WO2003022523A1 - Outil, dispositif et procede de finissage, dispositif de traitement et procede de production de dispositif a semiconducteurs - Google Patents

Outil, dispositif et procede de finissage, dispositif de traitement et procede de production de dispositif a semiconducteurs Download PDF

Info

Publication number
WO2003022523A1
WO2003022523A1 PCT/JP2002/009022 JP0209022W WO03022523A1 WO 2003022523 A1 WO2003022523 A1 WO 2003022523A1 JP 0209022 W JP0209022 W JP 0209022W WO 03022523 A1 WO03022523 A1 WO 03022523A1
Authority
WO
WIPO (PCT)
Prior art keywords
dressing
pad
tool
holding mechanism
dressing tool
Prior art date
Application number
PCT/JP2002/009022
Other languages
English (en)
Japanese (ja)
Inventor
Susumu Hoshino
Eiichi Yamamoto
Takahiko Mitsui
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001272945A external-priority patent/JP2003080456A/ja
Priority claimed from JP2002058096A external-priority patent/JP2003257911A/ja
Priority claimed from JP2002175035A external-priority patent/JP4348900B2/ja
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to KR1020047003519A priority Critical patent/KR100565913B1/ko
Priority to EP02765417.7A priority patent/EP1426140B1/fr
Publication of WO2003022523A1 publication Critical patent/WO2003022523A1/fr
Priority to US10/791,670 priority patent/US20050032467A1/en
Priority to US11/511,279 priority patent/US20060292969A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Abstract

La présente invention concerne un dispositif de finissage (DA) qui comprend : un mécanisme de support de patin (10) destiné à soutenir et faire tourner un patin de rectification comportant une surface de patin en forme de disque percé en son centre (15a) ; un outil de finissage (2) possédant une surface de finissage sensiblement rectangulaire (3) ; et un mécanisme de support d'outil de finissage (1) destiné à soutenir l'outil de finissage (2) de façon que la surface de finissage (3) est opposée à la surface de patin (15a) du patin de rectification (15) qui est maintenu et tourné par le mécanisme de support de patin (10). Le mécanisme de support d'outil de finissage (1) maintient l'outil de finissage (2) en butée contre la surface de patin (15a) pour effectuer le finissage, l'axe longitudinal dudit outil étant placé dans le sens de la largeur (L1) de la surface de finissage (3) et dirigé de façon qu'il s'étend radialement par rapport à la surface de patin (15a). L'invention permet d'améliorer la planéité de la surface traitée après le finissage.
PCT/JP2002/009022 2001-09-10 2002-09-05 Outil, dispositif et procede de finissage, dispositif de traitement et procede de production de dispositif a semiconducteurs WO2003022523A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020047003519A KR100565913B1 (ko) 2001-09-10 2002-09-05 드레싱 공구, 드레싱 장치, 드레싱 방법, 가공 장치 및반도체 디바이스 제조 방법
EP02765417.7A EP1426140B1 (fr) 2001-09-10 2002-09-05 Outil, dispositif et procede de finissage, dispositif de traitement et procede de production de dispositif a semiconducteurs
US10/791,670 US20050032467A1 (en) 2001-09-10 2004-03-03 Dressing tool, dressing device, dressing method, processing device and semiconductor device producing method
US11/511,279 US20060292969A1 (en) 2001-09-10 2006-08-29 Dressing tool, dressing device, dressing method, processing device and semiconductor device producing method

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2001-272945 2001-09-10
JP2001272945A JP2003080456A (ja) 2001-09-10 2001-09-10 ドレッシング工具、この工具を用いたドレッシング装置およびこのドレッシング装置によりドレッシングされた加工工具を用いた製造装置
JP2002-058096 2002-03-04
JP2002058096A JP2003257911A (ja) 2002-03-04 2002-03-04 ドレッシング方法及び装置、研磨装置、半導体デバイス並びに半導体デバイス製造方法
JP2002-175035 2002-06-14
JP2002175035A JP4348900B2 (ja) 2002-06-14 2002-06-14 ドレッシング方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10/791,670 Continuation US20050032467A1 (en) 2001-09-10 2004-03-03 Dressing tool, dressing device, dressing method, processing device and semiconductor device producing method
US11/511,279 Continuation US20060292969A1 (en) 2001-09-10 2006-08-29 Dressing tool, dressing device, dressing method, processing device and semiconductor device producing method

Publications (1)

Publication Number Publication Date
WO2003022523A1 true WO2003022523A1 (fr) 2003-03-20

Family

ID=27347468

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009022 WO2003022523A1 (fr) 2001-09-10 2002-09-05 Outil, dispositif et procede de finissage, dispositif de traitement et procede de production de dispositif a semiconducteurs

Country Status (6)

Country Link
US (2) US20050032467A1 (fr)
EP (1) EP1426140B1 (fr)
KR (1) KR100565913B1 (fr)
CN (1) CN1553842A (fr)
TW (1) TW546182B (fr)
WO (1) WO2003022523A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106965307A (zh) * 2017-05-02 2017-07-21 廊坊合力天机械设备有限公司 一种吸音板上曲面布料修整装置及修整方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8412370B2 (en) * 2005-04-01 2013-04-02 Nikon Corporation Polishing apparatus with dressing position setting means
CN100546770C (zh) * 2007-11-20 2009-10-07 浙江工业大学 抛光垫修整装置
JP5510779B2 (ja) * 2009-06-15 2014-06-04 Ｎｔｎ株式会社 研削装置
JP5764031B2 (ja) * 2011-10-06 2015-08-12 株式会社ディスコ 切削装置
TWI663025B (zh) * 2012-09-24 2019-06-21 日商荏原製作所股份有限公司 Grinding method and grinding device
JP6121795B2 (ja) * 2013-05-15 2017-04-26 株式会社荏原製作所 ドレッシング装置、該ドレッシング装置を備えた研磨装置、および研磨方法
JP6093741B2 (ja) * 2014-10-21 2017-03-08 信越半導体株式会社 研磨装置及びウェーハの研磨方法
CN106563980B (zh) * 2015-10-12 2020-04-10 株式会社迪思科 磨削方法
US9802293B1 (en) * 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
JP6803187B2 (ja) * 2016-10-05 2020-12-23 株式会社ディスコ 研削砥石のドレッシング方法
CN106938437A (zh) * 2017-05-12 2017-07-11 深圳市海德精密机械有限公司 一种亚微米级超镜面抛光设备
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
US10814457B2 (en) * 2018-03-19 2020-10-27 Globalfoundries Inc. Gimbal for CMP tool conditioning disk having flexible metal diaphragm
JP7308074B2 (ja) * 2019-05-14 2023-07-13 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN112975750A (zh) * 2021-02-08 2021-06-18 华中科技大学 平移式晶圆磨削用砂轮在线修磨装置
CN114952452B (zh) * 2022-04-19 2023-09-26 赛莱克斯微系统科技（北京）有限公司 抛光垫修整器、化学机械抛光装置和方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6471557A (en) 1987-09-10 1989-03-16 Aeg Elotherm Gmbh Method and device for electromagnetically agitating molten metal in continuous casting cooling mold
JPH07237113A (ja) * 1994-02-28 1995-09-12 Hitachi Zosen Corp 表面仕上げ装置付き両面研磨機
JPH0911117A (ja) * 1995-06-20 1997-01-14 Sony Corp 平坦化方法及び平坦化装置
US5782682A (en) * 1995-06-09 1998-07-21 Ehwa Diamond Ind. Co. Ltd. Grinding wheel having abrasive tips
JP2000237947A (ja) * 1999-02-19 2000-09-05 Speedfam-Ipec Co Ltd ドレッサ
US6116997A (en) * 1998-04-23 2000-09-12 Hakomori; Shunji Single side work polishing apparatus
JP2001162513A (ja) * 1999-12-09 2001-06-19 Daido Steel Co Ltd 片面ラップ盤のラップ面修正装置
US20010009844A1 (en) 1998-04-25 2001-07-26 Sung-Bum Cho Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
US6273797B1 (en) * 1999-11-19 2001-08-14 International Business Machines Corporation In-situ automated CMP wedge conditioner

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785585A (en) * 1995-09-18 1998-07-28 International Business Machines Corporation Polish pad conditioner with radial compensation
US6884155B2 (en) * 1999-11-22 2005-04-26 Kinik Diamond grid CMP pad dresser
US6237797B1 (en) * 1999-10-29 2001-05-29 John J. Hurford Fuel cap extension
US6547651B1 (en) * 1999-11-10 2003-04-15 Strasbaugh Subaperture chemical mechanical planarization with polishing pad conditioning

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6471557A (en) 1987-09-10 1989-03-16 Aeg Elotherm Gmbh Method and device for electromagnetically agitating molten metal in continuous casting cooling mold
JPH07237113A (ja) * 1994-02-28 1995-09-12 Hitachi Zosen Corp 表面仕上げ装置付き両面研磨機
US5782682A (en) * 1995-06-09 1998-07-21 Ehwa Diamond Ind. Co. Ltd. Grinding wheel having abrasive tips
JPH0911117A (ja) * 1995-06-20 1997-01-14 Sony Corp 平坦化方法及び平坦化装置
US6116997A (en) * 1998-04-23 2000-09-12 Hakomori; Shunji Single side work polishing apparatus
US20010009844A1 (en) 1998-04-25 2001-07-26 Sung-Bum Cho Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
JP2000237947A (ja) * 1999-02-19 2000-09-05 Speedfam-Ipec Co Ltd ドレッサ
US6273797B1 (en) * 1999-11-19 2001-08-14 International Business Machines Corporation In-situ automated CMP wedge conditioner
JP2001162513A (ja) * 1999-12-09 2001-06-19 Daido Steel Co Ltd 片面ラップ盤のラップ面修正装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1426140A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106965307A (zh) * 2017-05-02 2017-07-21 廊坊合力天机械设备有限公司 一种吸音板上曲面布料修整装置及修整方法

Also Published As

Publication number Publication date
US20050032467A1 (en) 2005-02-10
KR20040031070A (ko) 2004-04-09
CN1553842A (zh) 2004-12-08
EP1426140A4 (fr) 2007-08-08
US20060292969A1 (en) 2006-12-28
KR100565913B1 (ko) 2006-03-31
EP1426140B1 (fr) 2013-07-10
EP1426140A1 (fr) 2004-06-09
TW546182B (en) 2003-08-11

Similar Documents

Publication Publication Date Title
WO2003022523A1 (fr) Outil, dispositif et procede de finissage, dispositif de traitement et procede de production de dispositif a semiconducteurs
AU1670597A (en) Cerium oxide abrasive, semiconductor chip, semiconductor device, process for the production of them, and method for the polishing of substrates
AU1683899A (en) Abrasive, method of polishing wafer, and method of producing semiconductor device
WO2002053322A3 (fr) Systeme et procede de polissage et de planarisation de plaquettes semi-conductrices mettant en oeuvre des tampons a polir a aire specifique reduite et des techniques de recouvrement partiel et variable tampon-plaquette
EP1055486A3 (fr) Dispositif de dressage et dispositif de polissage
AU2001253382A1 (en) Abrasive article having a window system for polishing wafers, and methods
EP1205965A4 (fr) Compose abrasif pour polissage cmp, procede de polissage d'un substrat, procede de fabrication d'un dispositif a semiconducteur utilisant ledit compose, et additif pour compose abrasif cmp
EP1478012A4 (fr) Procede de polissage et fluide de polissage
AU4472997A (en) Semiconductor substrate polishing pad dresser, method of manufacturing the same, and chemicomechanical polishing method using the same dresser
EP0373501A3 (fr) Composition pour le polissage fin de plaquettes
TW376350B (en) Process for polishing a semiconductor device substrate
WO2004013242A3 (fr) Procede servant a reduire le cintrage et l'erosion lors de la planarisation par polissage chimico-mecanique (procede cmp)
TW429462B (en) Manufacturing method and processing device for semiconductor device
WO2003009349A3 (fr) Procedes et compositions pour polir mecaniquement et chimiquement des substrats d'isolation de tranchees peu profondes
TW200642796A (en) Manufacturing method for semiconductor wafers, slicing method for slicing work and wire saw used for the same
WO2001062436A1 (fr) Procede et appareil permettant de polir une partie circulaire exterieure a chanfrein d'une tranche
AU2001293125A1 (en) Tool for applying resilient tape to chuck used for grinding or polishing wafers
EP1175965A3 (fr) Outil de polissage, procédé de fabrication d'un tel outil, appareil de polissage d'une plaquette semiconductrice et procédé de polissage d'un substrat
WO2002066206A3 (fr) Procede et appareil de polissage de plaquettes
TW200731380A (en) Semiconductor wafer manufacturing method, semiconductor wafer double-sided grinding method, and semiconductor wafer double-sided grinding apparatus
TW430587B (en) Grinding or polishing method and device for semiconductor silicon single crystal wafer
EP1676672A4 (fr) Porteur de retenue de plaquettes, meuleuse double face l'utilisant et procede de meulage double face pour plaquettes
GB2360965B (en) Improvements in and relating to grinding machines
WO2003003428A3 (fr) Appareil, processus et procede permettant de monter et de traiter un substrat
WO2001028739A8 (fr) Dispositif de polissage pour bord peripherique exterieur de tranche de semi-conducteur

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN KR

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 10791670

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 20028176162

Country of ref document: CN

Ref document number: 2002765417

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020047003519

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2002765417

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 11511279

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 11511279

Country of ref document: US