AU2001253382A1 - Abrasive article having a window system for polishing wafers, and methods - Google Patents

Abrasive article having a window system for polishing wafers, and methods

Info

Publication number
AU2001253382A1
AU2001253382A1 AU2001253382A AU5338201A AU2001253382A1 AU 2001253382 A1 AU2001253382 A1 AU 2001253382A1 AU 2001253382 A AU2001253382 A AU 2001253382A AU 5338201 A AU5338201 A AU 5338201A AU 2001253382 A1 AU2001253382 A1 AU 2001253382A1
Authority
AU
Australia
Prior art keywords
methods
abrasive article
window system
polishing wafers
backing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001253382A
Inventor
Wesley J Bruxvoort
Jerry J. Fizel
John J Gagliardi
Chong Yong Kim
Michael J. Muilenburg
Daniel B. Pendergrass Jr.
Robert J. Streifel
Richard J Webb
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2001253382A1 publication Critical patent/AU2001253382A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/005—Making abrasive webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Abstract

A method of making an abrasive article for wafer planarization, the method comprising providing an abrasive coating composition, providing a backing having a first major surface, said surface having a first portion and a second portion, and bringing the backing into contact with the abrasive coating composition, so that the abrasive coating composition substantially adheres only to the first portion of the backing.
AU2001253382A 2000-11-29 2001-04-11 Abrasive article having a window system for polishing wafers, and methods Abandoned AU2001253382A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09726064 2000-11-29
US09/726,064 US20020072296A1 (en) 2000-11-29 2000-11-29 Abrasive article having a window system for polishing wafers, and methods
PCT/US2001/011841 WO2002043925A1 (en) 2000-11-29 2001-04-11 Abrasive article having a window system for polishing wafers, and methods

Publications (1)

Publication Number Publication Date
AU2001253382A1 true AU2001253382A1 (en) 2002-06-11

Family

ID=24917074

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001253382A Abandoned AU2001253382A1 (en) 2000-11-29 2001-04-11 Abrasive article having a window system for polishing wafers, and methods

Country Status (13)

Country Link
US (3) US20020072296A1 (en)
EP (2) EP1655103B1 (en)
JP (1) JP2004516947A (en)
KR (1) KR100711160B1 (en)
CN (1) CN1238161C (en)
AT (2) ATE320881T1 (en)
AU (1) AU2001253382A1 (en)
CA (1) CA2430377A1 (en)
DE (2) DE60134797D1 (en)
IL (1) IL155856A0 (en)
MY (1) MY126929A (en)
TW (1) TW564202B (en)
WO (1) WO2002043925A1 (en)

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US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
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Also Published As

Publication number Publication date
US20030064663A1 (en) 2003-04-03
CN1476368A (en) 2004-02-18
US20030022598A1 (en) 2003-01-30
CA2430377A1 (en) 2002-06-06
ATE320881T1 (en) 2006-04-15
EP1337380B1 (en) 2006-03-22
EP1337380A1 (en) 2003-08-27
MY126929A (en) 2006-10-31
DE60118171D1 (en) 2006-05-11
IL155856A0 (en) 2003-12-23
US6604985B2 (en) 2003-08-12
WO2002043925A1 (en) 2002-06-06
US6786810B2 (en) 2004-09-07
TW564202B (en) 2003-12-01
US20020072296A1 (en) 2002-06-13
KR20030048484A (en) 2003-06-19
EP1655103A1 (en) 2006-05-10
DE60118171T2 (en) 2007-01-25
KR100711160B1 (en) 2007-05-16
EP1655103B1 (en) 2008-07-09
DE60134797D1 (en) 2008-08-21
CN1238161C (en) 2006-01-25
JP2004516947A (en) 2004-06-10
ATE400405T1 (en) 2008-07-15

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