DE69928319D1 - Oberflächenbearbeitungsverfahren und Oberflächenbearbeitungsvorrichtung für Halbleiterscheiben - Google Patents

Oberflächenbearbeitungsverfahren und Oberflächenbearbeitungsvorrichtung für Halbleiterscheiben

Info

Publication number
DE69928319D1
DE69928319D1 DE69928319T DE69928319T DE69928319D1 DE 69928319 D1 DE69928319 D1 DE 69928319D1 DE 69928319 T DE69928319 T DE 69928319T DE 69928319 T DE69928319 T DE 69928319T DE 69928319 D1 DE69928319 D1 DE 69928319D1
Authority
DE
Germany
Prior art keywords
wafer
processing apparatus
treatment method
semiconductor wafers
transfer device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69928319T
Other languages
English (en)
Other versions
DE69928319T2 (de
Inventor
Toshihiko Ishikawa
Yasushi Katagiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP11001318A external-priority patent/JP3117132B2/ja
Priority claimed from JP325199A external-priority patent/JP3259251B2/ja
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of DE69928319D1 publication Critical patent/DE69928319D1/de
Application granted granted Critical
Publication of DE69928319T2 publication Critical patent/DE69928319T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
DE69928319T 1998-04-27 1999-04-26 Oberflächenbearbeitungsverfahren und Oberflächenbearbeitungsvorrichtung für Halbleiterscheiben Expired - Lifetime DE69928319T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP11733398 1998-04-27
JP11733798 1998-04-27
JP11733798 1998-04-27
JP11733398 1998-04-27
JP11001318A JP3117132B2 (ja) 1998-04-27 1999-01-06 ウェーハの平面加工装置
JP131899 1999-01-06
JP325199 1999-01-08
JP325199A JP3259251B2 (ja) 1998-04-27 1999-01-08 ウェーハの平面加工装置及びその平面加工方法

Publications (2)

Publication Number Publication Date
DE69928319D1 true DE69928319D1 (de) 2005-12-22
DE69928319T2 DE69928319T2 (de) 2006-04-20

Family

ID=27453377

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69928319T Expired - Lifetime DE69928319T2 (de) 1998-04-27 1999-04-26 Oberflächenbearbeitungsverfahren und Oberflächenbearbeitungsvorrichtung für Halbleiterscheiben

Country Status (4)

Country Link
US (2) US6257966B1 (de)
EP (1) EP0953409B1 (de)
AT (1) ATE309884T1 (de)
DE (1) DE69928319T2 (de)

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US8545290B2 (en) * 2010-12-08 2013-10-01 Edmond Arzuman Abrahamians Wafer polishing apparatus and method
US8535118B2 (en) * 2011-09-20 2013-09-17 International Business Machines Corporation Multi-spindle chemical mechanical planarization tool
JP5687647B2 (ja) * 2012-03-14 2015-03-18 株式会社東芝 半導体装置の製造方法、半導体製造装置
KR101409752B1 (ko) * 2012-04-26 2014-07-08 주식회사 탑 엔지니어링 기판 이송 로봇을 이용한 멀티 챔버 기판 처리 장치
US9142916B2 (en) 2013-03-15 2015-09-22 Tyco Electronics Corporation Connector assembly with receptacle carriers
CN104227704A (zh) * 2014-08-20 2014-12-24 苏州昌飞自动化设备厂 一种带三坐标微调的升降吸盘机械手的y轴微调座
CN104227705A (zh) * 2014-08-20 2014-12-24 苏州昌飞自动化设备厂 一种带三坐标微调的升降吸盘机械手
US9748090B2 (en) 2015-01-22 2017-08-29 Toshiba Memory Corporation Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
JP6503194B2 (ja) * 2015-02-16 2019-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102541489B1 (ko) * 2016-02-26 2023-06-08 삼성전자주식회사 기판 세정 장치 및 이를 이용한 기판 세정 설비
WO2018068854A1 (en) * 2016-10-13 2018-04-19 Osram Opto Semiconductors Gmbh Pick-up tool
CN109352492A (zh) * 2018-12-12 2019-02-19 徐锐 一种多工位3d海绵打磨机
CN110919526A (zh) * 2019-11-24 2020-03-27 湖南凯通电子有限公司 陶瓷基板研磨机
US20210323117A1 (en) * 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
KR20220116312A (ko) * 2020-11-05 2022-08-22 어플라이드 머티어리얼스, 인코포레이티드 수평 버핑 모듈
KR20230117437A (ko) * 2020-12-18 2023-08-08 어플라이드 머티어리얼스, 인코포레이티드 수평 사전 세정 모듈을 위한 패드 캐리어
WO2023009116A1 (en) * 2021-07-28 2023-02-02 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
CN114260217A (zh) * 2021-12-13 2022-04-01 上海提牛机电设备有限公司 晶圆清洗系统
CN114850113B (zh) * 2022-04-26 2024-01-09 中环领先半导体材料有限公司 一种减薄载台的清洗方法

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Also Published As

Publication number Publication date
EP0953409A3 (de) 2002-01-09
ATE309884T1 (de) 2005-12-15
EP0953409A2 (de) 1999-11-03
US20010024936A1 (en) 2001-09-27
EP0953409B1 (de) 2005-11-16
US6517420B2 (en) 2003-02-11
US6257966B1 (en) 2001-07-10
DE69928319T2 (de) 2006-04-20

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Legal Events

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8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition