TWI257126B - Slurry and polishing method - Google Patents
Slurry and polishing methodInfo
- Publication number
- TWI257126B TWI257126B TW92120053A TW92120053A TWI257126B TW I257126 B TWI257126 B TW I257126B TW 92120053 A TW92120053 A TW 92120053A TW 92120053 A TW92120053 A TW 92120053A TW I257126 B TWI257126 B TW I257126B
- Authority
- TW
- Taiwan
- Prior art keywords
- slurry
- organic compound
- cyclic organic
- polishing method
- oxidizer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Abstract
Slurry contains an oxidizer, water, Ph modifier, and cyclic organic compound for enhancing the chemical polishing of polished surface. Wherein the Ph value of the slurry is 5 to 10, and the cyclic organic compound contains an imidazole structure. Using the slurry to perform an interconnect process of a semiconductor device can keep low etching rate, and increase polishing rate. Also, using the slurry can avoid the erosion and dishing phenomenon of the metal surface. Therefore, the reliability of pattern of buried metal layer can be improved.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002216423 | 2002-07-25 | ||
JP2002216428 | 2002-07-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200405453A TW200405453A (en) | 2004-04-01 |
TWI257126B true TWI257126B (en) | 2006-06-21 |
Family
ID=31190292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92120053A TWI257126B (en) | 2002-07-25 | 2003-07-23 | Slurry and polishing method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2004012248A1 (en) |
AU (1) | AU2003248101A1 (en) |
TW (1) | TWI257126B (en) |
WO (1) | WO2004012248A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004010379A1 (en) * | 2004-03-03 | 2005-09-22 | Schott Ag | Process for the production of wafers with low-defect surfaces, the use of such wafers and electronic components obtained therefrom |
JP4316406B2 (en) * | 2004-03-22 | 2009-08-19 | 株式会社フジミインコーポレーテッド | Polishing composition |
JP4644434B2 (en) * | 2004-03-24 | 2011-03-02 | 株式会社フジミインコーポレーテッド | Polishing composition |
JP5648567B2 (en) * | 2010-05-07 | 2015-01-07 | 日立化成株式会社 | Polishing liquid for CMP and polishing method using the same |
JP5953766B2 (en) * | 2012-01-24 | 2016-07-20 | 日立化成株式会社 | Polishing liquid and substrate polishing method |
JP6589361B2 (en) * | 2015-05-01 | 2019-10-16 | 日立化成株式会社 | Abrasive, abrasive set, and substrate polishing method |
EP3969639A1 (en) * | 2019-05-13 | 2022-03-23 | Ecolab Usa Inc. | 1,2,4-triazolo[1,5-a] pyrimidine derivative as copper corrosion inhibitor |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6217416B1 (en) * | 1998-06-26 | 2001-04-17 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper/tantalum substrates |
JP2000252243A (en) * | 1998-12-28 | 2000-09-14 | Hitachi Chem Co Ltd | Polishing liquid for metal and polishing method using the same |
JP4538109B2 (en) * | 1999-02-18 | 2010-09-08 | 株式会社トッパンTdkレーベル | Chemical mechanical polishing composition |
JP3902897B2 (en) * | 1999-11-15 | 2007-04-11 | 日立化成工業株式会社 | Substrate polishing method using metal polishing liquid |
JP2001185514A (en) * | 1999-12-27 | 2001-07-06 | Hitachi Chem Co Ltd | Cmp abrasive and method for polishing substrate |
JP3841995B2 (en) * | 1999-12-28 | 2006-11-08 | Necエレクトロニクス株式会社 | Chemical mechanical polishing slurry |
JP4001219B2 (en) * | 2000-10-12 | 2007-10-31 | Jsr株式会社 | Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
US7375066B2 (en) * | 2000-03-21 | 2008-05-20 | Wako Pure Chemical Industries, Ltd. | Semiconductor wafer cleaning agent and cleaning method |
JP3768401B2 (en) * | 2000-11-24 | 2006-04-19 | Necエレクトロニクス株式会社 | Chemical mechanical polishing slurry |
JP3768402B2 (en) * | 2000-11-24 | 2006-04-19 | Necエレクトロニクス株式会社 | Chemical mechanical polishing slurry |
JP2003188120A (en) * | 2001-12-17 | 2003-07-04 | Hitachi Chem Co Ltd | Polishing liquid and polishing method for metal |
DE60332881D1 (en) * | 2002-04-30 | 2010-07-15 | Hitachi Chemical Co Ltd | Polish and polishing process |
JP2004031442A (en) * | 2002-06-21 | 2004-01-29 | Hitachi Chem Co Ltd | Polishing solution and polishing method |
JP2004031446A (en) * | 2002-06-21 | 2004-01-29 | Hitachi Chem Co Ltd | Polishing solution and polishing method |
-
2003
- 2003-07-23 TW TW92120053A patent/TWI257126B/en not_active IP Right Cessation
- 2003-07-24 WO PCT/JP2003/009389 patent/WO2004012248A1/en active Application Filing
- 2003-07-24 AU AU2003248101A patent/AU2003248101A1/en not_active Abandoned
- 2003-07-24 JP JP2004524136A patent/JPWO2004012248A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
AU2003248101A1 (en) | 2004-02-16 |
WO2004012248A1 (en) | 2004-02-05 |
JPWO2004012248A1 (en) | 2005-11-24 |
TW200405453A (en) | 2004-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |