JP4584439B2 - 放熱樹脂シート - Google Patents

放熱樹脂シート Download PDF

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Publication number
JP4584439B2
JP4584439B2 JP2000330067A JP2000330067A JP4584439B2 JP 4584439 B2 JP4584439 B2 JP 4584439B2 JP 2000330067 A JP2000330067 A JP 2000330067A JP 2000330067 A JP2000330067 A JP 2000330067A JP 4584439 B2 JP4584439 B2 JP 4584439B2
Authority
JP
Japan
Prior art keywords
heat
resin sheet
resin
dissipating
expandable member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000330067A
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English (en)
Japanese (ja)
Other versions
JP2002134666A5 (enExample
JP2002134666A (ja
Inventor
晴夫 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Achilles Corp
Original Assignee
Achilles Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Achilles Corp filed Critical Achilles Corp
Priority to JP2000330067A priority Critical patent/JP4584439B2/ja
Publication of JP2002134666A publication Critical patent/JP2002134666A/ja
Publication of JP2002134666A5 publication Critical patent/JP2002134666A5/ja
Application granted granted Critical
Publication of JP4584439B2 publication Critical patent/JP4584439B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Transformer Cooling (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
JP2000330067A 2000-10-30 2000-10-30 放熱樹脂シート Expired - Fee Related JP4584439B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000330067A JP4584439B2 (ja) 2000-10-30 2000-10-30 放熱樹脂シート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000330067A JP4584439B2 (ja) 2000-10-30 2000-10-30 放熱樹脂シート

Publications (3)

Publication Number Publication Date
JP2002134666A JP2002134666A (ja) 2002-05-10
JP2002134666A5 JP2002134666A5 (enExample) 2007-11-22
JP4584439B2 true JP4584439B2 (ja) 2010-11-24

Family

ID=18806645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000330067A Expired - Fee Related JP4584439B2 (ja) 2000-10-30 2000-10-30 放熱樹脂シート

Country Status (1)

Country Link
JP (1) JP4584439B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7744991B2 (en) * 2003-05-30 2010-06-29 3M Innovative Properties Company Thermally conducting foam interface materials
US20070169885A1 (en) * 2003-12-18 2007-07-26 Takamitu Mikuni Thermally conductive pressure-sensitive adhesive composition, thermally conductive sheet-form molded foam, and process for producing the same
JP2005272505A (ja) * 2004-03-23 2005-10-06 Nippon Zeon Co Ltd 熱伝導性感圧接着剤組成物及び熱伝導性シート状成形体
JP2005239744A (ja) * 2004-02-24 2005-09-08 Nippon Zeon Co Ltd 熱伝導性感圧接着剤組成物並びに熱伝導性発泡シート状成形体及びその製造方法
WO2007148729A1 (ja) * 2006-06-21 2007-12-27 Hitachi Kasei Polymer Co., Ltd. 熱伝導性熱可塑性粘着剤組成物
JP5173166B2 (ja) * 2006-08-14 2013-03-27 スリーエム イノベイティブ プロパティズ カンパニー 粘着性フィルム剥離方法
JP5042899B2 (ja) * 2008-03-31 2012-10-03 ポリマテック株式会社 熱伝導性シート及びその製造方法
JP2012119674A (ja) * 2010-11-11 2012-06-21 Kitagawa Ind Co Ltd 熱伝導シート
WO2018062172A1 (ja) * 2016-09-30 2018-04-05 積水化学工業株式会社 熱伝導性熱膨張性樹脂組成物、熱伝導性熱膨張性成形体、バッテリーモジュール、及びバッテリーパック
JP2019061959A (ja) * 2017-09-26 2019-04-18 積水化学工業株式会社 伝導率可変部材及び安全システム
JP6517909B1 (ja) * 2017-11-16 2019-05-22 株式会社パワーバンクシステム 蓄冷／蓄熱シート及び蓄冷／蓄熱シート生成方法
CN114982049A (zh) 2020-02-28 2022-08-30 日本瑞翁株式会社 电池单元间隔片和电池模块

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07307351A (ja) * 1994-05-11 1995-11-21 Toshiba Chem Corp 導電性ペースト
JPH08139235A (ja) * 1994-11-08 1996-05-31 Hitachi Ltd 電子機器およびその製造方法
JPH08133873A (ja) * 1994-11-11 1996-05-28 Sumitomo Metal Ind Ltd ろう付け用治具およびその製造方法
JPH09129793A (ja) * 1995-10-27 1997-05-16 Tonen Corp 半導体パッケージ用の熱伝プレート
JPH09219113A (ja) * 1996-02-08 1997-08-19 Asahi Chem Ind Co Ltd 熱伝導用ペースト
JP2000150742A (ja) * 1998-11-18 2000-05-30 Shibafu Engineering Kk 伝熱シート、半導体装置及び伝熱シートの製造方法

Also Published As

Publication number Publication date
JP2002134666A (ja) 2002-05-10

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