DE69612182D1 - Polymer und Resistmaterial - Google Patents

Polymer und Resistmaterial

Info

Publication number
DE69612182D1
DE69612182D1 DE69612182T DE69612182T DE69612182D1 DE 69612182 D1 DE69612182 D1 DE 69612182D1 DE 69612182 T DE69612182 T DE 69612182T DE 69612182 T DE69612182 T DE 69612182T DE 69612182 D1 DE69612182 D1 DE 69612182D1
Authority
DE
Germany
Prior art keywords
polymer
resist material
acetal
resolution
molecule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69612182T
Other languages
English (en)
Other versions
DE69612182T3 (de
DE69612182T2 (de
Inventor
Fumiyoshi Urano
Hirotoshi Fujie
Keiji Oono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Wako Pure Chemical Corp
Original Assignee
Wako Pure Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26388161&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69612182(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Wako Pure Chemical Industries Ltd filed Critical Wako Pure Chemical Industries Ltd
Publication of DE69612182D1 publication Critical patent/DE69612182D1/de
Application granted granted Critical
Publication of DE69612182T2 publication Critical patent/DE69612182T2/de
Publication of DE69612182T3 publication Critical patent/DE69612182T3/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
    • C08F212/22—Oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
    • C08F212/22—Oxygen
    • C08F212/24—Phenols or alcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
    • C09D125/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Emergency Medicine (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
DE69612182T 1996-02-09 1996-12-13 Polymer und Resistmaterial Expired - Lifetime DE69612182T3 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP4795596 1996-02-09
JP4795596 1996-02-09
JP16838796 1996-06-07
JP16838796 1996-06-07

Publications (3)

Publication Number Publication Date
DE69612182D1 true DE69612182D1 (de) 2001-04-26
DE69612182T2 DE69612182T2 (de) 2001-09-06
DE69612182T3 DE69612182T3 (de) 2005-08-04

Family

ID=26388161

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69612182T Expired - Lifetime DE69612182T3 (de) 1996-02-09 1996-12-13 Polymer und Resistmaterial

Country Status (9)

Country Link
US (1) US6033826A (de)
EP (1) EP0789279B2 (de)
JP (1) JP3724098B2 (de)
KR (1) KR100286960B1 (de)
CN (1) CN1145078C (de)
AT (1) ATE199985T1 (de)
DE (1) DE69612182T3 (de)
SG (1) SG63683A1 (de)
TW (1) TW440744B (de)

Families Citing this family (46)

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US6090526A (en) * 1996-09-13 2000-07-18 Shipley Company, L.L.C. Polymers and photoresist compositions
KR100250637B1 (ko) * 1997-01-06 2000-04-01 윤종용 디하이드로피란에 의한 웨이퍼 프라임 방법
US6319648B1 (en) * 1997-07-15 2001-11-20 E. I. Du Pont De Nemours And Company Dissolution inhibition resists for microlithography
KR19990036901A (ko) 1997-10-08 1999-05-25 카나가와 치히로 폴리스티렌계 고분자 화합물, 화학증폭 포지티브형 레지스트 재료 및 패턴 형성 방법
JP3813721B2 (ja) * 1997-12-26 2006-08-23 富士写真フイルム株式会社 ポジ型感光性組成物
US6037097A (en) * 1998-01-27 2000-03-14 International Business Machines Corporation E-beam application to mask making using new improved KRS resist system
JP3955384B2 (ja) * 1998-04-08 2007-08-08 Ａｚエレクトロニックマテリアルズ株式会社 化学増幅型レジスト組成物
JP3743187B2 (ja) * 1998-05-08 2006-02-08 住友化学株式会社 フォトレジスト組成物
TW473459B (en) * 1998-12-10 2002-01-21 Ibm Method for forming transparent conductive film using chemically amplified resist
TWI277830B (en) * 1999-01-28 2007-04-01 Sumitomo Chemical Co Resist composition
JP3785846B2 (ja) 1999-02-05 2006-06-14 住友化学株式会社 化学増幅型ポジ型レジスト組成物
US6537719B1 (en) * 1999-02-15 2003-03-25 Clariant Finance (Bvi) Limited Photosensitive resin composition
TW552475B (en) * 1999-06-09 2003-09-11 Wako Pure Chem Ind Ltd A resist composition
JP3353885B2 (ja) * 1999-12-28 2002-12-03 日本電気株式会社 化学増幅型レジスト
EP1117003B1 (de) 2000-01-17 2012-06-20 Shin-Etsu Chemical Co., Ltd. Verfahren zur Herstellung von chemisch verstärkter Resistzusammensetzung
AU2001238706A1 (en) 2000-02-27 2001-09-03 Shipley Company, L.L.C. Photoacid generators and photoresists comprising same
KR100674073B1 (ko) * 2000-03-07 2007-01-26 신에쓰 가가꾸 고교 가부시끼가이샤 화학 증폭 포지티브형 레지스트 재료
TW538312B (en) * 2000-03-07 2003-06-21 Shinetsu Chemical Co Chemical amplification, positive resist compositions
JP4329214B2 (ja) 2000-03-28 2009-09-09 住友化学株式会社 化学増幅型ポジ型レジスト組成物
JP4150491B2 (ja) * 2000-07-13 2008-09-17 富士フイルム株式会社 ポジ型感光性組成物
JP2002122986A (ja) * 2000-10-16 2002-04-26 Kansai Paint Co Ltd ポジ型感光性樹脂組成物、ポジ型感光性ドライフィルム、その組成物を使用して得られる材料及びパターン形成方法
JP2002122987A (ja) * 2000-10-16 2002-04-26 Kansai Paint Co Ltd ネガ型感光性樹脂組成物、ネガ型感光性ドライフィルム、その組成物を使用して得られる材料及びパターン形成方法
EP1204001B1 (de) 2000-11-01 2013-09-11 Shin-Etsu Chemical Co., Ltd. Resistzusammensetzung und Mustererzeugungsverfahren
TW538316B (en) * 2001-01-19 2003-06-21 Sumitomo Chemical Co Chemical amplifying type positive resist composition
JP4514978B2 (ja) * 2001-03-28 2010-07-28 國宏 市村 化学増幅型ポジ型レジスト組成物
US6936398B2 (en) * 2001-05-09 2005-08-30 Massachusetts Institute Of Technology Resist with reduced line edge roughness
JP3771815B2 (ja) * 2001-05-31 2006-04-26 東京応化工業株式会社 感光性積層体、それに用いるポジ型レジスト組成物及びそれらを用いるレジストパターン形成方法
TWI267697B (en) * 2001-06-28 2006-12-01 Tokyo Ohka Kogyo Co Ltd Chemical amplified type positive resist component and resist packed-layer material and forming method of resist pattern and manufacturing method of semiconductor device
JP4727092B2 (ja) * 2001-09-10 2011-07-20 東京応化工業株式会社 化学増幅型レジスト組成物
JP3886358B2 (ja) * 2001-10-31 2007-02-28 松下電器産業株式会社 パターン形成方法
JP4123920B2 (ja) * 2001-12-20 2008-07-23 Ｊｓｒ株式会社 共重合体、重合体混合物および感放射線性樹脂組成物
TW200401164A (en) * 2002-03-01 2004-01-16 Shipley Co Llc Photoresist compositions
EP1516230B1 (de) 2002-06-26 2015-12-30 FujiFilm Electronic Materials USA, Inc. Lichtempfindliche zusammensetzungen
US7666569B2 (en) * 2002-12-26 2010-02-23 Tokyo Ohka Kogyo Co., Ltd. Positive resist composition and method for forming resist pattern
JP4152810B2 (ja) * 2003-06-13 2008-09-17 東京応化工業株式会社 ポジ型レジスト組成物およびレジストパターン形成方法
JP4088784B2 (ja) 2003-06-19 2008-05-21 信越化学工業株式会社 高分子化合物の製造方法及びレジスト材料
US7250246B2 (en) 2004-01-26 2007-07-31 Fujifilm Corporation Positive resist composition and pattern formation method using the same
JP2005326491A (ja) * 2004-05-12 2005-11-24 Tokyo Ohka Kogyo Co Ltd ポジ型レジスト組成物及びレジストパターン形成方法
US8715918B2 (en) * 2007-09-25 2014-05-06 Az Electronic Materials Usa Corp. Thick film resists
JP4961324B2 (ja) * 2007-10-26 2012-06-27 富士フイルム株式会社 電子線、ｘ線又はｅｕｖ用ポジ型レジスト組成物及びそれを用いたパターン形成方法
TWI637936B (zh) * 2013-09-25 2018-10-11 日商東京應化工業股份有限公司 Radiation-sensitive composition and pattern manufacturing method
JP6228796B2 (ja) * 2013-09-26 2017-11-08 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法
CN104834182B (zh) * 2015-05-20 2019-05-03 杭州福斯特应用材料股份有限公司 一种具有高分辨率和优异掩孔性能的感光干膜
TWI717543B (zh) 2016-08-09 2021-02-01 德商馬克專利公司 光阻組合物及其用途
JP7310471B2 (ja) * 2019-09-12 2023-07-19 Jsr株式会社 パターン形成方法及び組成物
KR102458068B1 (ko) * 2020-11-02 2022-10-24 인하대학교 산학협력단 레지스트 조성물 및 이를 사용한 패턴 형성 방법

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JPH07268030A (ja) 1994-03-29 1995-10-17 Shin Etsu Chem Co Ltd テトラヒドロピラニル基で部分エーテル化されたポリヒドロキシスチレン及びその製造方法
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US5558971A (en) * 1994-09-02 1996-09-24 Wako Pure Chemical Industries, Ltd. Resist material

Also Published As

Publication number Publication date
KR980003842A (ko) 1998-03-30
CN1145078C (zh) 2004-04-07
JP3724098B2 (ja) 2005-12-07
ATE199985T1 (de) 2001-04-15
CN1159453A (zh) 1997-09-17
KR100286960B1 (ko) 2001-09-07
JPH1053621A (ja) 1998-02-24
EP0789279A1 (de) 1997-08-13
EP0789279B1 (de) 2001-03-21
US6033826A (en) 2000-03-07
DE69612182T3 (de) 2005-08-04
DE69612182T2 (de) 2001-09-06
SG63683A1 (en) 1999-03-30
EP0789279B2 (de) 2004-12-08
TW440744B (en) 2001-06-16

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8366 Restricted maintained after opposition proceedings