DE69416012D1 - Verfahren zum Herstellen einer lichtemittierenden Diode mit transparentem Substrat - Google Patents

Verfahren zum Herstellen einer lichtemittierenden Diode mit transparentem Substrat

Info

Publication number
DE69416012D1
DE69416012D1 DE69416012T DE69416012T DE69416012D1 DE 69416012 D1 DE69416012 D1 DE 69416012D1 DE 69416012 T DE69416012 T DE 69416012T DE 69416012 T DE69416012 T DE 69416012T DE 69416012 D1 DE69416012 D1 DE 69416012D1
Authority
DE
Germany
Prior art keywords
manufacturing
light emitting
emitting diode
transparent substrate
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69416012T
Other languages
English (en)
Other versions
DE69416012T2 (de
Inventor
Masanori Watanabe
Haruhisa Takiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE69416012D1 publication Critical patent/DE69416012D1/de
Publication of DE69416012T2 publication Critical patent/DE69416012T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0093Wafer bonding; Removal of the growth substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
DE69416012T 1993-02-10 1994-02-08 Verfahren zum Herstellen einer lichtemittierenden Diode mit transparentem Substrat Expired - Lifetime DE69416012T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2294693 1993-02-10
JP32033493A JP3230638B2 (ja) 1993-02-10 1993-12-20 発光ダイオードの製造方法

Publications (2)

Publication Number Publication Date
DE69416012D1 true DE69416012D1 (de) 1999-03-04
DE69416012T2 DE69416012T2 (de) 1999-07-15

Family

ID=26360245

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69416012T Expired - Lifetime DE69416012T2 (de) 1993-02-10 1994-02-08 Verfahren zum Herstellen einer lichtemittierenden Diode mit transparentem Substrat

Country Status (4)

Country Link
US (1) US5403916A (de)
EP (1) EP0611131B1 (de)
JP (1) JP3230638B2 (de)
DE (1) DE69416012T2 (de)

Families Citing this family (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6590502B1 (en) * 1992-10-12 2003-07-08 911Ep, Inc. Led warning signal light and movable support
US5376580A (en) * 1993-03-19 1994-12-27 Hewlett-Packard Company Wafer bonding of light emitting diode layers
JPH077218A (ja) * 1993-06-15 1995-01-10 Sony Corp 半導体レーザ
FR2726126A1 (fr) * 1994-10-24 1996-04-26 Mitsubishi Electric Corp Procede de fabrication de dispositifs a diodes electroluminescentes a lumiere visible
DE4438598C2 (de) * 1994-10-28 2002-09-19 Huang Kuo Hsin Halbleiter-Wafer-Verbindungstechnologie unter Verwendung eines transparenten leitfähigen Films
JP3635757B2 (ja) * 1995-12-28 2005-04-06 昭和電工株式会社 AlGaInP発光ダイオード
JP3233569B2 (ja) * 1996-03-22 2001-11-26 シャープ株式会社 半導体発光素子
DE59814431D1 (de) * 1997-09-29 2010-03-25 Osram Opto Semiconductors Gmbh Halbleiterlichtquelle und Verfahren zu ihrer Herstellung
GB2330679B (en) 1997-10-21 2002-04-24 911 Emergency Products Inc Warning signal light
US7663607B2 (en) 2004-05-06 2010-02-16 Apple Inc. Multipoint touchscreen
US6380865B1 (en) 1999-04-06 2002-04-30 911 Emergency Products, Inc. Replacement led lamp assembly and modulated power intensity for light source
US6462669B1 (en) 1999-04-06 2002-10-08 E. P . Survivors Llc Replaceable LED modules
US6614359B2 (en) 1999-04-06 2003-09-02 911 Emergency Products, Inc. Replacement led lamp assembly and modulated power intensity for light source
US6258699B1 (en) * 1999-05-10 2001-07-10 Visual Photonics Epitaxy Co., Ltd. Light emitting diode with a permanent subtrate of transparent glass or quartz and the method for manufacturing the same
US6705745B1 (en) * 1999-06-08 2004-03-16 911Ep, Inc. Rotational led reflector
WO2000074975A1 (en) 1999-06-08 2000-12-14 911 Emergency Products, Inc. Strip led light assembly for motor vehicle
US6700502B1 (en) * 1999-06-08 2004-03-02 911Ep, Inc. Strip LED light assembly for motor vehicle
DE60042187D1 (de) 1999-06-09 2009-06-25 Toshiba Kawasaki Kk Bond-typ Halbleitersubstrat, lichtemittierendes Halbleiterbauelement und Herstellungsverfahren
JP4635079B2 (ja) * 1999-06-09 2011-02-16 株式会社東芝 半導体発光素子の製造方法
US20050057941A1 (en) * 1999-08-04 2005-03-17 911Ep, Inc. 360 Degree pod warning light signal
US6547410B1 (en) 2000-07-28 2003-04-15 911 Emergency Products, Inc. LED alley/take-down light
US20050047167A1 (en) * 1999-08-04 2005-03-03 Pederson John C. Warning signal light bar
US6367949B1 (en) 1999-08-04 2002-04-09 911 Emergency Products, Inc. Par 36 LED utility lamp
US6623151B2 (en) 1999-08-04 2003-09-23 911Ep, Inc. LED double light bar and warning light signal
WO2001095673A1 (en) 2000-06-06 2001-12-13 911 Emergency Products, Inc. Led compensation circuit
JP2002141556A (ja) 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
US7053419B1 (en) * 2000-09-12 2006-05-30 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
JP4091261B2 (ja) * 2000-10-31 2008-05-28 株式会社東芝 半導体発光素子及びその製造方法
TW474034B (en) * 2000-11-07 2002-01-21 United Epitaxy Co Ltd LED and the manufacturing method thereof
US6879263B2 (en) * 2000-11-15 2005-04-12 Federal Law Enforcement, Inc. LED warning light and communication system
US8188878B2 (en) * 2000-11-15 2012-05-29 Federal Law Enforcement Development Services, Inc. LED light communication system
US7439847B2 (en) 2002-08-23 2008-10-21 John C. Pederson Intelligent observation and identification database system
TW493286B (en) * 2001-02-06 2002-07-01 United Epitaxy Co Ltd Light-emitting diode and the manufacturing method thereof
DE10111501B4 (de) 2001-03-09 2019-03-21 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zu dessen Herstellung
JP2002299739A (ja) * 2001-04-02 2002-10-11 Pioneer Electronic Corp 窒化物半導体レーザ素子及びその製造方法
JP4080843B2 (ja) * 2002-10-30 2008-04-23 株式会社東芝 不揮発性半導体記憶装置
JP2004235465A (ja) * 2003-01-30 2004-08-19 Tokyo Electron Ltd 接合方法、接合装置及び封止部材
JP4140007B2 (ja) * 2003-04-28 2008-08-27 信越半導体株式会社 発光素子及び発光素子の製造方法
JP2005019695A (ja) * 2003-06-26 2005-01-20 Toshiba Corp 半導体発光装置
KR101034055B1 (ko) 2003-07-18 2011-05-12 엘지이노텍 주식회사 발광 다이오드 및 그 제조방법
US7511314B2 (en) 2003-10-16 2009-03-31 Shin-Etsu Handotai Co., Ltd. Light emitting device and method of fabricating the same
JP4393306B2 (ja) * 2003-10-30 2010-01-06 シャープ株式会社 半導体発光素子およびその製造方法並びに半導体装置
JP4332407B2 (ja) 2003-10-31 2009-09-16 シャープ株式会社 半導体発光素子及びその製造方法
WO2005043636A1 (ja) 2003-11-04 2005-05-12 Shin-Etsu Handotai Co., Ltd. 発光素子
US6969626B2 (en) * 2004-02-05 2005-11-29 Advanced Epitaxy Technology Method for forming LED by a substrate removal process
KR100813764B1 (ko) 2004-03-29 2008-03-13 쇼와 덴코 가부시키가이샤 화합물 반도체 발광 소자 및 그 제조 방법
JP4154731B2 (ja) * 2004-04-27 2008-09-24 信越半導体株式会社 発光素子の製造方法及び発光素子
JP4092658B2 (ja) * 2004-04-27 2008-05-28 信越半導体株式会社 発光素子の製造方法
JP4857596B2 (ja) * 2004-06-24 2012-01-18 豊田合成株式会社 発光素子の製造方法
JP2006066518A (ja) 2004-08-25 2006-03-09 Sharp Corp 半導体発光素子および半導体発光素子の製造方法
JP2006156950A (ja) * 2004-10-29 2006-06-15 Sharp Corp 半導体発光素子の製造方法
CN100377377C (zh) * 2004-10-29 2008-03-26 夏普株式会社 半导体发光元件的制造方法
US7419839B2 (en) 2004-11-12 2008-09-02 Philips Lumileds Lighting Company, Llc Bonding an optical element to a light emitting device
JP4584785B2 (ja) * 2005-06-30 2010-11-24 シャープ株式会社 半導体発光素子の製造方法
CN101218687B (zh) 2005-07-05 2012-07-04 昭和电工株式会社 发光二极管及其制造方法
JP4225510B2 (ja) 2005-07-06 2009-02-18 昭和電工株式会社 化合物半導体発光ダイオードおよびその製造方法
JP2007059873A (ja) * 2005-07-26 2007-03-08 Sharp Corp 半導体発光素子及びその製造方法
WO2007073001A1 (en) 2005-12-22 2007-06-28 Showa Denko K.K. Light-emitting diode and method for fabricant thereof
JP4952883B2 (ja) * 2006-01-17 2012-06-13 ソニー株式会社 半導体発光素子
WO2007083829A1 (en) * 2006-01-23 2007-07-26 Showa Denko K.K. Light-emitting diode and method for fabrication thereof
JP5021213B2 (ja) * 2006-01-23 2012-09-05 昭和電工株式会社 発光ダイオード及びその製造方法
WO2007091704A1 (en) 2006-02-08 2007-08-16 Showa Denko K.K. Light-emitting diode and fabrication method thereof
US8097892B2 (en) 2006-02-14 2012-01-17 Showa Denko K.K. Light-emitting diode
JP4933130B2 (ja) 2006-02-16 2012-05-16 昭和電工株式会社 GaN系半導体発光素子およびその製造方法
JP4852322B2 (ja) * 2006-03-03 2012-01-11 ローム株式会社 窒化物半導体発光素子及びその製造方法
KR100736623B1 (ko) 2006-05-08 2007-07-09 엘지전자 주식회사 수직형 발광 소자 및 그 제조방법
JP2008004587A (ja) * 2006-06-20 2008-01-10 Sharp Corp 半導体発光素子及びその製造方法並びに化合物半導体発光ダイオード
JP5306589B2 (ja) * 2006-11-17 2013-10-02 シャープ株式会社 半導体発光素子及びその製造方法
US9414458B2 (en) 2007-05-24 2016-08-09 Federal Law Enforcement Development Services, Inc. LED light control assembly and system
US9100124B2 (en) 2007-05-24 2015-08-04 Federal Law Enforcement Development Services, Inc. LED Light Fixture
US9258864B2 (en) 2007-05-24 2016-02-09 Federal Law Enforcement Development Services, Inc. LED light control and management system
US9455783B2 (en) 2013-05-06 2016-09-27 Federal Law Enforcement Development Services, Inc. Network security and variable pulse wave form with continuous communication
US9294198B2 (en) 2007-05-24 2016-03-22 Federal Law Enforcement Development Services, Inc. Pulsed light communication key
US11265082B2 (en) 2007-05-24 2022-03-01 Federal Law Enforcement Development Services, Inc. LED light control assembly and system
WO2008148050A1 (en) 2007-05-24 2008-12-04 Federal Law Enforcement Development Services, Inc. Led light interior room and building communication system
JP4892445B2 (ja) * 2007-10-01 2012-03-07 昭和電工株式会社 半導体発光素子および半導体発光素子の製造方法
TW201027594A (en) * 2009-01-07 2010-07-16 Advanced Optoelectronic Tech Method for bonding two matertials
US8058143B2 (en) 2009-01-21 2011-11-15 Freescale Semiconductor, Inc. Substrate bonding with metal germanium silicon material
JP2010192701A (ja) 2009-02-18 2010-09-02 Showa Denko Kk 発光ダイオード、発光ダイオードランプ及び発光ダイオードの製造方法
JP2010239098A (ja) 2009-03-10 2010-10-21 Showa Denko Kk 発光ダイオード、発光ダイオードランプ及び照明装置
US8890773B1 (en) 2009-04-01 2014-11-18 Federal Law Enforcement Development Services, Inc. Visible light transceiver glasses
JP5244703B2 (ja) 2009-05-22 2013-07-24 昭和電工株式会社 発光ダイオード及び発光ダイオードランプ、並びに照明装置
JP2011198962A (ja) * 2010-03-18 2011-10-06 Toshiba Corp 半導体発光素子の製造方法
JP5801542B2 (ja) 2010-07-13 2015-10-28 昭和電工株式会社 発光ダイオード及び発光ダイオードランプ
JP5593163B2 (ja) 2010-08-18 2014-09-17 昭和電工株式会社 発光ダイオード及び発光ダイオードランプ
CA2814119C (en) 2010-10-12 2017-01-17 Alliance For Sustainable Energy, Llc High bandgap iii-v alloys for high efficiency optoelectronics
CA2824756C (en) 2011-01-14 2014-12-23 Federal Law Enforcement Development Services, Inc. Method of providing lumens and tracking of lumen consumption
CN102222734B (zh) * 2011-07-07 2012-11-14 厦门市三安光电科技有限公司 一种倒置太阳能电池制作方法
US10056531B2 (en) 2011-08-26 2018-08-21 Lumileds Llc Method of processing a semiconductor structure
US9265112B2 (en) 2013-03-13 2016-02-16 Federal Law Enforcement Development Services, Inc. LED light control and management system
JP6299478B2 (ja) * 2013-06-26 2018-03-28 日亜化学工業株式会社 発光装置およびその製造方法
US20150198941A1 (en) 2014-01-15 2015-07-16 John C. Pederson Cyber Life Electronic Networking and Commerce Operating Exchange
US20170048953A1 (en) 2015-08-11 2017-02-16 Federal Law Enforcement Development Services, Inc. Programmable switch and system
US10651343B2 (en) 2017-02-28 2020-05-12 King Abdullah University Of Science And Technology Integration of III-nitride nanowire on transparent conductive substrates for optoelectronic and electronic devices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2617798B2 (ja) * 1989-09-22 1997-06-04 三菱電機株式会社 積層型半導体装置およびその製造方法
JP2894779B2 (ja) * 1990-03-26 1999-05-24 株式会社東芝 半導体発光素子およびその製造方法
US5103271A (en) * 1989-09-28 1992-04-07 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method of fabricating the same
US5008718A (en) * 1989-12-18 1991-04-16 Fletcher Robert M Light-emitting diode with an electrically conductive window

Also Published As

Publication number Publication date
JPH06296040A (ja) 1994-10-21
DE69416012T2 (de) 1999-07-15
JP3230638B2 (ja) 2001-11-19
EP0611131B1 (de) 1999-01-20
EP0611131A1 (de) 1994-08-17
US5403916A (en) 1995-04-04

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