AU1827300A - Heat debondable adhesive composition and adhesion structure - Google Patents

Heat debondable adhesive composition and adhesion structure

Info

Publication number
AU1827300A
AU1827300A AU18273/00A AU1827300A AU1827300A AU 1827300 A AU1827300 A AU 1827300A AU 18273/00 A AU18273/00 A AU 18273/00A AU 1827300 A AU1827300 A AU 1827300A AU 1827300 A AU1827300 A AU 1827300A
Authority
AU
Australia
Prior art keywords
adhesive composition
adhesion structure
debondable adhesive
heat debondable
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU18273/00A
Other languages
English (en)
Inventor
Tetsuo Kanki
Kohichiro Kawate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of AU1827300A publication Critical patent/AU1827300A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AU18273/00A 1999-01-08 1999-11-22 Heat debondable adhesive composition and adhesion structure Abandoned AU1827300A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11002770A JP2000204332A (ja) 1999-01-08 1999-01-08 熱剥離性接着剤組成物および接着構造体
JP11/2770 1999-01-08
PCT/US1999/027696 WO2000040648A1 (en) 1999-01-08 1999-11-22 Heat debondable adhesive composition and adhesion structure

Publications (1)

Publication Number Publication Date
AU1827300A true AU1827300A (en) 2000-07-24

Family

ID=11538583

Family Applications (1)

Application Number Title Priority Date Filing Date
AU18273/00A Abandoned AU1827300A (en) 1999-01-08 1999-11-22 Heat debondable adhesive composition and adhesion structure

Country Status (5)

Country Link
EP (1) EP1141104B1 (enExample)
JP (1) JP2000204332A (enExample)
AU (1) AU1827300A (enExample)
DE (1) DE69908417T2 (enExample)
WO (1) WO2000040648A1 (enExample)

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DE19961940A1 (de) * 1999-12-22 2001-08-02 Henkel Kgaa Lösbare Klebeverindungen
KR20000018019A (ko) * 2000-01-04 2000-04-06 전효철 합성수지와 질석 및 제오라이트(열팽창광물질)등을혼합하여 합성수지 혼합물의 제조방법
JP2002317544A (ja) * 2001-04-23 2002-10-31 Tajima Inc 床タイルの施工方法
JP3629021B2 (ja) * 2001-09-28 2005-03-16 化研テック株式会社 熱剥離型接着構造体
FR2837114A1 (fr) * 2002-03-13 2003-09-19 Rescoll Soc Procede de separation commandee des assemblages et revetements colles et produits associes
US6882058B2 (en) 2002-11-05 2005-04-19 Henkel Corporation Organic acid containing compositions and methods for use thereof
US20040249042A1 (en) * 2003-06-09 2004-12-09 Motorola, Inc. Microwave removable coating
JP2006024751A (ja) * 2004-07-08 2006-01-26 Three M Innovative Properties Co 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品
JP5153103B2 (ja) * 2006-09-01 2013-02-27 株式会社アシックス 熱膨張性接着剤、シューズ、及びシューズの解体方法
JP2009007526A (ja) * 2007-06-29 2009-01-15 Kobe Steel Ltd 剥離用塗料組成物およびその塗膜を有する塗工基材
DE102008036713A1 (de) 2008-08-07 2010-02-11 Technische Universität Carolo-Wilhelmina Zu Braunschweig Verfahren zum Trennen zweier über zumindest eine Klebschicht miteinander verklebter Objekte
FR2943352B1 (fr) * 2009-03-17 2011-05-20 Astrium Sas Procede de collage demontable adapte aux materiaux poreux
DE102009019483A1 (de) 2009-05-04 2010-11-11 Eads Deutschland Gmbh Klebstoff-Zusammensetzung für lösbare Klebeverbindungen und Modifikation der Verkapselungsmaterialien für gezielte Energieeinbringung
DE102009019484B4 (de) 2009-05-04 2015-12-17 Airbus Defence and Space GmbH Kombination der Effekte von Expansionsstoffen und chemischen Abbaureagenzien für lösbare Klebeverbindungen
DE102009055091A1 (de) * 2009-12-21 2011-06-22 tesa SE, 20253 Induktiv erwärmbares Klebeband mit differentiellem Löseverhalten
EP2434528A1 (en) 2010-09-28 2012-03-28 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO An active carrier for carrying a wafer and method for release
TW201235402A (en) * 2011-01-07 2012-09-01 Ajinomoto Kk Resin composition for release film
WO2013012973A2 (en) 2011-07-19 2013-01-24 3M Innovative Properties Company Debondable adhesive article and methods of making and using the same
EP2877547A4 (en) * 2012-07-26 2016-01-27 3M Innovative Properties Co HEAT-RESOLVABLE ADHESIVES
CN104823080B (zh) 2012-07-26 2017-06-16 3M创新有限公司 可热脱粘的光学制品
KR101930128B1 (ko) 2013-07-03 2018-12-17 헨켈 아이피 앤드 홀딩 게엠베하 고온 탈결합가능한 접착제
KR102102955B1 (ko) 2013-08-12 2020-04-23 삼성디스플레이 주식회사 표시 장치의 제조 방법
KR102168052B1 (ko) 2014-06-24 2020-10-21 헨켈 아게 운트 코. 카게아아 1k uv 및 열 경화성 고온 탈결합가능한 접착제
KR101606360B1 (ko) * 2014-07-17 2016-03-28 한국생산기술연구원 경화성 플럭스 조성물 및 이를 포함하는 솔더 페이스트
EP3056225A1 (en) 2015-02-16 2016-08-17 Nitto Denko Corporation Debondable adhesive system
TWI738684B (zh) 2015-12-09 2021-09-11 德商漢高智慧財產控股公司 可脫黏組合物
GB2568105A (en) * 2017-11-07 2019-05-08 Rolls Royce Plc A joined article, a method of de-bonding an article and a method of curing a binder
JP7181571B2 (ja) * 2018-02-26 2022-12-01 国立大学法人大阪大学 解体性接着剤組成物、及び被着体の解体方法
EP3983459A1 (en) 2019-06-13 2022-04-20 3M Innovative Properties Company Crosslinkers and curable compositions including the same
DE102019220633A1 (de) * 2019-12-30 2021-07-01 Edag Engineering Gmbh Strukturverbindungsanordnung, Verwendung eines Gemisches aus einem Klebstoff und thermisch expandierenden Partikeln und Verfahren zur Verwertung einer Strukturverbindungsanordnung
JP7464005B2 (ja) * 2021-05-31 2024-04-09 信越化学工業株式会社 接合部材の解体方法及び接合部材並びに易解体性の液状シリコーン系接着剤
JP7772079B2 (ja) * 2021-09-30 2025-11-18 信越化学工業株式会社 接合部材の解体方法及び接合部材並びに易解体性の液状シリコーン系接着剤
JP7647494B2 (ja) * 2021-10-22 2025-03-18 トヨタ自動車株式会社 ロータの製造方法及びロータ
CN118871541A (zh) * 2022-03-14 2024-10-29 日东电工株式会社 易解体粘接片材、层叠体、接合体、接合体的制造方法及接合体的解体方法
EP4276155A1 (en) * 2022-05-11 2023-11-15 tesa SE Multilayered tape and process for debonding the multilayered tape
CN120187534A (zh) * 2022-11-16 2025-06-20 信越化学工业株式会社 接合构件的解体方法和易解体性的液体有机硅系粘接剂
LU506809B1 (en) * 2024-04-05 2025-10-06 Luxembourg Inst Science & Tech List Non-intumescent thermoset polymer compositions for dismantlable composites

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60252681A (ja) * 1984-05-30 1985-12-13 F S K Kk 熱剥離性粘着シ−ト
JPS6178887A (ja) * 1984-09-27 1986-04-22 Shinko Kagaku Kogyo Kk 熱剥離性を有する粘着シ−ト
JPS6222874A (ja) * 1985-07-22 1987-01-31 Mitsui Toatsu Chem Inc 熱時再剥離型粘着剤
JP2665383B2 (ja) * 1989-11-09 1997-10-22 日東電工株式会社 ダイシング・ダイボンドフィルム
DE4013161A1 (de) * 1990-04-25 1991-11-07 Schott Glaswerke Flammfeste polyorganosiloxanmasse
JP2970963B2 (ja) * 1991-08-14 1999-11-02 日東電工株式会社 剥離性感圧接着剤及びその粘着部材
JP3032074B2 (ja) * 1992-03-04 2000-04-10 日東電工株式会社 発泡性接着シート及びその製造方法
JP2898480B2 (ja) * 1992-09-14 1999-06-02 日東電工株式会社 加熱剥離性接着剤及び粘着部材
JPH06117544A (ja) * 1992-10-02 1994-04-26 Hitachi Chem Co Ltd 膨張黒鉛−金属ガスケット材料
JPH06211596A (ja) * 1992-11-30 1994-08-02 Fujitsu Ltd 高温超伝導薄膜等の薄膜の堆積方法および堆積用基板の保持方法
JP3308672B2 (ja) * 1993-02-26 2002-07-29 日東電工株式会社 接着シート
JPH07145357A (ja) * 1993-11-24 1995-06-06 Nitto Denko Corp 加熱剥離シート及び剥離方法

Also Published As

Publication number Publication date
EP1141104B1 (en) 2003-05-28
WO2000040648A1 (en) 2000-07-13
DE69908417D1 (de) 2003-07-03
DE69908417T2 (de) 2004-05-06
EP1141104A1 (en) 2001-10-10
JP2000204332A (ja) 2000-07-25

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase