JPS58186570A - Method of manufacturing auxiliary material for polishing - Google Patents

Abstract

PURPOSE:To lower the cost of an auxiliary material for polishing the surface of a semiconductor wafer, a metal plate or the like and heighten the wear resistance of the material, by utilizing the advantages of a laminated polyimide plate as the material and using a fiber-reinforced epoxy resin laminated plate or a prepreg as an intermediate layer. CONSTITUTION:A prepreg, which is made by coating or impregnating a woven carbon fiber fabric with a thermosetting resin composition containing a thermosetting polyimide resin monomer of prepolymer as an indispensable constituent, is placed on one or both sides of a fiber-reinforced epoxy resin laminated plate or a prepreg. A die-separating film or sheet is then placed on the former prepreg. These materials are interposed between the very smooth surfaces of plates. The materials are laminated together under pressure of 0.1-500kg/cm<2> at a temperature of 150-350 deg.C, thereby providing a laminated plate of low cost and high wear resistance as an auxiliary material for polishing.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a polishing auxiliary material with excellent wear resistance and mechanical properties. A prepreg obtained by coating or impregnating a carbon fiber woven fabric with a thermosetting resin composition that is an essential component of a polyimide resin or prepolymer is laminated and formed by placing a release film or sheet on top of it. This is a method for producing a polishing auxiliary material characterized by the following.

Table of relatively small objects such as semiconductor wafers and metal plates
In io polishing, the central part of a wear-resistant resin plate is cut out to the size K of the material to be polished, and the material to be polished is mounted in this hollowed out part and polished. The resin plate used as an auxiliary material for polishing is usually an inorganic fiber-reinforced Epolymer resin laminate, but this has the disadvantage of a short lifespan due to poor abrasion resistance. There is also a method of using an inorganic fiber cloth reinforced polyimide resin laminate, but it is expensive, so there was only one way to use it.

As a result of studying how to improve the above-mentioned drawbacks, we developed V4, which is a cheaper polishing auxiliary material that takes advantage of the advantages of polyimide laminates and uses fiber-reinforced Evokin as an intermediate layer! 1IlIiii
The present invention will be described below.

First, the 4m reinforced epoxy resin laminate or prepreg used for the intermediate layer of the present invention can be any material used for ordinary electrical materials, but in cases where heat resistance is required, etc. , phenol novolac type Evochishi resin, etc., which have high heat resistance are preferred. Furthermore, when using a laminate, it is preferable to use one that has been subjected to physical or chemical surface treatment.

Next, the thermosetting polyimide resin polymer or prepolymer of the present invention is a polyfunctional maleimide represented by the following general formula +1), the manimide prepolymer or cough maleimide, and a polyfunctional maleimide represented by the following general formula (2). Known maleimides which are prepolymers with amines; [m and R in the formula are the same as in the general formula (1)]
An imide prepolymer having an acetylene group at the end represented by the following formula is preferred.

[n in the formula is a number of 1 to 3] Also, the above imide monomer or prepoly 1-
A thermosetting resin composition having the following as an essential component is the above-mentioned imide monomer or prepolymer alone, and poly(meth)acrylate having an acryloyl group or methacryloyl &, polyfluorkenyl having an alkenyl group or an alkenyloxy group. , cyclic olefinically unsaturated compounds, epoxy resins, phenolic resins, cyanato resins, polyvinyl acetal resins, acrylic resins,
It is modified with resin, alkyd resin, liquid to elastomer rubber, thermosetting resin such as acid anhydride, and other resins. In addition, these K are used to improve the properties of the composition, such as traction reducers such as Teflon, graphite fluoride, and molybdenum sulfide, fillers, lubricants, coupling agents, and flame retardants, and also to accelerate the curing reaction. A curing catalyst is usually used for this purpose.

Coat or impregnate carbon fiber cloth with the thermosetting resin composition used in the present invention using a dry or wet method, and dry to obtain a prepreg. The above prepreg is laminated on one or both sides of an epoxy resin laminate or prepreg. In addition, release plastic film such as Teflon or heat-resistant polyolefin, or release film or sheet stacking such as aluminum sheet, # sandwiched between face plates, pressure 0.1 to 500.
kg/aj
150-350'0. Preferably, the laminated plate used for the polishing aid of the present invention is obtained by lamination molding at an angle of 170 to 250°0. Note that the conditions for lamination molding vary depending on the thermosetting resin composition used, the amount of catalyst, etc., and the optimum value is selected.Hereinafter, the present invention will be explained with reference to Examples. In addition, parts in the examples are parts by weight unless otherwise specified.

Example l 800 parts of bis(4-maleimidophenyl)methane and 100% of tohis(4-7minophenyl)methane and 160'
Preliminary reaction was carried out with O for 30 minutes, and then the general formula (3)
100 parts of a thermosetting polyimide represented by n=1.5 was added and mixed uniformly at 1600 ml.

This was dissolved in N-methyl-2-pyridone, 1 part of t-butylperoside was added as a catalyst, and the mixture was coated on carbon fiber cloth (Arisawa Seisakusho), heated and dried, and B-s
This prepreg has a thickness of 0.
．． A 3H heat-resistant glass cloth base epoxy resin laminate was stacked on both sides, and a 35μ thick aluminum foil was placed as a release sheet.
．． 150 minutes at a pressure of 30 kg/-, then 240°0,
Laminate molding for 40 minutes with Fl OkJ/j to a resin layer thickness of 10
A laminate for an auxiliary material of the present invention of μ was obtained. The test results of the obtained laminates are shown in Table 1.

Patent applicant: Mitsubishi Gas Chemical Co., Ltd. Representative Kazuyoshi Nagano

Claims (1)

[Claims] Fiber-reinforced epoxy resin laminate or prepreg outside 1
4, a prepreg obtained by coating or impregnating a warp fiber woven fabric with a thermosetting resin composition containing a thermosetting polyimide resin monomer or prepolymer as an essential component was layered, and a release film or sheet was further arranged. A method for producing a polishing auxiliary material characterized by laminated molding.