WO2015170556A1

WO2015170556A1 - Polishing carrier and method for manufacturing same

Info

Publication number: WO2015170556A1
Application number: PCT/JP2015/061513
Authority: WO
Inventors: 竜次妹尾; 準白髪; 隆行小林; 水野　裕之
Original assignee: 冨士ベークライト株式会社
Priority date: 2014-05-08
Filing date: 2015-04-14
Publication date: 2015-11-12
Also published as: JPWO2015170556A1; JP5834331B1

Abstract

A polishing carrier that comprises a laminate comprising base material layers and resin layers, wherein: the base material layers are formed of an organic fiber assembly impregnated with a resin; the resin layers contain not the aforesaid organic fibers but cyclic olefin polymer (A); and, in the laminate, the resin layers are disposed between a plurality of base material layers and also formed on both surfaces of the laminate. This polishing carrier has high strength and excellent durability and, therefore, can prevent the adhesion of foreign matters to a plate to be polished and occurrence of scratches.

Description

Polishing carrier and manufacturing method thereof

The present invention relates to an abrasive carrier comprising a laminate having a base material layer and a resin layer. The present invention also relates to a method for manufacturing the abrasive carrier. Furthermore, this invention relates to the grinding | polishing method using the said grinding | polishing carrier.

In the manufacturing process of an aluminum substrate for a semiconductor wafer or hard disk, there is a process of polishing the surface of these plate-like bodies. In this polishing step, a polishing carrier is used to hold the plate-like body. Generally, the polishing carrier has a plurality of through holes, and the plate-like body is held by the through holes. Then, the plate-like body is polished by driving the polishing carrier.

At this time, if the strength and durability of the polishing carrier are insufficient, the polishing carrier may be damaged during the polishing or foreign matter may fall off from the polishing carrier. As a result, foreign matter adheres to the surface of the plate-like body, or scratches (polishing scratches) occur on the plate-like body, so that a product with excellent quality cannot be obtained. For this reason, various polishing carriers with improved strength and durability have been proposed.

Patent Document 1 describes a polishing carrier including a holding material body and a surface layer coated on the surface of the holding material body. The holding material body includes a holding part having a holding hole for holding the plate-like body, a core part to which the holding part is attached, and a gear part attached to the outer periphery of the core part.

In Patent Document 1, it is described that the core part can be formed by laminating a prepreg impregnated with an epoxy resin on a glass fiber substrate and dried. The holding part and gear part impregnate an organic fiber base material such as aramid fiber base material, polyester fiber base material, polyphenylene sulfide fiber base material, polyvinyl alcohol fiber base material with epoxy resin, phenol resin, diallyl phthalate resin, etc. It is described that the prepreg can be laminated and molded by heating and pressing. Thereby, it is supposed that it can suppress generation | occurrence | production of impurities, such as damage to a plate-shaped body and glass powder, ensuring sufficient intensity | strength of a grinding | polishing carrier.

Patent Document 2 describes a manufacturing method of a polishing carrier. In this manufacturing method, a laminated plate obtained by heat-press molding a plurality of sheets of a thermosetting resin-impregnated sheet-like fiber substrate (prepreg) and a thermosetting resin-unimpregnated sheet-like fiber substrate is processed into a polishing carrier. It is a method to do. Patent Document 2 describes that the sheet-like fiber base material is preferably composed of organic fibers. More preferably, it is also described that the sheet-like fiber base material is an aramid fiber nonwoven fabric. It also describes the use of an epoxy resin as the thermosetting resin. According to this production method, the molten thermosetting resin in the prepreg penetrates into the resin-impregnated sheet-like fiber base material at the time of heat and pressure molding, and a laminate having a low resin content as a whole is easily produced. be able to. Since the resin content can be reduced, it is said that the reinforcing effect of the sheet-like fiber base material can be sufficiently exerted to obtain a highly rigid abrasive carrier.

Patent Document 3 includes a base layer in which a base material made of organic fibers is impregnated with a resin, and a surface film layer laminated on the surface of the base layer, and the surface film layer F has a tensile elastic modulus of 4000 N / mm ² or more. An object-holding material comprising an organic resin film is described. In that example, a polyester nonwoven fabric was impregnated with an epoxy resin varnish, and then dried to obtain a prepreg for constituting a base layer. Seven prepregs were laminated, and polyethylene naphthalate films were laminated on both front and back sides. Thereafter, an example is described in which a laminate is obtained by sandwiching and pressing the laminate between mirror plates.

In Patent Document 4, a polishing jig used when polishing a thin plate-like workpiece such as a silicon wafer or liquid crystal glass, the polishing jig is composed of a reinforcing fiber layer and a resin layer. Describes a polishing jig in which an ultrahigh molecular weight polyethylene layer is melted and bonded. The example describes an example in which a reinforcing fiber layer made of a glass woven fabric, an epoxy resin layer, and an ultrahigh molecular weight polyethylene layer are laminated.

However, in recent years, the quality required for a product after polishing has been increased, and even when a very small amount of fibers or foreign matter has fallen off from the polishing carrier during polishing, the plate-like body may be scratched. . Further, even if a very small amount of fibers or foreign matter is adhered to the plate-like body, the quality of the product is deteriorated. For this reason, an abrasive carrier having better strength and durability is desired, but the abrasive carriers described in Patent Documents 1 to 4 cannot satisfy the requirements.

JP 2003-225857 A JP 2003-260659 A JP 2002-59362 A Japanese Patent Application Laid-Open No. 11-58224

The present invention has been made in order to solve the above-described problems, and has excellent strength and durability capable of suppressing foreign matter from adhering to the polished plate-like body and generation of scratches. The object is to provide an abrasive carrier.

The subject is a polishing carrier comprising a laminate having a base material layer and a resin layer, wherein the base material layer comprises an organic fiber assembly impregnated with a resin, and the resin layer is a cyclic olefin polymer. Solved by providing a polishing carrier comprising (A), not containing the organic fibers, wherein the laminate has a resin layer between a plurality of substrate layers and also has a resin layer on both surfaces Is done. At this time, it is preferable that the said resin layer consists of a resin composition containing a cyclic olefin polymer (A) and a soft copolymer (B).

The resin layer comprises at least two monomers selected from the group consisting of 100 parts by mass of a cyclic olefin polymer (A) having a glass transition temperature of 60 to 200 ° C., an olefin, a diene, and an aromatic vinyl hydrocarbon. 1 to 50 parts by weight of a soft copolymer (B) having a glass transition temperature of 0 ° C. or lower, 0.001 to 1 part by weight of a radical initiator (C), and a radical polymerizable functional group It is preferably made of a resin composition obtained by melt-kneading 0 to 1 part by mass of a polyfunctional compound (D) having two or more thereof.

The cyclic olefin polymer (A) is preferably an acid-modified cyclic olefin polymer.

The organic fiber assembly is preferably at least one fiber selected from the group consisting of wholly aromatic polyester fibers, aramid fibers, polyphenylene sulfide fibers, and polyparaphenylene benzobisoxazole fibers. At this time, the organic fiber aggregate is preferably a nonwoven fabric. It is also preferable that the nonwoven fabric is a long fiber nonwoven fabric.

The thickness of the base layer is 10 to 1000 μm, the thickness of the resin layers on both surfaces of the laminate is 10 to 1000 μm, and the thickness of the resin layer between the base layers is 20 to 1000 μm. Preferably there is. It is also preferable that the polishing carrier has a thickness of 100 to 5000 μm. Moreover, it is also preferable that the thickness of the resin layer between the said base material layers is 2 times or more of the thickness of the resin layer of the both surfaces of the said laminated board.

The subject is a method for manufacturing the abrasive carrier, wherein the resin sheet is the outermost layer of a plurality of fiber sheets made of the organic fiber aggregate and a plurality of resin sheets containing the cyclic olefin polymer (A). To obtain a laminated body, and then heat and press the laminated body to melt the resin sheet, impregnate the molten resin into the organic fiber assembly, and then cool to obtain a laminated board, Subsequently, the problem can be solved by providing a manufacturing method of a polishing carrier, wherein a through hole for holding a plate to be polished is formed in the laminated plate.

A polishing method in which the plate-like body is held by the polishing carrier and the plate-like body is polished is a preferred embodiment of the present invention.

Since the polishing carrier of the present invention has excellent strength and durability, it is possible to suppress foreign matter from adhering to the plate to be polished and the occurrence of scratches.

1 is a plan view of a polishing carrier 1 in Example 1. FIG. 1 is a cross-sectional image of a polishing carrier 1 in Example 1. 3 is a cross-sectional image of a polishing carrier in Example 2. 3 is a cross-sectional image of a resin carrier in Comparative Example 1. 6 is a cross-sectional image of a resin carrier in Comparative Example 2. 10 is a cross-sectional image of a resin carrier in Comparative Example 3.

The present invention is an abrasive carrier comprising a laminate having a base material layer and a resin layer, wherein the base material layer comprises an organic fiber assembly impregnated with a resin, and the resin layer comprises a cyclic olefin polymer. It is a polishing carrier that contains (A) and does not contain the organic fiber, and the laminated plate has a resin layer between a plurality of base material layers and also has a resin layer on both surfaces. A polishing carrier that satisfies the above configuration has excellent strength and is not easily damaged during the polishing operation. In addition, since it has excellent durability, it is possible to prevent foreign matter from falling off and to prevent the occurrence of whiskers. When the plate-like body is polished using the polishing carrier of the present invention, no foreign matter adheres to the plate-like body and scratches are not generated.

In the present invention, it is important that the resin layer contains the cyclic olefin polymer (A). The cyclic olefin polymer (A) is a polymer excellent in heat resistance, heat aging resistance, chemical resistance, weather resistance, solvent resistance, dielectric properties, rigidity, and the like, and the cyclic olefin polymer (A) is used. Thus, an abrasive carrier having excellent strength and durability can be obtained. Since the cyclic olefin polymer (A) is amorphous, the dimensional accuracy of the obtained abrasive carrier is good. Moreover, since the cyclic olefin polymer (A) is a thermoplastic resin, it can be melted by heating, and the productivity of the abrasive carrier is improved.

It is also important that the resin layer does not contain the organic fiber. If the resin layer contains organic fibers, whiskers are generated in the resin layer, or the organic fibers are dropped from the resin layer, and foreign matter adheres to the plate-like body or scratches are generated. At this time, a trace amount of organic fibers may be contained in the resin layer as long as the effects of the present invention are not impaired. However, it is preferable that the resin layer does not contain any organic fiber from the viewpoint of completely suppressing generation of whiskers in the resin layer and dropping of the organic fiber from the resin layer.

The cyclic olefin polymer (A) may be obtained by polymerizing only an olefin monomer having an aliphatic cyclic skeleton, or may be copolymerized with an olefin monomer having an aliphatic cyclic skeleton. Copolymers with various monomers may be used. The copolymerization amount of other monomers is usually less than 50% by mass, and preferably less than 30% by mass. The cyclic olefin polymer (A) may be a resin composition containing a cyclic olefin polymer as a main component and other components. The main component is usually a component having a content of 50% by mass or more, and preferably a component having a content of 80% by mass or more.

The cyclic olefin polymer (A) is a non-crystalline and transparent polymer having a saturated hydrocarbon ring structure in the main chain or side chain of the polymer, and specifically, JP-A 63-264646. A ring-opening polymer of a monomer having a norbornene ring and a hydrogenated product thereof disclosed in JP-A 64-1705, JP-A 1-168724, JP-A 1-168725, etc. Addition polymers of monomers having a norbornene ring and α-olefins disclosed in JP-A-168708 and the like, cyclic olefins disclosed in JP-A-6-136057, JP-A-7-258362, etc. Resin composition comprising cyclic diene addition polymer and hydrogenated product thereof, and cyclic olefin polymer and soft copolymer disclosed in WO 2006/025294 And the like. Such resin compositions are, for example, trade names “e-mateX” from Fuji Bakelite Co., Ltd., trade names “Apel” and “Topas” from Mitsui Chemicals, Inc. and trade names from Nippon Zeon Co., Ltd. They are sold under the names “Zeonex” and “Zeonoa”, and it is possible to easily obtain commercial products. These commercial products often contain additives for improving durability and moldability, so use the resin before adding additives from the viewpoint of preventing foreign matter from falling off during polishing. In some cases, it may be preferable to form them. In some cases, it is preferable to use a resin in which the catalyst residue and residual volatile matter are particularly reduced.

The resin layer is preferably made of a resin composition containing a cyclic olefin polymer (A) and a soft copolymer (B). The abrasive carrier having such a resin layer can further improve the impact resistance and wear resistance of the abrasive carrier. In particular, the resin layer has at least two or more types selected from the group consisting of 100 parts by mass of a cyclic olefin polymer (A) having a glass transition temperature of 60 to 200 ° C., an olefin, a diene, and an aromatic vinyl hydrocarbon. 1 to 50 parts by mass of a soft copolymer (B) having a glass transition temperature of 0 ° C. or less, 0.001 to 1 part by mass of a radical initiator (C), and a radical polymerizable functional group More preferably, it is made of a resin composition obtained by melt-kneading 0 to 1 part by mass of a polyfunctional compound (D) having 2 or more in the molecule.

Hereinafter, the cyclic olefin polymer (A), the soft copolymer (B), the radical initiator (C) and the polyfunctional compound (D) having two or more radical polymerizable functional groups in the molecule will be described.

First, the cyclic olefin polymer (A) will be described. The cyclic olefin polymer (A) used in the present invention preferably has a glass transition temperature of 60 to 200 ° C. From the viewpoint of further improving the heat resistance of the polishing carrier, it is preferably 80 ° C. or higher, and more preferably 100 ° C. or higher. Moreover, since there exists a possibility of decomposition | disassembly when a shaping | molding temperature becomes high too much, it is preferable that a glass transition temperature is 200 degrees C or less. The glass transition temperature in the present invention is a glass transition start temperature measured at a heating rate of 10 ° C./min using a differential scanning calorimeter (DSC).

It is preferable that the MFR (melt flow rate: measured at 230 ° C. under a load of 2.16 kg) of the cyclic olefin polymer (A) is 0.1 to 500 g / 10 minutes. When MFR is less than 0.1 g / 10 min, the melt viscosity is too high, and the melt moldability of the resulting resin composition may be deteriorated. MFR is more preferably 0.5 g / 10 min or more, and even more preferably 1 g / 10 min or more. On the other hand, when the MFR exceeds 500 g / 10 min, the mechanical strength of the resulting resin composition may be reduced. MFR is more preferably 200 g / 10 min or less, and even more preferably 100 g / 10 min or less.

The cyclic olefin polymer (A) is obtained by polymerizing an olefin monomer having an aliphatic cyclic skeleton, and any polymer having an aliphatic cyclic skeleton in the obtained polymer may be used. The cyclic olefin polymer (A) is preferably a polymer obtained by polymerizing a cyclic olefin represented by the following formula [I] or [II].

(In the above formula [I], n is 0 or 1, m is 0 or a positive integer, q is 0 or 1, and R ¹ to R ¹⁸ and R ^a and R ^b are each independently A hydrogen atom, a halogen atom or a hydrocarbon group, R ¹⁵ to R ¹⁸ may be bonded to each other to form a monocyclic or polycyclic ring, and the monocyclic or polycyclic ring has a double bond And R ¹⁵ and R ¹⁶ , or R ¹⁷ and R ¹⁸ may form an alkylidene group.)

(In the formula [II], p and q are 0 or an integer of 1 or more, m and n are 0, 1 or 2, and R ¹ to R ¹⁹ are each independently a hydrogen atom, a halogen atom or an aliphatic carbonization. A hydrogen atom, an alicyclic hydrocarbon group, an aromatic hydrocarbon group or an alkoxy group, and a carbon atom to which R ⁹ (or R ¹⁰ ) is bonded, and a carbon atom to which R ¹³ or R ¹¹ is bonded May be bonded directly or via an alkylene group having 1 to 3 carbon atoms, and when n = m = 0, R ¹⁵ and R ¹² or R ¹⁵ and R ¹⁹ are bonded to each other to form a single ring or (A polycyclic aromatic ring may be formed.)

As the polymer obtained by polymerizing the cyclic olefin represented by the above formula [I] or [II], the following (a1), (a2), (a3) and (a4) are exemplified as preferable examples. .
(A1): Random copolymer of ethylene and a cyclic olefin represented by the above formula [I] or [II] (ethylene-cyclic olefin random copolymer)
(A2): Ring-opening polymer or ring-opening copolymer of cyclic olefin represented by the above formula [I] or [II] (a3): hydride of (a2) (a4): (a1), (a2 ) Or (a3) graft modified product

Among these, an ethylene-cyclic olefin random copolymer (a1), that is, a random copolymer of ethylene and a cyclic olefin represented by the above formula [I] or [II] is preferably used. Such an ethylene-cycloolefin random copolymer (a1) is preferably used because it provides a resin composition having excellent abrasion resistance and a small amount of volatile components released.

At this time, the cyclic olefin represented by the above formula [I] or [II] used as a raw material for the ethylene-cyclic olefin random copolymer (a1) is preferable from the viewpoint of heat resistance and availability. as, tetracyclo [4.4.0.1 ^2,5 .1 ^7,10] -3- dodecene and derivatives hydrocarbon group substituted thereto is illustrated, tetracyclo [4.4.0.1 ^2,5 .1 ⁷ as particularly suitable ^{, 10} ] -3-dodecene.

The ethylene content in the ethylene-cyclic olefin random copolymer (a1) is preferably 40 to 85 mol% from the viewpoints of heat resistance and rigidity. The ethylene content is more preferably 50 mol% or more. Further, the ethylene content is more preferably 75 mol% or less. On the other hand, the cyclic olefin content is preferably 15 to 60 mol%. The content of the cyclic olefin is more preferably 25 mol% or more. Moreover, the content rate of a cyclic olefin is 50 mol% or less more suitably.

Next, the soft copolymer (B) will be described. The glass transition temperature of the soft copolymer (B) is preferably 0 ° C. or lower. The glass transition temperature is preferably −10 ° C. or lower, more preferably −20 ° C. or lower. Usually, the glass transition temperature is −100 ° C. or higher. The crystallinity measured by X-ray diffraction method is preferably 0-30%, more preferably 0-25%.

The MFR (melt flow rate: measured at 230 ° C. under a load of 2.16 kg based on ASTM® D1238) of the soft copolymer (B) is preferably 0.01 to 200 g / 10 minutes. If the MFR is less than 0.01 g / 10 min, the melt viscosity is too high, and the melt moldability of the resulting resin composition may be deteriorated. The MFR is more preferably 0.05 g / 10 min or more, and even more preferably 0.1 g / 10 min or more. On the other hand, when the MFR exceeds 200 g / 10 min, the mechanical strength of the resulting abrasive carrier may be reduced. MFR is more preferably 150 g / 10 min or less, and even more preferably 100 g / 10 min or less. In addition, it is preferable to use an intrinsic viscosity [η] measured in decalin at 135 ° C. of 0.01 to 10 dl / g, preferably 0.08 to 7 dl / g.

It is preferable that the soft copolymer (B) is obtained by polymerizing at least two kinds of monomers selected from the group consisting of olefins, dienes and aromatic vinyl hydrocarbons. At this time, preferred examples of the soft copolymer (B) include the following (b1), (b2), (b3), and (b4).
(B1): An amorphous or low crystalline soft copolymer (b2) obtained by polymerizing at least two monomers selected from the group consisting of ethylene and an α-olefin having 3 to 20 carbon atoms ): A soft copolymer obtained by polymerizing ethylene, an α-olefin having 3 to 20 carbon atoms, and a cyclic olefin (b3): a non-conjugated diene, ethylene and an α-olefin having 3 to 20 carbon atoms A soft copolymer (b4) obtained by polymerizing at least two monomers selected from the group consisting of: a random or block copolymer of an aromatic vinyl hydrocarbon and a conjugated diene, or a hydride thereof. A soft copolymer

Next, the radical initiator (C) will be described. The radical initiator (C) is not particularly limited as long as it can be thermally decomposed by heating during melt kneading to generate radicals. A peroxide, an azo compound, a redox initiator, etc. are mentioned. However, those containing metal are not preferable because metal residues are mixed in the polishing carrier. Moreover, the thing containing a nitrogen element like an azo compound has a possibility that a nitrogen-containing compound may volatilize from a grinding | polishing carrier, and may be unpreferable. Therefore, an organic peroxide is preferably employed. The radical initiator (C) is preferably decomposed at an appropriate rate during melt-kneading, and the one-minute half-life temperature thereof is preferably 30 to 250 ° C. The 1-minute half-life temperature is more preferably 50 ° C. or more and 200 ° C. or less.

Organic peroxides used as radical initiator (C) include ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide; 1,1-bis (t-butylperoxy) cyclohexane, 2,2-bis Peroxyketals such as (t-butylperoxy) octane; t-butylhydroperoxide, cumene hydroperoxide, 2,5-dimethylhexane-2,5-dihydroxyperoxide, 1,1,3,3- Hydroperoxides such as tetramethylbutyl hydroperoxide; di-t-butyl peroxide, 2,5-dimethyl-2,5-bis (t-butylperoxy) hexane, 2,5-dimethyl-2,5 -Dialkyl peroxides such as bis (t-butylperoxy) hexyne-3; diacyl such as lauroyl peroxide and benzoyl peroxide Okishido acids; t-butyl peroxy acetate, t- butyl peroxybenzoate, 2,5-dimethyl-2,5-bis (benzoyl peroxy) may be mentioned hexane peroxy esters such like.

Next, the polyfunctional compound (D) having two or more radical polymerizable functional groups in the molecule will be described. Examples of the polyfunctional compound (D) include divinylbenzene, vinyl acrylate, vinyl methacrylate, triaryl isocyanurate, diaryl phthalate, ethylene dimethacrylate, trimethylolpropane trimethacrylate, and the like.

The resin composition can be obtained by melt-kneading the cyclic olefin polymer (A), the soft copolymer (B), the radical initiator (C) and the polyfunctional compound (D).

The blending amount of the soft copolymer (B) is preferably 1 to 50 parts by mass with respect to 100 parts by mass of the cyclic olefin polymer (A). When the blending amount of the soft copolymer (B) is less than 1 part by mass, the improvement in wear resistance is insufficient, and is preferably 5 parts by mass or more. On the other hand, if the blending amount of the soft copolymer (B) exceeds 50 parts by mass, the rigidity of the resulting laminate may be reduced, making it difficult to use as an abrasive carrier, preferably 25 masses. Or less.

The blending amount of the radical initiator (C) is preferably 0.001 to 1 part by mass with respect to 100 parts by mass of the cyclic olefin polymer (A). When the blending amount of the radical initiator (C) is less than 0.001 part by mass, the crosslinking reaction does not proceed sufficiently, resulting in insufficient improvement in wear resistance. is there. On the other hand, when the compounding quantity of a radical initiator (C) exceeds 1 mass part, there exists a possibility that stain resistance may deteriorate, and it is 0.5 mass part or less suitably.

The compounding amount of the polyfunctional compound (D) is preferably 0 to 1 part by mass with respect to 100 parts by mass of the cyclic olefin polymer (A). The polyfunctional compound (D) can be blended arbitrarily and may not be blended, but is preferably blended in order to advance the crosslinking reaction efficiently. The suitable compounding quantity in that case is 0.001 mass part or more, More preferably, it is 0.01 mass part or more. On the other hand, when the compounding amount of the polyfunctional compound (D) exceeds 1 part by mass, the stain resistance may be deteriorated, and it is preferably 0.5 part by mass or less.

The cyclic olefin polymer (A) used in the present invention is preferably an acid-modified cyclic olefin polymer from the viewpoint of adhesion to the base material layer. Such an acid-modified cyclic olefin polymer can be produced by blending a cyclic olefin polymer (A) with a modifier so as to obtain a desired acid-modified amount and graft polymerization. It can also be produced by preparing a product and then mixing this modified product with an unmodified cyclic olefin polymer. At this time, the content of the unsaturated carboxylic acid unit or the unit derived from the anhydride thereof in the polymer contained in the resin layer is preferably 0.1 to 5% by mass. When the said content is less than 0.1 mass%, there exists a possibility that the adhesiveness excellent with the base material layer may not be obtained, and it is more preferable that it is 0.2 mass% or more. On the other hand, when the content exceeds 5% by mass, the stain resistance may be deteriorated, and it is more preferably 3% by mass or less.

As the modifier, unsaturated carboxylic acids are usually used. Specifically, (meth) acrylic acid, maleic acid, fumaric acid, tetrahydrophthalic acid, itaconic acid, citraconic acid, crotonic acid, isocrotonic acid, endocis-bicyclo [2.2.1] unsaturated carboxylic acids such as hept-5-ene-2,3-dicarboxylic acid (nadic acid), and derivatives of these unsaturated carboxylic acids such as unsaturated carboxylic acid anhydrides, unsaturated carboxylic acid halides, Examples thereof include unsaturated carboxylic acid amides, unsaturated carboxylic acid imides, and ester compounds of unsaturated carboxylic acids.

Specific examples of the unsaturated carboxylic acid derivative include maleic anhydride, citraconic anhydride, maleenyl chloride, maleimide, monomethyl maleate, dimethyl maleate, glycidyl maleate, and the like.

Among these modifiers, α, β-unsaturated dicarboxylic acids and α, β-unsaturated dicarboxylic acid anhydrides such as maleic acid, nadic acid and anhydrides of these acids are preferably used. These modifiers can be used in combination of two or more.

In the present invention, it is also important that the base material layer is composed of an organic fiber aggregate impregnated with a resin. By doing in this way, it can prevent that an organic fiber falls off from a base material layer. In addition, it is possible to prevent the beard from being generated on the polishing carrier. Here, the resin impregnated in the organic fiber assembly is the cyclic polyolefin polymer (A).

The organic fiber is not particularly limited as long as it is formed from an organic polymer compound, and is preferably a synthetic fiber from the viewpoint of strength. The organic fiber used in the present invention is selected from the group consisting of wholly aromatic polyester fiber, aramid fiber, polyphenylene sulfide fiber and polyparaphenylene benzobisoxazole fiber from the viewpoint of strength, abrasion resistance and chemical resistance. Preferably at least one fiber. Among these, polyphenylene sulfide fiber or wholly aromatic polyester fiber is more preferable, and wholly aromatic polyester fiber is more preferable from the viewpoint of excellent balance between workability when forming through holes and gears in the laminate and the strength of the obtained abrasive carrier. Further preferred.

The organic fiber aggregate contained in the base material layer is not particularly limited, and a woven fabric, a knitted fabric, a non-woven fabric, or the like can be used. Especially, it is preferable that an organic fiber assembly is a nonwoven fabric from a point with little anisotropy.

Nonwoven fabrics are classified as long fiber nonwoven fabrics or short fiber nonwoven fabrics. Although any nonwoven fabric can be used as the nonwoven fabric in the present invention, it is preferably a long-fiber nonwoven fabric from the viewpoint of less fluffing and fiber falling off.

Moreover, as a kind of nonwoven fabric, the nonwoven fabric obtained by the direct method can also be mentioned. Specific examples of the non-woven fabric obtained by the direct method include a melt blown non-woven fabric manufactured by a melt blow method, a spun bond non-woven fabric manufactured by a spun bond method, and the like. From the viewpoint of dimensional stability, the organic fiber aggregate used in the present invention is preferably a melt blown nonwoven fabric. What processed the liquid crystal polymer which consists of wholly aromatic polyester into the nonwoven fabric by the melt blow method is used suitably.

In addition, examples of the type of nonwoven fabric include a nonwoven fabric obtained by a wet method (wet nonwoven fabric) and a nonwoven fabric obtained by a dry method (dry nonwoven fabric). Although any nonwoven fabric can be used as the nonwoven fabric in the present invention, it is preferable that the organic fiber aggregate used in the present invention is a wet nonwoven fabric from the viewpoint of high fiber density. The wet nonwoven fabric is manufactured by dispersing short fibers in a dispersion medium such as water and can easily obtain a thin and dense fiber assembly with small thickness unevenness. Therefore, there is no fear that fibers will be mixed into the resin layer when it is used for the base material layer, and a polishing carrier with good thickness accuracy can be obtained.

In order to improve the strength and durability of the abrasive carrier, it is preferable to use an organic fiber aggregate having a density of 0.15 g / cm ³ or more. The density is more preferably 0.3 g / cm ³ or more. Thus, by using a high-density organic fiber assembly, it is possible to prevent fibers from being mixed from the base material layer to the resin layer. Also, when cutting to form through holes and gears in the laminate, the organic fibers are cut cleanly at the end face, and beards are unlikely to occur. On the other hand, the density is usually 1.5 g / cm ³ or less and preferably 1.2 g / cm ³ or less.

The abrasive carrier of the present invention comprises a laminate having a base material layer and a resin layer. In the present invention, it is important that the laminate has a resin layer between a plurality of substrate layers and has a resin layer on both surfaces. Hereinafter, the resin layer between the base layers may be referred to as an intermediate resin layer, and the resin layers on both surfaces may be referred to as a surface resin layer. When the laminate has the intermediate resin layer between the plurality of base material layers, the strength and durability of the abrasive carrier are improved, and the dimensional stability of the abrasive carrier is improved. Moreover, it can prevent that an organic fiber falls off from the surface of a grinding | polishing carrier by having a surface resin layer on both surfaces of a laminated board.

The thickness of the base material layer is preferably 10 to 1000 μm. There exists a possibility that the intensity | strength of a grinding | polishing carrier may fall that the thickness of a base material layer is less than 10 micrometers. The thickness of the base material layer is more preferably 20 μm or more. On the other hand, when the thickness of the base material layer exceeds 1000 μm, it may be difficult to produce the base material layer itself. The thickness of the base material layer is more preferably 500 μm or less, and further preferably 300 μm or less.

The thickness of the surface resin layer is preferably 10 to 1000 μm. If the thickness of the surface resin layer is less than 10 μm, the organic fibers may fall off the surface of the polishing carrier. The thickness of the surface resin layer is more preferably 20 μm or more. On the other hand, if the thickness of the surface resin layer exceeds 1000 μm, the strength of the polishing carrier may be reduced. The thickness of the surface resin layer is more preferably 500 μm or less. Here, in order to increase the rigidity of the polishing carrier, it is preferable that the surface resin layer is thinner. From this viewpoint, the thickness of the surface resin layer is preferably 200 μm or less, and more preferably 100 μm or less.

The thickness of the intermediate resin layer is preferably 20 to 1000 μm. When the thickness of the intermediate resin layer is less than 20 μm, it becomes easy to peel between the base material layers. The thickness of the intermediate resin layer is more preferably 40 μm or more. Here, in order to increase the rigidity of the polishing carrier, it is preferable that the intermediate resin layer is thick. From this viewpoint, the thickness of the intermediate resin layer is preferably 200 μm or more, and more preferably 300 μm or more. On the other hand, if the thickness of the intermediate resin layer exceeds 1000 μm, the overall strength of the polishing carrier may be reduced.

The thickness of the polishing carrier of the present invention is preferably 100 to 5000 μm. If the thickness of the polishing carrier is less than 100 μm, the strength and durability of the polishing carrier may be reduced. The thickness of the polishing carrier is more preferably 200 μm or more. On the other hand, when the thickness of the polishing carrier exceeds 5000 μm, the production cost may increase. The thickness of the polishing carrier is more preferably 3000 μm or less.

Examples of the layer configuration in the present invention include the following 5-layer configuration, 7-layer configuration, 9-layer configuration, and 11-layer configuration, and a 5-layer configuration is preferable. (R) is a resin layer, and (F) is a base material layer.

5-layer structure: (R) / (F) / (R) / (F) / (R)
7-layer structure: (R) / (F) / (R) / (F) / (R) / (F) / (R)
9-layer configuration: (R) / (F) / (R) / (F) / (R) / (F) / (R) / (F) / (R)
Eleven layers: (R) / (F) / (R) / (F) / (R) / (F) / (R) / (F) / (R) / (F) / (R)
When an external force is applied to bend the polishing carrier, a compressive stress and a tensile stress are generated in the base material layer on both sides of the intermediate layer in the polishing carrier as a force repelling the external force. The bending elastic modulus (rigidity) of the abrasive carrier is improved by using a layer in which compressive stress and tensile stress are generated as a base material layer. At this time, the thickness of the intermediate resin layer is preferably at least twice the thickness of the surface resin layer, more preferably at least 5 times. By increasing the thickness of the intermediate resin layer relative to the surface resin layer, the base material layer is disposed on the outer side. By disposing the base material layer on the outer side, the expansion and contraction of the polishing carrier surface due to bending can be constrained by the high elastic base material layer, so that the bending characteristics of the polishing carrier are further improved. The thickness of the intermediate resin layer is usually 50 times or less the thickness of the surface resin layer.

Further, regarding the total thickness of the resin layer and the total thickness of the base material layer, it is preferable that the total thickness of the resin layer is larger from the viewpoint of preventing the fibers from dropping from the cut surface. On the other hand, from the viewpoint of the strength of the abrasive carrier, it is preferable that the total thickness of the base material layer is large. From the viewpoint of these balances, the total thickness of the resin layer is preferably 0.1 times or more of the thickness of the polishing carrier, more preferably 0.2 times or more, and 0.4 times or more. More preferably. Moreover, it is 0.8 times or less normally, Preferably it is 0.7 times or less.

Although it does not specifically limit as a manufacturing method of the grinding | polishing carrier of this invention, The said resin sheet makes the outermost layer the several fiber sheet which consists of the said organic fiber assembly, and the several resin sheet containing the said cyclic olefin polymer (A). To obtain a laminate, and then heat and pressure the laminate to melt the resin sheet, impregnate the molten resin into the organic fiber assembly, and then cool to obtain a laminate Subsequently, a method for manufacturing a polishing carrier, wherein a through hole for holding a plate to be polished is formed in the laminated plate is preferable.

First, a laminate is obtained by superposing a plurality of fiber sheets made of the organic fiber aggregate and a plurality of resin sheets containing the cyclic olefin polymer (A) so that the resin sheet is the outermost layer. At this time, the number of fiber sheets and resin sheets to be used is not particularly limited as long as a laminate having a resin layer between a plurality of substrate layers and having a resin layer on both surfaces can be obtained when heated and pressurized. . Each base material layer may be formed from only one fiber sheet, or may be formed from a plurality of fiber sheets. Each resin layer may be formed from only one resin sheet, or may be formed from a plurality of resin sheets. From the viewpoint of the productivity of the laminate and the adhesion between the base material layer and the resin layer, it is preferable that both the base material layer and the resin layer are formed from a single sheet. In this case, at least two fiber sheets and at least three resin sheets are prepared, and the sheets are alternately stacked one by one so that the resin sheet is the outermost layer.

As the fiber sheet, the organic fiber described above can be used in the form of a sheet by a known method. As the resin sheet, a resin composition containing the cyclic olefin polymer (A) described above in the form of a sheet by a known method can be used. The number of sheets to be stacked is not particularly limited as long as there are at least three resin sheets and at least two fiber sheets. The number of sheets to be stacked is usually 10 or less for both the resin sheet and the fiber sheet. The method of heating and pressing is not particularly limited, and a known heating and pressing apparatus can be used.

Next, the laminate is heated and pressed to melt the resin sheet, the molten resin is impregnated in the organic fiber assembly, and then cooled to obtain a laminate. Specifically, the laminate is heated and pressed for a predetermined time at a temperature equal to or higher than the melting point of the used resin sheet to impregnate the resin. This can prevent the fibers from dropping off. Thereafter, the laminate is cooled to room temperature and then depressurized to obtain a laminate having good dimensional accuracy. The pressure at this time is not particularly limited as long as it is a pressure capable of impregnating the molten resin into the organic fiber assembly. The method of heating and pressing is not particularly limited, and a known heating and pressing apparatus can be used.

Subsequently, a through-hole for holding a plate to be polished is formed in the laminated plate to obtain a polishing carrier. The number of holes formed in the laminate is not particularly limited, and may be one or more. The forming method is not particularly limited, and a through hole may be formed in the laminated plate using a router machine or the like. At this time, the laminated plate may be formed into a predetermined size or shape, or a driving gear may be formed as necessary. Moreover, if a high-density organic fiber aggregate is used for a base material layer, it can suppress that a fiber falls from the cut surface formed when a through-hole and a gear are formed in a laminated board, or a beard is produced. Accordingly, since the fibers do not fall off from the polishing carrier during polishing, the generation of scratches can be suppressed.

The plate-like body is held by the polishing carrier of the present invention and the plate-like body is polished. Since the abrasive carrier of the present invention has excellent strength and durability, it is possible to prevent the foreign matter from falling off while preventing the abrasive carrier from being damaged. When the plate-like body is polished using such a polishing carrier, it is possible to prevent foreign matter from adhering to the plate-like body and generation of scratches. The plate-like body to be polished is not particularly limited, and examples thereof include semiconductor wafers, aluminum disks and glass disks for hard disks, and glass substrates for liquid crystal displays.

Hereinafter, the present invention will be described more specifically using examples.

Example 1
[Production of polishing carrier]
(Production of resin sheet)
The following cyclic olefin polymer (a) 100 parts by mass, ethylene / propylene random copolymer (b) 11 parts by mass, radical initiator (c) 0.022 parts by mass and polyfunctional compound (d) 0.022 parts by mass Was melt-kneaded with an extruder to obtain a resin composition. The resin composition is commercially available from Fuji Bakelite Co., Ltd. under the name “FB-0422X1”.

-Cyclic olefin polymer (a)
Ethylene and tetracyclo [4.4.0.1 ^2,5 .1 ^7,10] -3- dodecene (hereinafter sometimes abbreviated as "TCD-3") and random copolymer (ethylene -TCD-3 random copolymer) . TCD-3 content measured by ¹³ C-NMR is 77.8% by mass (38 mol%), ethylene content is 22.2% by mass (62 mol%), and intrinsic viscosity [η] measured in decalin at 135 ° C. is 0.60 dl / g and a glass transition temperature (Tg) are 105 degreeC. The MFR (measured at 230 ° C. and 2.16 kg load based on ASTM D1238) is 8.2 g / 10 min. The structural formula of TCD-3 is as follows. In the above formula [I], n = 0, m = 1 and R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , This is a case where R ¹⁶ , R ¹⁷ and R ¹⁸ are hydrogen atoms.

・ Soft copolymer (b)
Ethylene-propylene random copolymer “P-0880” manufactured by Mitsui Chemicals, Inc. The ethylene content is 80 mol%, the intrinsic viscosity [η] is 2.5 dl / g, and the glass transition temperature (Tg) is −54 ° C. MFR (measured based on ASTM D1238 at 230 ° C. and 2.16 kg load) is 0.4 g / 10 min, density is 0.867 g / cm ³ , and crystallinity measured by X-ray diffraction method is about 10%. is there.

-Radical initiator (c)
“Perhexine 25B” manufactured by Nippon Oil & Fat Co., Ltd. 2,5-dimethyl-2,5-bis (t-butylperoxy) hexyne-3 is the main component (90% or more). The 1 minute half-life temperature is 194.3 ° C.

・ Polyfunctional compound (d)
Divinylbenzene

Then, the above resin composition, 2,5 dimethyl-2,5-di- (t-butylperoxin) -hexyne-3, and maleic anhydride were mixed to obtain a mixture. The content of the resin composition in this mixture is 98.5% by mass, the content of 2,5 dimethyl-2,5-di- (t-butylperoxin) is 0.5% by mass, and anhydrous The content of maleic acid was 1.0% by mass. The mixture was put into a twin-screw extruder (“TEX30α” manufactured by Nippon Steel Co., Ltd.), melt-kneaded and reacted, and then pelletized to obtain pellets. 2,5dimethyl-2,5-di- (t-butylperoxin) -hexyne-3 was “Perhexin25B” manufactured by NOF Corporation.

The obtained pellets were put into an extruder to form a film to obtain a resin sheet (resin sheet S1) having a thickness of 0.56 mm and a resin sheet (resin sheet S2) having a thickness of 0.11 mm.

(Nonwoven fabric)
As the non-woven fabric, a non-woven fabric “Vecruz MBBK150FZSO” (weight per unit: 150 g / m ² , thickness: 323 μm, density: 0.46 g / cm ³ ) manufactured by Kuraray Laflex Co., Ltd. was used. “Veculus MBBK150FZSO” is a non-woven fabric produced by a melt blow molding method, obtained by thermocompression bonding, and does not contain an adhesive.

(Production of laminates)
A resin sheet S1, a nonwoven fabric, a resin sheet S2, a nonwoven fabric, and a resin sheet S1 were sequentially stacked on the press plate. And the release film was arrange | positioned to the uppermost surface and the lowermost surface. Ten sets were prepared as one set. After pressurization was started and the press pressure was confirmed to be 3.5 MPa, the press plate was heated while maintaining the press pressure. As soon as it was confirmed that the temperature of the press plate reached 180 ° C., the press pressure was set to 7.5 MPa and the press plate was cooled with cooling water. When the temperature of the press plate returned to room temperature, the pressurization was stopped and the laminated plate was taken out from the press plate. The time from the start of heating until the temperature of the press plate reached 180 ° C. was 60 minutes, and the time from the start of cooling until the temperature of the press plate returned to room temperature was 60 minutes.

When the thicknesses of the 10 laminated plates obtained were each measured with a micrometer, the thickness of the thinnest laminated plate was 1.035 mm, and the thickness of the thickest laminated plate was 1.066 mm. It was found that a laminate with high thickness accuracy can be obtained.

(Production of polishing carrier)
The laminated plate was processed using a router machine to produce a polishing carrier 1. A plan view of the obtained abrasive carrier 1 is shown in FIG. As shown in FIG. 1, the polishing carrier 1 has a driving gear 2 on the outer periphery and five through holes 3 for holding a plate-like body to be polished.

(Cross section observation)
The cross section of the obtained abrasive carrier 1 was observed using a laser microscope. FIG. 2 is a cross-sectional image of the polishing carrier 1. In FIG. 2, F ₁ and F ₂ each represent a base material layer, R ₁ and R ₃ each represent a surface resin layer, and R ₂ represents an intermediate resin layer. As shown in FIG. 2, the obtained abrasive carrier has alternating nonwoven fabric layers (F ₁ , F ₂ ) and resin layers (R ₁ , R ₂ , R ₃ ) impregnated with a resin composition containing a cyclic olefin polymer. It has a laminated multilayer structure (R ₁ / F ₁ / R ₂ / F ₂ / R ₃ ). When the thickness of the polishing carrier was measured, the thickness was 1066 μm (1.066 mm). The thickness of each layer is as follows.
R ₁ : 36 μm
F ₁ : 248 μm
R ₂ : 482 μm
F ₂ : 258 μm
R ₃ : 42 μm

[Evaluation]
(Evaluation of bending properties)
In accordance with JIS K7171, the bending properties of the obtained laminate were measured. Specifically, using “AG-10TB” manufactured by Shimadzu Corporation as a measuring device, the 10 obtained abrasive carriers were cut into 1.0 mm × 25 mm × 20 mm (thickness × width × length). A test piece was obtained. Then, using these test pieces, the bending strength (MPa) and the bending elastic modulus (MPa) were measured at 25 ° C. under the conditions of a test speed of 1 mm / min and a fulcrum distance of 16 mm. Asked. As a result, the bending strength was 142.9 MPa and the bending elastic modulus was 4374 MPa.

(Abrasion test)
After processing the obtained laminated plate into a disk shape having a diameter of 100 mm, the five laminated plates were held with an abrasive carrier made of epoxy glass (EG). Then, the polishing carrier made of EG was moved horizontally using a polishing apparatus, and the laminated plate processed into a disk shape was polished for 660 minutes (load: 178 g / cm ³ , rotation speed: 30 rpm). The abrasive is colloidal silica (10-fold diluted solution of trade name “COMPOL-80” manufactured by Fujimi Incorporated). And the abrasion thickness (micrometer) of a laminated board (average value of 5 laminated boards) was calculated | required by calculating | requiring the difference of the thickness of the laminated board before a grinding | polishing test, and the thickness of the laminated board after a grinding | polishing test. The smaller this value, the better the durability. As a result, the wear thickness was 1 μm.

(Polishing test)
In the polishing test, the obtained polishing carrier was mounted on a polishing apparatus, the plate-like body was held by the through hole, and the polishing carrier was driven horizontally to polish the plate-like body for 6 minutes. The plate-like body polished in this test is an aluminum substrate having a thickness of 1.27 mm. Further, the abrasive used in this test was “Disklite” manufactured by Fujimi Incorporated.

(Evaluation of substrate after polishing)
Using a wafer inspection apparatus “Candela 7100” manufactured by KLA-Tencor, scratches present on the polished surface of the polished aluminum substrate were confirmed. As a result, no scratch was observed on the polished surface of the aluminum substrate. Moreover, it was confirmed whether the foreign material had adhered to the grinding | polishing surface of the aluminum substrate after grinding | polishing using said apparatus. As a result, few foreign substances were confirmed on the polished surface of the aluminum substrate.

Example 2
(Production of resin sheet)
Pellets obtained by the same method as in Example 1 were put into a twin screw extruder manufactured by Hitachi Zosen Corporation to form a film, and a resin sheet S3 having a thickness of 280 μm was obtained.

(Nonwoven fabric)
The same non-woven fabric as in Example 1 was used.

(Production of laminates)
Three resin sheets S3 and two non-woven fabrics were stacked between the press plates. At this time, the resin sheet S3 and the non-woven fabric were alternately laminated so that both surfaces became the resin sheet S3. And the release film was arrange | positioned to the uppermost surface and the lowermost surface. 15 sets were prepared as one set. After pressurization was started and the press pressure was confirmed to be 3.5 MPa, the press plate was heated while maintaining the press pressure. As soon as it was confirmed that the temperature of the press plate reached 160 ° C., the press pressure was set to 7.5 MPa and the press plate was cooled with cooling water. When the temperature of the press plate returned to room temperature, the pressurization was stopped and the laminated plate was taken out from the press plate. The time from the start of heating until the temperature of the press plate reached 160 ° C. was 40 minutes, and the time from the start of cooling until the temperature of the press plate returned to room temperature was 40 minutes.

When the thicknesses of the 15 laminated plates obtained were each measured with a micrometer, the thickness of the thickest laminated plate was 1.115 mm, and the thickness of the thinnest laminated plate was 1.095 mm. It was found that a laminate with high thickness accuracy can be obtained.

(Production of polishing carrier)
A polishing carrier was produced in the same manner as in Example 1.

(Cross section observation)
The cross section of the polishing carrier was observed in the same manner as in Example 1. FIG. 3 is a cross-sectional image of the polishing carrier. As shown in FIG. 3, the obtained abrasive carrier has alternating nonwoven fabric layers (F ₁ , F ₂ ) and resin sheet layers (R ₁ , R ₂ , R ₃ ) impregnated with a resin composition containing a cyclic olefin polymer. It has a multi-layer structure laminated. Here, when the thickness of the polishing carrier was measured, the thickness was 1115 μm (1.115 mm). The thickness of each layer is as follows.
R ₁ : 215 μm
F ₁ : 268 μm
R ₂ : 135 μm
F ₂ : 275 μm
R ₃ : 222 μm

[Evaluation]
(Evaluation of bending properties)
The bending strength (MPa) and bending elastic modulus (MPa) were measured in the same manner as in Example 1. As a result, the bending strength was 137.8 MPa and the bending elastic modulus was 3219 MPa.

(Polishing test)
A polishing test was performed using a polishing carrier in the same manner as in Example 1.

(Evaluation of substrate after polishing)
As in Example 1, scratches present on the polished surface of the polished aluminum substrate were confirmed. As a result, no scratch was observed on the polished surface of the aluminum substrate. Further, using the same apparatus as in Example 1, it was confirmed whether or not foreign matter had adhered to the polished surface of the polished aluminum substrate. As a result, few foreign substances were confirmed on the polished surface of the aluminum substrate.

Comparative Example 1
(Preparation of varnish)
A varnish was prepared by adding a bisphenol A type epoxy resin as a thermosetting resin and an amine compound as a curing agent to a mixed solvent of toluene, methanol and methyl cellosolve and dissolving them.

(Preparation of prepreg)
The said varnish was put into the container and the polyphenylene sulfide nonwoven fabric (PPS nonwoven fabric) was immersed in the varnish in a container. Then, the PPS nonwoven fabric was dried and the varnish was semi-cured to obtain a prepreg. The epoxy resin content (Rc) in the obtained prepreg was 61.6% by mass. The PPS nonwoven fabric used here is a wet nonwoven fabric “Torcon Paper PS0100S” manufactured by Toray Industries, Inc. (weight per unit: 108 g / m ² , thickness: 115 μm, density: 0.94 g / cm ³ ). “Torcon Paper PS0100S” was obtained by dispersing fibers made of a high-melting point PPS resin and fibers made of a PPS resin having a melting point lower than that of the resin in a dispersion medium, and then rolling and thermocompression bonding. And does not contain adhesive.

(Production of laminates)
Five release prepregs were stacked between the press plates, and release films were placed on the uppermost and lowermost surfaces. Ten sets of these were prepared, and the resin was cured by heating and pressing at a temperature of 160 ° C. and a pressure of 1.5 MPa for 60 minutes to obtain 10 laminates. When the thickness of the obtained laminate was measured with a micrometer, the thickness of the thickest laminate was 1.015 mm, and the thickness of the thinnest laminate was 0.992 mm. It was found that a laminate with high thickness accuracy can be obtained.

(Cross section observation)
The cross section of the obtained abrasive carrier was observed using a laser microscope. FIG. 4 is a cross-sectional image of the polishing carrier. As shown in FIG. 4, the obtained abrasive carrier has a multilayer structure in which PPS nonwoven fabric layers (F ₁ to F ₅ ) containing epoxy resin and epoxy resin layers (R ₂ to R ₅ ) are alternately laminated. Yes, the surface layers (R ₁ , R ₆ ) are epoxy resin layers. Here, when the thickness of the polishing carrier was measured, the thickness was 992 μm. The thickness of F ₁ was 101 μm, the thickness of F ₂ was 98 μm, the thickness of F ₃ was 122 μm, the thickness of F ₄ was 96 μm, and the thickness of F ₅ was 94 μm. The thickness of R ₁ is 52 μm, the thickness of R ₂ is 100 μm, the thickness of R ₃ is 92 μm, the thickness of R ₄ is 84 μm, the thickness of R ₅ is 95 μm, and the thickness of R ₆ is It was 58 μm.

[Evaluation]
(Abrasion test)
A wear test was conducted in the same manner as in Example 1. As a result, the wear thickness was 7 μm.

Comparative Example 2
Comparative Example 2 is an example in which a test was performed using a resin carrier “aramid carrier” manufactured by Sagami PC Co., Ltd. This carrier is an aramid fiber non-woven fabric impregnated with an epoxy resin. The cross section of the obtained abrasive carrier was observed using a laser microscope. FIG. 5 is a cross-sectional image of the resin carrier. As shown in FIG. 5, the resin carrier did not have a multilayer structure, and did not have a resin layer on the surface. Moreover, as shown by the part enclosed with the line in FIG. 5, it turned out that the beard has generate | occur | produced in the said resin carrier.

[Evaluation]
(Polishing test)
A polishing test was performed using a polishing carrier in the same manner as in Example 1.

(Evaluation of substrate after polishing)
When scratches present on the polished surface of the polished aluminum substrate were confirmed, no scratches were confirmed. However, when it was confirmed whether or not foreign matter had adhered to the polished surface of the aluminum substrate after polishing, it was confirmed that more than twice as many foreign matters had adhered to the polished surface as compared to the polishing carrier of Example 1. It was done.

Comparative Example 3
Comparative Example 3 is an example in which a test was performed using a resin carrier “EG (epoxy glass) carrier” manufactured by Sagami PC Co., Ltd. This carrier is obtained by overlapping and curing glass fiber woven fabric impregnated with an epoxy resin. The cross section of the obtained abrasive carrier was observed using a laser microscope. FIG. 6 is a cross-sectional image of the resin carrier. As shown in FIG. 6, the resin carrier was found to have a multilayer structure having three glass fiber woven fabric layers. However, the resin carrier did not have a resin layer containing no fiber between the glass fiber layers or the surface.

[Evaluation]
(Abrasion test)
A wear test was conducted in the same manner as in Example 1. As a result, the wear thickness was 10 μm.

(Evaluation of substrate after polishing)
When scratches existing on the polished surface of the polished aluminum substrate were confirmed, scratches were confirmed.

1 Polishing carrier 2 Gear 3 Through hole

Claims

A polishing carrier comprising a laminate having a base material layer and a resin layer;
The base layer is composed of an organic fiber assembly impregnated with a resin,
The resin layer contains a cyclic olefin polymer (A) and does not contain the organic fiber,
An abrasive carrier, wherein the laminate has a resin layer between a plurality of base material layers and also has a resin layer on both surfaces.
The abrasive carrier according to claim 1, wherein the resin layer comprises a resin composition containing a cyclic olefin polymer (A) and a soft copolymer (B).
The resin layer comprises at least two monomers selected from the group consisting of 100 parts by mass of a cyclic olefin polymer (A) having a glass transition temperature of 60 to 200 ° C., an olefin, a diene, and an aromatic vinyl hydrocarbon. 1 to 50 parts by weight of a soft copolymer (B) having a glass transition temperature of 0 ° C. or lower, 0.001 to 1 part by weight of a radical initiator (C), and a radical polymerizable functional group The abrasive carrier according to claim 2, comprising a resin composition obtained by melt-kneading 0 to 1 part by mass of a polyfunctional compound (D) having two or more thereof.
The abrasive carrier according to any one of claims 1 to 3, wherein the cyclic olefin polymer (A) is an acid-modified cyclic olefin polymer.
The organic fiber aggregate is at least one fiber selected from the group consisting of wholly aromatic polyester fibers, aramid fibers, polyphenylene sulfide fibers, and polyparaphenylene benzobisoxazole fibers. Polishing carrier.
The abrasive carrier according to any one of claims 1 to 5, wherein the organic fiber aggregate is a nonwoven fabric.
The polishing carrier according to claim 6, wherein the nonwoven fabric is a long-fiber nonwoven fabric.
The thickness of the base layer is 10 to 1000 μm, the thickness of the resin layers on both surfaces of the laminate is 10 to 1000 μm, and the thickness of the resin layer between the base layers is 20 to 1000 μm. The polishing carrier according to any one of claims 1 to 7.
The polishing carrier according to any one of claims 1 to 8, wherein the thickness of the polishing carrier is 100 to 5000 µm.
The abrasive carrier according to any one of claims 1 to 9, wherein the thickness of the resin layer between the base layers is at least twice the thickness of the resin layers on both surfaces of the laminate.
A method for producing an abrasive carrier according to claim 1;
A plurality of fiber sheets made of the organic fiber aggregate and a plurality of resin sheets containing the cyclic olefin polymer (A) are stacked so that the resin sheet is an outermost layer, to obtain a laminate,
The laminate is heated and pressurized to melt the resin sheet, the molten resin is impregnated into the organic fiber assembly, and then cooled to obtain a laminate,
Then, the manufacturing method of the grinding | polishing carrier characterized by forming the through-hole for hold | maintaining the plate-shaped body grind | polished in the said laminated board.
A polishing method for polishing a plate by holding the plate with the polishing carrier according to any one of claims 1 to 10.