CN111409319A - 一种柔性高导热系数界面材料及其制备方法 - Google Patents

一种柔性高导热系数界面材料及其制备方法 Download PDF

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CN111409319A
CN111409319A CN202010234701.7A CN202010234701A CN111409319A CN 111409319 A CN111409319 A CN 111409319A CN 202010234701 A CN202010234701 A CN 202010234701A CN 111409319 A CN111409319 A CN 111409319A
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thermal conductivity
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唐春峰
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Suzhou Gaotai Electronic Technology Co ltd
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Abstract

本发明公开了一种柔性高导热系数界面材料，包括依次设置的保护膜层、石墨层、粘结剂层和绝层，所述石墨层嵌设于粘结剂层。本发明还公开了上述柔性高导热系数界面材料的制备方法。本发明制备得到的热界面材料具有较高的导热系数，较好柔韧性，较小的硬度，较小的密度，较小的厚度和可弯曲折叠的高性能。

Description

一种柔性高导热系数界面材料及其制备方法
技术领域
本发明属于导热界面材料领域，特别涉及一种柔性高导热系数界面材料及其制备方法。
背景技术
在电子仪器及设备日益向轻、薄、短、小的方向发展的情况下，微电子集成技术高速发展，电子元器件、逻辑电路体积成倍地缩小，因此在高频的工作频率下，电子元器件产生的热量迅速积累、增加，使电子元器件无法正常地运行工作。因此，热界面材料应运而生。
它质软，耐冲击，易加工，能适应不同形状的界面导热要求。因为其优异的可压缩变形特性，填充于散热器和热源之间时，在两电子元器件界面间形成了良好紧密接触，排除了低热导率空气的存在，将散热器功效大大提高。但是，导热效率较低的界面材料依然无法满足电子元器件密集的脚步，所以使界面材料的导热效率提高是电子设备散热发展中必不可少的关键环节，高导热系数界面材料的研究和开发具有重要的理论和经济价值。
电子元器件温度每升高2℃，其可靠性就下降10％。尤其是现在进入5G时代，CPU功率越来越大，功率元件越来越多。
常规的导热材料一般导热系数1-8W/mK，特制的材料可以达到10W/mK，对于5G基站大功率元器件来说，普通导热界面材料不能满足散热要求。
因此亟待一种导热性能好的材料应用于大功率元器件。
发明内容
本发明的目的是针对上述问题，一方面，本发明提供一种柔性高导热系数界面材料，包括依次设置的保护膜层、石墨层、粘结剂层和绝层，所述石墨层嵌设于粘结剂层。
作为本发明实施方式的进一步改进，所述石墨层为人工石墨片层或天然石墨片层。
作为本发明实施方式的进一步改进，所述石墨层的厚度范围选自0.01-0.3mm。
作为本发明实施方式的进一步改进，所述石墨层的厚度范围选自0.02-0.1mm。
作为本发明实施方式的进一步改进，所述粘结剂层为环氧胶、丙烯酸胶、硅胶、PU胶、EVA热熔胶、NR橡胶、CR橡胶的一种或几种配置而成。
作为本发明实施方式的进一步改进，所述胶粘剂选择加成型硅胶。
作为本发明实施方式的进一步改进，所述绝层包括基材，所述基材选自PE膜、PP膜、PET膜、PA膜、PI膜、PO膜等体积电阻大于1011Ωcm数量级薄膜中的一种。
作为本发明实施方式的进一步改进，所述基材优选PI膜。
作为本发明实施方式的进一步改进，所述绝层包括亚敏涂层，所述亚敏涂层设置在所述基材的两侧；所述亚敏涂层选自丙烯酸涂层、硅胶涂层、PU涂层的一种或两种。
作为本发明实施方式的进一步改进，所述保护膜层选自氟素离型膜、硅油离型膜、非硅离型膜的一种。
作为本发明实施方式的进一步改进，所述氟素离型膜的厚度范围为0.025-0.1mm。
作为本发明实施方式的进一步改进，所述氟素离型膜的厚度范围优选0.05-0.075mm。
另一方面，本发明公开了一种柔性高导热系数界面材料的制备方法，所述制备方法包括以下步骤：
S1、裁切石墨片，裁切规格控制在长度200-500mm、宽度100-500mm；其中长度优选300-500mm，宽度优选200-300mm；
S2、在载料治具底部喷涂一层胶粘剂，涂胶量为10-300g/m2，优选100-200g/m2；其中，载料治具的选择较石墨片的规格大10mm；
S3、在胶粘剂上方平铺一层S1裁切得到的石墨片；
S4、在S3所述的石墨片层上依次喷涂胶粘剂和平铺石墨片，依次叠加至载料治具中产品厚度50-400mm，优选200-300mm；
S5、在S4所制备得到的产品上施加0.3MPA的压力，保压30min后泄压；
S6、将载料治具内的产品保持加压的状态下放入烘箱进行加热，烘箱温度设置50℃-150℃，时间30-120min，待冷却后取出；
S7、卸载载料治具，通过线切割或者空气刀切割预成型料形成片材，所述片材的厚度为0.2-20mm；
S8、S7制备得到的片材的一面贴合保护膜，另一面贴合绝层。
作为本发明实施方式的进一步改进，所述步骤S6中烘箱升温为梯度化升温，具体为先升温至45-60℃，保持30分钟，然后升温至80-90℃，保持10分钟，继续升温至120-130℃，保持10分钟。
作为本发明实施方式的进一步改进，所述步骤S5中施加压力的方式为在载料治具中S4所制备得到的产品上加载一块压板，所述压板的质量为2kg。
与现有技术相比，本发明具有以下有益效果：
本发明所得热界面材料具有较高的导热系数，较好柔韧性，较小的硬度，较小的密度，较小的厚度和可弯曲折叠的高性能。
具体实施方式
下面将结合本发明实施例，对本发明的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明提供一种柔性高导热系数界面材料，包括依次设置的保护膜层、石墨层、粘结剂层和绝层，所述石墨层嵌设于粘结剂层。
其中，石墨层为人工石墨片层或天然石墨片层。
优选地，石墨层的厚度范围选自0.01-0.3mm。
具体地，石墨层的厚度范围选自0.02-0.1mm。
可选地，粘结剂层为环氧胶、丙烯酸胶、硅胶、PU胶、EVA热熔胶、NR橡胶、CR橡胶的一种或几种配置而成。
胶粘剂选择加成型硅胶。
绝层包括基材，基材选自PE膜、PP膜、PET膜、PA膜、PI膜、PO膜等体积电阻大于1011Ωcm数量级薄膜中的一种。
其中，基材优选PI膜。
绝层包括亚敏涂层，亚敏涂层设置在所述基材的两侧；亚敏涂层选自丙烯酸涂层、硅胶涂层、PU涂层的一种或两种。
保护膜层选自氟素离型膜、硅油离型膜、非硅离型膜的一种。
其中，氟素离型膜的厚度范围为0.025-0.1mm。
氟素离型膜的厚度范围优选0.05-0.075mm。
另一方面，本发明公开了一种柔性高导热系数界面材料的制备方法，所述制备方法包括以下步骤：
S1、裁切石墨片，裁切规格控制在长度200-500mm、宽度100-500mm；其中长度优选300-500mm，宽度优选200-300mm；
S2、在载料治具底部喷涂一层胶粘剂，涂胶量为10-300g/m2，优选100-200g/m2；其中，载料治具的选择较石墨片的规格大10mm；
S3、在胶粘剂上方平铺一层S1裁切得到的石墨片；
S4、在S3所述的石墨片层上依次喷涂胶粘剂和平铺石墨片，依次叠加至载料治具中产品厚度50-400mm，优选200-300mm；
S5、在S4所制备得到的产品上施加0.3MPA的压力，保压30min后泄压；施加压力的方式为在载料治具中S4所制备得到的产品上加载一块压板，所述压板的质量为2kg；
S6、将载料治具内的产品保持加压的状态下放入烘箱进行加热，烘箱温度设置50℃-150℃，时间30-120min，待冷却后取出；在本发明实施例中，步骤S6中烘箱升温为梯度化升温，具体为先升温至45-60℃，保持30分钟，然后升温至80-90℃，保持10分钟，继续升温至120-130℃，保持10分钟；
S7、卸载载料治具，通过线切割或者空气刀切割预成型料形成片材，所述片材的厚度为0.2-20mm；
S8、S7制备得到的片材的一面贴合保护膜，另一面贴合绝层。
与现有技术相比，本发明具有以下有益效果：
本发明所得热界面材料具有较高的导热系数，较好柔韧性，较小的硬度，较小的密度，较小的厚度和可弯曲折叠的高性能。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (10)

1.一种柔性高导热系数界面材料，其特征在于，包括依次设置的保护膜层、石墨层、粘结剂层和绝层，所述石墨层嵌设于粘结剂层。
2.根据权利要求1所述的柔性高导热系数界面材料，其特征在于，所述石墨层为人工石墨片层或天然石墨片层。
3.根据权利要求1所述的柔性高导热系数界面材料，其特征在于，所述石墨层的厚度范围选自0.01-0.3mm。
4.根据权利要求1所述的柔性高导热系数界面材料，其特征在于，所述粘结剂层为环氧胶、丙烯酸胶、硅胶、PU胶、EVA热熔胶、NR橡胶、CR橡胶的一种或几种配置而成。
5.根据权利要求1所述的柔性高导热系数界面材料，其特征在于，所述绝层包括基材，所述基材选自PE膜、PP膜、PET膜、PA膜、PI膜、PO膜等体积电阻大于1011Ωcm数量级薄膜中的一种。
6.根据权利要求5所述的柔性高导热系数界面材料，其特征在于，所述绝层包括亚敏涂层，所述亚敏涂层设置在所述基材的两侧；所述亚敏涂层选自丙烯酸涂层、硅胶涂层、PU涂层的一种或两种。
7.根据权利要求1所述的柔性高导热系数界面材料，其特征在于，所述保护膜层选自氟素离型膜、硅油离型膜、非硅离型膜的一种；所述氟素离型膜的厚度范围为0.025-0.1mm。
8.一种柔性高导热系数界面材料的制备方法，其特征在于，所述制备方法包括以下步骤：
S1、裁切石墨片，裁切规格控制在长度200-500mm、宽度100-500mm；
S2、在载料治具底部喷涂一层胶粘剂，涂胶量为10-300g/m2；
S3、在胶粘剂上方平铺一层S1裁切得到的石墨片；
S4、在S3所述的石墨片层上依次喷涂胶粘剂和平铺石墨片，依次叠加至载料治具中产品厚度50-400mm；
S5、在S4所制备得到的产品上施加0.3MPA的压力，保压30min后泄压；
S6、将载料治具内的产品保持加压的状态下放入烘箱进行加热，烘箱温度设置50℃-150℃，时间30-120min，待冷却后取出；
S7、卸载载料治具，通过线切割或者空气刀切割预成型料形成片材，所述片材的厚度为0.2-20mm；
S8、S7制备得到的片材的一面贴合保护膜，另一面贴合绝层。
9.根据权利要求8所述的柔性高导热系数界面材料的制备方法，其特征在于，所述步骤S6中烘箱升温为梯度化升温，具体为先升温至45-60℃，保持30分钟，然后升温至80-90℃，保持10分钟，继续升温至120-130℃，保持10分钟。
10.根据权利要求8所述的柔性高导热系数界面材料的制备方法，其特征在于，所述步骤S5中施加压力的方式为在载料治具中S4所制备得到的产品上加载一块压板，所述压板的质量为2kg。
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