DE69525824D1 - Zusammengesetzter Leistungs-MOSFET - Google Patents

Zusammengesetzter Leistungs-MOSFET

Info

Publication number
DE69525824D1
DE69525824D1 DE69525824T DE69525824T DE69525824D1 DE 69525824 D1 DE69525824 D1 DE 69525824D1 DE 69525824 T DE69525824 T DE 69525824T DE 69525824 T DE69525824 T DE 69525824T DE 69525824 D1 DE69525824 D1 DE 69525824D1
Authority
DE
Germany
Prior art keywords
power mosfet
composite power
composite
mosfet
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69525824T
Other languages
English (en)
Other versions
DE69525824T2 (de
Inventor
Kozo Sakamoto
Shigeo Otaka
Kyouichi Takagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69525824D1 publication Critical patent/DE69525824D1/de
Publication of DE69525824T2 publication Critical patent/DE69525824T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
    • H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
    • H03K17/0822—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit in field-effect transistor switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
    • H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Logic Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electronic Switches (AREA)
DE69525824T 1994-12-14 1995-12-08 Zusammengesetzter Leistungs-MOSFET Expired - Fee Related DE69525824T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31015294A JP3485655B2 (ja) 1994-12-14 1994-12-14 複合型ｍｏｓｆｅｔ

Publications (2)

Publication Number Publication Date
DE69525824D1 true DE69525824D1 (de) 2002-04-18
DE69525824T2 DE69525824T2 (de) 2002-10-31

Family

ID=18001791

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69525824T Expired - Fee Related DE69525824T2 (de) 1994-12-14 1995-12-08 Zusammengesetzter Leistungs-MOSFET

Country Status (6)

Country Link
US (1) US5629542A (de)
EP (1) EP0717497B1 (de)
JP (1) JP3485655B2 (de)
KR (1) KR100390557B1 (de)
DE (1) DE69525824T2 (de)
TW (1) TW285768B (de)

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JP4504222B2 (ja) * 2005-02-21 2010-07-14 矢崎総業株式会社 過電流検出装置
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WO2007048196A1 (en) * 2005-10-26 2007-05-03 Sf2 Infrastructure Limited Mosfet circuits
DE102006006878A1 (de) * 2006-01-20 2007-07-26 Continental Teves Ag & Co. Ohg Schaltungsanordnung mit Rückspeiseschutz zum Schalten in Leistungsanwendungen
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JP5130906B2 (ja) * 2007-12-26 2013-01-30 サンケン電気株式会社 スイッチ装置
JP2008244487A (ja) * 2008-04-21 2008-10-09 Renesas Technology Corp 複合型ｍｏｓｆｅｔ
JP5493291B2 (ja) * 2008-05-12 2014-05-14 セイコーエプソン株式会社 半導体装置および電子機器
US7756173B2 (en) * 2008-06-20 2010-07-13 Alfrey Anthony J Laser diode driver with adaptive compliance voltage
US8183892B2 (en) 2009-06-05 2012-05-22 Fairchild Semiconductor Corporation Monolithic low impedance dual gate current sense MOSFET
JP2011066139A (ja) 2009-09-16 2011-03-31 Sanken Electric Co Ltd 複合半導体装置
JP2011182591A (ja) * 2010-03-02 2011-09-15 Panasonic Corp 半導体装置
US8537517B1 (en) * 2011-04-26 2013-09-17 Manufacturing Networks Incorporated System and method for fast-acting power protection
JP2013042270A (ja) * 2011-08-12 2013-02-28 Advanced Power Device Research Association トランジスタ回路、双方向スイッチ回路、ダイオード回路及びトランジスタ回路の製造方法
JP5990437B2 (ja) 2012-09-10 2016-09-14 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
US9245888B2 (en) * 2012-09-29 2016-01-26 Infineon Technologies Ag Reverse polarity protection for n-substrate high-side switches
KR101440892B1 (ko) * 2013-02-01 2014-09-18 삼성에스디아이 주식회사 캡 커버 및 이를 포함하는 배터리 팩
JP6215652B2 (ja) * 2013-10-28 2017-10-18 エスアイアイ・セミコンダクタ株式会社 基準電圧発生装置
JP6332601B2 (ja) * 2014-01-31 2018-05-30 アルプス電気株式会社 半導体集積回路装置
WO2016038721A1 (ja) * 2014-09-11 2016-03-17 三菱電機株式会社 半導体装置
US9484339B2 (en) 2014-11-26 2016-11-01 Infineon Technologies Ag Smart semiconductor switch
US10164447B2 (en) 2015-02-26 2018-12-25 Renesas Electronics Corporation Semiconductor chip, semiconductor device and battery pack
JP6480795B2 (ja) * 2015-04-16 2019-03-13 ルネサスエレクトロニクス株式会社 半導体装置およびそれを用いた回路装置
JP2017055255A (ja) 2015-09-09 2017-03-16 株式会社東芝 パワー半導体装置
JP6617002B2 (ja) * 2015-10-20 2019-12-04 株式会社 日立パワーデバイス 整流器、それを用いたオルタネータおよび電源
EP3179591A1 (de) * 2015-12-11 2017-06-14 HS Elektronik Systeme GmbH Festkörperleistungsregler
WO2017175326A1 (ja) * 2016-04-06 2017-10-12 新電元工業株式会社 パワーモジュール
DE102016114002A1 (de) 2016-07-29 2018-02-01 Eberspächer Controls Landau Gmbh & Co. Kg Trennschalteranordnung, insbesondere für ein Bordspannungssystem eines Fahrzeugs
US10978869B2 (en) * 2016-08-23 2021-04-13 Alpha And Omega Semiconductor Incorporated USB type-C load switch ESD protection
DE102016216508A1 (de) 2016-09-01 2018-03-01 Siemens Aktiengesellschaft Steuern eines Halbleiterschalters in einem Schaltbetrieb
US10079539B2 (en) 2017-02-01 2018-09-18 Dialog Semiconductor (Uk) Limited Power supply protection circuit
FR3068836B1 (fr) * 2017-07-07 2019-08-23 Stmicroelectronics (Rousset) Sas Circuit de protection d'un commutateur de puissance
US10962585B2 (en) * 2018-05-09 2021-03-30 Keithley Instruments, Llc Gate charge measurements using two source measure units
JP7094181B2 (ja) * 2018-08-29 2022-07-01 日清紡マイクロデバイス株式会社 負荷駆動回路
US11574902B2 (en) * 2019-01-31 2023-02-07 Texas Instruments Incorporated Clamp for power transistor device
JP7232208B2 (ja) * 2020-03-19 2023-03-02 株式会社東芝 半導体装置
JP2023032984A (ja) * 2021-08-27 2023-03-09 富士電機株式会社 半導体モジュール

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Also Published As

Publication number Publication date
KR100390557B1 (ko) 2003-09-03
EP0717497B1 (de) 2002-03-13
JP3485655B2 (ja) 2004-01-13
DE69525824T2 (de) 2002-10-31
EP0717497A3 (de) 1998-04-15
EP0717497A2 (de) 1996-06-19
KR960026762A (ko) 1996-07-22
TW285768B (de) 1996-09-11
US5629542A (en) 1997-05-13
JPH08167838A (ja) 1996-06-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee