DE69734138D1 - Suspension zum chemisch-mechanischen Polieren von Kupfersubstraten - Google Patents

Suspension zum chemisch-mechanischen Polieren von Kupfersubstraten

Info

Publication number
DE69734138D1
DE69734138D1 DE69734138T DE69734138T DE69734138D1 DE 69734138 D1 DE69734138 D1 DE 69734138D1 DE 69734138 T DE69734138 T DE 69734138T DE 69734138 T DE69734138 T DE 69734138T DE 69734138 D1 DE69734138 D1 DE 69734138D1
Authority
DE
Germany
Prior art keywords
chemical mechanical
mechanical polishing
substrate
suspension
polishing slurry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69734138T
Other languages
English (en)
Other versions
DE69734138T2 (de
Inventor
Vlasta Brusic Kaufman
Rodney C Kistler
Shumin Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/763,705 external-priority patent/US5954997A/en
Priority claimed from US08/891,649 external-priority patent/US6126853A/en
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of DE69734138D1 publication Critical patent/DE69734138D1/de
Publication of DE69734138T2 publication Critical patent/DE69734138T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • ing And Chemical Polishing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69734138T 1996-12-09 1997-12-05 Suspension zum chemisch-mechanischen Polieren von Kupfersubstraten Expired - Lifetime DE69734138T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US08/763,705 US5954997A (en) 1996-12-09 1996-12-09 Chemical mechanical polishing slurry useful for copper substrates
US763705 1996-12-09
US891649 1997-07-11
US08/891,649 US6126853A (en) 1996-12-09 1997-07-11 Chemical mechanical polishing slurry useful for copper substrates
US944036 1997-09-29
US08/944,036 US6309560B1 (en) 1996-12-09 1997-09-29 Chemical mechanical polishing slurry useful for copper substrates

Publications (2)

Publication Number Publication Date
DE69734138D1 true DE69734138D1 (de) 2005-10-13
DE69734138T2 DE69734138T2 (de) 2006-01-19

Family

ID=27419572

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69734138T Expired - Lifetime DE69734138T2 (de) 1996-12-09 1997-12-05 Suspension zum chemisch-mechanischen Polieren von Kupfersubstraten

Country Status (13)

Country Link
US (1) US6309560B1 (de)
EP (2) EP0846742B1 (de)
JP (1) JP4494538B2 (de)
KR (1) KR100690470B1 (de)
AT (1) ATE304040T1 (de)
AU (1) AU5373998A (de)
DE (1) DE69734138T2 (de)
DK (1) DK0846742T3 (de)
ES (1) ES2248831T3 (de)
IL (1) IL130393A0 (de)
MY (2) MY185089A (de)
TW (1) TW419714B (de)
WO (1) WO1998026025A1 (de)

Families Citing this family (129)

* Cited by examiner, † Cited by third party
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EP0846742A2 (de) 1998-06-10
AU5373998A (en) 1998-07-03
TW419714B (en) 2001-01-21
MY134702A (en) 2007-12-31
DE69734138T2 (de) 2006-01-19
EP1559762A3 (de) 2006-06-07
EP0846742B1 (de) 2005-09-07
ATE304040T1 (de) 2005-09-15
US6309560B1 (en) 2001-10-30
JP4494538B2 (ja) 2010-06-30
KR20000057476A (ko) 2000-09-15
EP1559762A2 (de) 2005-08-03
MY185089A (en) 2021-04-30
IL130393A0 (en) 2000-06-01
KR100690470B1 (ko) 2007-03-09
DK0846742T3 (da) 2005-10-03
EP1559762B1 (de) 2012-09-05
EP0846742A3 (de) 1998-10-28

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