TW356436B - Polishing pad and method and apparatus for planarizing and polishing the surface of a workpiece - Google Patents

Polishing pad and method and apparatus for planarizing and polishing the surface of a workpiece

Info

Publication number
TW356436B
TW356436B TW086113227A TW86113227A TW356436B TW 356436 B TW356436 B TW 356436B TW 086113227 A TW086113227 A TW 086113227A TW 86113227 A TW86113227 A TW 86113227A TW 356436 B TW356436 B TW 356436B
Authority
TW
Taiwan
Prior art keywords
polishing
planarizing
pad
workpiece
polishing pad
Prior art date
Application number
TW086113227A
Other languages
Chinese (zh)
Inventor
In-Ki Kim
Original Assignee
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Corp filed Critical Speedfam Corp
Application granted granted Critical
Publication of TW356436B publication Critical patent/TW356436B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Abstract

A polishing pad, apparatus for evenly polishing or planarizing the surfaces of workpieces, comprising: a polishing pad with a plurality of grooves along the surface of the pad for uniformly guiding a slurry radially outward across the surface of the pad.
TW086113227A 1996-09-19 1997-09-12 Polishing pad and method and apparatus for planarizing and polishing the surface of a workpiece TW356436B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71592296A 1996-09-19 1996-09-19

Publications (1)

Publication Number Publication Date
TW356436B true TW356436B (en) 1999-04-21

Family

ID=24876006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086113227A TW356436B (en) 1996-09-19 1997-09-12 Polishing pad and method and apparatus for planarizing and polishing the surface of a workpiece

Country Status (2)

Country Link
TW (1) TW356436B (en)
WO (1) WO1998012020A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2345255B (en) * 1998-12-29 2000-12-27 United Microelectronics Corp Chemical-Mechanical Polishing Pad
US6238271B1 (en) 1999-04-30 2001-05-29 Speed Fam-Ipec Corp. Methods and apparatus for improved polishing of workpieces
US20020068516A1 (en) * 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
US6783436B1 (en) 2003-04-29 2004-08-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with optimized grooves and method of forming same
US7364493B1 (en) 2006-07-06 2008-04-29 Itt Manufacturing Enterprises, Inc. Lap grinding and polishing machine

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2063961A1 (en) * 1969-10-13 1971-07-16 Radiotechnique Compelec Mechanico-chemical grinder for semi-con-ducting panels
US5527215A (en) * 1992-01-10 1996-06-18 Schlegel Corporation Foam buffing pad having a finishing surface with a splash reducing configuration
JPH07321076A (en) * 1994-05-24 1995-12-08 Toshiba Corp Manufacture of semiconductor device and abrasive device
US5645469A (en) * 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels

Also Published As

Publication number Publication date
WO1998012020A1 (en) 1998-03-26

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