MY131804A - Polishing carrier, surface-polishing apparatus, and surface-polishing method - Google Patents
Polishing carrier, surface-polishing apparatus, and surface-polishing methodInfo
- Publication number
- MY131804A MY131804A MYPI9904118A MY131804A MY 131804 A MY131804 A MY 131804A MY PI9904118 A MYPI9904118 A MY PI9904118A MY 131804 A MY131804 A MY 131804A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing
- allows
- reticulate
- regions
- work
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A TOTAL OF FOUR RETICULATE REGIONS 103 ARE FORMED ON A PLATE SURFACE, EACH OF WHICH ARE FORMED BETWEEN WORK-SUPPORTING OPENINGS 102. THE RETICULATE REGIONS 103 ARE FORMED INDIVIDUALLY IN SUITABLE SHAPES SO AS TO BE SPACED BY PREDETERMINED WIDTHS FROM AN OUTER PERIPHERAL SECTION, ON WHICH EXTERNAL TEETH 101 ARE FORMED, AND FROM PERIPHERAL SECTIONS OF THE WORK-HOLDING OPENINGS 102. THIS PROVIDES A TECHNIQUE THAT ALLOWS EVEN SIGNIFICANTLY THIN WORKS TO BE POLISHED WITHOUT PROBLEMS, ALLOWS A LOW PROCESSING PRECISION ATTRIBUTABLE TO VARIATION OF THE CARRIER SHAPE TO BE REDUCED, AND ALSO ALLOWS ACCIDENTS SUCH AS DAMAGE ON THE WORKS TO BE REDUCED.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35463298 | 1998-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY131804A true MY131804A (en) | 2007-09-28 |
Family
ID=18438871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI9904118 MY131804A (en) | 1998-12-14 | 1999-09-22 | Polishing carrier, surface-polishing apparatus, and surface-polishing method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3975251B2 (en) |
CN (1) | CN1132719C (en) |
MY (1) | MY131804A (en) |
WO (1) | WO2000035630A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100463778C (en) * | 2004-09-10 | 2009-02-25 | 上海日进机床有限公司 | Parallel planar grinder |
JP5138407B2 (en) * | 2008-02-14 | 2013-02-06 | セイコーインスツル株式会社 | Wafer and wafer polishing method |
JP2012111001A (en) * | 2010-11-25 | 2012-06-14 | Nikon Corp | Work carrier and polishing device having work carrier |
CN103009242A (en) * | 2011-09-28 | 2013-04-03 | 上海双明光学科技有限公司 | Protection method for processing heavy-caliber ultrathin quartz glass |
JP5937850B2 (en) * | 2012-02-29 | 2016-06-22 | 株式会社ブリヂストン | Grinding method |
CN112091811B (en) * | 2016-03-31 | 2022-09-06 | Hoya株式会社 | Carrier and method for manufacturing substrate using the same |
CN106363529A (en) * | 2016-11-14 | 2017-02-01 | 宜兴市晶科光学仪器有限公司 | Work fixture for double-side grinding and polishing machine |
CN107457687A (en) * | 2017-09-30 | 2017-12-12 | 德清晶生光电科技有限公司 | The erratic star wheel of uniform grinding |
CN108608316A (en) * | 2018-05-18 | 2018-10-02 | 成都成量工具集团有限公司 | The processing tool and processing method of gauge block |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52109293U (en) * | 1976-02-16 | 1977-08-19 | ||
JPS6434155U (en) * | 1987-08-26 | 1989-03-02 | ||
JPH10180623A (en) * | 1996-12-26 | 1998-07-07 | Mitsubishi Materials Shilicon Corp | Lapping device |
JPH1128661A (en) * | 1997-07-09 | 1999-02-02 | Nippon Electric Glass Co Ltd | Polishing method and polishing device |
JPH1190817A (en) * | 1997-09-18 | 1999-04-06 | Oputonikusu Seimitsu:Kk | Lapping carrier and its manufacture |
-
1999
- 1999-08-04 WO PCT/JP1999/004246 patent/WO2000035630A1/en active Application Filing
- 1999-08-04 JP JP56299099A patent/JP3975251B2/en not_active Expired - Fee Related
- 1999-08-04 CN CN998028770A patent/CN1132719C/en not_active Expired - Fee Related
- 1999-09-22 MY MYPI9904118 patent/MY131804A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2000035630A1 (en) | 2000-06-22 |
JP3975251B2 (en) | 2007-09-12 |
CN1132719C (en) | 2003-12-31 |
CN1290202A (en) | 2001-04-04 |
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