CN102528649A - Workpiece carrier and grinding device with the same - Google Patents
Workpiece carrier and grinding device with the same Download PDFInfo
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- CN102528649A CN102528649A CN2011103789862A CN201110378986A CN102528649A CN 102528649 A CN102528649 A CN 102528649A CN 2011103789862 A CN2011103789862 A CN 2011103789862A CN 201110378986 A CN201110378986 A CN 201110378986A CN 102528649 A CN102528649 A CN 102528649A
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- glass substrate
- workpiece carrier
- retention tab
- carrier
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Abstract
The present invention provides a workpiece carrier which can improve manufacturing productivity of glass substrates. The workpiece carrier according to the embodiment of the invention is used in glass grinding and is used for holding a glass substrate W which is clamped between an upper fixed disc and a lower fixed disc that oppose each other vertically and rotate relatively for being ground. The workpiece carrier 50 is provided with a workpiece holding sheet 55 which prevents abuttment of a side surface of the glass substrate W and an inner wall surface 53 and keeps the glass substrate W in a workpiece keeping hole at the inner wall surface 53 of the workpiece holding hole for accommodating the glass substrate W. The workpiece holding sheet 22 is formed by means of ultrahigh-modular-weight polyethylene.
Description
Technical field
The present invention system is about a kind of workpiece carrier of maintenance glass substrate and grind the lapping device of the glass substrate that this workpiece carrier kept.
Background technology
All the time, as the known lapping device that various forms are arranged of lapping device of lower surface on the grinding work-piece.For example; Use the known two sides lapping device of pinion gear mechanism; Possess have grind upper surface and be set as rotatable under price fixing, have with grinds the grindings lower surface of upper surface subtend and be set as rotatable on price fixing, be set as rotatable central gear at the central part of price fixing down, descending perimembranous outside the price fixing to be set as rotatable internal gear and be engaged in central gear and internal gear between and by pull together running and the workpiece carrier of rotation, revolution of two gears; The workpiece system that the workpiece carrier is kept is held on price fixing and last price fixing under the relative rotation; Lower surface is ground (for example, with reference to patent documentation 1) simultaneously on the workpiece.
Above-mentioned lapping device; Workpiece is under the state that is contained in the workpiece retaining hole that is located at the workpiece carrier; Price fixing by under on rotating relatively grinds; But this moment, the side of workpiece was connected to wall within the workpiece retaining hole, was that the situation of glass substrate etc. has and produces fine scar or damaged etc. anxiety at workpiece.Therefore, motion has elastic component that within workpiece retaining hole wall the is provided with polyurethane system lapping device (for example, with reference to patent documentation 2) with the damage that prevents side surface of workpiece.
Patent documentation 1: TOHKEMY 2005-28498 communique
Patent documentation 2: TOHKEMY 2007-98543 communique
Summary of the invention
Here, about the glass substrate (light shield substrate) of the light shield that is used in the LCD manufacturing, be to grind basically by lapping device same as described above.Because light shield substrate system forms fine pattern by light lithography, therefore require high cleanliness factor.In recent years, along with the productivity of the maximization of the maximization of LCD, panel size promotes, the light shield substrate also maximizes gradually.Grinding factory, substrate side surfaces and the damage observed because of maximization, weightization prevent that the sliding of using relatively of elastic component from making the elastic component abrasion be attached to the phenomenon of substrate side surfaces, and the clean step before the shipment is strengthened gradually.
Yet, in light shield manufacturing works, the clean step before system film step, the common phenomenon that is attached to the light shield substrate to residual particulates of the trace of removing from substrate again.Moreover; Even in order to reduce the stress that acts on elastic component corresponding with the maximization of substrate size elastic component is maximized or make the substrate shipment before clean and strengthen; Also be difficult for to satisfy more risings residual particulates son require specification, so requirement makes the new tool of the productive rate rising of glass substrate.
The present invention system constitutes in view of the problems referred to above, and its purpose is to provide a kind of new tool that can make the productive rate rising of glass substrate.
In order to reach above-mentioned purpose, the workpiece carrier of the 1st form of illustration of the present invention is to keep being clamped in subtend up and down and relatively on the rotation between price fixing and the following price fixing and the workpiece carrier that the quilt glass grinding of the tabular glass substrate of grinding is used.This workpiece carrier; Within being used to accommodate the workpiece retaining hole of glass substrate wall possess the glass substrate of preventing side and internal face butt and simultaneously glass substrate is remained on the workpiece retention tab in the workpiece retaining hole, this workpiece retention tab system forms by ultra-high molecular weight polyethylene.
In addition, this workpiece retention tab can be and in the Taibo formula abrasion resistance test of JIS K6264-2, establishes the abrasion wheel for H22, test loading are 9.8N, the abrasion volume when testing time is 1000 times is 10～20mm
3Ultra-high molecular weight polyethylene.Again, to can be the hardness of the durometer type D of JISK6253 be 60～70 ultra-high molecular weight polyethylene to this workpiece retention tab.
The 2nd form of illustration of the present invention is a lapping device.Lapping device possesses: following price fixing has and grinds upper surface and be driven in rotation; Last price fixing has with the grinding lower surface that grinds the configuration of upper surface subtend and is driven in rotation; The workpiece carrier of the 1st form of illustration of the present invention; And the carrier retaining member, the workpiece carrier is remained on down (for example, the 35, the 1st, the 2nd arm 31,32 of the carrier ring in the example etc.) between price fixing and the last price fixing.
The workpiece carrier of the 1st form of illustration according to the present invention; Wall possesses the butt of wall within side and the workpiece retaining hole of the glass substrate of preventing and simultaneously glass substrate is remained on the workpiece retention tab in the workpiece retaining hole within being used to accommodate the workpiece retaining hole of glass substrate, and this workpiece retention tab system forms by ultra-high molecular weight polyethylene.Therefore, can suppress the abrasion of the workpiece retention tab that relatively sliding of glass substrate and workpiece retention tab followed.By this, can prevent chipping of workpiece retention tab in the grinding steps of glass substrate adhere to, and system film step before clean adhering to again of residual particulates in the step, make the productive rate lifting of glass substrate manufacturing and light shield manufacturings.Moreover, owing to can suppress the abrasion of workpiece retention tab, therefore the workpiece carrier that can use for a long time can be provided.
The lapping device of the 2nd form of illustration according to the present invention possesses the workpiece carrier of above-mentioned the 1st form and constitutes lapping device.Therefore, can suppress the abrasion of workpiece retention tab at grinding steps.By this, can prevent chipping of workpiece retention tab in the grinding steps of glass substrate adhere to, and system film step before clean adhering to again of residual particulates in the step, make the productive rate lifting of glass substrate manufacturing and light shield manufacturings.Moreover, owing to can suppress the abrasion of workpiece retention tab, therefore can make the replacing life-span of workpiece carrier (workpiece retention tab) elongated, reduce the manufacturing original cost of glass substrate.
The specific embodiment
Below, with reference to graphic explanation the present invention's example.Fig. 4 is the side view of lapping device PM, and the vertical view that the V arrow of Fig. 5 system from Fig. 4 observed explains that at first the summary of lapping device PM constitutes.
Lapping device PM is that the C type that lower cage 1 and upper shelf 2 connect to one in the wings is configured to, and is provided with price fixing 10 and carrier swing mechanism 30 down in lower cage 1, is provided with price fixing 20 in upper shelf 2.
Following price fixing 10 has the smooth grinding upper surface 11 of unlatching up and forms discoidly, can carry out the rotation and the up-down of both forward and reverse directions by price fixing driving mechanism under the omission diagram that is located at lower cage 1.Last price fixing 20 has and grinds smooth the grindings lower surface 21 that upper surface 11 subtends open down and form discoidly, and the price fixing driving mechanism carry out the rotation and the up-down of both forward and reverse directions on can illustrating by the omission that is located at upper shelf 2.
The formation of carrier swing mechanism 30; Possess holding workpieces carrier 50 circular carrier ring 35, can open and close the ground pivot tie in swinging axle 33 and from the 1st arm 31 of left and right sides clamping carrier ring 35 and the 2nd arm 32, shown in circular-arc arrow additional Fig. 5, make the 1st, the 2nd arm 31; 32 see through around wobble drive mechanism (not shown) that swinging axle 33 swings, shown in linearity arrow additional among Fig. 4 that swinging axle 33 makes the 1st, the 2nd arm 31,32 front and back reciprocating swing come and go driving mechanism (not shown).
Fig. 6 is the vertical view of carrier ring 35 that shows the state of holding workpieces carrier 50, and Fig. 7 is the profile that the VII-VII arrow of demonstration from Fig. 6 observed.Shown in two figure, carrier ring 35 is at the outstanding flange part 35a of square level in the annulus that is provided with in full week of internal face, the circular-arc both ends of supporting the workpiece carrier 50 that forms ellipticity at this flange part 35a.
Be formed with the workpiece retaining hole 50a that accommodates the maintenance workpiece at workpiece carrier 50 openings, between the price fixing about this workpiece retaining hole 50a accommodates glass substrate W and is configured in.It is that the thickness of slab of glass substrate W is thin that the thickness of slab of workpiece carrier 50 grinds object; By adjustment price fixing 10 up and down; 20 height and position; Set under the state of clamping glass substrate W between the grindings lower surface 21 of the grindings upper surface 11 of following price fixing 10 and last price fixing 20, lower surface does not contact and grinds upper surface 11 and grinding lower surface 21 (by grinding) on the workpiece carrier 50.In addition, about the formation of workpiece carrier 50 will in after specify.
At the lapping device PM of formation in this way; By last price fixing driving mechanism price fixing 20 is backed out toward the top; Under the state that workpiece carrier 50 swing is backed out, glass substrate W carried and put, make workpiece carrier 50 return abrasion site and price fixing 10 is risen glass substrate W is housed in workpiece retaining hole 50a by price fixing driving mechanism down at price fixing 10 down.At this moment, the relative position of glass substrate W and workpiece retaining hole 50a, the workpiece carrier 50 that can be undertaken by carrier swing mechanism 30 swing and move forward and backward, the rotation and the lift adjustment of price fixing driving mechanism down.
Then; By last price fixing driving mechanism price fixing 20 is descended; Glass substrate W is held on down between the grinding lower surface 21 of grinding upper surface 11 and last price fixing of price fixing; Make down price fixing 10 and last price fixing 20 rotate (for example, driving) relatively by the abrasive supply device that omits diagram while supplying grinding agent, by this lower surface on the glass substrate W is flatly ground simultaneously in opposite spin.At this moment, can carry out swinging and swing of workpiece carrier 50,, can see through carrier ring 35 and workpiece carrier 50 and make the motion of the glass substrate W precession of the equinoxes by with these combinations by the wobble drive mechanism and the round driving mechanism of carrier swing mechanism 30.By this, following two sides is ground simultaneously on the glass substrate W, can make the glass substrate of flatness height.
Then, to constituting in detail of workpiece carrier 50, describe with reference to Fig. 1 and Fig. 2.Here, Fig. 1 is the vertical view of workpiece carrier 50, the profile that the II-II arrow of Fig. 2 system remarks from Fig. 1 is observed.
Like summary description, workpiece carrier 50 is for both sides are by parallel ellipticity of cutting down on the disk, and heart portion opening is formed with the workpiece retaining hole 50a that keeps glass substrate W therein.The glass substrate (light shield substrate) that is used in the light shield of LCD manufacturing is the rectangular shape of the size corresponding with the size of LCD, and the opening size of workpiece retaining hole 50a is than the appearance and size of the glass substrate W rectangular shape of some greatly.
In addition; With workpiece retention tab 55; 55... be fixed on wall 53 within each limit of workpiece retaining hole 50a; 53... state under, set for face within the 55a of liner plate portion of subtend at interval that is comprise wide size within the workpiece retaining hole of workpiece retention tab 55 the glass substrate W of correspondence the side at interval that is the appearance and size of glass substrate (between being formed with a little between workpiece retention tab 55 and the glass substrate W within the crack wide size) a little greatly.By this; Can make the positioning operation facilitation when glass substrate W is contained in workpiece retaining hole 50a; Even and the glass substrate W that is contained in workpiece retaining hole 50a also can reduce the impulsive force that acts on workpiece retention tab 55 and reduce the loss of the 55a of liner plate portion of slip generation relatively in the situation of grinding steps because of the frictional force displacement.Below, about workpiece carrier 50, embodiment more specifically is described.
(embodiment)
As glass substrate W, the synthetic quartz glass substrate that the light shield of the size of use 1620 * 1780 * 17mm is used, PM grinds by lapping device.The body of workpiece carrier 50 is a Merlon system, uses the form with reference to Fig. 1, Fig. 2 explanation.Particularly, the thickness of workpiece carrier 50 bodies is that the opening size of 12mm, workpiece retaining hole 50a is 1628 * 1788mm.
To the ultra-high molecular weight polyethylene enforcement hardness of material and the test of abrasion performance, has following characteristic.Hardness is carried out the hardness test of the durometer type D of JIS (JIS Japanese Industrial Standard) K6253, and the hardness of acquisition is 60～70.Abrasion performance carries out the Taibo formula abrasion resistance test of JIS K6264-2 defined, establishes the abrasion wheel for H22, test loading are 9.8N, the abrasion volume when testing time is 1000 times is 10～20mm
3
According to above-mentioned condition,, so that the light shield of the size of 1620 * 1780 * 17mm grinding condition with the grinding of synthetic quartz glass substrate two sides is ground, finish the back and clean grinding with the step of cleaning identical with convention by lapping device PM.
Carry out the visual examination of this glass substrate (synthetic quartz glass substrate that light shield is used) W at dust free room.Visual examination system is undertaken by the method for the use high brightness halogen lamp that extensively carries out all the time.Its result, though find a plurality of attachments in the side of glass substrate W, this attachment can be removed with the wiping of ethanol.Again, substrate surface only detect in the zone of 600 * 600mm 10 less than attachment.
Above-mentioned glass substrate W simultaneously make chromium film film forming after, carry out visual examination at dust free room.Do not detect bright spot (bright spot) under the above film of 5 μ m, also do not detect every 1cm
2The 5 μ m that concentrate more than 10 less than film under bright spot.Here; When bright spot is carried out visual examination for making at glass substrate behind the metal film forming such as chromium film under the film around bright visible defective, be estimated as under there is the state of residual particulates sub (residual fine particles) or pollution attachments such as (contamination) on the border of glass substrate and chromium film and make chromium film film forming person.In the present embodiment, do not detect this kind defective (defect).
(comparative example)
Same as the previously described embodiments, by lapping device PM the light shield of the size of 1620 * 1780 * 17mm is ground with synthetic quartz glass substrate.The body of workpiece carrier is identical with embodiment, uses Merlon system person.Workpiece retention tab 55 is a polyurethane system, and machining and shaping becomes the shape identical with embodiment and be installed in workpiece carrier 50 to use.
To the polyurethane enforcement hardness of material and the test of abrasion performance, has following characteristic.Hardness is carried out the hardness test of the durometer type D of JIS K6253, and the hardness of acquisition is 40～50.Abrasion performance carries out the Taibo formula abrasion resistance test of JIS K6264-2 defined, establishes the abrasion wheel for H22, test loading are 9.8N, the abrasion volume when testing time is 1000 times is 110mm
3
According to above-mentioned condition, by lapping device PM, grind with the grinding condition identical with embodiment, after grinding end, clean with the identical step of cleaning, clean the visual examination of the glass substrate W of back at dust free room.Visual examination system uses the high brightness halogen lamp identical with embodiment to carry out.Its result has the white attachment at the muscle shape of edge direction extension in the set of the side of glass substrate W, and this attachment can't be removed with the wiping of ethanol.Detect 10～100 attachment in the zone of 600 * 600mm at substrate surface again.
After above-mentioned glass substrate W makes chromium film film forming, detect bright spot under the film of 2 10 μ m, go out every 1cm 2 location detection
2The 5 μ m that concentrate more than 10 less than film under bright spot.
Comprehensive above check result, as follows.
(1) comparative example of the workpiece retention tab of use polyurethane system (convention example)
Substrate side surfaces: set has the white attachment of muscle shape, even also be difficult for removing with the wiping of ethanol.
Substrate surface: the attachment that detects 10～100 in the zone of 600 * 600mm.
After the film forming: detect bright spot under the film of 2 10 μ m, go out every 1cm 2 location detection
2The 5 μ m that concentrate more than 10 less than film under bright spot.
(2) embodiment of the workpiece retention tab 55 of use ultrahigh molecular weight polyethylene
Substrate side surfaces:, can remove with the wiping of ethanol though find a plurality of attachments.
Substrate surface: detect in the zone of 600 * 600mm 10 less than attachment.
After the film forming: do not detect bright spot under the above film of 5 μ m, also do not detect every 1cm
2The 5 μ m that concentrate more than 10 less than film under bright spot.
With knowing after the above-mentioned check result comparison, make workpiece retention tab 55 be the embodiment of ultrahigh molecular weight polyethylene, can make a large amount of minimizing of residual particulates attached to glass substrate, can know the generation of bright spot under the film that can be suppressed at the film forming step.
Be with; According to the workpiece carrier 50 of the form of the present invention of above explanation and possess the lapping device PM of this workpiece carrier 50; Can prevent the workpiece retention tab 55 of the grinding steps of glass substrate W chip adhere to, and system film step before clean adhering to again of residual particulates in the step, make the productive rate lifting of glass substrate manufacturing and light shield manufacturings.Again, owing to can suppress the abrasion of workpiece retention tab 55, workpiece carrier 50 is used between more long-term, at lapping device PM, owing to can make the replacings life-span of workpiece carrier 50 (workpiece retention tab 55) elongated, so can reduce the manufacturing original cost of glass substrate.
In addition; More than in the example of explanation; Though be illustrated in the formation of each limit configuration plurality of workpieces retention tab 55 of wall within the workpiece retaining hole 50a; But the number of configured of workpiece retention tab 55 can suitably be set according to the size of glass substrate W or quality etc., and the formation that the workpiece retention tab of long band is set on each limit one by one also can.Again; Though the form illustration of lapping device is by the 1st, the 2nd arm 31; 32 see through the lapping device that the carrier ring makes the form that the workpiece carrier swings all around, but lapping device also is equally applicable to the lapping device of other forms, for example pinion gear formula, obtains identical effect.
Description of drawings
Fig. 1 is as form of the present invention and the vertical view of the workpiece carrier of illustration.
The profile that the II-II arrow of Fig. 2 system remarks from Fig. 1 is observed.
Fig. 3 owner will show the stereogram of workpiece retention tab.
Fig. 4 is the side view of lapping device PM.
The vertical view that the V arrow of Fig. 5 system from Fig. 4 observed.
Fig. 6 is the vertical view of carrier ring of the state of holding workpieces carrier.
The profile that the VII-VII arrow of Fig. 7 system from Fig. 6 observed.
The primary clustering symbol description
The PM lapping device
The W glass substrate
10 times price fixings
11 grind upper surface
Price fixing on 20
21 grind lower surface
30 carrier swing mechanisms
31 the 1st arms
32 the 2nd arms
33 swinging axles
35 carrier rings
The 35a flange part
50 workpiece carriers
50a workpiece retaining hole
53 internal faces
The 53b recess
55 workpiece retention tabs
55a liner plate portion
The 55b protuberance
The thickness of d1 workpiece retention tab
The thickness of d2 glass substrate
The thickness of d3 workpiece
Claims (9)
1. workpiece carrier is maintenance to being clamped in subtend up and down and relatively on the rotation between price fixing and the following price fixing and the workpiece carrier that the glass grinding that the quilt tabular glass substrate of grinding keeps is used is characterized in that:
Wall possesses the butt of the side that prevents this glass substrate and this internal face and simultaneously this glass substrate is remained on the workpiece retention tab in this workpiece retaining hole within accommodating the workpiece retaining hole of this glass substrate;
This workpiece retention tab system forms by ultra-high molecular weight polyethylene.
2. according to claim 1 workpiece carrier, wherein, this workpiece retention tab is for establishing the abrasion wheel for H22, test loading are 9.8N, the abrasion volume when testing time is 1000 times is 10～20mm in the Taibo formula abrasion resistance test of JIS K6264-2
3Ultra-high molecular weight polyethylene.
3. according to claim 1 or claim 2 workpiece carrier, wherein, the hardness of the durometer type D that this workpiece retention tab is JIS K6253 is 60～70 ultra-high molecular weight polyethylene.
4. like each said workpiece carrier in the claim 1 to 3, wherein, the light shield substrate that this glass substrate is used for the liquid crystal panel manufacturing.
5. lapping device possesses:
Following price fixing has and grinds upper surface and be driven in rotation;
Last price fixing has and the grinding lower surface and be driven in rotation of this grinding upper surface subtend configuration;
Each said workpiece carrier in the claim 1 to 4; And
The carrier retaining member remains on this workpiece carrier between this time price fixing and this last price fixing.
6. workpiece carrier is to being clamped in subtend up and down and relatively on the rotation between price fixing and the following price fixing and the workpiece carrier that the glass grinding that the quilt tabular glass substrate of grinding keeps is used is characterized in that possessing:
The workpiece retaining hole is used to accommodate this glass substrate; And
The workpiece retention tab is located at wall within this retaining hole;
This workpiece retention tab system forms by ultra-high molecular weight polyethylene, prevents that the side of this glass substrate and the butt of this internal face from also remaining on this glass substrate in this workpiece retaining hole simultaneously.
7. like each said workpiece carrier in the claim 1,2,3,4,6, wherein, the thickness of this workpiece retention tab is by the thin thickness of the tabular glass substrate of grinding.
8. like each said workpiece carrier in the claim 1,2,3,4,6,7, wherein, the thickness of this workpiece retention tab is than the thin thickness of this workpiece carrier.
9. the workpiece carrier of claim 8, wherein, end is positioned on this workpiece carrier square under the surface on this workpiece retention tab;
End is positioned under this workpiece carrier on the surface under this workpiece retention tab.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010262211A JP2012111001A (en) | 2010-11-25 | 2010-11-25 | Work carrier and polishing device having work carrier |
| JP2010-262211 | 2010-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102528649A true CN102528649A (en) | 2012-07-04 |
Family
ID=46337338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103789862A Pending CN102528649A (en) | 2010-11-25 | 2011-11-25 | Workpiece carrier and grinding device with the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2012111001A (en) |
| CN (1) | CN102528649A (en) |
| TW (1) | TW201223701A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6269450B2 (en) * | 2014-11-18 | 2018-01-31 | 信越半導体株式会社 | Workpiece processing equipment |
| JP6777530B2 (en) * | 2016-12-26 | 2020-10-28 | クアーズテック株式会社 | Polishing method |
| JP6827663B2 (en) * | 2017-04-24 | 2021-02-10 | 株式会社荏原製作所 | Substrate polishing device |
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| JP2000052241A (en) * | 1998-08-10 | 2000-02-22 | Speedfam-Ipec Co Ltd | Carrier for polishing device |
| CN1290202A (en) * | 1998-12-14 | 2001-04-04 | 精工爱普生株式会社 | Polishing carrier, surface polishing device, and surface polishing method |
| JP2005169568A (en) * | 2003-12-11 | 2005-06-30 | Mitsui Chemicals Inc | Retainer ring and polishing device using the same |
| JP2007098543A (en) * | 2005-10-07 | 2007-04-19 | Nikon Corp | Workpiece carrier and double-sided polishing device |
| CN101489722A (en) * | 2006-07-18 | 2009-07-22 | 信越半导体股份有限公司 | Carrier for double-sided polishing device, double-sided polishing device using the same and double-sided polishing method |
| CN101823233A (en) * | 2009-03-06 | 2010-09-08 | 株式会社Lg化学 | Be used for system and method with glass polishing |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6272051U (en) * | 1985-10-24 | 1987-05-08 | ||
| JPH05339437A (en) * | 1992-06-12 | 1993-12-21 | Mitsubishi Cable Ind Ltd | Flame-resistant resin composition |
| JPH1158224A (en) * | 1997-08-12 | 1999-03-02 | Nitto Shinko Kk | Polishing jig and manufacture thereof |
| JP3075614U (en) * | 2000-08-11 | 2001-02-27 | 作新工業株式会社 | Polishing work carrier |
| EP1827622B1 (en) * | 2004-12-23 | 2008-05-14 | Florian Felix | Sliding coating for winter sports equipment |
| JP5114113B2 (en) * | 2007-07-02 | 2013-01-09 | スピードファム株式会社 | Work carrier |
| JP5002750B2 (en) * | 2007-08-22 | 2012-08-15 | 株式会社日清製粉グループ本社 | A cell for storing and holding samples to be sliced |
| JP2010179375A (en) * | 2009-02-03 | 2010-08-19 | Sumco Corp | Grinding object carrier and manufacturing method of ground product |
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2010
- 2010-11-25 JP JP2010262211A patent/JP2012111001A/en active Pending
-
2011
- 2011-11-24 TW TW100143038A patent/TW201223701A/en unknown
- 2011-11-25 CN CN2011103789862A patent/CN102528649A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000052241A (en) * | 1998-08-10 | 2000-02-22 | Speedfam-Ipec Co Ltd | Carrier for polishing device |
| CN1290202A (en) * | 1998-12-14 | 2001-04-04 | 精工爱普生株式会社 | Polishing carrier, surface polishing device, and surface polishing method |
| JP2005169568A (en) * | 2003-12-11 | 2005-06-30 | Mitsui Chemicals Inc | Retainer ring and polishing device using the same |
| JP2007098543A (en) * | 2005-10-07 | 2007-04-19 | Nikon Corp | Workpiece carrier and double-sided polishing device |
| CN101489722A (en) * | 2006-07-18 | 2009-07-22 | 信越半导体股份有限公司 | Carrier for double-sided polishing device, double-sided polishing device using the same and double-sided polishing method |
| CN101823233A (en) * | 2009-03-06 | 2010-09-08 | 株式会社Lg化学 | Be used for system and method with glass polishing |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201223701A (en) | 2012-06-16 |
| JP2012111001A (en) | 2012-06-14 |
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Application publication date: 20120704 |