JPH1158224A - Polishing jig and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To maintain the extent of surface smoothability for a long period of time by making up an ultrahigh molecular weight polyethylene layer on the surface. SOLUTION: First of all, in order to make a prepreg, such resin as constituting a resin layer is mixed. Then, this compound solution is impregnated in a reinforced fiber layer 2, and heated and dried up, thereby making up the prepreg of a B stage. At the time of stacking the prepreg and, after an ultrahigh molecular weight polyethylene film or sheet 4 is stacked at the outside, it is heated, pressurized and hardened. As to this ultrahigh molecular weight polyethylene film or sheet 4, it is one million to nine millions in viscosity mean molecular weight, if desirable, such a layer as made up of ultrahigh molecular weight polyethylene resin of three millions to five millions in the viscosity mean molecular weight is recommended. Since the ultrahigh molecular weight polyethylene layer is formed on the surface like this, the extent of surface slidability is well improved, and consequently, the surface smoothability is maintainable for a long period of time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for processing a silicon wafer, glass for a liquid crystal display device or the like using a plane precision polishing machine such as a lapping machine, a honing machine, a buffing machine (buff lace) or a polishing machine. The present invention relates to a polishing jig to be used and a method of manufacturing the same, particularly to a polishing jig having excellent wear resistance, a long service life, high polishing accuracy of a polished product, and a good polishing effect, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Generally, when processing a thin plate-shaped work such as a silicon wafer or a glass for liquid crystal using a plane precision polishing machine such as a lapping machine, a honing machine, a buffing machine (buff lace), a polishing machine, etc. In this case, a thin plate-shaped carrier or a polishing jig called a template is used.

As the polishing jig, a metal plate having a work holding hole for holding one or a plurality of works, a resin-coated metal plate, a fiber reinforced resin laminate, or the like is used. When polishing electronic parts such as a silicon wafer and a glass for liquid crystal, which are disliked to adhere, a fiber reinforced resin fiber board is used.

[0004] As shown in FIG.
The prepreg 40 is obtained by impregnating the reinforcing fiber layer 20 with the resin 30.
Is formed, and after laminating a plurality of the prepregs 40,
Heat, cure and bond.

[0005] In this case, the resins used include epoxy resins, unsaturated polyester resins, phenol resins,
A thermosetting resin such as a melamine resin or a diacrylate resin, or a thermoplastic resin such as a polyester resin or polypropylene is used.

The reinforcing fibers include glass fibers, carbon fibers, ceramic fibers, and inorganic fibers such as boron fibers.
Thermosetting or thermoplastic resin fibers or natural organic fibers are used.

[0007]

When the polishing jig is used for polishing, the polishing jig inevitably wears in the surface direction, and the work holding hole also wears with this.
There is a problem in that the processing accuracy of the work is reduced, or chipping in which the work is missing occurs, and the productivity is reduced.

In order to enhance the abrasion resistance, a material having excellent abrasion resistance is selected as a material of the resin and the reinforcing fiber to be used. In particular, an epoxy resin is impregnated into a glass fiber layer, and is heated and dried. A glass / epoxy laminate obtained by laminating and bonding prepregs formed in a B-stage shape is extremely excellent from the viewpoints of wear resistance and durability.

Therefore, an attempt was made to increase the amount of reinforcing fibers in order to increase the wear resistance. However, in this case, the polishing jig was liable to be warped, and on the contrary, the processing accuracy could be reduced. It has been found.

The present invention has been completed in order to solve the technical problems of the conventional polishing jig.
In the polishing jig, an ultra-high-molecular-weight polyethylene layer is formed on the surface, so that the ultra-high-molecular-weight polyethylene layer improves the slipperiness of the surface, and as a result,
Since the amount of wear is significantly reduced and the surface smoothness is maintained for a long period of time, the occurrence of chipping can be prevented for a long period of time, and the service life becomes extremely long. An object of the present invention is to provide a polishing jig having a high polishing efficiency and a good polishing efficiency, and a method for manufacturing the same.

[0011]

A first polishing jig according to the present invention (hereinafter referred to as a first product of the present invention) is used for polishing a thin plate-shaped work such as a silicon wafer or a liquid crystal glass. In order to achieve the above object, the polishing jig is characterized in that an ultrahigh molecular weight polyethylene layer is formed on the surface of the polishing jig.

First, the first product of the present invention will be described in detail. In the first product of the present invention, polishing jigs include silicon wafers, disks, ceramics, glass for liquid crystal,
Lap machines, honing machines,
A buffing machine (buff lace), a polishing machine or the like, which is used to hold a work at a predetermined position when processing using a plane precision polishing machine, is a polishing method called a thin plate-shaped carrier or a template. Jigs.

Examples of the polishing jig include a metal plate having a work holding hole for holding one or a plurality of works, a resin-coated metal plate, and a fiber-reinforced resin laminated plate. When polishing electronic components such as silicon wafers, ceramics, and glass for liquid crystal, which are liable to be adhered, a fiber reinforced resin fiber plate is used.

The first product of the present invention is characterized in that an ultrahigh molecular weight polyethylene layer is formed on the surface of the polishing jig.

In the present invention, examples of the ultrahigh molecular weight polyethylene layer include a layer formed of an ultrahigh molecular weight polyethylene resin having a viscosity average molecular weight of 1,000,000 to 9,000,000, preferably a viscosity average molecular weight of 3,000,000 to 5,000,000. If the viscosity-average molecular weight is less than 1,000,000, the required mechanical strength and abrasion resistance may not be improved. Is not preferable because it becomes difficult.

As described above, since the ultrahigh molecular weight polyethylene layer is formed on the surface of the polishing jig, the ultrahigh molecular weight polyethylene layer improves the slipperiness of the surface,
As a result, the amount of wear is remarkably reduced, and the surface smoothness is maintained for a long period of time, so that the occurrence of chipping can be prevented for a long period of time. The polishing accuracy is high, and the polishing efficiency is good.

Here, as a method for measuring the molecular weight, the intrinsic viscosity [η] at 135 ° C.
It is a value calculated by a viscosity average molecular weight conversion formula 5.37 × 10 ⁴ × [η] ^1.37 specified in ASTM D4020.

The ultrahigh molecular weight polyethylene layer has a thickness of 5 μm to 500 μm, preferably 10 μm to 3 μm.
It is desirable to form the film into a film having a thickness of 00 μm, particularly preferably 15 μm to 150 μm. If the layer thickness is as thin as less than 5 μm, it becomes difficult to form a film, it is difficult to obtain a uniform film, and there is a possibility that the adhesive strength varies. On the other hand, if the thickness exceeds 500 μm, the degree of freedom in designing the thickness of the polishing jig decreases, which is not preferable. Therefore, the thickness of the ultrahigh molecular weight polyethylene layer is preferably 10 μm to 300 μm, from the viewpoints of ease of film formation and freedom of thickness design as a polishing jig.
Particularly preferably, it is more preferably 15 μm to 150 μm.

In the present invention, when the polishing jig comprises a reinforcing fiber layer and a resin layer, the surface of the polishing jig, or between the reinforcing fiber layer and the resin layer, between the resin layer and the resin layer, or the like. A layer formed by melting and bonding an ultrahigh molecular weight polyethylene layer between the layers is excellent.

That is, a second polishing jig according to the present invention (hereinafter referred to as a second product of the present invention) is a polishing jig used for polishing a thin plate-shaped work such as a silicon wafer or a glass for liquid crystal. In order to achieve the above object, the polishing jig comprises a reinforcing fiber layer and a resin layer, and an ultrahigh molecular weight polyethylene layer is melted and bonded between the surface and the layer.

The fibers constituting the reinforcing fiber layer used in the second product of the present invention are not particularly limited. Specifically, for example, inorganic fibers such as glass fiber, carbon fiber and boron fiber, or natural fibers , Regenerated fibers, at least one selected from semi-synthetic fibers or synthetic fibers, or a fiber mixture thereof, such as those conventionally used in this kind of polishing jig, but among these, the most durable It is desirable to use glass fiber which has high property and is available at a reasonable price.

The method of using the reinforcing fiber is not particularly limited. Specifically, for example, a cloth such as woven fabric, nonwoven fabric, mat, cloth or knit, fiber bundle, long fiber, short fiber, filament, etc. However, it is preferable to use a fabric such as a woven fabric or a nonwoven fabric from the viewpoint of easy handling, strength non-directionality and the like.

The basis weight of the reinforcing fiber layer is 50 to 300 g / g for reasons of handleability and reinforcing reliability.
range of m ^2, particularly preferably in the range of 80~250g / ^{m 2.}

Further, the resin constituting the resin layer used in the product of the present invention is not particularly limited, and may be a thermosetting resin or a thermoplastic resin.

Examples of the thermosetting resin include epoxy resin, melamine resin, unsaturated polyester resin, polyurethane resin, phenol resin, polyimide resin, alkyd resin, diacrylate resin and the like.

On the other hand, examples of the thermoplastic resin include a polyamide resin, a polysulfide resin, a polyacetal resin, a polyolefin resin, a polyester resin, and a polyurethane resin.

However, the thermoplastic resin has insufficient mechanical strength, and furthermore, the mechanical strength is further reduced by the processing heat. Therefore, the thermoplastic resin is not suitable for dry polishing in which the processing heat is hardly dissipated. Although not suitable for use, it is suitable for wet polishing in which the work and the polishing jig are sufficiently cooled by circulation of the polishing liquid.

As the resin for the polishing jig, a thermosetting resin is desirable from the viewpoint of heat resistance, mechanical strength, durability, polishing accuracy, etc., and particularly, heat resistance, mechanical strength, moisture resistance,
It is desirable to use an epoxy resin from the viewpoints of dimensional stability, adhesiveness, durability, polishing accuracy, handleability, productivity of a polishing jig, cost, and the like.

In the second product of the present invention, if necessary, a curing agent, a curing accelerator or various stabilizers, and additives such as a solvent are added to the resin.

The second product of the present invention is preferably formed of an epoxy resin composition in which a curing agent, a curing accelerator, and the like are blended with an epoxy resin. In particular, heat resistance, mechanical strength, moisture resistance, and dimensions are preferred. From the viewpoints of stability, adhesiveness, durability, polishing precision, handling, productivity and cost of the polishing jig, for example, (A) bisphenol A type epoxy resin,
It is desirable to use (B) cyanoguanidine, (C) imidazole or a derivative thereof and (D) a tertiary amine as essential components.

The bisphenol A epoxy resin (A) preferably used herein is not particularly limited as long as it is obtained by reacting bisphenol A with epichlorohydrin in the presence of an alkali.

Examples of the commercially available bisphenol A type epoxy resin (A) include, for example, Epoxy manufactured by Shell Chemical Company.
on825, Epon828, Epon1001, Ep
on1002, Epon1004, Epon1007,
Or Epon1009, Yuko Shell Epoxy Epicoat 815, Epicoat 827, Epicoat 828,
Epicoat 834, Epicoat 1055, Epicoat 8
27-X-75, Epicoat 1001-B-80, Epicoat 1001-X-70, Epicoat 1001-X-
75, epicoat 1001, epicoat 1002, epicoat 1004, epicoat 1007 or epicoat 1
009, AER334, AER330, A manufactured by Asahi Kasei Corporation
ER331, AER337, AER661, AER66
4, AER667 or AER669, Adeka resin EP-4200, Adeka resin EP-430 manufactured by Asahi Denka Co., Ltd.
0, ADEKARESIN EP-4100, ADEKARESIN EP-
4340, ADEKARESIN EP-5100, ADEKARESIN EP-5200, ADEKARESIN EP-5400, ADEKARESIN EP-5700 or ADEKARESIN EP-590
0, Sumitomo Chemical Co., Ltd. Sumiepoxy ELA-115, Sumiepoxy ELA-127, Sumiepoxy ELA-12
8, Sumiepoxy ELA-134, Sumiepoxy ESA
-011, Sumiepoxy ESA-012, Sumiepoxy ESA-014, Sumiepoxy ESA-017 or Sumiepoxy ESA-019, Epicron 855, Epicron 840, Epicron 860, Epicron 1050, Epicron 2050, Epicron 40 manufactured by Dai Nippon Ink Co., Ltd.
50, Epicron 7050 or Epicron 9050, DER330, DER33 manufactured by Dow Chemical (Japan)
1, DER661, DER662, DER664, DE
R667 or DER669, Pre-Epo PE-10, Pre-Epo PE-25, Pre-Epo PE manufactured by Dainippon Color Material Co., Ltd.
-70, Pre-Epo PE-80, Pre-Epo PE-10
0, pre-epoe PE-120 or pre-epoe PE-15
0, Epototo YD-115, Epototo YD-127, Epotote YD-128, Epototo Y
D-134, Epotote YD-011, Epotote YD
-012, Epotote YD-014, Epotote YD-
017 or Epototo YD-019, Araldite GY-250, Araldite GY- manufactured by Ciba-Geigy Japan
261, Araldite GY-30, Araldite 607
1, Araldite 6084, Araldite 6097 or Araldite 6099, EPOMIC R-130, EPOMIC R-139, EPOMIC R manufactured by Mitsui Chemicals Epoxy
-140, EPOMIC R-144, EPOMIC R-30
1, EPOMIC R-302, EPOMIC R-304, EPOMIC R-307 or EPOMIC R-309.

As the bisphenol A type epoxy resin (A), if desired, a plurality of types may be mixed and used, and heat resistance, mechanical strength, moisture resistance, dimensional stability, adhesiveness, and durability may be used. Mixing other epoxy resins, such as urethane-modified epoxy resin or nitrile rubber-modified epoxy resin, within a range that does not adversely affect the properties, polishing accuracy, handleability, productivity of the polishing jig, pot life, sheet life, etc. Is also good.

The cyanoguanidine (B) has the following structural formula

[0035]

Embedded image

Is a compound having

Commercially available products of (B) cyanoguanidine include, for example, CG-NA and C-NA, which are DICY CG series manufactured by AC Japan Limited.
G, CG-325, CG-1200, CG-1400,
DICIEANEX-200, DICIEANEX-325
And DICIANEX-1200.

The imidazole or its derivative (C) is not particularly limited as long as it is liquid or solid, and examples of commercially available products include Curesol OR manufactured by Shikoku Chemicals Co., Ltd. Series 2E4NZ, 1B2MZ, Curesol C manufactured by the company
2MZ: CN which is N series, 2E4MZ-CN, 2PHZ-CN which is Curazole HZ series made by the company
Other company made _{1M2EZ, 1B2EZ, C 11 Z,} 2
MA-OK and the like.

In addition, the tertiary amine (D) may be either liquid or solid, and is not particularly limited. Examples of commercially available tertiary amines include Ancamine series manufactured by Air Products. K-54,
K-1110, K-61B, Curing Agent
D (manufactured by Shell), 2-ethylhexanoate (D
MP-30).

When epoxy resins containing the above (A) to (D) as essential components are used, the amounts of these components are determined by the required pot life, heat resistance, mechanical strength, moisture resistance, dimensional stability, adhesion, From the viewpoints of durability, polishing resistance, handleability, productivity of polishing jig, pot life and sheet life,
(B) 3 to 25 parts by weight of cyanoguanidine based on 100 parts by weight of bisphenol A type epoxy resin, (C)
It is preferable to use 0.1 to 3 parts by weight of imidazole or a derivative thereof and 0.1 to 2 parts by weight of (D) a tertiary amine.
(B) 5 to 20 parts by weight of cyanoguanidine, (C) 0.2 to 2 parts by weight of imidazole or a derivative thereof, and (D) 0.15 to 1.5 parts by weight of tertiary amine, based on 0 parts by weight. Is more preferred.

The epoxy resin containing (A) to (D) as essential components includes, in addition to the components (A) to (D),
(E) Bisphenol A type elastic epoxy resin, (F) phenol novolak type epoxy resin and (G) aromatic polyamine are blended to further enhance pot life and heat resistance, and further enhance toughness and adhesion. Is also good.

In this case, the mixing ratio of (A) bisphenol A type epoxy resin is 10 to 50 parts by weight and (F)
The phenol novolak type epoxy resin is 50 to 90 parts by weight, and the total weight of the (A) bisphenol A type epoxy resin and (F) the phenol novolak type epoxy resin is 100 parts by weight. 3 to 25 parts by weight of cyanoguanidine, (C) 0.1 to 3 parts by weight of imidazole or a derivative thereof, (D) 0.1 to 2 parts by weight of a tertiary amine, (E) 1 to 20 parts by weight of a bisphenol A type elastic epoxy resin Parts, (G) the aromatic polyamine is preferably 0.5 to 20 parts by weight,
(B) 5 to 20 parts by weight of cyanoguanidine, based on 100 parts by weight of the total weight of (A) bisphenol A type epoxy resin and (F) phenol novolak type epoxy resin
(C) 0.2 to 2 parts by weight of imidazole or a derivative thereof, (D) 0.15 to 1.5 parts by weight of a tertiary amine, (E)
More preferably, the content is 3.5 to 15 parts by weight of a bisphenol A elastic epoxy resin and 5 to 15 parts by weight of (G) an aromatic polyamine.

The (E) bisphenol A type elastic epoxy resin is an epoxy resin having a bisphenol A type skeleton and a cured product having elasticity. Examples of commercially available products include, for example, Shin Nihon Rika Co., Ltd. Rica Resin BEO-60E, Adeka Resin EP400 from Asahi Denka
0, Epicoat 871 manufactured by Yuka Shell Epoxy, Epototo YD-171 manufactured by Toto Kasei, and the like.

The (F) phenol novolak type epoxy resin is a glycidyl etherified resin obtained by reacting a novolak resin with epichlorohydrin, and is represented by the following general formula.

[0045]

Embedded image

Examples of commercially available (F) phenol novolak type epoxy resins include Epicoat 157S95 manufactured by Yuka Shell Epoxy, Epicron N-800 manufactured by Dainippon Ink and DEN438 manufactured by Dow Chemical Co., Ltd. Shell Epicoat 152, Epicoat 154, Dow Chemical's DEN-431, DEN-438, DEN-
439, DEN-485, Araldite EPN-1138 and Araldite EPN-113 manufactured by Ciba Geigy
9. Epicron N-730 and Epicron N manufactured by DIC
-738 and Epicron N-740.

The aromatic polyamine (G) is not particularly limited, but specific examples thereof include diamido diphenylmethane, metaphenylenediamine, diaminodiphenyl sulfone, and toluenediamine.

In addition, (H) a silane coupling agent is further added to the components (A) to (G) to provide particularly high mechanical strength, moisture resistance, moisture resistance, adhesive strength, heat resistance and toughness. The properties may be further improved.

In this case, the mixing ratio of (A) bisphenol A type epoxy resin is 10 to 50 parts by weight and (F) phenol novolak type epoxy resin is 50 to 90 parts by weight. (B) cyanoguanidine 3 to 2 with respect to 100 parts by weight in total with (F) phenol novolak type epoxy resin
5 parts by weight, (C) imidazole or a derivative thereof 0.1
To 3 parts by weight, (D) 0.1 to 2 parts by weight of a tertiary amine,
(E) 1 to 20 parts by weight of a bisphenol A type elastic epoxy resin, (G) 0.5 to 20 parts by weight of an aromatic polyamine,
(H) The silane coupling agent is preferably used in an amount of 0.05 to 5 parts by weight. Particularly, based on 100 parts by weight of the total weight of (A) bisphenol A type epoxy resin and (F) phenol novolak type epoxy resin, (B) 5 to 20 parts by weight of cyanoguanidine, (C) 0.2 to 2 parts by weight of imidazole or a derivative thereof, (D) 0.15 to 5 parts by weight of tertiary amine
1.5 parts by weight, (E) 3.5 to 15 parts by weight of a bisphenol A type elastic epoxy resin, (G) aromatic polyamine 5 to
More preferably, the amount is 15 parts by weight and 0.1 to 3 parts by weight of the (H) silane coupling agent. If the blending ratio of the silane coupling agent is less than 0.05 part by weight, the effect is poor and there is no point in blending. On the other hand, if it exceeds 5 parts by weight, the effect is limited and uneconomical. It is not preferable because the overall balance may be lost and the characteristics may be deteriorated.

The silane coupling agent is not particularly limited as long as it is a silane coupling agent. For example, vinyl tris (β-methoxy-ethoxy) silane, vinyl triethoxy silane, vinyl trimethoxy silane, β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane N-β (Aminoethyl), γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, etc. Is mentioned.

Also, a combination of the above (A) bisphenol A type epoxy resin and an acid anhydride is preferable, but the compounding ratio is as follows. It is desirably in the range of ６０60 parts by weight, preferably in the range of 20-40 parts by weight.

In this case, phthalic anhydride (manufactured by Nippon Ciba Geigy Co., Hardner HT9017) may be used as the acid anhydride.
Trimellitic anhydride (manufactured by Nippon Shokubai Kagaku Co., Ltd.), cyclopentane / tetracarboxylic dianhydride (manufactured by Hitachi Chemical Co., Ltd.), endmethylenetetrahydrophthalic anhydride (manufactured by Hitachi Chemical Co., Ltd.) and methylhexahydrophthalic anhydride (new Japan) Rikashid HM-700, manufactured by Rikasha Co., Ltd.).

The epoxy resin composition used in the second product of the present invention may optionally contain an organic solvent. The organic solvent may be benzene in addition to a typical ketone organic solvent as an organic solvent. , Toluene, para-xylene and the like.

The ketone organic solvent is an organic solvent having a ketone group, such as acetone, methyl ethyl ketone, methyl propyl ketone, isopropyl methyl ketone, butyl methyl ketone, methyl isobutyl ketone, pinacolone, diethyl ketone (propion) and diisobutyl ketone. Aliphatic saturated ketones, unsaturated ketones such as methyl vinyl ketone, mesityl oxide or methyl heptenone,
Cyclobutanone, alicyclic ketones such as cyclopentanone or cyclohexanone, acetophenone, propiophenone, butyrophenone, valerophenone, aromatic ketones such as benzophenone, dibenzyl ketone or 2-acetonaphthone, and heterocyclic ketones such as acethienone or 2-acetofuron. And the like.

When the resin liquid is applied or impregnated to the reinforcing fiber layer, the ratio of the reinforcing fiber layer to the resin liquid (solid content) is such that the solid component in the resin liquid is 20 parts by weight based on 100 parts by weight of the reinforcing fiber layer. ~ 150 parts by weight, especially 30-12 parts by weight
When the solid content in the resin liquid is too small as less than 20 parts by weight, the resin is liable to be chipped or reduced, and as a result, it is necessary to increase the molding pressure. It is not preferable because distortion tends to occur in the molded product and warpage and twisting occur and it becomes impossible to use it as a polishing jig material. On the other hand, when the solid component in the resin liquid exceeds 150 parts by weight, the resin content of the molded product is large. This is not preferred because the wear resistance is reduced, the flow of the resin in the molding process is increased, and molding is difficult, and the thickness of the molded product tends to vary widely. Thus, a resin layer is formed on one side or both sides of the reinforcing fiber layer.

The second product of the present invention is characterized in that the polishing jig comprises a reinforcing fiber layer and a resin layer, and an ultrahigh molecular weight polyethylene layer is melted and bonded between the surface and the layer. .

In the second product of the present invention, the ultrahigh molecular weight polyethylene layer may be the same as that of the first product of the present invention, but is omitted here to avoid redundant description.

As described above, since the ultrahigh molecular weight polyethylene layer is formed on the surface of the polishing jig, the ultrahigh molecular weight polyethylene layer improves the slipperiness of the surface,
As a result, the amount of wear is remarkably reduced, and the surface smoothness is maintained for a long period of time, so that the occurrence of chipping can be prevented for a long period of time. The polishing accuracy is high, and the polishing efficiency is good.

Next, a method of manufacturing the polishing jig of the present invention will be described. In the first method for manufacturing a polishing jig according to the present invention (hereinafter referred to as the first method of the present invention), a reinforcing fiber layer is impregnated with a resin solution, and this is heated and dried to form a B-stage prepreg. Then, when laminating a plurality of prepregs, a film or a sheet made of ultra-high molecular weight polyethylene is laminated on the surface thereof, and then heated and pressed to be adhered and cured.

In the first method of the present invention, the detailed description of the reinforcing fiber layer and the fiber used therefor, the resin layer, the resin used therefor, and the ultrahigh molecular weight polyethylene are described in detail in the above-mentioned product of the present invention. Since the description overlaps with the description, the description is omitted here.

In the first method of the present invention, first, a resin constituting a resin layer is blended to prepare a prepreg.
Then, the reinforcing fiber layer is impregnated with the compound liquid (resin liquid), heated and dried to form a B-stage prepreg.

The method for impregnating the reinforcing fiber layer with the compound liquid (resin liquid) is not particularly limited. Specifically, for example, a solution or dispersion of the compound liquid (resin liquid) is reinforced. What is necessary is just to apply | coat to a fiber layer, immerse a reinforcing fiber layer in the solution or dispersion liquid of the said compound, and to pour the molten liquid of resin into a reinforcing fiber layer.

The method of applying the resin liquid to the reinforcing fiber layer is not particularly limited, and examples thereof include flow coating, head coating,
A method such as roller brush, knife coat, roll coat, spin coat, pipe doctor nozzle method (PDN method), kiss coat, applicate, or coating may be employed.

The method for impregnating the reinforcing fiber layer with the resin liquid includes a continuous treatment method in which the raw material of the reinforcing fiber layer is continuously supplied into the resin liquid and continuously pulled up, And a batch processing method in which the cut reinforcing fiber layer is dipped in a resin solution and pulled up.

In the first method of the present invention, a so-called B-stage prepreg can be obtained by impregnating the reinforcing fiber layer with the resin liquid and then drying it by heating so that the surface is not sticky. The method for producing the prepreg of the stage is not particularly limited.

The conditions for manufacturing a B-stage prepreg by impregnating the reinforcing fiber layer with a resin solution, heating and drying the pre-preg are different depending on the type and components of the resin. For example, a B-stage prepreg is prepared using an epoxy resin composition. When producing a prepreg, generally at a temperature of 100 to 150 ° C. for 15 seconds to
What is necessary is just to heat for about 30 seconds.

As another manufacturing method of the B-stage prepreg, for example, a reinforcing fiber layer is set in a mold having a predetermined contour, a resin liquid is poured into the reinforcing fiber layer, heated, dried, and then released. Producing a prepreg having a predetermined contour by so-called, a casting method, or a reinforcing fiber layer is set on a support having releasability such as a belt, and a resin liquid is applied thereto, for example, a flow coat, a head coat, B-stage prepreg by applying to a certain thickness by a method such as roller brush, knife coat, roll coat, spin coat, pipe doctor nozzle method (PDN method), kiss coat, spraying, applicate or coating, heating and drying And the like can be cited as an example.

When the reinforcing fiber layer is coated or impregnated with the resin liquid, the ratio of the reinforcing fiber layer to the resin liquid (solid content) is such that the solid component in the resin liquid is 20 parts by weight based on 100 parts by weight of the reinforcing fiber layer. ~ 150 parts by weight, especially 30-12 parts by weight
When the solid content in the resin liquid is too small as less than 20 parts by weight, the resin is liable to be chipped or reduced, and as a result, it is necessary to increase the molding pressure. It is not preferable because distortion tends to occur in the molded product and warpage and twisting occur and it becomes impossible to use it as a polishing jig material. On the other hand, when the solid component in the resin liquid exceeds 150 parts by weight, the resin content of the molded product is large. This is not preferred because the wear resistance is reduced, the flow of the resin in the molding process is increased, and molding is difficult, and the thickness of the molded product tends to vary widely.

In this case, in order to form a resin layer on one side of the reinforcing fiber layer, a resin liquid is applied to one side of the reinforcing fiber layer, and heated and dried under the conditions described above to produce a B-stage prepreg. You just have to do it.

In the first method of the present invention, when laminating a plurality of the above-mentioned prepregs, after laminating a film or sheet made of ultrahigh molecular weight polyethylene on the outer surface thereof, heat and pressure to adhere and cure. It is characterized by

When laminating the prepreg thus obtained, a method of laminating a film or sheet made of ultra-high molecular weight polyethylene on at least the surface layer thereof, and bonding and curing the same may be a conventional method. When the prepreg and the ultra-high molecular weight polyethylene sheet are stacked, adhered and cured by heating and pressing, they are formed into a predetermined contour shape, and by forming a required number of work holding holes, the product of the present invention, namely, polishing Tools are obtained.

The heating and curing conditions differ depending on the type of prepreg or ultrahigh molecular weight polyethylene film or sheet. Generally, a pressure of 10 to 50 kg / cm ² is applied, and a temperature of 140 to 300 ° C. and 10 ~ 9
0 minute heating, preferably applying a pressure of 15 to 30 kg / cm ² , and at a temperature of 150 to 250 ° C. for 30 to 60
You only have to heat for a minute.

The formation of the contour shape and the work holding hole is as follows.
A processing method suitable for the polishing jig may be adopted.For example, in the case of a polishing jig using a glass epoxy prepreg that cannot be punched, the contour shape and the work holding hole may be formed by laser processing or the like. is there.

In the present invention, the film or sheet made of ultrahigh molecular weight polyethylene has a viscosity average molecular weight of 1,000,000 to 9,000,000, preferably a viscosity average molecular weight of 30
A layer formed of an ultra-high molecular weight polyethylene resin having a viscosity average molecular weight of 10 to 5 million;
If it is less than 100,000, the required mechanical strength and abrasion resistance may not be improved. On the other hand, if it exceeds 9,000,000, the melt viscosity of the resin is so high that it is difficult to form a film.

As described above, since the ultrahigh molecular weight polyethylene layer is formed on the surface of the polishing jig, the surface slipperiness is improved by the ultrahigh molecular weight polyethylene layer,
As a result, the amount of wear is remarkably reduced, and the surface smoothness is maintained for a long period of time, so that the occurrence of chipping can be prevented for a long period of time. The polishing accuracy is high, and the polishing efficiency is good.

Here, as the method of measuring the viscosity average molecular weight, the above-mentioned method can be mentioned, but is omitted here to avoid redundant description.

In the first method of the present invention, the method for forming the ultrahigh molecular weight polyethylene resin into a film or a sheet is not particularly limited, but specific examples thereof include, for example, an inflation method (Japanese Patent Laid-Open No. 62-122736). Gazette), T-die method, skive method, etc.
A known method that can form a 00 μm film or sheet can be used.

The ultrahigh molecular weight polyethylene film or sheet has a thickness of 5 μm to 500 μm, preferably 10 μm to 300 μm, particularly preferably 15 μm to 300 μm.
When the thickness of the film or sheet is reduced to less than 5 μm, it is difficult to form a film or a sheet, and furthermore, it is difficult to obtain a uniform film, and there is a possibility that the adhesive strength varies. On the other hand, when the thickness exceeds 500 μm, the degree of freedom in designing the thickness of the polishing jig decreases, which is not preferable.
Therefore, from the viewpoint of easiness of forming a film or a sheet and freedom of thickness design as a polishing jig, the thickness of the film or sheet made of ultrahigh molecular weight polyethylene is preferably 10 μm to 300 μm, particularly preferably 10 μm to 300 μm. Preferably 15μ
It is more desirable that the thickness be from m to 150 μm.

In this case, the surface of the film or sheet is preferably roughened in order to enhance the adhesion to a metal or resin layer. As the surface treatment method of this film or sheet, specifically, for example, corona treatment,
The surface treatment is preferably performed by plasma treatment, sputter etching treatment, or the like.

As described above, since the ultrahigh molecular weight polyethylene layer is formed on the surface of the polishing jig, the surface slipperiness is improved by the ultrahigh molecular weight polyethylene layer,
As a result, the amount of wear is remarkably reduced, and the surface smoothness is maintained for a long period of time, so that the occurrence of chipping can be prevented for a long period of time. The polishing accuracy is high, and the polishing efficiency is good.

In the second method of manufacturing a polishing jig according to the present invention (hereinafter referred to as the second method of the present invention), a reinforcing fiber layer is impregnated with a resin solution, and this is heated and dried to form a B-stage. The prepreg is formed, and then, when laminating the plurality of prepregs, after laminating a film or sheet made of ultra-high molecular weight polyethylene on each layer and surface thereof,
It is characterized in that it is adhered and cured by heating and pressing.

That is, in the first method of the present invention, an ultrahigh molecular weight polyethylene film or sheet is laminated on the surface of the polishing jig, and then heated and pressed to adhere and cure.
In the second method of the present invention, a film or sheet made of ultra-high molecular weight polyethylene is laminated not only on the surface but also between the layers, and then heated and pressed to adhere and cure. , Which have characteristics.

In the second method of the present invention, as in the case of the first method of the present invention, when a prepreg is formed and a plurality of prepregs thus obtained are laminated, a film or sheet made of ultrahigh molecular weight polyethylene is used. The method of laminating and bonding and curing between the surface and each layer may be according to a conventional method,
For example, by stacking a predetermined number of prepregs and a film or sheet made of ultra-high molecular weight polyethylene, bonding by heating and pressing, curing, forming into a predetermined contour shape, and forming a required number of work holding holes. Thus, a product of the present invention, that is, a polishing jig is obtained.

The heating and curing conditions vary depending on the type of prepreg or ultrahigh molecular weight polyethylene film or sheet, but are generally 10 to 50 kg / cm ^2.
At a temperature of 140 to 300 ° C. and 10 to 9
The heating may be performed for 0 minute, preferably at a pressure of 15 to 30 kg / cm ² , and at a temperature of 150 to 250 ° C. for 30 to 60 minutes.

The formation of the contour shape and the work holding hole is as follows.
A processing method suitable for the polishing jig may be adopted.For example, in the case of a polishing jig using a glass epoxy prepreg that cannot be punched, the contour shape and the work holding hole may be formed by laser processing or the like. is there.

In the second method of the present invention, a film or sheet made of ultrahigh molecular weight polyethylene is laminated not only on the outer surface but also between the layers, and then heated and pressed to adhere and cure. Therefore, the reinforcing fiber layer, resin solution, prepreg, ultrahigh molecular weight polyethylene film or sheet used in the second method of the present invention, or a method for producing the same, etc., are the same as those of the present invention (the first product of the present invention and the second product of the present invention).
Including goods. ) And the first method of the present invention, so that they are omitted to avoid redundant description.

As described above, since the ultrahigh molecular weight polyethylene layer is formed on the surface of the polishing jig, the surface slipperiness is improved by the ultrahigh molecular weight polyethylene layer,
As a result, the amount of wear is remarkably reduced, and the surface smoothness is maintained for a long period of time, so that the occurrence of chipping can be prevented for a long period of time. The polishing accuracy is high, and the polishing efficiency is good.

Further, as in the second method of the present invention, a film or sheet made of ultrahigh molecular weight polyethylene is laminated not only on the surface of the polishing jig but also between individual layers of a plurality of prepregs, and then heated and heated. When pressed, adhered and cured,
This ultrahigh molecular weight polyethylene film or sheet is preferable because it absorbs internal stress and prevents distortion and warpage and twisting of the molded product, and prevents distortion, warping and twisting due to use.

Further, in a third method of manufacturing a polishing jig according to the present invention (hereinafter, referred to as a third method of the present invention), a plurality of prepregs are laminated, and the prepregs are heated and pressed to bond and cure. After obtaining the laminated molded body, when laminating the plurality of laminated molded bodies, after laminating a film or sheet made of ultra-high molecular weight polyethylene on the surface thereof, it is necessary to adhere and cure by heating and pressing. It is a feature.

That is, in the second method of the present invention, a film or sheet made of ultrahigh molecular weight polyethylene is laminated not only on the surface of the polishing jig but also between individual layers of a plurality of prepregs, and then heated and pressed. The third method of the present invention forms a prepreg in the same manner as in the first method of the present invention, and laminates a plurality of prepregs in advance, as in the case of the first method of the present invention. After heating and pressurizing, bonding and curing to obtain a laminated molded body, when laminating a plurality of laminated molded bodies, after laminating a film or sheet made of ultra high molecular weight polyethylene on the surface thereof, heating It is characterized in that it adheres and cures under pressure.

That is, in the third method of the present invention, a plurality of prepregs are laminated in advance, and the laminate is heated and pressed to be bonded and cured to obtain a laminated molded body. When laminating, after laminating a film or sheet made of ultra-high molecular weight polyethylene on the outer surface,
The method of heating, pressing and bonding and curing may be a conventional method, for example, stacking a predetermined number of laminated molded articles and a film or sheet made of ultra-high molecular weight polyethylene on the outer surface thereof, heating, pressing and bonding, The product of the present invention, that is, a polishing jig, is obtained by curing, forming into a predetermined contour shape, and forming a required number of work holding holes.

The heating and curing conditions vary depending on the type of the laminated molded product or the film or sheet made of ultra-high molecular weight polyethylene, but are generally from 10 to 50 kg / cm ^2.
At a temperature of 140 to 300 ° C. and 10 to 9
The heating may be performed for 0 minute, preferably at a pressure of 15 to 30 kg / cm ² , and at a temperature of 150 to 250 ° C. for 30 to 60 minutes.

The formation of the contour shape and the work holding hole is as follows.
A processing method suitable for the polishing jig may be adopted.For example, in the case of a polishing jig using a glass epoxy prepreg that cannot be punched, the contour shape and the work holding hole may be formed by laser processing or the like. is there.

Incidentally, the reinforcing fiber layer, resin solution, prepreg, ultrahigh molecular weight polyethylene film or sheet used in the third method of the present invention, or a method for producing the same, and the like are the same as those of the present invention (the first product of the present invention and the present invention). (Including the second product.)
Since it is the same as the case of the first method of the present invention, it is omitted to avoid redundant description.

As described above, since the ultra-high molecular weight polyethylene layer is formed on the surface of the polishing jig, the ultra-high molecular weight polyethylene layer improves the slipperiness of the surface.
As a result, the amount of wear is remarkably reduced, and the surface smoothness is maintained for a long period of time, so that the occurrence of chipping can be prevented for a long period of time. The polishing accuracy is high, and the polishing efficiency is good.

In addition, in the fourth manufacturing method of the polishing jig according to the present invention (hereinafter, referred to as the fourth method of the present invention).
After laminating a plurality of prepregs, heating, applying pressure, bonding and curing to obtain a laminated molded body, when laminating the plurality of laminated molded bodies, ultra-high molecular weight polyethylene After laminating a film or sheet made of
It is characterized in that it is adhered and cured by heating and pressing.

That is, the third method of the present invention relates to the first method of the present invention.
A prepreg is formed in the same manner as in the method, and a plurality of the prepregs are laminated in advance, and the prepreg is heated, pressed, adhered, and cured to obtain a laminated molded body. When laminating, after laminating a film or sheet made of ultra-high molecular weight polyethylene on the surface, heating, pressurizing, bonding, curing, is characterized in that,
In the fourth method of the present invention, after laminating a film or sheet made of ultrahigh molecular weight polyethylene not only on the surface of the polishing jig but also between individual layers of a plurality of laminated molded articles obtained in advance, heating and pressing are performed. It has the features of bonding and curing.

In the fourth method of the present invention, a laminated molded article is formed in the same manner as in the third method of the present invention, and when a plurality of laminated molded articles thus obtained are laminated, an ultrahigh molecular weight polyethylene The method of laminating and bonding and curing the film or sheet between its surface and each layer may be a conventional method.For example, a predetermined number of laminated molded articles and a film or sheet made of ultra-high molecular weight polyethylene may be stacked, heated and heated. The product of the present invention, that is, a polishing jig is obtained by pressing, bonding and curing, forming a predetermined contour shape, and forming a required number of work holding holes.

The heating and curing conditions differ depending on the type of the laminated molded article or the film or sheet made of ultra-high molecular weight polyethylene, and generally, a pressure of 10 to 50 kg / cm ² is applied, and at a temperature of 140 to 300 ° C. 10-90
The heating may be carried out for 30 minutes, preferably at a pressure of 15 to 30 kg / cm ² , and at a temperature of 150 to 250 ° C. for 30 to 60 minutes.

The formation of the contour shape and the work holding hole is as follows.
A processing method suitable for the polishing jig may be employed.For example, in the case of a polishing jig using a glass epoxy prepreg that cannot be punched, the contour shape and the work holding hole may be formed by laser processing or the like. is there.

Incidentally, the reinforcing fiber layer, resin solution, prepreg, ultrahigh molecular weight polyethylene film or sheet used in the fourth method of the present invention, or a method for producing the same, and the like are the same as those of the present invention (the first product of the present invention and the present invention). (Including the second product.)
Since it is the same as the case of the first method of the present invention, it is omitted to avoid redundant description.

As described above, since the ultrahigh molecular weight polyethylene layer is formed on the surface of the polishing jig, the surface slipperiness is improved by the ultrahigh molecular weight polyethylene layer.
As a result, the amount of wear is remarkably reduced, and the surface smoothness is maintained for a long period of time, so that the occurrence of chipping can be prevented for a long period of time. The polishing accuracy is high, and the polishing efficiency is good.

In the fourth method of the present invention, an ultrahigh molecular weight polyethylene film or sheet is laminated not only on the surface of the polishing jig but also between individual layers of a plurality of laminated molded articles, and then heated, When pressed and adhered and cured, this ultra-high molecular weight polyethylene film or sheet absorbs internal stress, preventing distortion and warpage and twisting of molded products, as well as distortion and warping due to use, etc. This is preferable because generation is prevented.

[0104]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a polishing jig according to an embodiment of the present invention and a method for manufacturing the polishing jig will be specifically described with reference to the drawings, but the present invention is not limited thereto.

EXAMPLE A polishing jig 1 shown in the schematic cross-sectional view of FIG. 1 was made of a glass woven cloth (manufactured by Asahi Shovel Co., Ltd., part number A) having an apparent thickness of 0.18 mm.
(S7628 / 450), a resin layer 3 made of an epoxy resin composition, and an ultrahigh molecular weight polyethylene layer (ultrahigh molecular weight polyethylene film) 4.

In this case, an ultra-high molecular weight polyethylene film 4 is laminated on the surface of the laminate and between the layers, and is melted and bonded to form an ultra-high molecular weight polyethylene layer 4.

The polishing jig 1 is manufactured by the method for manufacturing a polishing jig according to one embodiment of the present invention shown in the process diagram of FIG.

In this method, first, in a resin compounding step, 100 parts by weight of an epoxy resin (trade name: Epicoat 1001 manufactured by Yuka Shell Epoxy Co., Ltd.) is added to a dicyanamide (trade name, manufactured by Nippon Carbide Co., Ltd.) : DICY)
To 5 parts by weight and 0.1 part by weight of imidazole (manufactured by Shikoku Chemicals Co., Ltd., 2PHZ-CN) as a curing accelerator, 70 parts by weight of methyl ethyl ketone as a solvent were blended and uniformly mixed, and the solid content concentration was 60 parts by weight. % Of a solution of the epoxy resin composition.

Next, in a prepreg manufacturing process, the reinforcing fiber layer 2 was impregnated with the solution of the epoxy resin composition so as to have a solid content weight ratio of 1: 1.
For 10 minutes to form a B-stage glass epoxy prepreg.

Thereafter, in the laminating step, this glass
Four epoxy prepregs and an ultra-high molecular weight polyethylene film are stacked, and a pressure of 20 kg / cm ² and a temperature of 1
The laminate was heated and cured at 50 ° C. for 90 minutes to obtain a laminate.

The ultra-high-molecular-weight polyethylene film was previously coated with an ultra-high-molecular-weight polyethylene resin having an average molecular weight of 3,000,000 (HIZEX, Million 240S, manufactured by Mitsui Petrochemical Co., Ltd.) by inflation to a thickness of 25 μm.
After obtaining a film of m, a film obtained by subjecting the surface of the film to a corona treatment was used.

In the actual method of manufacturing a polishing jig,
Processing steps such as mechanical processing and laser processing, in this case, a contour and a work holding hole are formed in the laser processing step, but here, in order to perform a comparative test, the laminate is cut into an appropriate planar shape. Test pieces were prepared. The test piece thus obtained was used as an example.

Comparative Example A test piece was prepared in the same manner as in the above example except that the ultrahigh molecular weight polyethylene film was not used. The test piece thus obtained was used as a comparative example.

Using each of the test pieces of Examples and Comparative Examples, a method of testing the abrasion of plastic with a wear wheel (JIS-K-72)
04). As a result, a wear characteristic diagram shown in FIG. 3 was obtained.

As a result of 100,000 tests, the thickness of the conventional product (comparative example) was reduced by as much as 40 μm.
In the example, the thickness was reduced by only about 10 μm, and from the abrasion characteristic diagram shown in FIG. 3, it was recognized that the example had remarkably excellent wear resistance.

Further, a polishing jig for a silicon wafer was prepared by laser processing by using those of the example and the comparative example, and was used. As a result, the abrasion amount of the example was lower than that of the comparative example. It is extremely low, and the surface smoothness is maintained for a long period of time, so that the occurrence of chipping can be prevented for a long period of time. In addition, the service life is extremely long, the polishing accuracy of the polished product is high, and the polishing efficiency is high. Was found to be good.

It is understood that the reason for this is that the surface ultra-high molecular weight polyethylene layer generates or improves the surface slipperiness, that is, self-lubrication, and as a result, the abrasion resistance is remarkably improved.

In this case, in the case of the embodiment, compared to the comparative example, there is no distortion or warpage or twisting of the molded product, and the occurrence of distortion, warping or twisting due to use is prevented. It was recognized that.

The reason for this is that, in the embodiment, an ultra-high molecular weight polyethylene layer is formed not only on the surface of the polishing jig but also between individual layers of a plurality of prepregs. It is understood that stress was absorbed.

[0120]

As described above, the first polishing jig according to the present invention has the above-mentioned configuration, and the ultra-high molecular weight polyethylene layer is formed on the surface of the polishing jig. , The ultra-high molecular weight polyethylene layer improves the slipperiness of the surface, as a result, the wear amount is significantly reduced,
Since the surface smoothness is maintained for a long period of time, the occurrence of chipping can be prevented for a long period of time, and the service life becomes extremely long, and the polishing accuracy of the polished product is high, and the polishing efficiency is improved. It has the following effects.

In the second polishing jig according to the present invention,
This polishing jig is composed of a reinforcing fiber layer and a resin layer, and an ultra-high molecular weight polyethylene layer is melted and bonded between the surface and the interlayer, so that the surface ultra-high molecular weight polyethylene layer improves the slipperiness of the surface. As a result, the amount of wear is significantly reduced, and the surface smoothness is maintained for a long period of time, so that the occurrence of chipping can be prevented for a long period of time. The effect is that the polishing accuracy of the product is high and the polishing efficiency is good.

In the second polishing jig, if an ultrahigh molecular weight polyethylene layer is formed not only on the surface of the polishing jig but also between individual layers of a plurality of prepregs, the ultrahigh molecular weight The polyethylene layer absorbs internal stress, and has the effect of preventing the molded product from being distorted, warped, and twisted, and from being used, from being distorted, warped, and twisted.

In the first method for manufacturing a polishing jig according to the present invention, the reinforcing fiber layer is impregnated with a resin solution, and is dried by heating to form a B-stage prepreg. When laminating, a film or sheet made of ultra-high molecular weight polyethylene is laminated on the surface and then adhered and cured by heating and pressing. Thus, the ultra-high molecular weight polyethylene layer is formed on the surface of the polishing jig. Formed on the surface of the polishing jig, thereby improving the slipperiness. As a result, the wear amount is significantly reduced, and the surface smoothness is maintained for a long period of time. As a result, the occurrence of chipping is prevented for a long period of time. It is possible to obtain a polishing jig according to the present invention in which the service life is extremely long, the polishing accuracy of the polished product is high, and the polishing efficiency is good.

In the second method of manufacturing a polishing jig according to the present invention, the reinforcing fiber layer is impregnated with a resin solution, and is heated and dried to form a B-stage prepreg. When laminating a prepreg, an ultrahigh molecular weight polyethylene film or sheet is laminated on each layer and on the surface thereof, and then heated and pressed to adhere and cure.

As described above, since the ultrahigh molecular weight polyethylene layer is formed on the surface of the polishing jig,
This ultra-high molecular weight polyethylene layer improves the slipperiness of the surface, and as a result, the wear amount is remarkably reduced and the surface smoothness is maintained for a long time, so that the occurrence of chipping can be prevented for a long time. Yes,
Further, the polishing jig according to the present invention, which has a very long service life, a high polishing accuracy of the polished product, and a good polishing efficiency, can be obtained.

Further, as in the second method of the present invention, a film or sheet made of ultrahigh molecular weight polyethylene is laminated not only on the surface of the polishing jig but also between individual layers of a plurality of prepregs, and then heated and heated. When pressed, adhered and cured,
This ultra-high-molecular-weight polyethylene film or sheet absorbs internal stress, prevents distortion and warpage of the molded product, and prevents the occurrence of twisting. A jig can be obtained.

Further, in the third method for manufacturing a polishing jig according to the present invention, a plurality of prepregs are laminated, and the prepregs are heated, pressed, adhered and cured to obtain a laminated molded article.
When laminating a plurality of laminated molded products, a film or sheet made of ultra-high molecular weight polyethylene is laminated on the surface, and then heated and pressed to adhere and cure.

As described above, since the ultrahigh molecular weight polyethylene layer is formed on the surface of the polishing jig, the surface slipperiness is improved by the ultrahigh molecular weight polyethylene layer.
As a result, the amount of wear is remarkably reduced, and the surface smoothness is maintained for a long period of time, so that the occurrence of chipping can be prevented for a long period of time. A polishing jig according to the present invention having high polishing accuracy and good polishing efficiency can be obtained.

In addition, in the fourth method of manufacturing a polishing jig according to the present invention, a plurality of prepregs are laminated, and the prepregs are heated, pressed, adhered and cured to obtain a laminated molded article. When laminating a plurality of laminated molded articles, an ultra-high molecular weight polyethylene film or sheet is laminated on each layer and on the surface thereof, and then heated and pressed to adhere and cure.

As described above, since the ultrahigh molecular weight polyethylene layer is formed on the surface of the polishing jig, the surface slipperiness is improved by the ultrahigh molecular weight polyethylene layer.
As a result, the amount of wear is remarkably reduced, and the surface smoothness is maintained for a long period of time, so that the occurrence of chipping can be prevented for a long period of time. A polishing jig according to the present invention having high polishing accuracy and good polishing efficiency can be obtained.

In the fourth method of the present invention, an ultra-high molecular weight polyethylene film or sheet is laminated not only on the surface of the polishing jig but also between individual layers of a plurality of laminated molded articles, and then heated, When pressed and adhered and cured, this ultra-high molecular weight polyethylene film or sheet absorbs internal stress, preventing distortion and warpage and twisting of molded products, as well as distortion and warping due to use, etc. It is possible to obtain the polishing jig according to the present invention, which does not cause any generation.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a polishing jig according to one embodiment of the present invention.

FIG. 2 is a process diagram of a method for manufacturing a polishing jig according to one embodiment of the present invention.

FIG. 3 is a characteristic diagram showing characteristics of a wear test of a polishing jig.

FIG. 4 is a schematic sectional view of a conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Polishing jig 2 Reinforcement fiber layer 3 Resin layer 4 Ultra-high molecular weight polyethylene layer (Film or sheet made of ultra-high molecular weight polyethylene)

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Akira Tateishi 2-7-1, Ninomiya, Fukui City Shinko Chemical Industry Co., Ltd. No. 2 Mitsui Petrochemical Industry Co., Ltd.

Claims (8)

[Claims] 1. A polishing jig used for polishing a thin plate-shaped work such as a silicon wafer or a liquid crystal glass, wherein an ultra-high molecular weight polyethylene layer is formed on a surface of the polishing jig. Utensils. 2. A polishing jig used for polishing a thin work such as a silicon wafer or a glass for liquid crystal, the polishing jig comprises a reinforcing fiber layer and a resin layer,
A polishing jig characterized in that an ultra-high molecular weight polyethylene layer is melted and bonded between the surface and the interlayer. 3. The ultrahigh molecular weight polyethylene layer has a thickness of 5 μm.
The polishing jig according to claim 1, wherein the polishing jig has a diameter of m to 500 μm. 4. A method for impregnating a resin liquid into a reinforcing fiber layer, heating and drying the resin liquid to form a B-stage prepreg, and then, when laminating a plurality of prepregs, a surface made of ultra-high molecular weight polyethylene A method for manufacturing a polishing jig, comprising laminating a film or sheet, and then bonding and curing by heating and pressing. 5. A method for impregnating a reinforcing fiber layer with a resin solution, heating and drying it to form a B-stage prepreg, and then, when laminating a plurality of prepregs, an ultra-high molecular weight A method for manufacturing a polishing jig, comprising laminating a polyethylene film or sheet, and then bonding and curing by heating and pressing. 6. After laminating a plurality of prepregs, bonding and curing them by heating, pressurizing, and obtaining a laminated molded body, when laminating the plurality of laminated molded bodies, an ultra-high surface is formed on the surface thereof. A method for manufacturing a polishing jig, comprising laminating a film or sheet made of a polyethylene having a molecular weight, bonding and curing by heating and pressing. 7. After laminating a plurality of prepregs, heating and pressurizing them to adhere and cure to obtain a laminated molded body, when laminating the plurality of laminated molded bodies, the respective layers and surfaces thereof are laminated. A method for manufacturing a polishing jig, comprising laminating a film or sheet made of ultra-high molecular weight polyethylene, and then bonding and curing by heating and pressing. 8. The ultrahigh molecular weight polyethylene film or sheet has a thickness of 5 μm to 500 μm.
8. The method for manufacturing a polishing jig according to any one of items 7 to 7.