EP1426140A4 - Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method - Google Patents

Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method

Info

Publication number
EP1426140A4
EP1426140A4 EP02765417A EP02765417A EP1426140A4 EP 1426140 A4 EP1426140 A4 EP 1426140A4 EP 02765417 A EP02765417 A EP 02765417A EP 02765417 A EP02765417 A EP 02765417A EP 1426140 A4 EP1426140 A4 EP 1426140A4
Authority
EP
European Patent Office
Prior art keywords
dressing
pad
tool
holding mechanism
dressing tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP02765417A
Other languages
German (de)
French (fr)
Other versions
EP1426140A1 (en
EP1426140B1 (en
Inventor
Susumu Hoshino
Eiichi Yamamoto
Takahiko Mitsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001272945A external-priority patent/JP2003080456A/en
Priority claimed from JP2002058096A external-priority patent/JP2003257911A/en
Priority claimed from JP2002175035A external-priority patent/JP4348900B2/en
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of EP1426140A1 publication Critical patent/EP1426140A1/en
Publication of EP1426140A4 publication Critical patent/EP1426140A4/en
Application granted granted Critical
Publication of EP1426140B1 publication Critical patent/EP1426140B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Abstract

A dressing device (DA) is comprised of a pad holding mechanism (10) for holding and rotating a grinding pad (15) having a doughnut disk-shaped pad surface (15a), a dressing tool (2) having a substantially rectangular dressing surface (3), and a dressing tool holding mechanism (1) for holding the dressing tool (2) with the dressing surface (3) opposed to the pad surface (15a) of the grinding pad (15) held and rotated by the pad holding mechanism (10). The dressing tool holding mechanism (1) abuts dressing tool (2) held therein against the pad surface (15a) to effect dressing with the widthwise centerline (L1) of the dressing surface (3) directed to extend radially of the pad surface (15a). This makes it possible to improve the flatness of the processed surface after dressing.
EP02765417.7A 2001-09-10 2002-09-05 Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method Expired - Lifetime EP1426140B1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2001272945A JP2003080456A (en) 2001-09-10 2001-09-10 Dressing tool, dressing device using the tool and manufacturing device using working tool dressed by the dressing device
JP2001272945 2001-09-10
JP2002058096 2002-03-04
JP2002058096A JP2003257911A (en) 2002-03-04 2002-03-04 Dressing method and dressing device, polishing device, and semiconductor device and manufacturing method thereof
JP2002175035A JP4348900B2 (en) 2002-06-14 2002-06-14 Dressing method
JP2002175035 2002-06-14
PCT/JP2002/009022 WO2003022523A1 (en) 2001-09-10 2002-09-05 Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method

Publications (3)

Publication Number Publication Date
EP1426140A1 EP1426140A1 (en) 2004-06-09
EP1426140A4 true EP1426140A4 (en) 2007-08-08
EP1426140B1 EP1426140B1 (en) 2013-07-10

Family

ID=27347468

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02765417.7A Expired - Lifetime EP1426140B1 (en) 2001-09-10 2002-09-05 Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method

Country Status (6)

Country Link
US (2) US20050032467A1 (en)
EP (1) EP1426140B1 (en)
KR (1) KR100565913B1 (en)
CN (1) CN1553842A (en)
TW (1) TW546182B (en)
WO (1) WO2003022523A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006106790A1 (en) * 2005-04-01 2008-09-11 株式会社ニコン Polishing apparatus, semiconductor device manufacturing method using the polishing apparatus, and semiconductor device manufactured by the semiconductor device manufacturing method
CN100546770C (en) * 2007-11-20 2009-10-07 浙江工业大学 Trimming device for polishing cushion
JP5510779B2 (en) * 2009-06-15 2014-06-04 Ｎｔｎ株式会社 Grinding equipment
JP5764031B2 (en) * 2011-10-06 2015-08-12 株式会社ディスコ Cutting equipment
TWI663018B (en) * 2012-09-24 2019-06-21 日商荏原製作所股份有限公司 Grinding method and grinding device
JP6121795B2 (en) * 2013-05-15 2017-04-26 株式会社荏原製作所 Dressing apparatus, polishing apparatus equipped with the dressing apparatus, and polishing method
JP6093741B2 (en) * 2014-10-21 2017-03-08 信越半導体株式会社 Polishing apparatus and wafer polishing method
CN106563980B (en) * 2015-10-12 2020-04-10 株式会社迪思科 Grinding method
US9802293B1 (en) * 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
JP6803187B2 (en) * 2016-10-05 2020-12-23 株式会社ディスコ Grinding wheel dressing method
CN106965307A (en) * 2017-05-02 2017-07-21 廊坊合力天机械设备有限公司 A kind of abatvoix top-surface camber cloth trimming device and dressing method
CN106938437A (en) * 2017-05-12 2017-07-11 深圳市海德精密机械有限公司 A kind of super mirror finish equipment of submicron order
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
US10814457B2 (en) * 2018-03-19 2020-10-27 Globalfoundries Inc. Gimbal for CMP tool conditioning disk having flexible metal diaphragm
JP7308074B2 (en) * 2019-05-14 2023-07-13 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
CN112975750A (en) * 2021-02-08 2021-06-18 华中科技大学 Online grinding device for grinding wheel for translational wafer grinding
CN114952452B (en) * 2022-04-19 2023-09-26 赛莱克斯微系统科技（北京）有限公司 Polishing pad conditioner, chemical mechanical polishing device and method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3730300A1 (en) 1987-09-10 1989-03-23 Aeg Elotherm Gmbh Method and apparatus for the electromagnetic stirring of metal melts in a continuous casting mould
JP2953943B2 (en) * 1994-02-28 1999-09-27 日立造船株式会社 Double-side polishing machine with surface finishing device
KR0158750B1 (en) * 1995-06-09 1999-01-15 김수광 Grinding sheet
JPH0911117A (en) * 1995-06-20 1997-01-14 Sony Corp Flattening method and apparatus
US5785585A (en) * 1995-09-18 1998-07-28 International Business Machines Corporation Polish pad conditioner with radial compensation
US6884155B2 (en) * 1999-11-22 2005-04-26 Kinik Diamond grid CMP pad dresser
JPH11300599A (en) * 1998-04-23 1999-11-02 Speedfam-Ipec Co Ltd Method and device for grinding one side of work
KR19990081117A (en) 1998-04-25 1999-11-15 윤종용 CMP Pad Conditioning Disc and Conditioner, Manufacturing Method, Regeneration Method and Cleaning Method of the Disc
JP2000237947A (en) * 1999-02-19 2000-09-05 Speedfam-Ipec Co Ltd Dresser
US6237797B1 (en) * 1999-10-29 2001-05-29 John J. Hurford Fuel cap extension
US6547651B1 (en) * 1999-11-10 2003-04-15 Strasbaugh Subaperture chemical mechanical planarization with polishing pad conditioning
US6273797B1 (en) * 1999-11-19 2001-08-14 International Business Machines Corporation In-situ automated CMP wedge conditioner
JP2001162513A (en) * 1999-12-09 2001-06-19 Daido Steel Co Ltd Lapping surface truing device for single-side lapping machine

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *

Also Published As

Publication number Publication date
WO2003022523A1 (en) 2003-03-20
TW546182B (en) 2003-08-11
EP1426140A1 (en) 2004-06-09
EP1426140B1 (en) 2013-07-10
KR20040031070A (en) 2004-04-09
CN1553842A (en) 2004-12-08
US20050032467A1 (en) 2005-02-10
US20060292969A1 (en) 2006-12-28
KR100565913B1 (en) 2006-03-31

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