EP0411346A3 - Precision grinding machine for lapping, precision grinding or polishing - Google Patents
Precision grinding machine for lapping, precision grinding or polishing Download PDFInfo
- Publication number
- EP0411346A3 EP0411346A3 EP19900113033 EP90113033A EP0411346A3 EP 0411346 A3 EP0411346 A3 EP 0411346A3 EP 19900113033 EP19900113033 EP 19900113033 EP 90113033 A EP90113033 A EP 90113033A EP 0411346 A3 EP0411346 A3 EP 0411346A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- precision grinding
- lapping
- polishing
- grinding machine
- machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8915458U DE8915458U1 (en) | 1989-07-31 | 1989-07-31 | Finishing machine for lapping, fine grinding or polishing |
DE19893925274 DE3925274A1 (en) | 1989-07-31 | 1989-07-31 | Supply and dispensing mechanism for lapping mixt. |
DE8915458U | 1989-07-31 | ||
DE3925274 | 1989-07-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0411346A2 EP0411346A2 (en) | 1991-02-06 |
EP0411346A3 true EP0411346A3 (en) | 1991-04-10 |
Family
ID=25883567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19900113033 Withdrawn EP0411346A3 (en) | 1989-07-31 | 1990-07-07 | Precision grinding machine for lapping, precision grinding or polishing |
Country Status (2)
Country | Link |
---|---|
US (1) | US5197230A (en) |
EP (1) | EP0411346A3 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5329732A (en) | 1992-06-15 | 1994-07-19 | Speedfam Corporation | Wafer polishing method and apparatus |
US5733175A (en) | 1994-04-25 | 1998-03-31 | Leach; Michael A. | Polishing a workpiece using equal velocity at all points overlapping a polisher |
US5607341A (en) | 1994-08-08 | 1997-03-04 | Leach; Michael A. | Method and structure for polishing a wafer during manufacture of integrated circuits |
US5556322A (en) * | 1995-09-05 | 1996-09-17 | Sommer & Maca Industries, Inc. | Pneumatic mechanism for the application of uniform pressure to a mechanically adjustable spindle |
US5697832A (en) * | 1995-10-18 | 1997-12-16 | Cerion Technologies, Inc. | Variable speed bi-directional planetary grinding or polishing apparatus |
US5738568A (en) * | 1996-10-04 | 1998-04-14 | International Business Machines Corporation | Flexible tilted wafer carrier |
US5816892A (en) * | 1997-02-06 | 1998-10-06 | Cobra Machine Tool Co., Inc. | Positioning control for combined milling machine and internally positioned grinding wheel |
US5810648A (en) * | 1997-03-05 | 1998-09-22 | Hmt Technology Corporation | Device for texturing a disc substrate |
US5928067A (en) * | 1997-10-14 | 1999-07-27 | Beloit Technologies, Inc. | Headbox apron finishing and lapping device |
US6254463B1 (en) | 1998-10-09 | 2001-07-03 | International Business Machines Corporation | Chemical planar head dampening system |
JP2000127033A (en) * | 1998-10-27 | 2000-05-09 | Speedfam-Ipec Co Ltd | Polishing device |
CN100380600C (en) * | 2002-03-28 | 2008-04-09 | 信越半导体株式会社 | Double side polishing device for wafer and double side polishing method |
US6875076B2 (en) | 2002-06-17 | 2005-04-05 | Accretech Usa, Inc. | Polishing machine and method |
IT1396287B1 (en) * | 2009-09-28 | 2012-11-16 | Biesse Spa | CONTINUOUS DISTRIBUTOR |
US20120003900A1 (en) * | 2010-07-01 | 2012-01-05 | Artisan Industries Inc. | Apparatus and Method for Refinishing a Surface In-Situ |
CN114888651B (en) * | 2022-04-25 | 2023-03-21 | 长春理工大学 | Flywheel disc semi-product grinding and polishing repair device and repair method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH244291A (en) * | 1943-11-27 | 1946-09-15 | Ag Ryter | Machine for polishing the face of stone. |
DE2442081A1 (en) * | 1974-09-03 | 1976-03-18 | Jmj Werkzeugmasch Gmbh | TWO-DISC LAEPING MACHINE |
DE2440978A1 (en) * | 1974-08-27 | 1976-03-18 | Jmj Werkzeugmaschinen Gmbh | PROCESS AND MACHINE FOR PLAN, PLANPARALLEL AND OUTDOOR ROUND LAPS |
FR2564360A1 (en) * | 1984-05-21 | 1985-11-22 | Crismatec | DOUBLE-SIDED MACHINING MACHINE AND DEVICE FOR TRANSMITTING CURRENT AND FLUID BETWEEN A ROTATING STRUCTURE AND A NON-ROTATING STRUCTURE |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE218300C (en) * | ||||
US2973605A (en) * | 1959-11-09 | 1961-03-07 | Carman Lab Inc | Lapping machine |
DE1577322A1 (en) * | 1966-11-26 | 1970-01-08 | Deutsche Edelstahlwerke Ag | Device on single or double disc horizontal lapping machines |
JPS6010869B2 (en) * | 1978-10-06 | 1985-03-20 | 日本真空技術株式会社 | Safety devices for polishing machines |
JPS55144958A (en) * | 1979-04-18 | 1980-11-12 | Tsutomu Kimura | Lapping machine |
US4315383A (en) * | 1980-05-13 | 1982-02-16 | Spitfire Tool & Machine, Co. Inc. | Inner gear drive for abrading machines |
JPS63120077A (en) * | 1986-11-08 | 1988-05-24 | Otani Reiji | Driving method for lapping and polishing machine for robot loading/unloading |
-
1990
- 1990-07-07 EP EP19900113033 patent/EP0411346A3/en not_active Withdrawn
- 1990-07-16 US US07/553,727 patent/US5197230A/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH244291A (en) * | 1943-11-27 | 1946-09-15 | Ag Ryter | Machine for polishing the face of stone. |
DE2440978A1 (en) * | 1974-08-27 | 1976-03-18 | Jmj Werkzeugmaschinen Gmbh | PROCESS AND MACHINE FOR PLAN, PLANPARALLEL AND OUTDOOR ROUND LAPS |
DE2442081A1 (en) * | 1974-09-03 | 1976-03-18 | Jmj Werkzeugmasch Gmbh | TWO-DISC LAEPING MACHINE |
FR2564360A1 (en) * | 1984-05-21 | 1985-11-22 | Crismatec | DOUBLE-SIDED MACHINING MACHINE AND DEVICE FOR TRANSMITTING CURRENT AND FLUID BETWEEN A ROTATING STRUCTURE AND A NON-ROTATING STRUCTURE |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 4, no. 96 (M-20)(578) 11 Juli 1980, & JP-A-55 54173 (NIPPON SHINKU GIJUTSU K.K.) 21 April 1980, * |
Also Published As
Publication number | Publication date |
---|---|
EP0411346A2 (en) | 1991-02-06 |
US5197230A (en) | 1993-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): CH DE ES FR GB IT LI |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): CH DE ES FR GB IT LI |
|
17P | Request for examination filed |
Effective date: 19910413 |
|
17Q | First examination report despatched |
Effective date: 19920921 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 19930408 |