JPH03234467A - Polishing method of metal mold mounting surface of stamper and polishing machine therefor - Google Patents

Polishing method of metal mold mounting surface of stamper and polishing machine therefor

Info

Publication number
JPH03234467A
JPH03234467A JP2024393A JP2439390A JPH03234467A JP H03234467 A JPH03234467 A JP H03234467A JP 2024393 A JP2024393 A JP 2024393A JP 2439390 A JP2439390 A JP 2439390A JP H03234467 A JPH03234467 A JP H03234467A
Authority
JP
Japan
Prior art keywords
polishing
stamper
mounting surface
metal mold
mold mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024393A
Inventor
Shoji Akino
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2024393A priority Critical patent/JPH03234467A/en
Publication of JPH03234467A publication Critical patent/JPH03234467A/en
Application status is Pending legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • B24B37/013Devices or means for detecting lapping completion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245Pads with fixed abrasives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Abstract

PURPOSE:To highly shorten the time required from polishing start to finish by providing an arithmetic part of an optical displacement gauge for continually calculating and determining the measurement value of displacement quantity of a measuring surface orthogonal to a metal mold mounting surface on the basis of the measurement signal of a sensor. CONSTITUTION:A value obtained by subtracting the determined thickness of a stamper 1 to be finished by polishing from the thickness of the stamper prior to polishing is taken as a polishing margin, and then polishing is started. The polishing quantity of the metal mold mounting surface 1a of the stamper 1 is continually measured by an optical displacement gauge 3 during polishing, and when the measurement value reaches the polishing margin, a polishing machine is stopped by a control unit 8.
JP2024393A 1990-02-05 1990-02-05 Polishing method of metal mold mounting surface of stamper and polishing machine therefor Pending JPH03234467A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024393A JPH03234467A (en) 1990-02-05 1990-02-05 Polishing method of metal mold mounting surface of stamper and polishing machine therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2024393A JPH03234467A (en) 1990-02-05 1990-02-05 Polishing method of metal mold mounting surface of stamper and polishing machine therefor

Publications (1)

Publication Number Publication Date
JPH03234467A true JPH03234467A (en) 1991-10-18

Family

ID=12136924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024393A Pending JPH03234467A (en) 1990-02-05 1990-02-05 Polishing method of metal mold mounting surface of stamper and polishing machine therefor

Country Status (1)

Country Link
JP (1) JPH03234467A (en)

Cited By (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5964643A (en) * 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US6068540A (en) * 1997-05-16 2000-05-30 Siemens Aktiengesellschaft Polishing device and polishing cloth for semiconductor substrates
US6146242A (en) * 1999-06-11 2000-11-14 Strasbaugh, Inc. Optical view port for chemical mechanical planarization endpoint detection
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6179709B1 (en) 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
WO2001010599A1 (en) * 1999-08-11 2001-02-15 Speedfam-Ipec Corporation Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing
US6190234B1 (en) 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US6247998B1 (en) 1999-01-25 2001-06-19 Applied Materials, Inc. Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
US6254459B1 (en) * 1998-03-10 2001-07-03 Lam Research Corporation Wafer polishing device with movable window
US6261155B1 (en) 1997-05-28 2001-07-17 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6280289B1 (en) 1998-11-02 2001-08-28 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
US6296548B1 (en) 1998-11-02 2001-10-02 Applied Materials, Inc. Method and apparatus for optical monitoring in chemical mechanical polishing
US6309276B1 (en) 2000-02-01 2001-10-30 Applied Materials, Inc. Endpoint monitoring with polishing rate change
US6332470B1 (en) 1997-12-30 2001-12-25 Boris Fishkin Aerosol substrate cleaner
WO2002026445A1 (en) * 2000-09-29 2002-04-04 Strasbaugh, Inc. Polishing pad with built-in optical sensor
US6383058B1 (en) 2000-01-28 2002-05-07 Applied Materials, Inc. Adaptive endpoint detection for chemical mechanical polishing
US6399501B2 (en) * 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
US6506097B1 (en) 2000-01-18 2003-01-14 Applied Materials, Inc. Optical monitoring in a two-step chemical mechanical polishing process
US6524164B1 (en) 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US6537133B1 (en) 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US6602724B2 (en) 2000-07-27 2003-08-05 Applied Materials, Inc. Chemical mechanical polishing of a metal layer with polishing rate monitoring
US6621584B2 (en) 1997-05-28 2003-09-16 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
WO2003097300A1 (en) * 2002-05-14 2003-11-27 Strasbaugh Polishing pad with optical sensor
US6676717B1 (en) 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6696005B2 (en) 2002-05-13 2004-02-24 Strasbaugh Method for making a polishing pad with built-in optical sensor
US6716085B2 (en) 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
US6719818B1 (en) 1995-03-28 2004-04-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
JP2004516947A (en) * 2000-11-29 2004-06-10 スリーエム イノベイティブ プロパティズ カンパニー Abrasive articles, and methods having a window system for polishing a wafer
US6849152B2 (en) 1992-12-28 2005-02-01 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6878038B2 (en) 2000-07-10 2005-04-12 Applied Materials Inc. Combined eddy current sensing and optical monitoring for chemical mechanical polishing
US6913513B2 (en) * 2000-02-16 2005-07-05 Ebara Corporation Polishing apparatus
US6913514B2 (en) * 2003-03-14 2005-07-05 Ebara Technologies, Inc. Chemical mechanical polishing endpoint detection system and method
US6930782B1 (en) 2003-03-28 2005-08-16 Lam Research Corporation End point detection with imaging matching in semiconductor processing
US6966816B2 (en) 2001-05-02 2005-11-22 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
US6994607B2 (en) 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US7001242B2 (en) 2002-02-06 2006-02-21 Applied Materials, Inc. Method and apparatus of eddy current monitoring for chemical mechanical polishing
US7008295B2 (en) 2003-02-04 2006-03-07 Applied Materials Inc. Substrate monitoring during chemical mechanical polishing
US7037403B1 (en) 1992-12-28 2006-05-02 Applied Materials Inc. In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization
US7097537B1 (en) 2003-08-18 2006-08-29 Applied Materials, Inc. Determination of position of sensor measurements during polishing
US7118457B2 (en) 2000-05-19 2006-10-10 Applied Materials, Inc. Method of forming a polishing pad for endpoint detection
US7120553B2 (en) 2004-07-22 2006-10-10 Applied Materials, Inc. Iso-reflectance wavelengths
US7153185B1 (en) 2003-08-18 2006-12-26 Applied Materials, Inc. Substrate edge detection
US7235154B2 (en) 2004-01-08 2007-06-26 Strasbaugh Devices and methods for optical endpoint detection during semiconductor wafer polishing
US7264536B2 (en) 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US7731566B2 (en) 1995-03-28 2010-06-08 Applied Materials, Inc. Substrate polishing metrology using interference signals
JP2011164110A (en) * 1999-12-23 2011-08-25 Kla-Tencor Corp In-situ metalization monitoring using eddy current measurement or optical measurement

Cited By (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7037403B1 (en) 1992-12-28 2006-05-02 Applied Materials Inc. In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization
US7569119B2 (en) 1992-12-28 2009-08-04 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization
US7024063B2 (en) 1992-12-28 2006-04-04 Applied Materials Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US7582183B2 (en) 1992-12-28 2009-09-01 Applied Materials, Inc. Apparatus for detection of thin films during chemical/mechanical polishing planarization
US6849152B2 (en) 1992-12-28 2005-02-01 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US8506356B2 (en) 1995-03-28 2013-08-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US7011565B2 (en) 1995-03-28 2006-03-14 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US7731566B2 (en) 1995-03-28 2010-06-08 Applied Materials, Inc. Substrate polishing metrology using interference signals
US6860791B2 (en) 1995-03-28 2005-03-01 Applied Materials, Inc. Polishing pad for in-situ endpoint detection
US7775852B2 (en) 1995-03-28 2010-08-17 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6719818B1 (en) 1995-03-28 2004-04-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6280290B1 (en) 1995-03-28 2001-08-28 Applied Materials, Inc. Method of forming a transparent window in a polishing pad
US6875078B2 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US8092274B2 (en) 1995-03-28 2012-01-10 Applied Materials, Inc. Substrate polishing metrology using interference signals
US7118450B2 (en) 1995-03-28 2006-10-10 Applied Materials, Inc. Polishing pad with window and method of fabricating a window in a polishing pad
US6910944B2 (en) 1995-03-28 2005-06-28 Applied Materials, Inc. Method of forming a transparent window in a polishing pad
US8556679B2 (en) 1995-03-28 2013-10-15 Applied Materials, Inc. Substrate polishing metrology using interference signals
JP2007027781A (en) * 1995-03-28 2007-02-01 Applied Materials Inc Polishing pad
US6045439A (en) * 1995-03-28 2000-04-04 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US7255629B2 (en) 1995-03-28 2007-08-14 Applied Materials, Inc. Polishing assembly with a window
US7841926B2 (en) 1995-03-28 2010-11-30 Applied Materials, Inc. Substrate polishing metrology using interference signals
US5964643A (en) * 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US6676717B1 (en) 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6537133B1 (en) 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US6068540A (en) * 1997-05-16 2000-05-30 Siemens Aktiengesellschaft Polishing device and polishing cloth for semiconductor substrates
US6261155B1 (en) 1997-05-28 2001-07-17 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6621584B2 (en) 1997-05-28 2003-09-16 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6332470B1 (en) 1997-12-30 2001-12-25 Boris Fishkin Aerosol substrate cleaner
US6254459B1 (en) * 1998-03-10 2001-07-03 Lam Research Corporation Wafer polishing device with movable window
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6652355B2 (en) 1998-11-02 2003-11-25 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
US6913511B2 (en) 1998-11-02 2005-07-05 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
US6659842B2 (en) 1998-11-02 2003-12-09 Applied Materials Inc. Method and apparatus for optical monitoring in chemical mechanical polishing
US6524165B1 (en) 1998-11-02 2003-02-25 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6296548B1 (en) 1998-11-02 2001-10-02 Applied Materials, Inc. Method and apparatus for optical monitoring in chemical mechanical polishing
US6280289B1 (en) 1998-11-02 2001-08-28 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
US6494766B1 (en) 1998-11-02 2002-12-17 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US7018271B2 (en) 1998-11-02 2006-03-28 Applied Materials Inc. Method for monitoring a substrate during chemical mechanical polishing
US6764380B2 (en) 1998-11-02 2004-07-20 Applied Materials Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US7086929B2 (en) 1999-01-25 2006-08-08 Applied Materials Endpoint detection with multiple light beams
US6190234B1 (en) 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US6247998B1 (en) 1999-01-25 2001-06-19 Applied Materials, Inc. Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
US6607422B1 (en) 1999-01-25 2003-08-19 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US6986699B2 (en) 1999-01-25 2006-01-17 Applied Materials, Inc. Method and apparatus for determining polishing endpoint with multiple light sources
US6585563B1 (en) 1999-02-04 2003-07-01 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US6796880B2 (en) 1999-02-04 2004-09-28 Applied Materials, Inc. Linear polishing sheet with window
US6179709B1 (en) 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US6991517B2 (en) 1999-02-04 2006-01-31 Applied Materials Inc. Linear polishing sheet with window
US6146242A (en) * 1999-06-11 2000-11-14 Strasbaugh, Inc. Optical view port for chemical mechanical planarization endpoint detection
WO2000076725A1 (en) * 1999-06-11 2000-12-21 Lam Research Corporation Optical view port for chemical mechanical planarization endpoint detection
US6488568B1 (en) 1999-06-11 2002-12-03 Lam Research Corporation Optical view port for chemical mechanical planarization endpoint detection
WO2001010599A1 (en) * 1999-08-11 2001-02-15 Speedfam-Ipec Corporation Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing
US6896585B2 (en) 1999-09-14 2005-05-24 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US7677959B2 (en) 1999-09-14 2010-03-16 Applied Materials, Inc. Multilayer polishing pad and method of making
US6524164B1 (en) 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US7189141B2 (en) 1999-09-14 2007-03-13 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US6399501B2 (en) * 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
JP2011164110A (en) * 1999-12-23 2011-08-25 Kla-Tencor Corp In-situ metalization monitoring using eddy current measurement or optical measurement
US6632124B2 (en) 2000-01-18 2003-10-14 Applied Materials Inc. Optical monitoring in a two-step chemical mechanical polishing process
US6506097B1 (en) 2000-01-18 2003-01-14 Applied Materials, Inc. Optical monitoring in a two-step chemical mechanical polishing process
US6383058B1 (en) 2000-01-28 2002-05-07 Applied Materials, Inc. Adaptive endpoint detection for chemical mechanical polishing
US6309276B1 (en) 2000-02-01 2001-10-30 Applied Materials, Inc. Endpoint monitoring with polishing rate change
US6913513B2 (en) * 2000-02-16 2005-07-05 Ebara Corporation Polishing apparatus
US7118457B2 (en) 2000-05-19 2006-10-10 Applied Materials, Inc. Method of forming a polishing pad for endpoint detection
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US7429207B2 (en) 2000-05-19 2008-09-30 Applied Materials, Inc. System for endpoint detection with polishing pad
US9333621B2 (en) 2000-05-19 2016-05-10 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US7008297B2 (en) 2000-07-10 2006-03-07 Applied Materials Inc. Combined eddy current sensing and optical monitoring for chemical mechanical polishing
US6878038B2 (en) 2000-07-10 2005-04-12 Applied Materials Inc. Combined eddy current sensing and optical monitoring for chemical mechanical polishing
US6869332B2 (en) 2000-07-27 2005-03-22 Applied Materials, Inc. Chemical mechanical polishing of a metal layer with polishing rate monitoring
US6602724B2 (en) 2000-07-27 2003-08-05 Applied Materials, Inc. Chemical mechanical polishing of a metal layer with polishing rate monitoring
US6986701B2 (en) 2000-09-29 2006-01-17 Strasbaugh Polishing pad with built-in optical sensor
WO2002026445A1 (en) * 2000-09-29 2002-04-04 Strasbaugh, Inc. Polishing pad with built-in optical sensor
US6739945B2 (en) 2000-09-29 2004-05-25 Strasbaugh Polishing pad with built-in optical sensor
JP2004516947A (en) * 2000-11-29 2004-06-10 スリーエム イノベイティブ プロパティズ カンパニー Abrasive articles, and methods having a window system for polishing a wafer
US7195536B2 (en) 2001-05-02 2007-03-27 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
US6966816B2 (en) 2001-05-02 2005-11-22 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
US7682221B2 (en) 2001-05-02 2010-03-23 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
US7198544B2 (en) 2001-12-28 2007-04-03 Applied Materials, Inc. Polishing pad with window
US6994607B2 (en) 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US6716085B2 (en) 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
US7374477B2 (en) 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
US7001242B2 (en) 2002-02-06 2006-02-21 Applied Materials, Inc. Method and apparatus of eddy current monitoring for chemical mechanical polishing
US6696005B2 (en) 2002-05-13 2004-02-24 Strasbaugh Method for making a polishing pad with built-in optical sensor
US6726528B2 (en) 2002-05-14 2004-04-27 Strasbaugh Polishing pad with optical sensor
US6884150B2 (en) 2002-05-14 2005-04-26 Strasbaugh Polishing pad sensor assembly with a damping pad
WO2003097300A1 (en) * 2002-05-14 2003-11-27 Strasbaugh Polishing pad with optical sensor
US8858298B2 (en) 2002-07-24 2014-10-14 Applied Materials, Inc. Polishing pad with two-section window having recess
US7008295B2 (en) 2003-02-04 2006-03-07 Applied Materials Inc. Substrate monitoring during chemical mechanical polishing
US6913514B2 (en) * 2003-03-14 2005-07-05 Ebara Technologies, Inc. Chemical mechanical polishing endpoint detection system and method
US6930782B1 (en) 2003-03-28 2005-08-16 Lam Research Corporation End point detection with imaging matching in semiconductor processing
US7153185B1 (en) 2003-08-18 2006-12-26 Applied Materials, Inc. Substrate edge detection
US7097537B1 (en) 2003-08-18 2006-08-29 Applied Materials, Inc. Determination of position of sensor measurements during polishing
US7264536B2 (en) 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US7547243B2 (en) 2003-09-23 2009-06-16 Applied Materials, Inc. Method of making and apparatus having polishing pad with window
US7235154B2 (en) 2004-01-08 2007-06-26 Strasbaugh Devices and methods for optical endpoint detection during semiconductor wafer polishing
US7120553B2 (en) 2004-07-22 2006-10-10 Applied Materials, Inc. Iso-reflectance wavelengths

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