DE69908417T2 - Wärme entklebbare klebstoffzusammensetzung und klebestruktur - Google Patents
Wärme entklebbare klebstoffzusammensetzung und klebestruktur Download PDFInfo
- Publication number
- DE69908417T2 DE69908417T2 DE69908417T DE69908417T DE69908417T2 DE 69908417 T2 DE69908417 T2 DE 69908417T2 DE 69908417 T DE69908417 T DE 69908417T DE 69908417 T DE69908417 T DE 69908417T DE 69908417 T2 DE69908417 T2 DE 69908417T2
- Authority
- DE
- Germany
- Prior art keywords
- adhesive
- heat
- adhesive composition
- expandable
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
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- DPZSNGJNFHWQDC-ARJAWSKDSA-N (z)-2,3-diaminobut-2-enedinitrile Chemical compound N#CC(/N)=C(/N)C#N DPZSNGJNFHWQDC-ARJAWSKDSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
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- 239000011324 bead Substances 0.000 description 1
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- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 230000007246 mechanism Effects 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
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- 229910052750 molybdenum Inorganic materials 0.000 description 1
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- OHBCEHHJPNBVME-UHFFFAOYSA-N n-[[3,5-dimethyl-4-(oxiran-2-ylmethoxy)phenyl]methyl]prop-2-enamide Chemical compound CC1=CC(CNC(=O)C=C)=CC(C)=C1OCC1OC1 OHBCEHHJPNBVME-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
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- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
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- 239000009719 polyimide resin Substances 0.000 description 1
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- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
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- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- 229910000077 silane Inorganic materials 0.000 description 1
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- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11002770A JP2000204332A (ja) | 1999-01-08 | 1999-01-08 | 熱剥離性接着剤組成物および接着構造体 |
| JP277099 | 1999-01-08 | ||
| PCT/US1999/027696 WO2000040648A1 (en) | 1999-01-08 | 1999-11-22 | Heat debondable adhesive composition and adhesion structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69908417D1 DE69908417D1 (de) | 2003-07-03 |
| DE69908417T2 true DE69908417T2 (de) | 2004-05-06 |
Family
ID=11538583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69908417T Expired - Lifetime DE69908417T2 (de) | 1999-01-08 | 1999-11-22 | Wärme entklebbare klebstoffzusammensetzung und klebestruktur |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1141104B1 (enExample) |
| JP (1) | JP2000204332A (enExample) |
| AU (1) | AU1827300A (enExample) |
| DE (1) | DE69908417T2 (enExample) |
| WO (1) | WO2000040648A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008036713A1 (de) | 2008-08-07 | 2010-02-11 | Technische Universität Carolo-Wilhelmina Zu Braunschweig | Verfahren zum Trennen zweier über zumindest eine Klebschicht miteinander verklebter Objekte |
| DE102019220633A1 (de) * | 2019-12-30 | 2021-07-01 | Edag Engineering Gmbh | Strukturverbindungsanordnung, Verwendung eines Gemisches aus einem Klebstoff und thermisch expandierenden Partikeln und Verfahren zur Verwertung einer Strukturverbindungsanordnung |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19961940A1 (de) * | 1999-12-22 | 2001-08-02 | Henkel Kgaa | Lösbare Klebeverindungen |
| KR20000018019A (ko) * | 2000-01-04 | 2000-04-06 | 전효철 | 합성수지와 질석 및 제오라이트(열팽창광물질)등을혼합하여 합성수지 혼합물의 제조방법 |
| JP2002317544A (ja) * | 2001-04-23 | 2002-10-31 | Tajima Inc | 床タイルの施工方法 |
| JP3629021B2 (ja) * | 2001-09-28 | 2005-03-16 | 化研テック株式会社 | 熱剥離型接着構造体 |
| FR2837114A1 (fr) * | 2002-03-13 | 2003-09-19 | Rescoll Soc | Procede de separation commandee des assemblages et revetements colles et produits associes |
| US6882058B2 (en) * | 2002-11-05 | 2005-04-19 | Henkel Corporation | Organic acid containing compositions and methods for use thereof |
| US20040249042A1 (en) * | 2003-06-09 | 2004-12-09 | Motorola, Inc. | Microwave removable coating |
| JP2006024751A (ja) * | 2004-07-08 | 2006-01-26 | Three M Innovative Properties Co | 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品 |
| JP5153103B2 (ja) * | 2006-09-01 | 2013-02-27 | 株式会社アシックス | 熱膨張性接着剤、シューズ、及びシューズの解体方法 |
| JP2009007526A (ja) * | 2007-06-29 | 2009-01-15 | Kobe Steel Ltd | 剥離用塗料組成物およびその塗膜を有する塗工基材 |
| FR2943352B1 (fr) * | 2009-03-17 | 2011-05-20 | Astrium Sas | Procede de collage demontable adapte aux materiaux poreux |
| DE102009019483A1 (de) | 2009-05-04 | 2010-11-11 | Eads Deutschland Gmbh | Klebstoff-Zusammensetzung für lösbare Klebeverbindungen und Modifikation der Verkapselungsmaterialien für gezielte Energieeinbringung |
| DE102009019484B4 (de) | 2009-05-04 | 2015-12-17 | Airbus Defence and Space GmbH | Kombination der Effekte von Expansionsstoffen und chemischen Abbaureagenzien für lösbare Klebeverbindungen |
| DE102009055091A1 (de) * | 2009-12-21 | 2011-06-22 | tesa SE, 20253 | Induktiv erwärmbares Klebeband mit differentiellem Löseverhalten |
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| KR102102955B1 (ko) | 2013-08-12 | 2020-04-23 | 삼성디스플레이 주식회사 | 표시 장치의 제조 방법 |
| WO2015196345A1 (en) | 2014-06-24 | 2015-12-30 | Henkel (China) Company Limited | 1k uv and thermal cure high temperature debondable adhesive |
| KR101606360B1 (ko) * | 2014-07-17 | 2016-03-28 | 한국생산기술연구원 | 경화성 플럭스 조성물 및 이를 포함하는 솔더 페이스트 |
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| GB2568105A (en) * | 2017-11-07 | 2019-05-08 | Rolls Royce Plc | A joined article, a method of de-bonding an article and a method of curing a binder |
| JP7181571B2 (ja) * | 2018-02-26 | 2022-12-01 | 国立大学法人大阪大学 | 解体性接着剤組成物、及び被着体の解体方法 |
| EP3983459A1 (en) | 2019-06-13 | 2022-04-20 | 3M Innovative Properties Company | Crosslinkers and curable compositions including the same |
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| CN118871541A (zh) * | 2022-03-14 | 2024-10-29 | 日东电工株式会社 | 易解体粘接片材、层叠体、接合体、接合体的制造方法及接合体的解体方法 |
| EP4276155A1 (en) * | 2022-05-11 | 2023-11-15 | tesa SE | Multilayered tape and process for debonding the multilayered tape |
| EP4620585A1 (en) * | 2022-11-16 | 2025-09-24 | Shin-Etsu Chemical Co., Ltd. | Disassembly method for bonded member and easily-disassembled silicone-based liquid adhesive agent |
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| JPS60252681A (ja) * | 1984-05-30 | 1985-12-13 | F S K Kk | 熱剥離性粘着シ−ト |
| JPS6178887A (ja) * | 1984-09-27 | 1986-04-22 | Shinko Kagaku Kogyo Kk | 熱剥離性を有する粘着シ−ト |
| JPS6222874A (ja) * | 1985-07-22 | 1987-01-31 | Mitsui Toatsu Chem Inc | 熱時再剥離型粘着剤 |
| JP2665383B2 (ja) * | 1989-11-09 | 1997-10-22 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
| DE4013161A1 (de) * | 1990-04-25 | 1991-11-07 | Schott Glaswerke | Flammfeste polyorganosiloxanmasse |
| JP2970963B2 (ja) * | 1991-08-14 | 1999-11-02 | 日東電工株式会社 | 剥離性感圧接着剤及びその粘着部材 |
| JP3032074B2 (ja) * | 1992-03-04 | 2000-04-10 | 日東電工株式会社 | 発泡性接着シート及びその製造方法 |
| JP2898480B2 (ja) * | 1992-09-14 | 1999-06-02 | 日東電工株式会社 | 加熱剥離性接着剤及び粘着部材 |
| JPH06117544A (ja) * | 1992-10-02 | 1994-04-26 | Hitachi Chem Co Ltd | 膨張黒鉛−金属ガスケット材料 |
| JPH06211596A (ja) * | 1992-11-30 | 1994-08-02 | Fujitsu Ltd | 高温超伝導薄膜等の薄膜の堆積方法および堆積用基板の保持方法 |
| JP3308672B2 (ja) * | 1993-02-26 | 2002-07-29 | 日東電工株式会社 | 接着シート |
| JPH07145357A (ja) * | 1993-11-24 | 1995-06-06 | Nitto Denko Corp | 加熱剥離シート及び剥離方法 |
-
1999
- 1999-01-08 JP JP11002770A patent/JP2000204332A/ja active Pending
- 1999-11-22 DE DE69908417T patent/DE69908417T2/de not_active Expired - Lifetime
- 1999-11-22 AU AU18273/00A patent/AU1827300A/en not_active Abandoned
- 1999-11-22 EP EP99961757A patent/EP1141104B1/en not_active Expired - Lifetime
- 1999-11-22 WO PCT/US1999/027696 patent/WO2000040648A1/en not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008036713A1 (de) | 2008-08-07 | 2010-02-11 | Technische Universität Carolo-Wilhelmina Zu Braunschweig | Verfahren zum Trennen zweier über zumindest eine Klebschicht miteinander verklebter Objekte |
| DE102019220633A1 (de) * | 2019-12-30 | 2021-07-01 | Edag Engineering Gmbh | Strukturverbindungsanordnung, Verwendung eines Gemisches aus einem Klebstoff und thermisch expandierenden Partikeln und Verfahren zur Verwertung einer Strukturverbindungsanordnung |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69908417D1 (de) | 2003-07-03 |
| AU1827300A (en) | 2000-07-24 |
| JP2000204332A (ja) | 2000-07-25 |
| EP1141104B1 (en) | 2003-05-28 |
| WO2000040648A1 (en) | 2000-07-13 |
| EP1141104A1 (en) | 2001-10-10 |
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