FR2831148B1 - Procede et dispositif de manipulation d'un wafer - Google Patents

Procede et dispositif de manipulation d'un wafer

Info

Publication number
FR2831148B1
FR2831148B1 FR0113607A FR0113607A FR2831148B1 FR 2831148 B1 FR2831148 B1 FR 2831148B1 FR 0113607 A FR0113607 A FR 0113607A FR 0113607 A FR0113607 A FR 0113607A FR 2831148 B1 FR2831148 B1 FR 2831148B1
Authority
FR
France
Prior art keywords
wafer
handling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0113607A
Other languages
English (en)
Other versions
FR2831148A1 (fr
Inventor
Florence Binagot
Philippe Patrice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR0113607A priority Critical patent/FR2831148B1/fr
Publication of FR2831148A1 publication Critical patent/FR2831148A1/fr
Application granted granted Critical
Publication of FR2831148B1 publication Critical patent/FR2831148B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
FR0113607A 2001-10-22 2001-10-22 Procede et dispositif de manipulation d'un wafer Expired - Fee Related FR2831148B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0113607A FR2831148B1 (fr) 2001-10-22 2001-10-22 Procede et dispositif de manipulation d'un wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0113607A FR2831148B1 (fr) 2001-10-22 2001-10-22 Procede et dispositif de manipulation d'un wafer

Publications (2)

Publication Number Publication Date
FR2831148A1 FR2831148A1 (fr) 2003-04-25
FR2831148B1 true FR2831148B1 (fr) 2004-01-02

Family

ID=8868559

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0113607A Expired - Fee Related FR2831148B1 (fr) 2001-10-22 2001-10-22 Procede et dispositif de manipulation d'un wafer

Country Status (1)

Country Link
FR (1) FR2831148B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005126814A (ja) 2003-09-30 2005-05-19 Seiko Epson Corp 表面処理方法
CN104096980B (zh) * 2014-06-26 2016-01-20 长春光华微电子设备工程中心有限公司 激光切割真空吸附平台

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4316757A (en) 1980-03-03 1982-02-23 Monsanto Company Method and apparatus for wax mounting of thin wafers for polishing
IE55238B1 (en) 1983-08-03 1990-07-04 Nat Starch Chem Corp Carrier film with conductive adhesive for dicing of semiconductor wafers
US5476566A (en) 1992-09-02 1995-12-19 Motorola, Inc. Method for thinning a semiconductor wafer
US5392406A (en) 1992-09-18 1995-02-21 3Com Corporation DMA data path aligner and network adaptor utilizing same
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
DE69928319T2 (de) * 1998-04-27 2006-04-20 Tokyo Seimitsu Co. Ltd., Mitaka Oberflächenbearbeitungsverfahren und Oberflächenbearbeitungsvorrichtung für Halbleiterscheiben
FR2781925B1 (fr) 1998-07-30 2001-11-23 Commissariat Energie Atomique Transfert selectif d'elements d'un support vers un autre support
JP3538070B2 (ja) * 1999-07-08 2004-06-14 株式会社東芝 半導体装置の製造方法
FR2796491B1 (fr) 1999-07-12 2001-08-31 Commissariat Energie Atomique Procede de decollement de deux elements et dispositif pour sa mise en oeuvre

Also Published As

Publication number Publication date
FR2831148A1 (fr) 2003-04-25

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100630