DE69604771T2 - Magnetisches kompositartikel und produkt zur unterdrückung von elektromagnetischen interferenzen - Google Patents

Magnetisches kompositartikel und produkt zur unterdrückung von elektromagnetischen interferenzen

Info

Publication number
DE69604771T2
DE69604771T2 DE69604771T DE69604771T DE69604771T2 DE 69604771 T2 DE69604771 T2 DE 69604771T2 DE 69604771 T DE69604771 T DE 69604771T DE 69604771 T DE69604771 T DE 69604771T DE 69604771 T2 DE69604771 T2 DE 69604771T2
Authority
DE
Germany
Prior art keywords
magnetic
soft magnetic
circuit board
printed circuit
composite material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69604771T
Other languages
German (de)
English (en)
Other versions
DE69604771D1 (de
Inventor
Mitsuharu Sato
Yutaka Shimada
Eishu Sugawara
Shigeyoshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Application granted granted Critical
Publication of DE69604771D1 publication Critical patent/DE69604771D1/de
Publication of DE69604771T2 publication Critical patent/DE69604771T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/287—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials materials for magnetic shielding, e.g. ferromagnetic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Soft Magnetic Materials (AREA)
  • Aerials With Secondary Devices (AREA)
DE69604771T 1995-07-20 1996-07-22 Magnetisches kompositartikel und produkt zur unterdrückung von elektromagnetischen interferenzen Expired - Lifetime DE69604771T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7183911A JPH0935927A (ja) 1995-07-20 1995-07-20 複合磁性体及びそれを用いた電磁干渉抑制体
PCT/JP1996/002040 WO1997004469A1 (en) 1995-07-20 1996-07-22 Composite magnetic material and product for eliminating electromagnetic interference

Publications (2)

Publication Number Publication Date
DE69604771D1 DE69604771D1 (de) 1999-11-25
DE69604771T2 true DE69604771T2 (de) 2000-03-09

Family

ID=16143978

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69604771T Expired - Lifetime DE69604771T2 (de) 1995-07-20 1996-07-22 Magnetisches kompositartikel und produkt zur unterdrückung von elektromagnetischen interferenzen

Country Status (7)

Country Link
EP (1) EP0785557B1 (enExample)
JP (1) JPH0935927A (enExample)
KR (1) KR100267358B1 (enExample)
CN (1) CN1135574C (enExample)
DE (1) DE69604771T2 (enExample)
TW (1) TW305048B (enExample)
WO (1) WO1997004469A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011087263A1 (de) * 2011-11-28 2013-05-29 Lenze Drives Gmbh Abschirmvorrichtung für elektrische Einheiten

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3404618B2 (ja) * 1996-09-02 2003-05-12 エヌイーシートーキン株式会社 電磁干渉抑制体
JP3475386B2 (ja) * 1997-09-01 2003-12-08 Ｎｅｃトーキン株式会社 電磁干渉抑制体
US6284363B1 (en) 1998-03-23 2001-09-04 Fuji Polymer Industries Co., Ltd. Electromagnetic wave absorbing thermoconductive silicone gel molded sheet and method for producing the same
DE59903559D1 (de) 1998-07-10 2003-01-09 Epcos Ag Magnetisierbares erzeugnis, seine verwendung sowie ein verfahren zu seiner herstellung
JP2000058691A (ja) * 1998-08-07 2000-02-25 Sharp Corp ミリ波半導体装置
JP2000133986A (ja) * 1998-10-27 2000-05-12 Murata Mfg Co Ltd 放射ノイズ抑制部品の取付構造
US6103134A (en) * 1998-12-31 2000-08-15 Motorola, Inc. Circuit board features with reduced parasitic capacitance and method therefor
WO2001024205A1 (en) 1999-09-28 2001-04-05 Tokin Corporation Composite magnetic sheet and method of producing the same
DE19947130C1 (de) * 1999-09-30 2000-11-02 Siemens Ag Elektrisches Gerät mit in einem Gehäuse angeordneten und nach außen elektromagnetisch abgeschirmten Komponenten
JP2001126910A (ja) * 1999-10-25 2001-05-11 Tokin Corp 複合磁性体、複合磁性体シートおよびそれらの製造方法
DE10000523A1 (de) * 2000-01-08 2001-07-26 Inst Maschinen Antriebe Und El Ferrit-Compound-Material mit hoher elektromagnetischer Absorption im Frequenzbereich von 20 MHz bis 40 GHz
DE10016380C2 (de) * 2000-03-29 2002-01-24 Infineon Technologies Ag Gehäuse für ein elektrisches Bauteil
CN1288753C (zh) * 2000-04-04 2006-12-06 Nec东金株式会社 电磁噪声抑制器、使用该抑制器的半导体器件及其制造方法
JP4623244B2 (ja) * 2000-04-11 2011-02-02 信越化学工業株式会社 電磁波吸収性熱伝導性シリコーンゴム組成物
DE10024439A1 (de) * 2000-05-19 2001-12-06 Koppe Franz Verguss- oder Einbettmasse mit elektromagnetischen Abschirmeigenschaften zur Herstellung elektronischer Bauteile
JP3723927B2 (ja) * 2000-07-11 2005-12-07 日本ライナー株式会社 エポキシ樹脂を短時間で硬化する方法及び、該硬化方法によって得られたエポキシ樹脂硬化物による電磁波吸収方法
JP2002064189A (ja) * 2000-08-21 2002-02-28 Tokin Corp マグネティック・ランダム・アクセス・メモリ
JP3865601B2 (ja) 2001-06-12 2007-01-10 日東電工株式会社 電磁波抑制体シート
JP2002374092A (ja) * 2001-06-15 2002-12-26 Polymatech Co Ltd 放熱性電波吸収体
JP3864773B2 (ja) * 2001-12-10 2007-01-10 三菱マテリアル株式会社 広い周波数帯域の高周波に対して優れた電波吸収特性を示す電波吸収体用混合粉末および電波吸収体
DE10162637C1 (de) * 2001-12-20 2003-08-21 Eupec Gmbh & Co Kg Schaltungsanordnung mit elektronischen Bauelementen auf einem isolierenden Trägersubstrat
DE10229542B4 (de) 2002-07-01 2004-05-19 Infineon Technologies Ag Elektronisches Bauteil mit mehrschichtiger Umverdrahtungsplatte und Verfahren zur Herstellung desselben
JPWO2004061876A1 (ja) * 2002-12-27 2006-05-18 Tdk株式会社 グラニュラー物質、磁性薄膜、磁気素子
JP2004266784A (ja) * 2003-01-10 2004-09-24 Murata Mfg Co Ltd ノイズフィルタ
US7625633B2 (en) 2003-03-25 2009-12-01 Shin-Etsu Polymer., Ltd. Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods
JP4417377B2 (ja) 2004-02-24 2010-02-17 信越ポリマー株式会社 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付構造体、およびそれらの製造方法
US7561114B2 (en) * 2004-12-03 2009-07-14 Nitta Corporation Electromagnetic interference suppressor, antenna device and electronic information transmitting apparatus
DE102005022473B4 (de) * 2005-05-14 2007-05-24 Forschungszentrum Karlsruhe Gmbh Vorrichtung zur Dämpfung von Reflexionen elektromagnetischer Wellen, Verfahren zu ihrer Herstellung und ihre Verwendung
KR100716679B1 (ko) * 2005-10-27 2007-05-09 한국과학기술연구원 노이즈 감쇄층, 노이즈 감쇄 회로기판 및 이들의 제조방법
KR100712836B1 (ko) * 2005-11-02 2007-05-04 한국과학기술연구원 전자기파 간섭 차폐용 다층 필름 및 이를 포함하는회로기판
US8466764B2 (en) 2006-09-12 2013-06-18 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8941457B2 (en) 2006-09-12 2015-01-27 Cooper Technologies Company Miniature power inductor and methods of manufacture
US9589716B2 (en) 2006-09-12 2017-03-07 Cooper Technologies Company Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets
US8378777B2 (en) 2008-07-29 2013-02-19 Cooper Technologies Company Magnetic electrical device
EP2317548A1 (en) * 2008-07-10 2011-05-04 Alps Electric Co., Ltd. Heat-conductive noise suppression sheet
US8659379B2 (en) 2008-07-11 2014-02-25 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9859043B2 (en) 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
JP5161813B2 (ja) * 2008-10-10 2013-03-13 Ｄｏｗａエレクトロニクス株式会社 混合フェライト粉およびその製造方法、並びに、電波吸収体
JP5912278B2 (ja) * 2011-04-06 2016-04-27 Ｎｅｃトーキン株式会社 電磁干渉抑制体
KR101209979B1 (ko) 2011-10-24 2012-12-07 엘지이노텍 주식회사 차폐장치 및 무선전력 송신장치
CN103377787B (zh) * 2012-04-25 2016-06-01 比亚迪股份有限公司 一种nfc磁片用浆料及其制备方法和一种nfc磁片
CN102892279B (zh) * 2012-09-06 2015-09-02 刘伟德 一种电磁屏蔽材料、应用及其制造方法
US9418780B2 (en) 2012-12-06 2016-08-16 Samsung Electronics Co., Ltd. Magnetic composite material
CN104134513A (zh) * 2013-05-02 2014-11-05 杨立章 软磁复合薄膜和制造方法及其在电子设备中的应用
WO2015173196A1 (en) * 2014-05-14 2015-11-19 Dsm Ip Assets B.V. Soft magnetic material composition and component made from the material
KR102410075B1 (ko) 2015-10-27 2022-06-16 헨켈 아게 운트 코. 카게아아 저주파수 emi 차폐를 위한 전도성 조성물
WO2017078404A1 (ko) * 2015-11-02 2017-05-11 주식회사 아모그린텍 형상 이방성 자성 입자, 이를 포함하는 전자파 흡수시트 및 이를 포함하는 안테나 모듈
JP6407186B2 (ja) 2016-03-23 2018-10-17 Tdk株式会社 電子回路パッケージ
CN106229104A (zh) * 2016-08-31 2016-12-14 北京康普锡威科技有限公司 一种软磁复合粉末及其磁粉芯制备方法
JP6934660B2 (ja) * 2017-07-31 2021-09-15 北川工業株式会社 電磁波抑制シート
EP3439438B1 (en) 2017-08-02 2024-10-09 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Non-uniform magnetic foil embedded in component carrier
CN111919521A (zh) 2018-03-30 2020-11-10 大金工业株式会社 电波吸收材料以及电波吸收片
TWI787517B (zh) * 2018-06-08 2022-12-21 日商麥克賽爾股份有限公司 電磁波吸收體及電磁波吸收體用組成物
CN109411887B (zh) * 2018-12-07 2024-04-05 厦门大学嘉庚学院 三维镜像工型缝隙分形偶极子超宽频带天线及终端
KR102641133B1 (ko) * 2019-09-30 2024-02-28 교세라 가부시키가이샤 전자 장치용 덮개체, 패키지, 전자 장치, 및 전자 모듈

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2873225A (en) * 1957-05-20 1959-02-10 Adams Edmond Magnetic flake core
CA2005198A1 (en) * 1989-01-26 1990-07-26 Charles E. Boyer, Iii Microwave absorber employing acicular magnetic metallic filaments
JPH04108666A (ja) * 1990-08-30 1992-04-09 Tokin Corp 複合型フェライト材料及びその製造方法
JPH04352498A (ja) * 1991-05-30 1992-12-07 Mitsui Toatsu Chem Inc 高透磁率を有する電磁シールド用絶縁ペースト
JPH0595197A (ja) * 1991-10-01 1993-04-16 Mitsui Toatsu Chem Inc プリント配線板およびそれに用いる基板
JPH06251928A (ja) * 1992-12-29 1994-09-09 Sony Corp フェライト樹脂
JPH0818271A (ja) * 1994-06-27 1996-01-19 Tokin Corp 電子装置およびそのノイズ抑制方法
JP3401650B2 (ja) * 1994-01-20 2003-04-28 エヌイーシートーキン株式会社 電磁波干渉抑制体
FI117224B (fi) * 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
JPH0993034A (ja) * 1995-09-22 1997-04-04 Tokin Corp 複合磁性体及びその製造方法ならびに電磁干渉抑制体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011087263A1 (de) * 2011-11-28 2013-05-29 Lenze Drives Gmbh Abschirmvorrichtung für elektrische Einheiten

Also Published As

Publication number Publication date
CN1135574C (zh) 2004-01-21
EP0785557A1 (en) 1997-07-23
DE69604771D1 (de) 1999-11-25
CN1165579A (zh) 1997-11-19
HK1001438A1 (en) 1998-06-19
KR100267358B1 (ko) 2000-10-16
EP0785557B1 (en) 1999-10-20
KR970706588A (ko) 1997-11-03
WO1997004469A1 (en) 1997-02-06
TW305048B (enExample) 1997-05-11
EP0785557A4 (enExample) 1997-07-30
JPH0935927A (ja) 1997-02-07

Similar Documents

Publication Publication Date Title
DE69504377T2 (de) Mittel mit geringer elektromagnetischer Transparenz und Reflexion zur Unterdrückung von elektromagnetischen Interferenzen und damit versehene elektronische Vorrichtung
EP0785557B1 (en) Composite magnetic material and product for eliminating electromagnetic interference
DE69618252T2 (de) Magnetischer Kompositartikel zur Unterdrückung von elektromagnetischen Interferenzen
DE69727207T2 (de) Hoch warmeleitendes magnetisches mischmaterial
US6972097B2 (en) Composite magnetic material and electromagnetic interference suppressor member using the same
DE69732290T2 (de) Produkt zur unterdrückung von elektromagnetischen interferenzen
DE69119506T2 (de) Leiterplatte mit EMI-Unterdrückung
DE60100124T2 (de) Signalübertragungskabel mit auf dem Kabelmantel befindlichem geräuschabsorbierenden Magnetfilm hohen Verlustfaktors
KR100329677B1 (ko) 전자기파간섭억제체
DE69812221T2 (de) Gedruckte Leiterplatte
DE69023790T2 (de) LC-Störschutzfilter.
DE2851388C2 (enExample)
DE69731730T2 (de) Magnetisches prepreg, verfahren zu dessen herstellung und diese prepreg verwendende leiterplatte
DE69719950T2 (de) Emi schutzteil und vorrichtung damit
US6137389A (en) Inductor element for noise suppression
DE69737349T2 (de) Verbundmagnetband
DE60101756T2 (de) Leiterplatte mit körnigem magnetischem Film
DE602005002614T2 (de) Mikrowellen-Absorbermaterial
DE69817102T2 (de) Elektromagnetische Rauschunterdrückungsanordnung
DE68909670T2 (de) Elektrische Vorrichtung.
DE69730310T2 (de) Magnetische kompositfolie, herstellungsverfahren und material zur unterdruckung von elektromagnetischen interferenzen
DE69029757T2 (de) LC-Störfilter
DE60218905T2 (de) Gegen-emi-komponente und gegen-emi-verfahren
DE60104470T2 (de) Elektronisches Bauteil bei dem hochfrequente Ströme unterdrückt werden und Bonddraht dafür
DE202016008742U1 (de) Frequenzselektive Strukturen zur EMI - Abschwächung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NEC TOKIN CORP., SENDAI, MIYAGI, JP