CN1135574C - 复合磁性材料及其制造方法和应用 - Google Patents

复合磁性材料及其制造方法和应用 Download PDF

Info

Publication number
CN1135574C
CN1135574C CNB961910607A CN96191060A CN1135574C CN 1135574 C CN1135574 C CN 1135574C CN B961910607 A CNB961910607 A CN B961910607A CN 96191060 A CN96191060 A CN 96191060A CN 1135574 C CN1135574 C CN 1135574C
Authority
CN
China
Prior art keywords
magnetic
powder
soft magnetic
composite
anisotropy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB961910607A
Other languages
English (en)
Chinese (zh)
Other versions
CN1165579A (zh
Inventor
�����ټ�
吉田荣吉
佐藤光晴
菅原英州
岛田宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Publication of CN1165579A publication Critical patent/CN1165579A/zh
Application granted granted Critical
Publication of CN1135574C publication Critical patent/CN1135574C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/287—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials materials for magnetic shielding, e.g. ferromagnetic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Soft Magnetic Materials (AREA)
  • Aerials With Secondary Devices (AREA)
CNB961910607A 1995-07-20 1996-07-22 复合磁性材料及其制造方法和应用 Expired - Lifetime CN1135574C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP183911/1995 1995-07-20
JP7183911A JPH0935927A (ja) 1995-07-20 1995-07-20 複合磁性体及びそれを用いた電磁干渉抑制体
JP183911/95 1995-07-20

Publications (2)

Publication Number Publication Date
CN1165579A CN1165579A (zh) 1997-11-19
CN1135574C true CN1135574C (zh) 2004-01-21

Family

ID=16143978

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB961910607A Expired - Lifetime CN1135574C (zh) 1995-07-20 1996-07-22 复合磁性材料及其制造方法和应用

Country Status (7)

Country Link
EP (1) EP0785557B1 (enExample)
JP (1) JPH0935927A (enExample)
KR (1) KR100267358B1 (enExample)
CN (1) CN1135574C (enExample)
DE (1) DE69604771T2 (enExample)
TW (1) TW305048B (enExample)
WO (1) WO1997004469A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109392238A (zh) * 2017-08-02 2019-02-26 奥特斯奥地利科技与系统技术有限公司 嵌入部件承载件中的不均匀磁箔

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3404618B2 (ja) * 1996-09-02 2003-05-12 エヌイーシートーキン株式会社 電磁干渉抑制体
JP3475386B2 (ja) * 1997-09-01 2003-12-08 Necトーキン株式会社 電磁干渉抑制体
US6284363B1 (en) 1998-03-23 2001-09-04 Fuji Polymer Industries Co., Ltd. Electromagnetic wave absorbing thermoconductive silicone gel molded sheet and method for producing the same
DE59903559D1 (de) 1998-07-10 2003-01-09 Epcos Ag Magnetisierbares erzeugnis, seine verwendung sowie ein verfahren zu seiner herstellung
JP2000058691A (ja) * 1998-08-07 2000-02-25 Sharp Corp ミリ波半導体装置
JP2000133986A (ja) * 1998-10-27 2000-05-12 Murata Mfg Co Ltd 放射ノイズ抑制部品の取付構造
US6103134A (en) * 1998-12-31 2000-08-15 Motorola, Inc. Circuit board features with reduced parasitic capacitance and method therefor
WO2001024205A1 (en) 1999-09-28 2001-04-05 Tokin Corporation Composite magnetic sheet and method of producing the same
DE19947130C1 (de) * 1999-09-30 2000-11-02 Siemens Ag Elektrisches Gerät mit in einem Gehäuse angeordneten und nach außen elektromagnetisch abgeschirmten Komponenten
JP2001126910A (ja) * 1999-10-25 2001-05-11 Tokin Corp 複合磁性体、複合磁性体シートおよびそれらの製造方法
DE10000523A1 (de) * 2000-01-08 2001-07-26 Inst Maschinen Antriebe Und El Ferrit-Compound-Material mit hoher elektromagnetischer Absorption im Frequenzbereich von 20 MHz bis 40 GHz
DE10016380C2 (de) * 2000-03-29 2002-01-24 Infineon Technologies Ag Gehäuse für ein elektrisches Bauteil
CN1288753C (zh) * 2000-04-04 2006-12-06 Nec东金株式会社 电磁噪声抑制器、使用该抑制器的半导体器件及其制造方法
JP4623244B2 (ja) * 2000-04-11 2011-02-02 信越化学工業株式会社 電磁波吸収性熱伝導性シリコーンゴム組成物
DE10024439A1 (de) * 2000-05-19 2001-12-06 Koppe Franz Verguss- oder Einbettmasse mit elektromagnetischen Abschirmeigenschaften zur Herstellung elektronischer Bauteile
JP3723927B2 (ja) * 2000-07-11 2005-12-07 日本ライナー株式会社 エポキシ樹脂を短時間で硬化する方法及び、該硬化方法によって得られたエポキシ樹脂硬化物による電磁波吸収方法
JP2002064189A (ja) * 2000-08-21 2002-02-28 Tokin Corp マグネティック・ランダム・アクセス・メモリ
JP3865601B2 (ja) 2001-06-12 2007-01-10 日東電工株式会社 電磁波抑制体シート
JP2002374092A (ja) * 2001-06-15 2002-12-26 Polymatech Co Ltd 放熱性電波吸収体
JP3864773B2 (ja) * 2001-12-10 2007-01-10 三菱マテリアル株式会社 広い周波数帯域の高周波に対して優れた電波吸収特性を示す電波吸収体用混合粉末および電波吸収体
DE10162637C1 (de) * 2001-12-20 2003-08-21 Eupec Gmbh & Co Kg Schaltungsanordnung mit elektronischen Bauelementen auf einem isolierenden Trägersubstrat
DE10229542B4 (de) 2002-07-01 2004-05-19 Infineon Technologies Ag Elektronisches Bauteil mit mehrschichtiger Umverdrahtungsplatte und Verfahren zur Herstellung desselben
JPWO2004061876A1 (ja) * 2002-12-27 2006-05-18 Tdk株式会社 グラニュラー物質、磁性薄膜、磁気素子
JP2004266784A (ja) * 2003-01-10 2004-09-24 Murata Mfg Co Ltd ノイズフィルタ
US7625633B2 (en) 2003-03-25 2009-12-01 Shin-Etsu Polymer., Ltd. Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods
JP4417377B2 (ja) 2004-02-24 2010-02-17 信越ポリマー株式会社 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付構造体、およびそれらの製造方法
US7561114B2 (en) * 2004-12-03 2009-07-14 Nitta Corporation Electromagnetic interference suppressor, antenna device and electronic information transmitting apparatus
DE102005022473B4 (de) * 2005-05-14 2007-05-24 Forschungszentrum Karlsruhe Gmbh Vorrichtung zur Dämpfung von Reflexionen elektromagnetischer Wellen, Verfahren zu ihrer Herstellung und ihre Verwendung
KR100716679B1 (ko) * 2005-10-27 2007-05-09 한국과학기술연구원 노이즈 감쇄층, 노이즈 감쇄 회로기판 및 이들의 제조방법
KR100712836B1 (ko) * 2005-11-02 2007-05-04 한국과학기술연구원 전자기파 간섭 차폐용 다층 필름 및 이를 포함하는회로기판
US8466764B2 (en) 2006-09-12 2013-06-18 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8941457B2 (en) 2006-09-12 2015-01-27 Cooper Technologies Company Miniature power inductor and methods of manufacture
US9589716B2 (en) 2006-09-12 2017-03-07 Cooper Technologies Company Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets
US8378777B2 (en) 2008-07-29 2013-02-19 Cooper Technologies Company Magnetic electrical device
EP2317548A1 (en) * 2008-07-10 2011-05-04 Alps Electric Co., Ltd. Heat-conductive noise suppression sheet
US8659379B2 (en) 2008-07-11 2014-02-25 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9859043B2 (en) 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
JP5161813B2 (ja) * 2008-10-10 2013-03-13 Dowaエレクトロニクス株式会社 混合フェライト粉およびその製造方法、並びに、電波吸収体
JP5912278B2 (ja) * 2011-04-06 2016-04-27 Necトーキン株式会社 電磁干渉抑制体
KR101209979B1 (ko) 2011-10-24 2012-12-07 엘지이노텍 주식회사 차폐장치 및 무선전력 송신장치
DE102011087263A1 (de) * 2011-11-28 2013-05-29 Lenze Drives Gmbh Abschirmvorrichtung für elektrische Einheiten
CN103377787B (zh) * 2012-04-25 2016-06-01 比亚迪股份有限公司 一种nfc磁片用浆料及其制备方法和一种nfc磁片
CN102892279B (zh) * 2012-09-06 2015-09-02 刘伟德 一种电磁屏蔽材料、应用及其制造方法
US9418780B2 (en) 2012-12-06 2016-08-16 Samsung Electronics Co., Ltd. Magnetic composite material
CN104134513A (zh) * 2013-05-02 2014-11-05 杨立章 软磁复合薄膜和制造方法及其在电子设备中的应用
WO2015173196A1 (en) * 2014-05-14 2015-11-19 Dsm Ip Assets B.V. Soft magnetic material composition and component made from the material
KR102410075B1 (ko) 2015-10-27 2022-06-16 헨켈 아게 운트 코. 카게아아 저주파수 emi 차폐를 위한 전도성 조성물
WO2017078404A1 (ko) * 2015-11-02 2017-05-11 주식회사 아모그린텍 형상 이방성 자성 입자, 이를 포함하는 전자파 흡수시트 및 이를 포함하는 안테나 모듈
JP6407186B2 (ja) 2016-03-23 2018-10-17 Tdk株式会社 電子回路パッケージ
CN106229104A (zh) * 2016-08-31 2016-12-14 北京康普锡威科技有限公司 一种软磁复合粉末及其磁粉芯制备方法
JP6934660B2 (ja) * 2017-07-31 2021-09-15 北川工業株式会社 電磁波抑制シート
CN111919521A (zh) 2018-03-30 2020-11-10 大金工业株式会社 电波吸收材料以及电波吸收片
TWI787517B (zh) * 2018-06-08 2022-12-21 日商麥克賽爾股份有限公司 電磁波吸收體及電磁波吸收體用組成物
CN109411887B (zh) * 2018-12-07 2024-04-05 厦门大学嘉庚学院 三维镜像工型缝隙分形偶极子超宽频带天线及终端
KR102641133B1 (ko) * 2019-09-30 2024-02-28 교세라 가부시키가이샤 전자 장치용 덮개체, 패키지, 전자 장치, 및 전자 모듈

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2873225A (en) * 1957-05-20 1959-02-10 Adams Edmond Magnetic flake core
CA2005198A1 (en) * 1989-01-26 1990-07-26 Charles E. Boyer, Iii Microwave absorber employing acicular magnetic metallic filaments
JPH04108666A (ja) * 1990-08-30 1992-04-09 Tokin Corp 複合型フェライト材料及びその製造方法
JPH04352498A (ja) * 1991-05-30 1992-12-07 Mitsui Toatsu Chem Inc 高透磁率を有する電磁シールド用絶縁ペースト
JPH0595197A (ja) * 1991-10-01 1993-04-16 Mitsui Toatsu Chem Inc プリント配線板およびそれに用いる基板
JPH06251928A (ja) * 1992-12-29 1994-09-09 Sony Corp フェライト樹脂
JPH0818271A (ja) * 1994-06-27 1996-01-19 Tokin Corp 電子装置およびそのノイズ抑制方法
JP3401650B2 (ja) * 1994-01-20 2003-04-28 エヌイーシートーキン株式会社 電磁波干渉抑制体
FI117224B (fi) * 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
JPH0993034A (ja) * 1995-09-22 1997-04-04 Tokin Corp 複合磁性体及びその製造方法ならびに電磁干渉抑制体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109392238A (zh) * 2017-08-02 2019-02-26 奥特斯奥地利科技与系统技术有限公司 嵌入部件承载件中的不均匀磁箔
US10993313B2 (en) 2017-08-02 2021-04-27 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Non-uniform magnetic foil embedded in component carrier
CN109392238B (zh) * 2017-08-02 2021-11-26 奥特斯奥地利科技与系统技术有限公司 嵌入部件承载件中的不均匀磁箔

Also Published As

Publication number Publication date
DE69604771T2 (de) 2000-03-09
EP0785557A1 (en) 1997-07-23
DE69604771D1 (de) 1999-11-25
CN1165579A (zh) 1997-11-19
HK1001438A1 (en) 1998-06-19
KR100267358B1 (ko) 2000-10-16
EP0785557B1 (en) 1999-10-20
KR970706588A (ko) 1997-11-03
WO1997004469A1 (en) 1997-02-06
TW305048B (enExample) 1997-05-11
EP0785557A4 (enExample) 1997-07-30
JPH0935927A (ja) 1997-02-07

Similar Documents

Publication Publication Date Title
CN1165579A (zh) 复合磁性材料和使用该材料的电磁波干扰抑制体
CN1075339C (zh) 电磁穿透性和反射性低的电磁干扰抑制体及其电子装置
CN1097270C (zh) 一种电磁干扰抑制磁性复合材料及其制造方法
CN1169164C (zh) 复合磁体和电磁干扰抑制体
CN1154125C (zh) 抗电磁干扰元件及拥有该元件的有源器件
US6972097B2 (en) Composite magnetic material and electromagnetic interference suppressor member using the same
US8377340B2 (en) Electromagnetic wave suppression sheet, device, and electronic apparatus
CN1717968A (zh) 电磁波噪声抑制体、具有电磁波噪声抑制功能的结构体、以及其制造方法
JP4849220B2 (ja) 電磁波干渉抑制用シート及びその製造法、高周波信号用フラットケーブル並びにフレキシブルプリント基板
CN1143325C (zh) 电磁干扰抑制材料
CN1363100A (zh) 软磁粉末与使用该粉末的复合磁材料
JP2011249628A (ja) 電磁干渉抑制体の製造方法
CN1190804C (zh) 在准微波段具有最大复导磁率的磁物质及其生产方法
JP3528257B2 (ja) プリント配線基板
JP4157012B2 (ja) 電子装置
JP3979541B2 (ja) 複合磁性体及びそれを用いた電磁干渉抑制体
JP3505691B2 (ja) 電子装置
CN1893763A (zh) 电路基板、电子设备和电源装置
JP2004221602A (ja) Emi対策部品及びそれを備えた能動素子
HK1001438B (en) Composite magnetic material and product for eliminating electromagnetic interference

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20040121

EXPY Termination of patent right or utility model