CN1290202A - Polishing carrier, surface polishing device, and surface polishing method - Google Patents
Polishing carrier, surface polishing device, and surface polishing method Download PDFInfo
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- CN1290202A CN1290202A CN 99802877 CN99802877A CN1290202A CN 1290202 A CN1290202 A CN 1290202A CN 99802877 CN99802877 CN 99802877 CN 99802877 A CN99802877 A CN 99802877A CN 1290202 A CN1290202 A CN 1290202A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a technology, wherein a total of four net-shaped areas (103) arranged between work holding holes (102) on the plate surface of the carrier are formed, the net-shaped areas (103) are formed in appropriate forms on the inner sides of the work holding holes so that an outer edge part forming external gear teeth (101) and the opening edge parts of the work holding holes (102) are separated by a specified width from the net-shaped areas, whereby, when a surface polishing is made using the polishing carrier, even an extremely thin work can be polished without any problem, and a lowering of working precision resulting from the deformation of the carrier and the probability of an accident such as work damage can be reduced.
Description
Technical field
The present invention relates to a kind of polishing carrier, face grinder assembly and method for polishing surface, particularly relate to a kind of Surface-micromachining process that is applicable to when grinding sheet-like workpieces.
Background technology
The face grinder assembly of Cai Yonging as shown in figure 10 in the past, be that a kind of its outer edge that is configured between upper mounting plate 1 and lower platform 2 possesses the external tooth 11 that meshes with sun gear 3 and internal gear 4, the discoid polishing carrier 10 that also has the workpiece retaining hole 12 that keeps workpiece 20 simultaneously, in workpiece 20 insertion workpiece retaining holes 12 and under the state that keeps, between upper mounting plate 1 and lower platform 2, send into grinding-material 5 limits by the limit and make in upper mounting plate 1, lower platform 2, sun gear 3 and the internal gear 4 at least one to do suitably rotation, thereby carry out grinder that surface of the work grinds etc.In this face grinder assembly, when grinding laminal workpiece 20, for example when semiconductor wafer, liquid crystal board substrate, quartzy wafer etc., the lamellar polishing carrier that adopts the carbon tool steel that forms by rolling processing etc. to constitute usually.The carriage of representing among Figure 12 with circular workpiece retaining hole is an example of polishing carrier 10.
In this polishing carrier 10, be formed with by being used to keep the circle of workpiece 20 or the workpiece retaining hole 12 that square peristome constitutes.Because there is the wave that causes because of process in the polishing carrier of new product, so will carry out break-in (hereinafter to be referred as " carriage friction ") before the attrition process under the state that workpiece is not inserted in the workpiece retaining hole on lapping device.In the time can obtaining certain flatness and reach desirable thickness, just can begin and to carry out attrition process in the workpiece 20 insertion workpiece retaining holes 12 by this carriage friction.
The thickness of polishing carrier 10 normally than workpiece 20 last fine finishining thickness slightly unfertile land form, but as shown in figure 11, when workpiece 20 was very thin, the thickness of polishing carrier 10 is attenuation thereupon also, reached sometimes below the 100 μ m.This extremely thin polishing carrier 10 easy deformation, and owing to be formed with workpiece retaining hole 12 on the plate face of polishing carrier 10 rigidity further reduces or the balance of rigidity is destroyed, therefore shown in chain-dotted line among Figure 10, easy stress during attrition process and on carriage, produce distortion (wave).Therefore, in the past in order in the rigidity that improves thin polishing carrier 10, also to improve the rigid balancing on the plate face, as shown in figure 13, on the part that does not form workpiece retaining hole 12 on the plate face of polishing carrier 10 ', form one or more fabrication holes 13 sometimes.
But, even under the situation that has formed above-mentioned fabrication hole 13, when polishing carrier 10 will the striated pattern occur gradually during attenuation on whole carrier frame plate face owing to continue to carry out attrition process.This striated pattern is corresponding with the wave that forms along the direction vertical with rolling direction.Under the situation that produces this wave, because the edge of opening portion of workpiece retaining hole 12 also is out of shape, so near the plate face of the carriage the workpiece retaining hole 12 contacts with upper mounting plate or lower platform, the grinding precision (flatness) of surface of the work is worsened, in addition, also might cause workpiece 20 from workpiece retaining hole 12, to fly out and damage, become the major accident of defective work because of its fragment makes all workpiece 20 in the grinding simultaneously.
Particularly, because polishing carrier generally forms by rolled plate, so produce wavy distortion on the direction vertical with rolling direction, above-mentioned striated pattern also extends along rolling direction.Therefore, under situation about having with the polishing carrier of the square cross retaining hole on the limit of rolling direction almost parallel, exist the edge of opening portion of an avris of workpiece retaining hole to produce up or down and stick up tail, the easier problem that flies out of workpiece.
On the other hand, along with the development of electronic instrument technology in recent years, the thickness of sheet-like materials such as semiconductor wafer, liquid crystal board substrate, quartzy wafer is more and more thinner, but also requires high-precision surface grinding, so the problems referred to above are very outstanding.Particularly the raising owing to clock frequency in electronic instrument, the information instrument is very fast, in order to improve frequency of oscillation, has also quickened the slimming of quartzy oscillator plate.
The present invention proposes in order to address the above problem, its objective is provides a kind of polishing carrier that possesses the workpiece retaining hole in employing to carry out under the situation of surface grinding, can grind extremely thin workpiece without barrier, reduce simultaneously that machining accuracy that the distortion because of carriage causes reduces or the technology of accident such as workpiece breakage.
Disclosure of an invention
For addressing the above problem, the described device of the invention of claim 1 is a kind ofly to constitute, be used for the polishing carrier that under the state in workpiece remains on above-mentioned workpiece retaining hole surface of the work ground by the board-like material that has the workpiece retaining hole on the plate face, and it is characterized in that: the plate face outside the above-mentioned workpiece retaining hole is provided with the mesh zone of having arranged the mesh that is made of little opening.By forming the mesh zone, the stress that can absorb, dispersion grinding is born in grinding with carriage, simultaneously can guarantee the rigidity of polishing carrier and make rigid uniform, even therefore the situation lower face at the polishing carrier that adopts thinner thickness corresponding to thin workpiece also is difficult for producing distortion such as wave, can reduce because of the mechanical property of material itself or the caused distortion of workpiece retaining hole that on the plate face, forms, so the very thin workpiece of attrition process can prevent flying out or the machining accuracy deterioration of workpiece simultaneously without barrier.
For addressing the above problem, the described device of the invention of claim 3 is a kind ofly to constitute, be used for the polishing carrier that under the state in workpiece remains on above-mentioned workpiece retaining hole surface of the work ground by the board-like material that has the workpiece retaining hole on the plate face, it is characterized in that: the mesh zone of having arranged the mesh that is made of little opening is set on the plate face outside the above-mentioned workpiece retaining hole, and beyond the above-mentioned workpiece retaining hole and above-mentioned mesh zone plate face in addition is provided with opening simultaneously.By also forming opening except the mesh zone, the stress that can absorb, dispersion grinding is born in grinding with carriage can be guaranteed the rigidity of polishing carrier and make rigid uniform simultaneously.Even therefore the situation lower face at the polishing carrier that adopts thinner thickness corresponding to thin workpiece also is difficult for producing distortion such as wave, can reduce because of the mechanical property of material itself or the caused distortion of workpiece retaining hole that on the plate face, forms, so the very thin workpiece of attrition process can prevent flying out or the machining accuracy deterioration of workpiece simultaneously without barrier.
The invention of claim 2 or claim 4 is in claim 1 or claim 3, and above-mentioned mesh zone only avoids with Rack preferably that the edge of opening portion ground of the outer rim of above-mentioned board-like material and above-mentioned workpiece retaining hole forms.By only avoiding the outer edge of above-mentioned board-like material and the edge of opening portion above-mentioned mesh of the ground formation zone of above-mentioned workpiece retaining hole with Rack, can have and can not reduce the structure that carriage whole rigidity and being used to keeps the rigidity of workpiece meaninglessly, can guarantee the absorption that the mesh zone is had and the effect of dispersion processing stress simultaneously.
The invention of claim 5 be in claim 1 to each of claim 4, above-mentioned mesh preferably is arranged on the above-mentioned plate face with the netted form of honeycomb.Because mesh is with the netted form of honeycomb, is the stagger form of about half period or the form arrangement identical with the ion arrangement in each layer of the fine and closely woven filling of described six sides of crystallography of mesh position between the adjacent column mesh, can guarantee in the mechanical property in mesh zone etc. side's property, and dispersion processing stress effectively, make the reduction of rigidity reduce to Min. simultaneously.
The invention of claim 6 be in claim 1 to each of claim 4, above-mentioned mesh preferably is arranged on the above-mentioned plate face with the netted form of honeycomb, the netting twine width that is present between the above-mentioned mesh in the above-mentioned mesh zone preferably is roughly necessarily.Because the netting twine width is roughly necessarily, can further improve in the mechanical property in mesh zone etc. side's property, and can make the wearing and tearing of carriage even, effectively dispersion processing stress.
The invention of claim 7 be in claim 1 to each of claim 6, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction.As board-like material, best is metal material, and rolling processing is that this metal material is made common and the most most economical tabular method.It is best adopting the high resiliency metallic plate that especially is called as spring steel in the carbon tool steel then grinding on the elasticity in each device as herein described.
The invention of claim 8 be in claim 1 to each of claim 6, above-mentioned board-like material is preferably along the rolling stock of the rolling processing of specific direction, above-mentioned workpiece retaining hole preferably is roughly square, and the extending direction of each limit portion preferably all intersects with above-mentioned specific direction in the edge of opening portion of above-mentioned workpiece retaining hole.Owing to be roughly the limit portion of square workpiece retaining hole and the direction of rolling processing intersects, fly out even under the situation that produces wave because of process, also can suppress workpiece.In addition, be applicable to that in the limit portion that is roughly square workpiece retaining hole and structure that rolling direction intersects under the situation of the polishing carrier that has other workpiece retaining hole in all existing structures that do not possess the mesh zone be effective.In this moment and this claim the value of the angle of the crossing preferably acute angle one side be below above 90 degree of 10 degree, above 90 degree of 30 degree with next better.In the above scope of 10 degree, can reduce flying out of workpiece, simultaneously be formed with several workpiece retaining holes situation under also can be easily with several workpiece retaining holes suitably or rotate and be arranged in symmetrically on the plate face of polishing carrier.In the scope more than 30 degree, the arrangement of several workpiece retaining holes is difficulty, but can reduce flying out of workpiece very effectively.
The invention of claim 9 be in claim 1 to each of claim 6, above-mentioned board-like material is preferably along the rolling stock of the rolling processing of specific direction, above-mentioned mesh preferably have along with the above-mentioned specific direction shape that prolongs of the direction of quadrature roughly.Since mesh have along with the above-mentioned specific direction shape that prolongs of the direction of quadrature roughly, can make the caused wave of rolling processing be difficult on the plate face, enlarge, therefore can reduce the distortion that processing produced of mesh zone and periphery thereof.
The invention of claim 10 be in claim 1 to each of claim 6, above-mentioned board-like material is preferably along the rolling stock of the rolling processing of specific direction, above-mentioned mesh preferably have along with the above-mentioned specific direction shape that prolongs of the direction of quadrature roughly, above-mentioned workpiece retaining hole preferably is roughly square, and the extending direction of each limit portion preferably all intersects with above-mentioned specific direction in the edge of opening portion of above-mentioned workpiece retaining hole.In this case, can play aforesaid right requirement 7,8,9 effect of Combination.
Claim 21 to the invention of claim 30 is a kind of method for polishing surface, it is characterized in that: the 1st workpiece is remained on claim 1 to described each polishing carrier of claim 10, surface of the work is carried out attrition process, afterwards, 2nd workpiece of original depth less than above-mentioned the 1st workpiece remained on the above-mentioned polishing carrier, surface of the work is carried out attrition process.After to one of the 1st workpiece enforcement or several attrition process operation, polishing carrier is thin because of the attrition process limit, contrasts the 2nd thin workpiece of the 1st workpiece with this polishing carrier and implements one or several attrition process operation, so can effectively utilize polishing carrier.Particularly, the application's polishing carrier is difficult for being out of shape because of machining stress, even and slimming also be difficult for producing distortion, more existing polishing carrier has obviously improved service life, is most effective, the most effective using method of this polishing carrier.
The invention of claim 31 be in claim 21 to each of claim 30, the original depth of above-mentioned the 1st workpiece and the 2nd workpiece is that 100 μ m are the most effective when following.The application's polishing carrier can be processed without barrier to thickness all workpiece below 100 μ m of processing difficulties in the prior art.In the scope of being confirmed in following embodiment, but no problem ground attrition process to the thickness of carriage is about 30 μ m.
Brief description of drawings
Fig. 1 is the vertical view of the flat shape of expression polishing carrier the 1st embodiment of the present invention.
Fig. 2 is the schematic plan of general configuration in the flat grinding device of the polishing carrier of embodiment among expression employing Fig. 1.
Fig. 3 is the vertical view of the flat shape of expression polishing carrier the 2nd embodiment of the present invention.
Fig. 4 is the schematic plan of the variation of the polishing carrier of embodiment in the presentation graphs 1.
Fig. 5 is the enlarged drawing of the flat shape in mesh zone among each embodiment of expression.
Fig. 6 is the enlarged drawing of other variation in expression mesh zone.
Fig. 7 is the enlarged drawing of other variation in expression mesh zone.
Fig. 8 is the enlarged drawing of other variation in expression mesh zone.
Fig. 9 is the shape of the workpiece retaining hole of expression polishing carrier and the key diagram of posture.
Figure 10 is for representing the general profile chart of the state that the employing polishing carrier grinds.
The general profile chart of grinding state when Figure 11 is the attenuation of expression polishing carrier.
Figure 12 is the vertical view of the flat shape of the existing polishing carrier of expression.
Figure 13 is the vertical view of the flat shape of existing other polishing carrier of expression.
The best mode that carries out an invention
Below, be illustrated with reference to the most preferred embodiment of accompanying drawing polishing carrier of the present invention, face grinder assembly and method for polishing surface.
Fig. 1 is the vertical view of expression polishing carrier the 1st embodiment of the present invention.This polishing carrier 100 has external tooth 101 and the workpiece retaining hole 102 same with existing polishing carrier.In the 1st embodiment, workpiece retaining hole 102 is roughly square such as the chamfering square that matches with not shown workpiece shape.Be formed with 4 the mesh zones 103 that amount to that are configured in respectively between the above-mentioned workpiece retaining hole 102 on the plate face.In order to avoid being formed with the outer edge of external tooth 101 or the edge of opening portion of workpiece retaining hole 102 with Rack, these mesh zones 103 form suitable shape respectively on the side within it.
The diameter or the shape of the mesh in mesh zone 103 (little opening), and remain between the mesh, the netting twine width that is equivalent to the plate face is suitably to form, in the 1st embodiment, with respect to be called as the high-carbon steel SK2 of carbon tool steel, SK3, elastomeric thickness such as SK4 is that the metallic plate of 50～60 μ m (thickness before the carriage friction) is a material, the carriage external diameter is 10cm, distance in the workpiece retaining hole between the subtend limit is about the carriage of 35mm, for the diameter of mesh is about 0.8mm, the carriage that is shaped as circle of mesh, the width of netting twine is about 0.2mm at the minimum place.The mesh in this mesh zone 103 and the shape or the arrangement of netting twine are shown in Fig. 5.At this, the diameter of mesh is preferably 5～15 times of the thickness of polishing carrier (carriage friction before thickness), with about 10 times for well.The width of netting twine is preferably 0.1～2.0% of carriage external diameter, with about 0.4～0.6% for well.This scope is to determine by the stress absorption of taking into account the mesh zone and rigidity.
Fig. 2 adopts above-mentioned polishing carrier for expression and is assembled into the approximate vertical view of the flat grinding device that is called as face lapping mill.At this, upper mounting plate 1 is represented by chain-dotted line.The external tooth 101 of polishing carrier 100 is meshed from inside and outside by the sun gear 3 that can dispose rotatably around the center with the ring-type internal gear 4 of sun gear 3 concentric arrangement.In illustrated example, with the equal angles arranged spaced several polishing carriers 100 are arranged between sun gear 3 and the internal gear 4.Polishing carrier 100 is as planetary gear and carry out suitable planetary motion by at least a in the rotation of sun gear 3 and internal gear 4.In addition, comprise the abrasive material of forming by the pottery grain outside the aluminium oxide by between upper mounting plate 1 and lower platform 2, supplying with, make at least one side's rotation in upper mounting plate 1 and the lower platform 2, can implement the grinding campaign of various complexity the workpiece (not shown) in the workpiece retaining hole 102 that remains on polishing carrier 100.
Fig. 3 is the vertical view of expression polishing carrier the 2nd embodiment of the present invention.This polishing carrier 200 also similarly possesses with existing polishing carrier external tooth 201 and workpiece retaining hole 202 is arranged.In the 2nd embodiment, workpiece retaining hole 202 is roughly square such as the chamfering square that matches with not shown workpiece shape.On the plate face and the 1st embodiment similarly be formed with 4 the mesh zones 203 that amount to that are configured in respectively between the workpiece retaining hole 202, in addition, between workpiece retaining hole 202 and the mesh zone 203, be formed with several openings 204 between workpiece retaining hole 202 or mesh zone 203 and the external tooth 201.These mesh zones 203 and opening 204 side within it form suitable shape respectively, so that avoid being formed with the outer edge of external tooth 201 or the edge of opening portion of workpiece retaining hole 202 with the width of regulation.
The diameter or the shape of the mesh in mesh zone 203 (little opening), and remain between the mesh, be equivalent to the netting twine width of plate face and the 1st embodiment similarly suitably forms.On the plate face outside the certain width of the edge of opening portion of the outer edge that formed workpiece retaining hole 202, mesh zone 203 and external tooth 201 or workpiece retaining hole 202, form opening 204 as much as possible.Among the 2nd embodiment, between workpiece retaining hole 202 and mesh zone 203, form bigger circular open 204a and smaller circular open 204b, between workpiece retaining hole 202 or mesh zone 203 and external tooth 201, form the opening 204c that is roughly parallelogram.At this, the shape of the opening 204c the external tooth 201 near is roughly the reasons are as follows of parallelogram.That is, since on the external tooth 201 power that applies for moving, so this power is born and dispersed cause by the hypotenuse of opening 204c with respect to radial skew ground.In addition, also because the lower platform of flat grinding device is provided with radial groove, might be impaired when the edge of opening 204c enters in the groove abreast, institute so that the edge tilt of opening 204c enter the cause to prevent that opening 204c from damaging in the groove.
In the 1st embodiment, by locating to be formed with mesh zone 103 beyond the position that in the plate face of polishing carrier 100, forms workpiece retaining hole 102, and, in the 2nd embodiment, the position that also forms workpiece retaining hole 202 and mesh zone 203 in the plate face of polishing carrier 200 locates to be formed with opening 204 in addition, even so when polishing carrier 100,200 becomes very thin, also be difficult for taking place existing this wave or deflection.For example, carriage diameter or material are being set under the identical situation, in the prior art, when carrying out along with grinding operation, when the thickness of carriage is thinned to 100～60 μ m left and right sides gradually, to produce the striated pattern, form wave clearly, and the accident that workpiece flies out will take place, and in the present embodiment, even be thinned to 50～35 μ m, the striated pattern is also very thin, and the accident that workpiece flies out does not take place.
Though this reason is also not really clear and definite, but can think that the stress that applies on when grinding polishing carrier 100 or the polishing carrier 200 can be absorbed, be disperseed by mesh zone 103 or mesh zone 203 and opening 204, simultaneously, different with the existing processes hole, can reduce, alleviate the inhomogeneities that the stress absorption of polishing carrier 100 or polishing carrier 200 or stress disperse, and do not make polishing carrier 100 or polishing carrier 200 self rigidity too increase the reason of flexibility with reducing by mesh zone 103 or mesh zone 203 and opening 204.
And, under the situation of the polishing carrier of the new product that the sheet material that uses the high-carbon steel form through rolling processing is made, though in order to make wave or the concavo-convex planarization on the initial carrier frame plate face, to rub to above-mentioned carriage, but in the past, for example the thickness for new product is 100 μ m, thickness when actual grinding begins is the carriage of 70 μ m, the carriage friction that must carry out about 30 μ m just can obtain sufficient flatness, therefore to carry out the carriage friction more than 3 hours, and in the present embodiment, thickness for new product is 60 μ m, thickness when actual grinding begins is the carriage of 50 μ m, the carriage friction of carrying out about 10 μ m can obtain sufficient flatness, and in the 1st embodiment, carriage needed time of rubbing foreshortened to about 1 hour, in the 2nd embodiment, carriage needed time of rubbing foreshortened to about 30 minutes.
Then, be that the quartzy oscillator plate of 55 μ m carries out attrition process to thickness, and investigated the carriage durability when grinding.At first, the original depth that makes existing polishing carrier shown in Figure 13 is 50 μ m, the beginning attrition process.Its result can carry out good grinding in the attrition process time within 2 hours, but the striated pattern occurred since the 3rd hour, then became at the 4th hour can not usage degree the striated pattern, therefore change.On the other hand, adopting original depth is the polishing carrier 100,200 of the present embodiment of 40 μ m, the beginning attrition process.Though carried out the carriage friction again to grinding carriage halfway, begun after 15 hours, still can carry out good attrition process from grinding.Though become about 35 μ m at this thickness that grinds carriage constantly, the striated pattern of problem do not occurred becoming.Though also sustainable the grinding is because of the thickness of carriage is ended less than the thickness of above-mentioned quartzy oscillator plate.And, after this, still can carry out attrition process to thinner quartzy oscillator plate (for example fine finishining thickness is the quartzy oscillator plate of 40 μ m) once more by same carriage.
Even the polishing carrier of present embodiment be thinned in the past can not the zone still can continue processing, and can not cause flying out or the reduction of machining accuracy of workpiece, can realize reducing the replacing frequency and the carriage quantity of carriage by improving durability, so be highly suitable for the high-frequencyization of quartz crystal, can reduce manufacturing cost simultaneously, boost productivity.Particularly, the durability that improves carriage is in the attrition process of extremely thin workpiece (below the 100 μ m), by with a slice polishing carrier the different workpiece of multiple thickness being carried out having special effect from thick to thin order grinding (using in turn).By this effect, the carriage of present embodiment can be improved 5 times to 15 times with respect to the life-span of existing carriage.
In addition, because comparing the unit price that only increases seldom with existing polishing carrier, the polishing carrier of present embodiment gets final product (for example), so can reduce totle drilling cost significantly by improving its life-span with respect to below 10% of manufacturing cost.
Below, the variation of the 1st embodiment is illustrated.The polishing carrier 100 of above-mentioned the 1st embodiment is set with the frame shape zone of certain width in the edge of opening portion of the outer edge of carrier frame plate face and workpiece retaining hole, in this frame shape zone, do not form mesh zone 103, but can be as shown in Figure 4, edge of opening portion in the outer edge of carrier frame plate face and workpiece retaining hole 102 sets the slightly little frame shape zone 104,105 of width, and one also spreads all over that formation mesh zone 106 is in the roughly whole zone outside the workpiece retaining hole 102 in the carrier frame plate face.Even so also can guarantee certain rigid,, thereby can avoid the distortion of carriage integral body or produce wave with respect to the correspondence increase of distortional stress by mesh zone 106.In this case, preferably adopt the material that is called as excellent spring such as spring steel.In addition, this variation can be applicable to the polishing carrier 200 of the 2nd embodiment too.
And in order to ensure rigidity, the mesh in mesh zone 103,203,106 arranges that to be preferably the such honeycomb in mesh shown in Figure 5 zone 1030 netted.But, in this case,, concentrate so be easy to generate stress on the narrower part of netting twine width in the netting twine 1032 because the netting twine 1032 that forms between the mesh 1031 has the part of the narrower and wider width of the width shown in 1032a, the 1032b.Therefore, in the mesh zone 106 separately shape of a mesh also to be preferably the such honeycomb in mesh zone shown in Figure 6 1040 netted.Mesh shown in Figure 6 zone 1040 since the arrangement of mesh 1041 and shape both sides to constitute honeycomb netted, so the rigidity height and can not make distortional stress concentrate in the drawings the part shown in the arrow but disperse equably.Particularly, the netting twine 1042 that exists between the mesh 1041 forms about equally the width of being always shown in 1042a, 1042b, so stress is disperseed.
In addition, above-mentioned each mesh zone all possesses the netted mesh of honeycomb arranges, but also not necessarily must arrange like this, for example, can dispose mesh respectively on the position of intersecting point of grid pattern, can also other arrange formation arbitrarily.And shape of a mesh also can be any.
Below, suitable variation is illustrated when forming polishing carrier with reference to Fig. 8 to adopting the rolling board-like material of being processed into.The various embodiments described above are that SK2, SK3, SK4 based on high-carbon steel etc. is through the rolling sheet material that processes, by punch process be shaped out shape and workpiece retaining hole, then by adopting photolithographic selective etch processing etc. to form mesh zone 1060 shown in Figure 8.At this, stamp out that the also available method same with forming the mesh zone forms workpiece retaining hole and/or external tooth after the profile.Like this polishing carrier of Xing Chenging as shown in Figure 8, with left and right directions among the figure as rolling direction PF.Sometimes residual on the surface of the board-like material of having implemented rolling processing have along the trickle scar of rolling direction PF extension, and, in order to eliminate this scar, to carry out surface treatments such as sandblast sometimes.But, can eliminate though carry out the surface treatment injurious surface mark, but still keep in the interior tissue directionality with respect to rolling direction, do not change with respect to the characteristic of wave transformation.
In this variation, make the shape of mesh 1061 for prolonging in mesh zone 1060 along direction with the rolling direction PF quadrature.That is, the width of mesh 1061 on rolling direction is narrower, with the direction of rolling direction quadrature on wider width.By such formation, along with the direction of rolling direction quadrature on the wave that forms and the stress that wave is formed be difficult in mesh zone 1060, enlarge, suppressed in mesh regional 1060 and periphery, to produce wave.Specifically, under the situation of hexagon mesh 1061 shown in Figure 8, the limit 1061b that makes mesh be limit 1061a be effective more than 2 times.In other cases, usually and the width on the direction of rolling direction quadrature be preferably more than 2 times of width of the rolling direction of mesh.
In addition, in above-mentioned variation, mesh 1061 is along the shape that prolongs with the direction of rolling direction quadrature, but as the structure that can obtain effect same, also can consider with the direction of rolling direction quadrature on the narrow structure of width, promptly with the direction of rolling direction quadrature on the interval of mesh little.
With the above-mentioned polishing carrier that similarly has rolling direction along specific direction in, form roughly square in the workpiece retaining hole, for example under the situation of triangle roughly, square roughly and pentagon roughly etc., the whole limit that is preferably rolling direction and workpiece retaining hole intersects mutually, is uneven structure.This is because owing to be easy to generate wave on the direction of above-mentioned and rolling direction PF quadrature, the limit 1021a parallel with rolling direction PF might be because of the either party integrally bending of wave W in the direction vertical with the plate face in the limit 1021a of workpiece retaining hole 1021 shown in Figure 9 and 1021b, and when producing this bending, then shown in chain-dotted line among Figure 11, the cause that workpiece flies out easily.And arbitrary limit all has under the situation with respect to the angle of the crossing θ of rolling direction PF and φ in resembling workpiece retaining hole 1022 4 limit 1022a, 1022b, among limit 1022a and the 1022a in arbitrary limit all with extending direction on the Gu Hefeng of wave W appears, therefore, even produce wave W, the paddy of the wave W that workpiece also can not be subjected to occurring on the limit or the obstruction at peak have reduced the possibility that workpiece flies out.
The limit of above-mentioned workpiece retaining hole and the angle of the crossing of rolling direction are preferably more than 10 degree, and be then better more than 30 degree.When having the angle of the crossing in the workpiece retaining hole, have approximately in 100 on three three grinding carriages that contain workpiece and workpiece takes place more than 30 fly out less than the limit of 10 degree.At the angle of the crossing all is above 30 degree of 10 degree when following, the flying out of workpiece be reduced in 100 below 10, and all be 30 to spend when above when making the angle of the crossing, flying out of workpiece do not taken place.In addition, these data are the data when producing the striated pattern on the polishing carrier that does not form the mesh zone.Owing in carriage, be difficult for producing wave, so its effect is better with mesh zone.
In addition, in this application, above-mentioned general square shape comprises that chamfering is square or rounding is square, so long as some gets final product for linearity on one side.
As the manufacture method of polishing carrier, except the method for above-mentioned selective etch, also can directly optionally form carriage by metallikon, electrocasting and vapor deposition method with mesh zone.
As mentioned above, according to the present invention, by forming mesh zone and opening, the stress that can absorb, dispersion grinding is born in grinding with carriage can be guaranteed the rigidity of polishing carrier simultaneously and increase flexible.Even the therefore distortion such as wave that under the situation of the polishing carrier that adopts thinner thickness corresponding to thin workpiece, also are difficult for producing the plate face, can reduce because of the mechanical property of material itself or the caused distortion of workpiece retaining hole that on the plate face, forms, so the very thin workpiece of attrition process can prevent flying out or the machining accuracy deterioration of workpiece simultaneously without barrier.
The possibility of industrial application
The present invention is applicable to when grinding sheet-like workpieces as polishing carrier, surface grinding dress Put and the use of plate face Ginding process.
Claims (31)
1. polishing carrier, constitute by the board-like material that has the workpiece retaining hole on the plate face, be used under the state in workpiece remains on above-mentioned workpiece retaining hole surface of the work being ground, it is characterized in that: the plate face outside the above-mentioned workpiece retaining hole is provided with the mesh zone of having arranged the mesh that is made of little opening.
2. polishing carrier according to claim 1, above-mentioned mesh zone are only to avoid the outer rim of above-mentioned board-like material with Rack and the edge of opening portion ground of above-mentioned workpiece retaining hole forms.
3. polishing carrier, constitute by the board-like material that has the workpiece retaining hole on the plate face, be used under the state in workpiece remains on above-mentioned workpiece retaining hole surface of the work being ground, it is characterized in that: the mesh zone of having arranged the mesh that is made of little opening is set on the plate face outside the above-mentioned workpiece retaining hole, and beyond the above-mentioned workpiece retaining hole and above-mentioned mesh zone plate face in addition is provided with opening simultaneously.
4. polishing carrier according to claim 3, above-mentioned mesh zone and above-mentioned opening are only to avoid the outer rim of above-mentioned board-like material with Rack and the edge of opening portion ground of above-mentioned workpiece retaining hole forms.
5. according to each described polishing carrier in the claim 1 to 4, above-mentioned mesh is arranged on the above-mentioned plate face with the netted form of honeycomb.
6. according to each described polishing carrier in the claim 1 to 4, above-mentioned mesh is arranged on the above-mentioned plate face with the netted form of honeycomb, and the netting twine width that is present between the above-mentioned mesh in the above-mentioned mesh zone is roughly necessarily.
7. according to each described polishing carrier in the claim 1 to 6, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction.
8. according to each described polishing carrier in the claim 1 to 6, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction, above-mentioned workpiece retaining hole is roughly square, and the extending direction of each limit portion all intersects with above-mentioned specific direction in the edge of opening portion of above-mentioned workpiece retaining hole.
9. according to each described polishing carrier in the claim 1 to 6, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction, above-mentioned mesh have along with the above-mentioned specific direction shape that prolongs of the direction of quadrature roughly.
10. according to each described polishing carrier in the claim 1 to 6, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction, above-mentioned mesh have along with the above-mentioned specific direction shape that prolongs of the direction of quadrature roughly, above-mentioned workpiece retaining hole is roughly square, and the extending direction of each limit portion all intersects with above-mentioned specific direction in the edge of opening portion of above-mentioned workpiece retaining hole.
11. face grinder assembly, comprise by the board-like material that has the workpiece retaining hole on the plate face constituting, be used for the polishing carrier that under the state in workpiece remains on above-mentioned workpiece retaining hole surface of the work ground, it is characterized in that: the plate face beyond the above-mentioned workpiece retaining hole is provided with has arranged the mesh zone that is made of little opening.
12. face grinder assembly according to claim 11, above-mentioned mesh zone are only to avoid the outer rim of above-mentioned board-like material with Rack and the edge of opening portion ground of above-mentioned workpiece retaining hole forms.
13. face grinder assembly, comprise by the board-like material that has the workpiece retaining hole on the plate face and constitute, be used for the polishing carrier that under the state in workpiece remains on above-mentioned workpiece retaining hole surface of the work ground, it is characterized in that: be provided with on the plate face beyond the above-mentioned workpiece retaining hole and arranged the mesh zone that is made of little opening, beyond the above-mentioned workpiece retaining hole and above-mentioned mesh zone plate face in addition is provided with opening simultaneously.
14. face grinder assembly according to claim 13, above-mentioned mesh zone and above-mentioned opening are only to avoid the outer rim of above-mentioned board-like material with Rack and the edge of opening portion ground of above-mentioned workpiece retaining hole forms.
15. according to each described face grinder assembly in the claim 11 to 14, above-mentioned mesh is arranged on the above-mentioned plate face with the netted form of honeycomb.
16. according to each described face grinder assembly in the claim 11 to 14, above-mentioned mesh is arranged on the above-mentioned plate face with the netted form of honeycomb, the netting twine width that is present between the above-mentioned mesh in the above-mentioned mesh zone is roughly necessarily.
17. according to each described face grinder assembly in the claim 11 to 16, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction.
18. according to each described face grinder assembly in the claim 11 to 16, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction, above-mentioned workpiece retaining hole is roughly square, and the extending direction of each limit portion all intersects with above-mentioned specific direction in the edge of opening portion of above-mentioned workpiece retaining hole.
19. according to each described face grinder assembly in the claim 11 to 16, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction, above-mentioned mesh have along with the above-mentioned specific direction shape that prolongs of the direction of quadrature roughly.
20. according to each described face grinder assembly in the claim 11 to 16, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction, above-mentioned mesh have along with the above-mentioned specific direction shape that prolongs of the direction of quadrature roughly, above-mentioned workpiece retaining hole is roughly square, and the extending direction of each limit portion all intersects with above-mentioned specific direction in the edge of opening portion of above-mentioned workpiece retaining hole.
21. method for polishing surface, it is characterized in that: the 1st workpiece is remained on the polishing carrier, surface of the work is carried out attrition process, afterwards, 2nd workpiece of original depth less than above-mentioned the 1st workpiece remained on the above-mentioned polishing carrier, surface of the work is carried out attrition process, wherein, above-mentioned polishing carrier is for to be made of the board-like material that has the workpiece retaining hole on the plate face, be used for the polishing carrier that under the state in workpiece remains on above-mentioned workpiece retaining hole surface of the work ground, and the plate face beyond the above-mentioned workpiece retaining hole is provided with and has arranged the mesh zone that is made of little opening.
22. method for polishing surface according to claim 21, above-mentioned mesh zone are only to avoid the outer rim of above-mentioned board-like material with Rack and the edge of opening portion ground of above-mentioned workpiece retaining hole forms.
23. method for polishing surface, it is characterized in that: the 1st workpiece is remained on the polishing carrier, surface of the work is carried out attrition process, afterwards, 2nd workpiece of original depth less than above-mentioned the 1st workpiece remained on the above-mentioned polishing carrier, surface of the work is carried out attrition process, wherein, above-mentioned polishing carrier is for to be made of the board-like material that has the workpiece retaining hole on the plate face, be used for the polishing carrier that under the state in workpiece remains on above-mentioned workpiece retaining hole surface of the work ground, and be provided with on the plate face beyond the above-mentioned workpiece retaining hole and arranged the mesh zone that constitutes by little opening, simultaneously beyond the above-mentioned workpiece retaining hole and the plate face beyond the above-mentioned mesh zone be provided with opening.
24. method for polishing surface according to claim 23, above-mentioned mesh zone and above-mentioned opening are only to avoid the outer rim of above-mentioned board-like material with Rack and the edge of opening portion ground of above-mentioned workpiece retaining hole forms.
25. according to each described method for polishing surface in the claim 21 to 24, above-mentioned mesh is arranged on the above-mentioned plate face with the netted form of honeycomb.
26. according to each described method for polishing surface in the claim 21 to 24, above-mentioned mesh is arranged on the above-mentioned plate face with the netted form of honeycomb, the netting twine width that is present between the above-mentioned mesh in the above-mentioned mesh zone is roughly necessarily.
27. according to each described method for polishing surface in the claim 21 to 26, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction.
28. according to each described method for polishing surface in the claim 21 to 26, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction, above-mentioned workpiece retaining hole is roughly square, and the extending direction of each limit portion all intersects with above-mentioned specific direction in the edge of opening portion of above-mentioned workpiece retaining hole.
29. according to each described method for polishing surface in the claim 21 to 26, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction, above-mentioned mesh have along with the above-mentioned specific direction shape that prolongs of the direction of quadrature roughly.
30. according to each described method for polishing surface in the claim 21 to 26, above-mentioned board-like material is the rolling stock along the rolling processing of specific direction, above-mentioned mesh have along with the above-mentioned specific direction shape that prolongs of the direction of quadrature roughly, above-mentioned workpiece retaining hole is roughly square, and the extending direction of each limit portion all intersects with above-mentioned specific direction in the edge of opening portion of above-mentioned workpiece retaining hole.
31. according to each described method for polishing surface in the claim 21 to 30, the original depth of above-mentioned the 1st workpiece and the 2nd workpiece is below the 100 μ m.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP354632/1998 | 1998-12-14 | ||
| JP35463298 | 1998-12-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1290202A true CN1290202A (en) | 2001-04-04 |
| CN1132719C CN1132719C (en) | 2003-12-31 |
Family
ID=18438871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN998028770A Expired - Fee Related CN1132719C (en) | 1998-12-14 | 1999-08-04 | Polishing carrier, surface polishing device, and surface polishing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3975251B2 (en) |
| CN (1) | CN1132719C (en) |
| MY (1) | MY131804A (en) |
| WO (1) | WO2000035630A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100463778C (en) * | 2004-09-10 | 2009-02-25 | 上海日进机床有限公司 | Parallel planar grinder |
| CN101510767A (en) * | 2008-02-14 | 2009-08-19 | 精工电子有限公司 | Wafer and polishing device and method, piezoelectric vibrating piece, method and apparatus for fabricating piezoelectric vibrating piece |
| CN102528649A (en) * | 2010-11-25 | 2012-07-04 | 株式会社尼康 | Workpiece carrier and grinding device with the same |
| CN103009242A (en) * | 2011-09-28 | 2013-04-03 | 上海双明光学科技有限公司 | Protection method for processing heavy-caliber ultrathin quartz glass |
| CN107457687A (en) * | 2017-09-30 | 2017-12-12 | 德清晶生光电科技有限公司 | The erratic star wheel of uniform grinding |
| CN108608316A (en) * | 2018-05-18 | 2018-10-02 | 成都成量工具集团有限公司 | The processing tool and processing method of gauge block |
| CN112091811A (en) * | 2016-03-31 | 2020-12-18 | Hoya株式会社 | Carrier and method for manufacturing substrate using the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5937850B2 (en) * | 2012-02-29 | 2016-06-22 | 株式会社ブリヂストン | Grinding method |
| CN106363529A (en) * | 2016-11-14 | 2017-02-01 | 宜兴市晶科光学仪器有限公司 | Work fixture for double-side grinding and polishing machine |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52109293U (en) * | 1976-02-16 | 1977-08-19 | ||
| JPS6434155U (en) * | 1987-08-26 | 1989-03-02 | ||
| JPH10180623A (en) * | 1996-12-26 | 1998-07-07 | Mitsubishi Materials Shilicon Corp | Lapping device |
| JPH1128661A (en) * | 1997-07-09 | 1999-02-02 | Nippon Electric Glass Co Ltd | Polishing method and polishing device |
| JPH1190817A (en) * | 1997-09-18 | 1999-04-06 | Oputonikusu Seimitsu:Kk | Lapping carrier and its manufacture |
-
1999
- 1999-08-04 WO PCT/JP1999/004246 patent/WO2000035630A1/en active Application Filing
- 1999-08-04 JP JP56299099A patent/JP3975251B2/en not_active Expired - Fee Related
- 1999-08-04 CN CN998028770A patent/CN1132719C/en not_active Expired - Fee Related
- 1999-09-22 MY MYPI9904118 patent/MY131804A/en unknown
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100463778C (en) * | 2004-09-10 | 2009-02-25 | 上海日进机床有限公司 | Parallel planar grinder |
| CN101510767A (en) * | 2008-02-14 | 2009-08-19 | 精工电子有限公司 | Wafer and polishing device and method, piezoelectric vibrating piece, method and apparatus for fabricating piezoelectric vibrating piece |
| CN102528649A (en) * | 2010-11-25 | 2012-07-04 | 株式会社尼康 | Workpiece carrier and grinding device with the same |
| CN103009242A (en) * | 2011-09-28 | 2013-04-03 | 上海双明光学科技有限公司 | Protection method for processing heavy-caliber ultrathin quartz glass |
| CN112091811A (en) * | 2016-03-31 | 2020-12-18 | Hoya株式会社 | Carrier and method for manufacturing substrate using the same |
| CN107457687A (en) * | 2017-09-30 | 2017-12-12 | 德清晶生光电科技有限公司 | The erratic star wheel of uniform grinding |
| CN108608316A (en) * | 2018-05-18 | 2018-10-02 | 成都成量工具集团有限公司 | The processing tool and processing method of gauge block |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2000035630A1 (en) | 2000-06-22 |
| JP3975251B2 (en) | 2007-09-12 |
| CN1132719C (en) | 2003-12-31 |
| MY131804A (en) | 2007-09-28 |
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