DE69411836T2 - Verfahren zum Herstellen einer lichtemittierenden Halbleitervorrichtung - Google Patents
Verfahren zum Herstellen einer lichtemittierenden HalbleitervorrichtungInfo
- Publication number
- DE69411836T2 DE69411836T2 DE69411836T DE69411836T DE69411836T2 DE 69411836 T2 DE69411836 T2 DE 69411836T2 DE 69411836 T DE69411836 T DE 69411836T DE 69411836 T DE69411836 T DE 69411836T DE 69411836 T2 DE69411836 T2 DE 69411836T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- light emitting
- emitting device
- semiconductor light
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/099—LED, multicolor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/163—Thick-thin oxides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/958—Passivation layer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26190393A JP2817590B2 (ja) | 1993-09-24 | 1993-09-24 | 発光素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69411836D1 DE69411836D1 (de) | 1998-08-27 |
DE69411836T2 true DE69411836T2 (de) | 1999-03-18 |
Family
ID=17368360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69411836T Expired - Fee Related DE69411836T2 (de) | 1993-09-24 | 1994-09-23 | Verfahren zum Herstellen einer lichtemittierenden Halbleitervorrichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5459106A (de) |
EP (1) | EP0645829B1 (de) |
JP (1) | JP2817590B2 (de) |
DE (1) | DE69411836T2 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004029412A1 (de) * | 2004-02-27 | 2005-10-13 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines solchen Halbleiterchips |
US7667240B2 (en) | 2003-06-30 | 2010-02-23 | Osram Opto Semiconductors Gmbh | Radiation-emitting semiconductor chip and method for producing such a semiconductor chip |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6013540A (en) * | 1998-05-01 | 2000-01-11 | Lucent Technologies, Inc. | Laser diode with substrate-side protection |
US6201264B1 (en) * | 1999-01-14 | 2001-03-13 | Lumileds Lighting, U.S., Llc | Advanced semiconductor devices fabricated with passivated high aluminum content III-V materials |
DE10261675B4 (de) * | 2002-12-31 | 2013-08-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit strahlungsdurchlässiger elektrischer Kontaktschicht |
CN100460942C (zh) * | 2004-06-02 | 2009-02-11 | 中芯国际集成电路制造(上海)有限公司 | 硅上液晶器件及其制造方法 |
JP5244703B2 (ja) | 2009-05-22 | 2013-07-24 | 昭和電工株式会社 | 発光ダイオード及び発光ダイオードランプ、並びに照明装置 |
CN102610708B (zh) * | 2011-01-19 | 2014-09-03 | 鼎元光电科技股份有限公司 | 发光二极管的制法 |
CN112259450A (zh) * | 2020-09-18 | 2021-01-22 | 厦门市三安集成电路有限公司 | 一种分段式蚀刻方法 |
CN114188458B (zh) * | 2021-12-02 | 2023-05-02 | 重庆康佳光电技术研究院有限公司 | 一种发光二极管的制作方法及发光二极管 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3914465A (en) * | 1972-09-25 | 1975-10-21 | Bell Telephone Labor Inc | Surface passivation of GaAs junction laser devices |
JPS4995592A (de) * | 1973-01-12 | 1974-09-10 | ||
JPS4995591A (de) * | 1973-01-12 | 1974-09-10 | ||
JPS5816535A (ja) * | 1981-07-23 | 1983-01-31 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
FI64878C (fi) * | 1982-05-10 | 1984-01-10 | Lohja Ab Oy | Kombinationsfilm foer isynnerhet tunnfilmelektroluminensstrukturer |
JPS6413740A (en) * | 1987-03-23 | 1989-01-18 | Toshiba Corp | Formation of wiring layer in semiconductor device |
JP2559536B2 (ja) * | 1990-12-17 | 1996-12-04 | 信越半導体株式会社 | 発光素子の製造方法 |
US5262360A (en) * | 1990-12-31 | 1993-11-16 | The Board Of Trustees Of The University Of Illinois | AlGaAs native oxide |
JPH05129662A (ja) * | 1991-10-31 | 1993-05-25 | Iwasaki Electric Co Ltd | 発光ダイオードランプの製造方法 |
-
1993
- 1993-09-24 JP JP26190393A patent/JP2817590B2/ja not_active Expired - Lifetime
-
1994
- 1994-09-22 US US08/310,088 patent/US5459106A/en not_active Expired - Fee Related
- 1994-09-23 DE DE69411836T patent/DE69411836T2/de not_active Expired - Fee Related
- 1994-09-23 EP EP94115044A patent/EP0645829B1/de not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7667240B2 (en) | 2003-06-30 | 2010-02-23 | Osram Opto Semiconductors Gmbh | Radiation-emitting semiconductor chip and method for producing such a semiconductor chip |
DE102004029412A1 (de) * | 2004-02-27 | 2005-10-13 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines solchen Halbleiterchips |
Also Published As
Publication number | Publication date |
---|---|
EP0645829A1 (de) | 1995-03-29 |
JP2817590B2 (ja) | 1998-10-30 |
EP0645829B1 (de) | 1998-07-22 |
US5459106A (en) | 1995-10-17 |
JPH0794777A (ja) | 1995-04-07 |
DE69411836D1 (de) | 1998-08-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |