JP2000204332A - 熱剥離性接着剤組成物および接着構造体 - Google Patents
熱剥離性接着剤組成物および接着構造体Info
- Publication number
- JP2000204332A JP2000204332A JP11002770A JP277099A JP2000204332A JP 2000204332 A JP2000204332 A JP 2000204332A JP 11002770 A JP11002770 A JP 11002770A JP 277099 A JP277099 A JP 277099A JP 2000204332 A JP2000204332 A JP 2000204332A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- heat
- temperature
- adhesive composition
- expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 62
- 239000000853 adhesive Substances 0.000 title claims description 116
- 230000001070 adhesive effect Effects 0.000 title claims description 116
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000012790 adhesive layer Substances 0.000 claims description 33
- 239000000126 substance Substances 0.000 claims description 30
- 229920001187 thermosetting polymer Polymers 0.000 claims description 19
- 229910010272 inorganic material Inorganic materials 0.000 abstract description 8
- 239000011147 inorganic material Substances 0.000 abstract description 8
- 230000008859 change Effects 0.000 abstract description 3
- 206010040844 Skin exfoliation Diseases 0.000 description 39
- 239000003822 epoxy resin Substances 0.000 description 25
- 229920000647 polyepoxide Polymers 0.000 description 25
- 238000010438 heat treatment Methods 0.000 description 22
- 239000003795 chemical substances by application Substances 0.000 description 21
- 239000010410 layer Substances 0.000 description 11
- 238000004064 recycling Methods 0.000 description 10
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000005855 radiation Effects 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000010419 fine particle Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- -1 usually Substances 0.000 description 5
- 239000010455 vermiculite Substances 0.000 description 5
- 235000019354 vermiculite Nutrition 0.000 description 5
- 229910052902 vermiculite Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 239000000779 smoke Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000008034 disappearance Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- DPZSNGJNFHWQDC-ARJAWSKDSA-N (z)-2,3-diaminobut-2-enedinitrile Chemical compound N#CC(/N)=C(/N)C#N DPZSNGJNFHWQDC-ARJAWSKDSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000010451 perlite Substances 0.000 description 1
- 235000019362 perlite Nutrition 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11002770A JP2000204332A (ja) | 1999-01-08 | 1999-01-08 | 熱剥離性接着剤組成物および接着構造体 |
| EP99961757A EP1141104B1 (en) | 1999-01-08 | 1999-11-22 | Heat debondable adhesive composition and adhesion structure |
| AU18273/00A AU1827300A (en) | 1999-01-08 | 1999-11-22 | Heat debondable adhesive composition and adhesion structure |
| DE69908417T DE69908417T2 (de) | 1999-01-08 | 1999-11-22 | Wärme entklebbare klebstoffzusammensetzung und klebestruktur |
| PCT/US1999/027696 WO2000040648A1 (en) | 1999-01-08 | 1999-11-22 | Heat debondable adhesive composition and adhesion structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11002770A JP2000204332A (ja) | 1999-01-08 | 1999-01-08 | 熱剥離性接着剤組成物および接着構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000204332A true JP2000204332A (ja) | 2000-07-25 |
| JP2000204332A5 JP2000204332A5 (enExample) | 2006-02-16 |
Family
ID=11538583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11002770A Pending JP2000204332A (ja) | 1999-01-08 | 1999-01-08 | 熱剥離性接着剤組成物および接着構造体 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1141104B1 (enExample) |
| JP (1) | JP2000204332A (enExample) |
| AU (1) | AU1827300A (enExample) |
| DE (1) | DE69908417T2 (enExample) |
| WO (1) | WO2000040648A1 (enExample) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002317544A (ja) * | 2001-04-23 | 2002-10-31 | Tajima Inc | 床タイルの施工方法 |
| JP2003171648A (ja) * | 2001-09-28 | 2003-06-20 | Kaken Tec Kk | 熱剥離型接着剤組成物 |
| JP2008056843A (ja) * | 2006-09-01 | 2008-03-13 | Asics Corp | 熱膨張性接着剤、シューズ、シューズの解体方法、及びシューズ解体用マイクロ波照射装置 |
| JP2009007526A (ja) * | 2007-06-29 | 2009-01-15 | Kobe Steel Ltd | 剥離用塗料組成物およびその塗膜を有する塗工基材 |
| WO2014018312A1 (en) * | 2012-07-26 | 2014-01-30 | 3M Innovative Properties Company | Heat de-bondable adhesive articles |
| KR20160010683A (ko) * | 2014-07-17 | 2016-01-28 | 한국생산기술연구원 | 경화성 플럭스 조성물 및 이를 포함하는 솔더 페이스트 |
| US9827739B2 (en) | 2012-07-26 | 2017-11-28 | 3M Innovative Properties Company | Heat de-bondable optical articles |
| JP2019147874A (ja) * | 2018-02-26 | 2019-09-05 | 国立大学法人大阪大学 | 解体性接着剤組成物、及び被着体の解体方法 |
| WO2023054052A1 (ja) * | 2021-09-30 | 2023-04-06 | 信越化学工業株式会社 | 接合部材の解体方法及び接合部材並びに易解体性の液状シリコーン系接着剤 |
| JP2023062995A (ja) * | 2021-10-22 | 2023-05-09 | トヨタ自動車株式会社 | ロータの製造方法及びロータ |
| WO2023176800A1 (ja) * | 2022-03-14 | 2023-09-21 | 日東電工株式会社 | 易解体接着シート、積層体、接合体、接合体の製造方法、及び接合体の解体方法 |
| WO2024106077A1 (ja) * | 2022-11-16 | 2024-05-23 | 信越化学工業株式会社 | 接合部材の解体方法及び易解体性の液状シリコーン系接着剤 |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19961940A1 (de) * | 1999-12-22 | 2001-08-02 | Henkel Kgaa | Lösbare Klebeverindungen |
| KR20000018019A (ko) * | 2000-01-04 | 2000-04-06 | 전효철 | 합성수지와 질석 및 제오라이트(열팽창광물질)등을혼합하여 합성수지 혼합물의 제조방법 |
| FR2837114A1 (fr) * | 2002-03-13 | 2003-09-19 | Rescoll Soc | Procede de separation commandee des assemblages et revetements colles et produits associes |
| US6882058B2 (en) * | 2002-11-05 | 2005-04-19 | Henkel Corporation | Organic acid containing compositions and methods for use thereof |
| US20040249042A1 (en) * | 2003-06-09 | 2004-12-09 | Motorola, Inc. | Microwave removable coating |
| JP2006024751A (ja) * | 2004-07-08 | 2006-01-26 | Three M Innovative Properties Co | 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品 |
| DE102008036713A1 (de) | 2008-08-07 | 2010-02-11 | Technische Universität Carolo-Wilhelmina Zu Braunschweig | Verfahren zum Trennen zweier über zumindest eine Klebschicht miteinander verklebter Objekte |
| FR2943352B1 (fr) * | 2009-03-17 | 2011-05-20 | Astrium Sas | Procede de collage demontable adapte aux materiaux poreux |
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| JP2002317544A (ja) * | 2001-04-23 | 2002-10-31 | Tajima Inc | 床タイルの施工方法 |
| JP2003171648A (ja) * | 2001-09-28 | 2003-06-20 | Kaken Tec Kk | 熱剥離型接着剤組成物 |
| JP2008056843A (ja) * | 2006-09-01 | 2008-03-13 | Asics Corp | 熱膨張性接着剤、シューズ、シューズの解体方法、及びシューズ解体用マイクロ波照射装置 |
| JP2009007526A (ja) * | 2007-06-29 | 2009-01-15 | Kobe Steel Ltd | 剥離用塗料組成物およびその塗膜を有する塗工基材 |
| WO2014018312A1 (en) * | 2012-07-26 | 2014-01-30 | 3M Innovative Properties Company | Heat de-bondable adhesive articles |
| US9827739B2 (en) | 2012-07-26 | 2017-11-28 | 3M Innovative Properties Company | Heat de-bondable optical articles |
| KR20160010683A (ko) * | 2014-07-17 | 2016-01-28 | 한국생산기술연구원 | 경화성 플럭스 조성물 및 이를 포함하는 솔더 페이스트 |
| KR101606360B1 (ko) | 2014-07-17 | 2016-03-28 | 한국생산기술연구원 | 경화성 플럭스 조성물 및 이를 포함하는 솔더 페이스트 |
| JP2019147874A (ja) * | 2018-02-26 | 2019-09-05 | 国立大学法人大阪大学 | 解体性接着剤組成物、及び被着体の解体方法 |
| JP7181571B2 (ja) | 2018-02-26 | 2022-12-01 | 国立大学法人大阪大学 | 解体性接着剤組成物、及び被着体の解体方法 |
| WO2023054052A1 (ja) * | 2021-09-30 | 2023-04-06 | 信越化学工業株式会社 | 接合部材の解体方法及び接合部材並びに易解体性の液状シリコーン系接着剤 |
| JPWO2023054052A1 (enExample) * | 2021-09-30 | 2023-04-06 | ||
| JP7772079B2 (ja) | 2021-09-30 | 2025-11-18 | 信越化学工業株式会社 | 接合部材の解体方法及び接合部材並びに易解体性の液状シリコーン系接着剤 |
| JP2023062995A (ja) * | 2021-10-22 | 2023-05-09 | トヨタ自動車株式会社 | ロータの製造方法及びロータ |
| JP7647494B2 (ja) | 2021-10-22 | 2025-03-18 | トヨタ自動車株式会社 | ロータの製造方法及びロータ |
| WO2023176800A1 (ja) * | 2022-03-14 | 2023-09-21 | 日東電工株式会社 | 易解体接着シート、積層体、接合体、接合体の製造方法、及び接合体の解体方法 |
| WO2024106077A1 (ja) * | 2022-11-16 | 2024-05-23 | 信越化学工業株式会社 | 接合部材の解体方法及び易解体性の液状シリコーン系接着剤 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69908417T2 (de) | 2004-05-06 |
| DE69908417D1 (de) | 2003-07-03 |
| AU1827300A (en) | 2000-07-24 |
| EP1141104B1 (en) | 2003-05-28 |
| WO2000040648A1 (en) | 2000-07-13 |
| EP1141104A1 (en) | 2001-10-10 |
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