 | 1993-03-30 | Mather Seal Company | Method and apparatus for bonding polytetrafluoroethylene to a metal substrate and articles thereby produced |
US5310977A (en) | 1989-02-03 | 1994-05-10 | Minnesota Mining And Manufacturing Company | Configured microwave susceptor |
US4961796A (en) | 1989-03-06 | 1990-10-09 | James River Corporation | System for bonding objects together |
CA2011740A1 (fr) | 1989-04-07 | 1990-10-07 | Glen Connell | Materiaux pouvant etre chauffes par hyperfrequences |
US5254824A (en) | 1989-04-07 | 1993-10-19 | Minnesota Mining And Manufacturing Company | Method and article for microwave bonding of polyethylene pipe |
US5123989A (en) | 1989-06-14 | 1992-06-23 | Toda Kogyo Corporation | Resin-bonding method |
SE501045C2 (sv) | 1990-09-17 | 1994-10-24 | Roofer Int Ab | Sätt vid läggning av takpapp och anordning för genomförande av förfarandet |
US5328539A (en) | 1990-11-28 | 1994-07-12 | H. B. Fuller Licensing & Financing Inc. | Radio frequency heating of thermoplastic receptor compositions |
US5182134A (en) | 1990-11-28 | 1993-01-26 | H. B. Fuller Licensing & Financing Inc. | Radio frequency cure of thermoset-receptor compositions |
AU656556B2 (en) | 1991-03-13 | 1995-02-09 | Minnesota Mining And Manufacturing Company | Radio frequency induction heatable compositions |
US5133630A (en) | 1991-04-04 | 1992-07-28 | Research Engineering & Manufacturing, Inc. | Fastener for thermoplastics |
US5420400A (en) | 1991-10-15 | 1995-05-30 | The Boeing Company | Combined inductive heating cycle for sequential forming the brazing |
US5599472A (en) | 1991-04-05 | 1997-02-04 | The Boeing Company | Resealable retort for induction processing of organic matrix composites or metals |
US5530227A (en) | 1991-04-05 | 1996-06-25 | The Boeing Company | Method and apparatus for consolidating organic matrix composites using induction heating |
US5723849A (en) | 1991-04-05 | 1998-03-03 | The Boeing Company | Reinforced susceptor for induction or resistance welding of thermoplastic composites |
US5410132A (en) | 1991-10-15 | 1995-04-25 | The Boeing Company | Superplastic forming using induction heating |
US7126096B1 (en) | 1991-04-05 | 2006-10-24 | Th Boeing Company | Resistance welding of thermoplastics in aerospace structure |
US5229562A (en) | 1991-04-05 | 1993-07-20 | The Boeing Company | Process for consolidation of composite materials |
US5248864A (en) | 1991-07-30 | 1993-09-28 | E. I. Du Pont De Nemours And Company | Method for induction heating of composite materials |
US5508496A (en) | 1991-10-18 | 1996-04-16 | The Boeing Company | Selvaged susceptor for thermoplastic welding by induction heating |
US5500511A (en) | 1991-10-18 | 1996-03-19 | The Boeing Company | Tailored susceptors for induction welding of thermoplastic |
US5313034A (en) | 1992-01-15 | 1994-05-17 | Edison Welding Institute, Inc. | Thermoplastic welding |
JPH061955A (ja) * | 1992-06-17 | 1994-01-11 | Nitto Denko Corp | 接着シート及び接着方法 |
WO1994008781A1 (fr) * | 1992-10-20 | 1994-04-28 | Avery Dennison Corporation | Colle de contact pour assemblage |
US5378879A (en) | 1993-04-20 | 1995-01-03 | Raychem Corporation | Induction heating of loaded materials |
US5374809A (en) | 1993-05-12 | 1994-12-20 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Induction heating coupler and annealer |
US5350902A (en) | 1993-05-12 | 1994-09-27 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Induction heating coupler |
US5374808A (en) | 1993-06-23 | 1994-12-20 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Method and device for determining bond separation strength using induction heating |
CA2173219C (fr) | 1993-11-03 | 2000-05-30 | Steven Andrew Jorissen | Compositions de resine epoxy thermodurcissables renforcees |
US5438181A (en) | 1993-12-14 | 1995-08-01 | Essex Specialty Products, Inc. | Apparatus for heating substrate having electrically-conductive and non-electrically-conductive portions |
US5534097A (en) | 1994-09-02 | 1996-07-09 | Lear Corporation | Method of bonding a seat trim cover to a foam cushion utilizing magnetic induction bonding |
US5486684A (en) | 1995-01-03 | 1996-01-23 | The Boeing Company | Multipass induction heating for thermoplastic welding |
US5538581A (en) | 1995-02-02 | 1996-07-23 | Davidson Textron Inc. | Method for electromagnetically welding thermoplastic articles together |
US5681128A (en) | 1995-02-21 | 1997-10-28 | Illinois Tool Works Inc. | Surface marking systems |
US5717191A (en) | 1995-06-06 | 1998-02-10 | The Boeing Company | Structural susceptor for thermoplastic welding |
US5705795A (en) | 1995-06-06 | 1998-01-06 | The Boeing Company | Gap filling for thermoplastic welds |
US5756973A (en) | 1995-06-07 | 1998-05-26 | The Boeing Company | Barbed susceptor for improviing pulloff strength in welded thermoplastic composite structures |
US5760379A (en) | 1995-10-26 | 1998-06-02 | The Boeing Company | Monitoring the bond line temperature in thermoplastic welds |
US5919387A (en) | 1996-04-03 | 1999-07-06 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Inductive systems for bonding and joining pipes |
TW343255B (en) | 1996-05-03 | 1998-10-21 | Senco Products | Fastening device for promoting the assembly and adherence of associated pieces by exposure to electromagnetic energy |
US5832594A (en) | 1996-05-31 | 1998-11-10 | The Boeing Company | Tooling for inserting Z-pins |
US5916469A (en) | 1996-06-06 | 1999-06-29 | The Boeing Company | Susceptor integration into reinforced thermoplastic composites |
US5770296A (en) | 1996-08-05 | 1998-06-23 | Senco Products, Inc. | Adhesive device |
TW345526B (en) | 1996-08-05 | 1998-11-21 | Senco Products | Method of assembling milled wood products and assembled milled wood product |
DK0915938T3 (da) | 1996-08-05 | 2001-08-27 | Senco Products | Fremgangsmåde til at klæbe præfabrikerede elementer til en arbejdsflade |
AU3827797A (en) | 1996-08-05 | 1998-03-06 | Senco Products Inc. | Method of adhesively assembling cellulosic products |
US5985083A (en) | 1996-08-05 | 1999-11-16 | Senco Products, Inc. | Method of adhesively assembling plastic products |
WO1998005726A1 (fr) | 1996-08-05 | 1998-02-12 | Senco Products, Inc. | Procede de collage par adhesion de composants en caoutchouc |
TW386056B (en) | 1996-08-05 | 2000-04-01 | Senco Products | Method of adhering roll goods to a work surface and article of roll goods including an adhesive device |
US6007663A (en) | 1996-08-05 | 1999-12-28 | Senco Products, Inc. | Method of adhering glass products to a work surface |
DE19644827C1 (de) * | 1996-10-29 | 1998-07-23 | Beiersdorf Ag | Verwendung eines Klebebandes zum Verkleben von Hartschaumteilen |
US5874713A (en) | 1997-07-08 | 1999-02-23 | Raychem Corporation | Single turn induction heating coil |
US6024822A (en) | 1998-02-09 | 2000-02-15 | Ato Findley, Inc. | Method of making disposable nonwoven articles with microwave activatable hot melt adhesive |
-
2001
- 2001-04-24 US US09/840,859 patent/US7141768B2/en not_active Expired - Lifetime
- 2001-04-25 EP EP20010930753 patent/EP1276827A2/fr not_active Withdrawn
- 2001-04-25 CA CA 2407206 patent/CA2407206A1/fr not_active Abandoned
- 2001-04-25 WO PCT/US2001/013347 patent/WO2001083184A2/fr not_active Application Discontinuation
- 2001-04-25 AU AU2001257258A patent/AU2001257258A1/en not_active Abandoned
Non-Patent Citations (1)
Title |
---|
See references of WO0183184A2 * |
Also Published As
Publication number | Publication date |
---|---|
CA2407206A1 (fr) | 2001-11-08 |
AU2001257258A1 (en) | 2001-11-12 |
US20020031644A1 (en) | 2002-03-14 |
WO2001083184A2 (fr) | 2001-11-08 |
US7141768B2 (en) | 2006-11-28 |
WO2001083184A3 (fr) | 2002-06-06 |
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