FR2063961A1 - Mechanico-chemical grinder for semi-con-ducting panels - Google Patents

Mechanico-chemical grinder for semi-con-ducting panels

Info

Publication number
FR2063961A1
FR2063961A1 FR6934956A FR6934956A FR2063961A1 FR 2063961 A1 FR2063961 A1 FR 2063961A1 FR 6934956 A FR6934956 A FR 6934956A FR 6934956 A FR6934956 A FR 6934956A FR 2063961 A1 FR2063961 A1 FR 2063961A1
Authority
FR
France
Prior art keywords
grooves
semi
scouring solution
periphery
panels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR6934956A
Other languages
French (fr)
Other versions
FR2063961B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR6934956A priority Critical patent/FR2063961A1/en
Publication of FR2063961A1 publication Critical patent/FR2063961A1/en
Application granted granted Critical
Publication of FR2063961B1 publication Critical patent/FR2063961B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The device has two rotary plates of different diameters, placed facing each other and arranged excentrically, the panel to be ground being pressed between the two and attached to one of the plates, a film of a scouring solution being interposed between the surface of the panel and the grinding wheel, which has a network of grooves joining a cavity near the centre to the periphery, the grooves being profiled so that the scouring solution circulates from the cavity towards the periphery under the influence of centrifugal force. The grinding face is pref. of PTFE at least in the portion where the grooves are formed. The grooves are pref. semicircular and tangential to the periphery with additional straight grooves tangential to the semi-circles, and of triangular profile, the section of the straight grooves being twice that of the semi-circular grooves. The scouring solution may be Nacl or KOCI for GaAs panels and HF or H2SO4 for GaP or Si panels. The device provides rotary plates whose coating does not need frequent renewal, and a constant flow of scouring solution.
FR6934956A 1969-10-13 1969-10-13 Mechanico-chemical grinder for semi-con-ducting panels Granted FR2063961A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR6934956A FR2063961A1 (en) 1969-10-13 1969-10-13 Mechanico-chemical grinder for semi-con-ducting panels

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR6934956A FR2063961A1 (en) 1969-10-13 1969-10-13 Mechanico-chemical grinder for semi-con-ducting panels

Publications (2)

Publication Number Publication Date
FR2063961A1 true FR2063961A1 (en) 1971-07-16
FR2063961B1 FR2063961B1 (en) 1974-05-03

Family

ID=9041442

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6934956A Granted FR2063961A1 (en) 1969-10-13 1969-10-13 Mechanico-chemical grinder for semi-con-ducting panels

Country Status (1)

Country Link
FR (1) FR2063961A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0020088A1 (en) * 1979-05-28 1980-12-10 Fujitsu Limited Apparatus for cleaning glass masks
EP0348757A2 (en) * 1988-06-28 1990-01-03 Mitsubishi Materials Silicon Corporation Method for polishing a silicon wafer
US4954141A (en) * 1988-01-28 1990-09-04 Showa Denko Kabushiki Kaisha Polishing pad for semiconductor wafers
EP0439124A2 (en) * 1990-01-22 1991-07-31 Micron Technology, Inc. Polishing pad with uniform abrasion
EP0674972A1 (en) * 1994-03-02 1995-10-04 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
WO1998012020A1 (en) * 1996-09-19 1998-03-26 Speedfam Corporation Methods and apparatus for uniform polishing of a workpiece
US5783497A (en) * 1994-08-02 1998-07-21 Sematech, Inc. Forced-flow wafer polisher
US6203407B1 (en) 1998-09-03 2001-03-20 Micron Technology, Inc. Method and apparatus for increasing-chemical-polishing selectivity
FR2799403A1 (en) * 1999-10-08 2001-04-13 Procedes Et Equipements Pour L Industrial polishing cloth with mechanical and chemical properties has treated cotton backing layer with cotton flock surface stuck to it
USRE37997E1 (en) 1990-01-22 2003-02-18 Micron Technology, Inc. Polishing pad with controlled abrasion rate
US6783436B1 (en) 2003-04-29 2004-08-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with optimized grooves and method of forming same
CN115922557A (en) * 2023-03-09 2023-04-07 长鑫存储技术有限公司 Polishing assembly and polishing equipment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE439364A (en) * 1938-12-16
US1667076A (en) * 1925-10-16 1928-04-24 Mcgovern Daniel Frederick Polishing wheel
US2992519A (en) * 1960-02-18 1961-07-18 Internat Optical Company Inc Apparatus for surfacing and polishing optical glass and other articles
US3050910A (en) * 1959-12-21 1962-08-28 Harry J Harris Automatic lapping machine
US3110988A (en) * 1960-10-06 1963-11-19 Speedlap Corp Lapping machine
US3161996A (en) * 1954-03-25 1964-12-22 Crane Packing Co Method of conditioning a rotatable lap

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1667076A (en) * 1925-10-16 1928-04-24 Mcgovern Daniel Frederick Polishing wheel
BE439364A (en) * 1938-12-16
US3161996A (en) * 1954-03-25 1964-12-22 Crane Packing Co Method of conditioning a rotatable lap
US3050910A (en) * 1959-12-21 1962-08-28 Harry J Harris Automatic lapping machine
US2992519A (en) * 1960-02-18 1961-07-18 Internat Optical Company Inc Apparatus for surfacing and polishing optical glass and other articles
US3110988A (en) * 1960-10-06 1963-11-19 Speedlap Corp Lapping machine

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0020088A1 (en) * 1979-05-28 1980-12-10 Fujitsu Limited Apparatus for cleaning glass masks
US4954141A (en) * 1988-01-28 1990-09-04 Showa Denko Kabushiki Kaisha Polishing pad for semiconductor wafers
EP0348757A2 (en) * 1988-06-28 1990-01-03 Mitsubishi Materials Silicon Corporation Method for polishing a silicon wafer
EP0348757A3 (en) * 1988-06-28 1990-03-07 Japan Silicon Co., Ltd. Method for polishing a silicon wafer
US5096854A (en) * 1988-06-28 1992-03-17 Japan Silicon Co., Ltd. Method for polishing a silicon wafer using a ceramic polishing surface having a maximum surface roughness less than 0.02 microns
EP0439124A2 (en) * 1990-01-22 1991-07-31 Micron Technology, Inc. Polishing pad with uniform abrasion
EP0439124A3 (en) * 1990-01-22 1992-02-26 Micron Technology, Inc. Polishing pad with uniform abrasion
USRE37997E1 (en) 1990-01-22 2003-02-18 Micron Technology, Inc. Polishing pad with controlled abrasion rate
US5650039A (en) * 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
EP0674972A1 (en) * 1994-03-02 1995-10-04 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
US5783497A (en) * 1994-08-02 1998-07-21 Sematech, Inc. Forced-flow wafer polisher
WO1998012020A1 (en) * 1996-09-19 1998-03-26 Speedfam Corporation Methods and apparatus for uniform polishing of a workpiece
US6203407B1 (en) 1998-09-03 2001-03-20 Micron Technology, Inc. Method and apparatus for increasing-chemical-polishing selectivity
US6325702B2 (en) 1998-09-03 2001-12-04 Micron Technology, Inc. Method and apparatus for increasing chemical-mechanical-polishing selectivity
US6893325B2 (en) 1998-09-03 2005-05-17 Micron Technology, Inc. Method and apparatus for increasing chemical-mechanical-polishing selectivity
FR2799403A1 (en) * 1999-10-08 2001-04-13 Procedes Et Equipements Pour L Industrial polishing cloth with mechanical and chemical properties has treated cotton backing layer with cotton flock surface stuck to it
US6783436B1 (en) 2003-04-29 2004-08-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with optimized grooves and method of forming same
CN115922557A (en) * 2023-03-09 2023-04-07 长鑫存储技术有限公司 Polishing assembly and polishing equipment

Also Published As

Publication number Publication date
FR2063961B1 (en) 1974-05-03

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