JP2000204332A5 - - Google Patents

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Publication number
JP2000204332A5
JP2000204332A5 JP1999002770A JP277099A JP2000204332A5 JP 2000204332 A5 JP2000204332 A5 JP 2000204332A5 JP 1999002770 A JP1999002770 A JP 1999002770A JP 277099 A JP277099 A JP 277099A JP 2000204332 A5 JP2000204332 A5 JP 2000204332A5
Authority
JP
Japan
Prior art keywords
heat
adhesive composition
inorganic substance
adhesive layer
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999002770A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000204332A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP11002770A priority Critical patent/JP2000204332A/ja
Priority claimed from JP11002770A external-priority patent/JP2000204332A/ja
Priority to PCT/US1999/027696 priority patent/WO2000040648A1/en
Priority to DE69908417T priority patent/DE69908417T2/de
Priority to EP99961757A priority patent/EP1141104B1/en
Priority to AU18273/00A priority patent/AU1827300A/en
Publication of JP2000204332A publication Critical patent/JP2000204332A/ja
Publication of JP2000204332A5 publication Critical patent/JP2000204332A5/ja
Pending legal-status Critical Current

Links

JP11002770A 1999-01-08 1999-01-08 熱剥離性接着剤組成物および接着構造体 Pending JP2000204332A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP11002770A JP2000204332A (ja) 1999-01-08 1999-01-08 熱剥離性接着剤組成物および接着構造体
PCT/US1999/027696 WO2000040648A1 (en) 1999-01-08 1999-11-22 Heat debondable adhesive composition and adhesion structure
DE69908417T DE69908417T2 (de) 1999-01-08 1999-11-22 Wärme entklebbare klebstoffzusammensetzung und klebestruktur
EP99961757A EP1141104B1 (en) 1999-01-08 1999-11-22 Heat debondable adhesive composition and adhesion structure
AU18273/00A AU1827300A (en) 1999-01-08 1999-11-22 Heat debondable adhesive composition and adhesion structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11002770A JP2000204332A (ja) 1999-01-08 1999-01-08 熱剥離性接着剤組成物および接着構造体

Publications (2)

Publication Number Publication Date
JP2000204332A JP2000204332A (ja) 2000-07-25
JP2000204332A5 true JP2000204332A5 (enExample) 2006-02-16

Family

ID=11538583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11002770A Pending JP2000204332A (ja) 1999-01-08 1999-01-08 熱剥離性接着剤組成物および接着構造体

Country Status (5)

Country Link
EP (1) EP1141104B1 (enExample)
JP (1) JP2000204332A (enExample)
AU (1) AU1827300A (enExample)
DE (1) DE69908417T2 (enExample)
WO (1) WO2000040648A1 (enExample)

Families Citing this family (37)

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Publication number Priority date Publication date Assignee Title
DE19961940A1 (de) * 1999-12-22 2001-08-02 Henkel Kgaa Lösbare Klebeverindungen
KR20000018019A (ko) * 2000-01-04 2000-04-06 전효철 합성수지와 질석 및 제오라이트(열팽창광물질)등을혼합하여 합성수지 혼합물의 제조방법
JP2002317544A (ja) * 2001-04-23 2002-10-31 Tajima Inc 床タイルの施工方法
JP3629021B2 (ja) * 2001-09-28 2005-03-16 化研テック株式会社 熱剥離型接着構造体
FR2837114A1 (fr) * 2002-03-13 2003-09-19 Rescoll Soc Procede de separation commandee des assemblages et revetements colles et produits associes
US6882058B2 (en) * 2002-11-05 2005-04-19 Henkel Corporation Organic acid containing compositions and methods for use thereof
US20040249042A1 (en) * 2003-06-09 2004-12-09 Motorola, Inc. Microwave removable coating
JP2006024751A (ja) * 2004-07-08 2006-01-26 Three M Innovative Properties Co 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品
JP5153103B2 (ja) * 2006-09-01 2013-02-27 株式会社アシックス 熱膨張性接着剤、シューズ、及びシューズの解体方法
JP2009007526A (ja) * 2007-06-29 2009-01-15 Kobe Steel Ltd 剥離用塗料組成物およびその塗膜を有する塗工基材
DE102008036713A1 (de) 2008-08-07 2010-02-11 Technische Universität Carolo-Wilhelmina Zu Braunschweig Verfahren zum Trennen zweier über zumindest eine Klebschicht miteinander verklebter Objekte
FR2943352B1 (fr) * 2009-03-17 2011-05-20 Astrium Sas Procede de collage demontable adapte aux materiaux poreux
DE102009019484B4 (de) 2009-05-04 2015-12-17 Airbus Defence and Space GmbH Kombination der Effekte von Expansionsstoffen und chemischen Abbaureagenzien für lösbare Klebeverbindungen
DE102009019483A1 (de) 2009-05-04 2010-11-11 Eads Deutschland Gmbh Klebstoff-Zusammensetzung für lösbare Klebeverbindungen und Modifikation der Verkapselungsmaterialien für gezielte Energieeinbringung
DE102009055091A1 (de) * 2009-12-21 2011-06-22 tesa SE, 20253 Induktiv erwärmbares Klebeband mit differentiellem Löseverhalten
EP2434528A1 (en) 2010-09-28 2012-03-28 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO An active carrier for carrying a wafer and method for release
TW201235402A (en) * 2011-01-07 2012-09-01 Ajinomoto Kk Resin composition for release film
US9821529B2 (en) 2011-07-19 2017-11-21 3M Innovative Properties Company Debondable adhesive article and methods of making and using the same
US10471681B2 (en) 2012-07-26 2019-11-12 3M Innovative Properties Company Heat de-bondable adhesive articles
US9827739B2 (en) 2012-07-26 2017-11-28 3M Innovative Properties Company Heat de-bondable optical articles
EP3017012B1 (en) 2013-07-03 2018-03-21 Henkel IP & Holding GmbH High temperature debondable adhesive
KR102102955B1 (ko) 2013-08-12 2020-04-23 삼성디스플레이 주식회사 표시 장치의 제조 방법
EP3161094B1 (en) 2014-06-24 2019-02-13 Henkel IP & Holding GmbH 1k uv and thermal cure high temperature debondable adhesive
KR101606360B1 (ko) * 2014-07-17 2016-03-28 한국생산기술연구원 경화성 플럭스 조성물 및 이를 포함하는 솔더 페이스트
EP3056225A1 (en) 2015-02-16 2016-08-17 Nitto Denko Corporation Debondable adhesive system
TWI738684B (zh) 2015-12-09 2021-09-11 德商漢高智慧財產控股公司 可脫黏組合物
GB2568105A (en) * 2017-11-07 2019-05-08 Rolls Royce Plc A joined article, a method of de-bonding an article and a method of curing a binder
JP7181571B2 (ja) * 2018-02-26 2022-12-01 国立大学法人大阪大学 解体性接着剤組成物、及び被着体の解体方法
CN114008092B (zh) 2019-06-13 2024-02-02 3M创新有限公司 交联剂和包含交联剂的可固化组合物
DE102019220633A1 (de) * 2019-12-30 2021-07-01 Edag Engineering Gmbh Strukturverbindungsanordnung, Verwendung eines Gemisches aus einem Klebstoff und thermisch expandierenden Partikeln und Verfahren zur Verwertung einer Strukturverbindungsanordnung
JP7464005B2 (ja) * 2021-05-31 2024-04-09 信越化学工業株式会社 接合部材の解体方法及び接合部材並びに易解体性の液状シリコーン系接着剤
EP4410921A4 (en) * 2021-09-30 2025-10-08 Shinetsu Chemical Co METHOD FOR DISASSEMBLING A BONDED ELEMENT, BONDED ELEMENT AND EASILY DISASSEMBLED SILICONE-BASED LIQUID ADHESIVE
JP7647494B2 (ja) * 2021-10-22 2025-03-18 トヨタ自動車株式会社 ロータの製造方法及びロータ
US20250257246A1 (en) * 2022-03-14 2025-08-14 Nitto Denko Corporation Easily dismantling adhesive sheet, laminated body, joined body, method for producing joined body, and method for dismantling joined body
EP4276155A1 (en) * 2022-05-11 2023-11-15 tesa SE Multilayered tape and process for debonding the multilayered tape
JPWO2024106077A1 (enExample) * 2022-11-16 2024-05-23
LU506809B1 (en) 2024-04-05 2025-10-06 Luxembourg Inst Science & Tech List Non-intumescent thermoset polymer compositions for dismantlable composites

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60252681A (ja) * 1984-05-30 1985-12-13 F S K Kk 熱剥離性粘着シ−ト
JPS6178887A (ja) * 1984-09-27 1986-04-22 Shinko Kagaku Kogyo Kk 熱剥離性を有する粘着シ−ト
JPS6222874A (ja) * 1985-07-22 1987-01-31 Mitsui Toatsu Chem Inc 熱時再剥離型粘着剤
JP2665383B2 (ja) * 1989-11-09 1997-10-22 日東電工株式会社 ダイシング・ダイボンドフィルム
DE4013161A1 (de) * 1990-04-25 1991-11-07 Schott Glaswerke Flammfeste polyorganosiloxanmasse
JP2970963B2 (ja) * 1991-08-14 1999-11-02 日東電工株式会社 剥離性感圧接着剤及びその粘着部材
JP3032074B2 (ja) * 1992-03-04 2000-04-10 日東電工株式会社 発泡性接着シート及びその製造方法
JP2898480B2 (ja) * 1992-09-14 1999-06-02 日東電工株式会社 加熱剥離性接着剤及び粘着部材
JPH06117544A (ja) * 1992-10-02 1994-04-26 Hitachi Chem Co Ltd 膨張黒鉛−金属ガスケット材料
JPH06211596A (ja) * 1992-11-30 1994-08-02 Fujitsu Ltd 高温超伝導薄膜等の薄膜の堆積方法および堆積用基板の保持方法
JP3308672B2 (ja) * 1993-02-26 2002-07-29 日東電工株式会社 接着シート
JPH07145357A (ja) * 1993-11-24 1995-06-06 Nitto Denko Corp 加熱剥離シート及び剥離方法

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