DE69823957T2 - Vorrichtung zum Polieren von Halbleiterscheiben - Google Patents

Vorrichtung zum Polieren von Halbleiterscheiben Download PDF

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Publication number
DE69823957T2
DE69823957T2 DE69823957T DE69823957T DE69823957T2 DE 69823957 T2 DE69823957 T2 DE 69823957T2 DE 69823957 T DE69823957 T DE 69823957T DE 69823957 T DE69823957 T DE 69823957T DE 69823957 T2 DE69823957 T2 DE 69823957T2
Authority
DE
Germany
Prior art keywords
wafer
assembly
polishing
head
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69823957T
Other languages
German (de)
English (en)
Other versions
DE69823957D1 (de
Inventor
Eric H. Livermore Engdahl
Edward T. Jr. Gilroy Ferri
Wilbur C. Palo Alto Krusell
Rahul San Jose Jairath
Randall L. Watsonville Green
Anil Santa Clara Pant
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE69823957D1 publication Critical patent/DE69823957D1/de
Publication of DE69823957T2 publication Critical patent/DE69823957T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/10—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a rigid member, e.g. pressure bar, table, pressing or supporting the belt over substantially its whole span
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69823957T 1997-11-12 1998-11-11 Vorrichtung zum Polieren von Halbleiterscheiben Expired - Fee Related DE69823957T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US968333 1997-11-12
US08/968,333 US6336845B1 (en) 1997-11-12 1997-11-12 Method and apparatus for polishing semiconductor wafers

Publications (2)

Publication Number Publication Date
DE69823957D1 DE69823957D1 (de) 2004-06-24
DE69823957T2 true DE69823957T2 (de) 2005-06-23

Family

ID=25514099

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69830374T Expired - Fee Related DE69830374T2 (de) 1997-11-12 1998-11-11 Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
DE69823957T Expired - Fee Related DE69823957T2 (de) 1997-11-12 1998-11-11 Vorrichtung zum Polieren von Halbleiterscheiben

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69830374T Expired - Fee Related DE69830374T2 (de) 1997-11-12 1998-11-11 Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben

Country Status (7)

Country Link
US (3) US6336845B1 (ko)
EP (2) EP0916452B1 (ko)
JP (2) JPH11221755A (ko)
KR (2) KR100507432B1 (ko)
AT (1) ATE267070T1 (ko)
DE (2) DE69830374T2 (ko)
TW (2) TW407312B (ko)

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KR102050975B1 (ko) * 2017-12-27 2020-01-08 주식회사 케이씨텍 기판 지지 유닛 및 이를 포함하는 기판 연마 장치
KR102564114B1 (ko) * 2018-05-16 2023-08-07 주식회사 케이씨텍 기판 처리 장치
KR20200130545A (ko) * 2019-05-08 2020-11-19 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
KR20220122363A (ko) * 2021-02-26 2022-09-02 주식회사 케이씨텍 기판 연마 시스템
CN113967874B (zh) * 2021-11-17 2022-10-14 江苏纳沛斯半导体有限公司 一种半导体晶圆制备用硅晶棒研磨加工设备
CN116344348A (zh) * 2023-05-29 2023-06-27 深圳辰达行电子有限公司 屏蔽栅沟槽sgt-mosfet半导体器件的制备方法

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US6517418B2 (en) 2003-02-11
US20010039168A1 (en) 2001-11-08
KR19990045176A (ko) 1999-06-25
DE69830374D1 (de) 2005-07-07
TW406328B (en) 2000-09-21
KR19990045177A (ko) 1999-06-25
JP4334642B2 (ja) 2009-09-30
US20010036792A1 (en) 2001-11-01
US6336845B1 (en) 2002-01-08
EP0916451A2 (en) 1999-05-19
JPH11221758A (ja) 1999-08-17
DE69823957D1 (de) 2004-06-24
EP0916452A2 (en) 1999-05-19
ATE267070T1 (de) 2004-06-15
DE69830374T2 (de) 2006-01-26
EP0916451A3 (en) 2000-07-26
EP0916452A3 (en) 2001-01-31
TW407312B (en) 2000-10-01
US6416385B2 (en) 2002-07-09
EP0916451B1 (en) 2004-05-19
JPH11221755A (ja) 1999-08-17
EP0916452B1 (en) 2005-06-01

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