ATE267070T1 - Vorrichtung zum polieren von halbleiterscheiben - Google Patents

Vorrichtung zum polieren von halbleiterscheiben

Info

Publication number
ATE267070T1
ATE267070T1 AT98309217T AT98309217T ATE267070T1 AT E267070 T1 ATE267070 T1 AT E267070T1 AT 98309217 T AT98309217 T AT 98309217T AT 98309217 T AT98309217 T AT 98309217T AT E267070 T1 ATE267070 T1 AT E267070T1
Authority
AT
Austria
Prior art keywords
polishing
processing
process path
semiconductive
discs
Prior art date
Application number
AT98309217T
Other languages
English (en)
Inventor
Eric H Engdahl
Edward T Ferri Jr
Wilbur C Krusell
Rahul Jairath
Randall L Green
Anil Pant
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE267070T1 publication Critical patent/ATE267070T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/10—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a rigid member, e.g. pressure bar, table, pressing or supporting the belt over substantially its whole span
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT98309217T 1997-11-12 1998-11-11 Vorrichtung zum polieren von halbleiterscheiben ATE267070T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/968,333 US6336845B1 (en) 1997-11-12 1997-11-12 Method and apparatus for polishing semiconductor wafers

Publications (1)

Publication Number Publication Date
ATE267070T1 true ATE267070T1 (de) 2004-06-15

Family

ID=25514099

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98309217T ATE267070T1 (de) 1997-11-12 1998-11-11 Vorrichtung zum polieren von halbleiterscheiben

Country Status (7)

Country Link
US (3) US6336845B1 (de)
EP (2) EP0916451B1 (de)
JP (2) JPH11221755A (de)
KR (2) KR100521538B1 (de)
AT (1) ATE267070T1 (de)
DE (2) DE69830374T2 (de)
TW (2) TW406328B (de)

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KR102050975B1 (ko) * 2017-12-27 2020-01-08 주식회사 케이씨텍 기판 지지 유닛 및 이를 포함하는 기판 연마 장치
KR102564114B1 (ko) * 2018-05-16 2023-08-07 주식회사 케이씨텍 기판 처리 장치
KR20200130545A (ko) * 2019-05-08 2020-11-19 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
KR20220122363A (ko) * 2021-02-26 2022-09-02 주식회사 케이씨텍 기판 연마 시스템
CN113967874B (zh) * 2021-11-17 2022-10-14 江苏纳沛斯半导体有限公司 一种半导体晶圆制备用硅晶棒研磨加工设备
CN116344348A (zh) * 2023-05-29 2023-06-27 深圳辰达行电子有限公司 屏蔽栅沟槽sgt-mosfet半导体器件的制备方法

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US6517418B2 (en) 2003-02-11
EP0916452A2 (de) 1999-05-19
EP0916451A3 (de) 2000-07-26
KR100507432B1 (ko) 2005-11-28
TW407312B (en) 2000-10-01
DE69830374D1 (de) 2005-07-07
EP0916452B1 (de) 2005-06-01
US20010039168A1 (en) 2001-11-08
EP0916451B1 (de) 2004-05-19
EP0916451A2 (de) 1999-05-19
TW406328B (en) 2000-09-21
KR19990045176A (ko) 1999-06-25
DE69823957T2 (de) 2005-06-23
DE69823957D1 (de) 2004-06-24
EP0916452A3 (de) 2001-01-31
KR19990045177A (ko) 1999-06-25
JPH11221758A (ja) 1999-08-17
JPH11221755A (ja) 1999-08-17
DE69830374T2 (de) 2006-01-26
US6416385B2 (en) 2002-07-09
US6336845B1 (en) 2002-01-08
KR100521538B1 (ko) 2006-03-23
US20010036792A1 (en) 2001-11-01

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