ATE309884T1 - Oberflächenbearbeitungsverfahren und oberflächenbearbeitungsvorrichtung für halbleiterscheiben - Google Patents

Oberflächenbearbeitungsverfahren und oberflächenbearbeitungsvorrichtung für halbleiterscheiben

Info

Publication number
ATE309884T1
ATE309884T1 AT99108151T AT99108151T ATE309884T1 AT E309884 T1 ATE309884 T1 AT E309884T1 AT 99108151 T AT99108151 T AT 99108151T AT 99108151 T AT99108151 T AT 99108151T AT E309884 T1 ATE309884 T1 AT E309884T1
Authority
AT
Austria
Prior art keywords
surface processing
wafer
transfer device
suction
processing device
Prior art date
Application number
AT99108151T
Other languages
English (en)
Inventor
Toshihiko Ishikawa
Yasushi Katagiri
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP11001318A external-priority patent/JP3117132B2/ja
Priority claimed from JP325199A external-priority patent/JP3259251B2/ja
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Application granted granted Critical
Publication of ATE309884T1 publication Critical patent/ATE309884T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
AT99108151T 1998-04-27 1999-04-26 Oberflächenbearbeitungsverfahren und oberflächenbearbeitungsvorrichtung für halbleiterscheiben ATE309884T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP11733398 1998-04-27
JP11733798 1998-04-27
JP11001318A JP3117132B2 (ja) 1998-04-27 1999-01-06 ウェーハの平面加工装置
JP325199A JP3259251B2 (ja) 1998-04-27 1999-01-08 ウェーハの平面加工装置及びその平面加工方法

Publications (1)

Publication Number Publication Date
ATE309884T1 true ATE309884T1 (de) 2005-12-15

Family

ID=27453377

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99108151T ATE309884T1 (de) 1998-04-27 1999-04-26 Oberflächenbearbeitungsverfahren und oberflächenbearbeitungsvorrichtung für halbleiterscheiben

Country Status (4)

Country Link
US (2) US6257966B1 (de)
EP (1) EP0953409B1 (de)
AT (1) ATE309884T1 (de)
DE (1) DE69928319T2 (de)

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JP4985513B2 (ja) * 2008-03-26 2012-07-25 富士通セミコンダクター株式会社 電子部品の剥離方法及び剥離装置
US8545290B2 (en) * 2010-12-08 2013-10-01 Edmond Arzuman Abrahamians Wafer polishing apparatus and method
US8535118B2 (en) * 2011-09-20 2013-09-17 International Business Machines Corporation Multi-spindle chemical mechanical planarization tool
JP5687647B2 (ja) * 2012-03-14 2015-03-18 株式会社東芝 半導体装置の製造方法、半導体製造装置
KR101409752B1 (ko) * 2012-04-26 2014-07-08 주식회사 탑 엔지니어링 기판 이송 로봇을 이용한 멀티 챔버 기판 처리 장치
US9142916B2 (en) 2013-03-15 2015-09-22 Tyco Electronics Corporation Connector assembly with receptacle carriers
CN104227705A (zh) * 2014-08-20 2014-12-24 苏州昌飞自动化设备厂 一种带三坐标微调的升降吸盘机械手
CN104227704A (zh) * 2014-08-20 2014-12-24 苏州昌飞自动化设备厂 一种带三坐标微调的升降吸盘机械手的y轴微调座
US9748090B2 (en) 2015-01-22 2017-08-29 Toshiba Memory Corporation Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
JP6503194B2 (ja) * 2015-02-16 2019-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102541489B1 (ko) * 2016-02-26 2023-06-08 삼성전자주식회사 기판 세정 장치 및 이를 이용한 기판 세정 설비
WO2018068854A1 (en) * 2016-10-13 2018-04-19 Osram Opto Semiconductors Gmbh Pick-up tool
CN109352492A (zh) * 2018-12-12 2019-02-19 徐锐 一种多工位3d海绵打磨机
CN110919526A (zh) * 2019-11-24 2020-03-27 湖南凯通电子有限公司 陶瓷基板研磨机
US20210323117A1 (en) * 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US20220134505A1 (en) * 2020-11-05 2022-05-05 Applied Materials, Inc. Horizontal buffing module
KR20230117437A (ko) 2020-12-18 2023-08-08 어플라이드 머티어리얼스, 인코포레이티드 수평 사전 세정 모듈을 위한 패드 캐리어
EP4377047A1 (de) * 2021-07-28 2024-06-05 Applied Materials, Inc. Poliermodule mit hohem durchsatz und modulare poliersysteme
CN114260217A (zh) * 2021-12-13 2022-04-01 上海提牛机电设备有限公司 晶圆清洗系统
CN114850113B (zh) * 2022-04-26 2024-01-09 中环领先半导体材料有限公司 一种减薄载台的清洗方法

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Also Published As

Publication number Publication date
US6517420B2 (en) 2003-02-11
DE69928319D1 (de) 2005-12-22
EP0953409B1 (de) 2005-11-16
EP0953409A2 (de) 1999-11-03
US20010024936A1 (en) 2001-09-27
EP0953409A3 (de) 2002-01-09
DE69928319T2 (de) 2006-04-20
US6257966B1 (en) 2001-07-10

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Legal Events

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