JP2002134666A5 - - Google Patents

Download PDF

Info

Publication number
JP2002134666A5
JP2002134666A5 JP2000330067A JP2000330067A JP2002134666A5 JP 2002134666 A5 JP2002134666 A5 JP 2002134666A5 JP 2000330067 A JP2000330067 A JP 2000330067A JP 2000330067 A JP2000330067 A JP 2000330067A JP 2002134666 A5 JP2002134666 A5 JP 2002134666A5
Authority
JP
Japan
Prior art keywords
heat
resin sheet
expandable member
dissipating
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000330067A
Other languages
English (en)
Japanese (ja)
Other versions
JP4584439B2 (ja
JP2002134666A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000330067A priority Critical patent/JP4584439B2/ja
Priority claimed from JP2000330067A external-priority patent/JP4584439B2/ja
Publication of JP2002134666A publication Critical patent/JP2002134666A/ja
Publication of JP2002134666A5 publication Critical patent/JP2002134666A5/ja
Application granted granted Critical
Publication of JP4584439B2 publication Critical patent/JP4584439B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000330067A 2000-10-30 2000-10-30 放熱樹脂シート Expired - Fee Related JP4584439B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000330067A JP4584439B2 (ja) 2000-10-30 2000-10-30 放熱樹脂シート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000330067A JP4584439B2 (ja) 2000-10-30 2000-10-30 放熱樹脂シート

Publications (3)

Publication Number Publication Date
JP2002134666A JP2002134666A (ja) 2002-05-10
JP2002134666A5 true JP2002134666A5 (enExample) 2007-11-22
JP4584439B2 JP4584439B2 (ja) 2010-11-24

Family

ID=18806645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000330067A Expired - Fee Related JP4584439B2 (ja) 2000-10-30 2000-10-30 放熱樹脂シート

Country Status (1)

Country Link
JP (1) JP4584439B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7744991B2 (en) * 2003-05-30 2010-06-29 3M Innovative Properties Company Thermally conducting foam interface materials
JP2005239744A (ja) * 2004-02-24 2005-09-08 Nippon Zeon Co Ltd 熱伝導性感圧接着剤組成物並びに熱伝導性発泡シート状成形体及びその製造方法
WO2005059053A1 (ja) * 2003-12-18 2005-06-30 Zeon Corporation 熱伝導性感圧接着剤組成物、熱伝導性発泡シート状成形体およびその製造方法
JP2005272505A (ja) * 2004-03-23 2005-10-06 Nippon Zeon Co Ltd 熱伝導性感圧接着剤組成物及び熱伝導性シート状成形体
CN101454418A (zh) * 2006-06-21 2009-06-10 日立化成高分子株式会社 热导性热塑性粘合剂组合物
JP5173166B2 (ja) * 2006-08-14 2013-03-27 スリーエム イノベイティブ プロパティズ カンパニー 粘着性フィルム剥離方法
JP5042899B2 (ja) * 2008-03-31 2012-10-03 ポリマテック株式会社 熱伝導性シート及びその製造方法
JP2012119674A (ja) * 2010-11-11 2012-06-21 Kitagawa Ind Co Ltd 熱伝導シート
JP6894379B2 (ja) * 2016-09-30 2021-06-30 積水化学工業株式会社 熱伝導性熱膨張性樹脂組成物、熱伝導性熱膨張性成形体、バッテリーモジュール、及びバッテリーパック
JP2019061959A (ja) * 2017-09-26 2019-04-18 積水化学工業株式会社 伝導率可変部材及び安全システム
JP6517909B1 (ja) * 2017-11-16 2019-05-22 株式会社パワーバンクシステム 蓄冷／蓄熱シート及び蓄冷／蓄熱シート生成方法
KR20220145336A (ko) 2020-02-28 2022-10-28 니폰 제온 가부시키가이샤 셀간 스페이서 및 배터리 모듈

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07307351A (ja) * 1994-05-11 1995-11-21 Toshiba Chem Corp 導電性ペースト
JPH08139235A (ja) * 1994-11-08 1996-05-31 Hitachi Ltd 電子機器およびその製造方法
JPH08133873A (ja) * 1994-11-11 1996-05-28 Sumitomo Metal Ind Ltd ろう付け用治具およびその製造方法
JPH09129793A (ja) * 1995-10-27 1997-05-16 Tonen Corp 半導体パッケージ用の熱伝プレート
JPH09219113A (ja) * 1996-02-08 1997-08-19 Asahi Chem Ind Co Ltd 熱伝導用ペースト
JP2000150742A (ja) * 1998-11-18 2000-05-30 Shibafu Engineering Kk 伝熱シート、半導体装置及び伝熱シートの製造方法

Similar Documents

Publication Publication Date Title
JP2002134666A5 (enExample)
TWI257543B (en) Equalizing temperature device
HK1052798A1 (zh) 网状载体上的热接口(介面)材料
JPH09326458A5 (enExample)
JP2000204332A5 (enExample)
CA2438242A1 (en) Thermal interface pad utilizing low melting metal with retention matrix
KR101724621B1 (ko) 방열 점착제, 이를 이용한 방열 시트 및 이를 구비한 전자기기
KR960703723A (ko) 열 전도성 상사 계면 물질(Conformal Thermally Conductive Interface Material)
JP2866632B2 (ja) 放熱材
WO2017185960A1 (zh) 一种终端设备以及相关方法
CN206562400U (zh) 一种cpu散热用导热泡棉垫片
EP1094516A3 (en) Thermally conductive composition and method of forming thermally conductive film with use of same
JP3220706U (ja) 電子機器放熱構造
CN216650312U (zh) 散热板和电子设备
CN109429444A (zh) 可携带电子装置的壳体转印散热涂层结构
TWM542324U (zh) 可攜帶電子裝置之散熱塗層結構
US6283201B1 (en) Heat-radiating structure
JP4899362B2 (ja) 蓄熱暖房装置
JP3114074U (ja) 電源供給器の放熱装置
CN206085852U (zh) 一种石墨烯复合散热膜
KR20010107096A (ko) 전자기기용 방열판의 냉각방법 및 그 장치
JPS5827997U (ja) 電子機器の放熱構造
KR20090000113U (ko) 열흡수 테이프
JPH0370925A (ja) 床暖房パネル
JP2012134255A (ja) 放熱構造