DE69607817D1 - Ausrichtung einer Leuchtdiodenanordnung - Google Patents

Ausrichtung einer Leuchtdiodenanordnung

Info

Publication number
DE69607817D1
DE69607817D1 DE69607817T DE69607817T DE69607817D1 DE 69607817 D1 DE69607817 D1 DE 69607817D1 DE 69607817 T DE69607817 T DE 69607817T DE 69607817 T DE69607817 T DE 69607817T DE 69607817 D1 DE69607817 D1 DE 69607817D1
Authority
DE
Germany
Prior art keywords
alignment
light emitting
emitting diode
diode arrangement
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69607817T
Other languages
English (en)
Other versions
DE69607817T2 (de
Inventor
Masumi Koizumi
Yukio Nakamura
Masaharu Nobori
Aya Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Publication of DE69607817D1 publication Critical patent/DE69607817D1/de
Application granted granted Critical
Publication of DE69607817T2 publication Critical patent/DE69607817T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Devices (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Record Information Processing For Printing (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69607817T 1995-12-26 1996-12-19 Ausrichtung einer Leuchtdiodenanordnung Expired - Lifetime DE69607817T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33861795A JP3258221B2 (ja) 1995-12-26 1995-12-26 位置合わせ用の認識マークおよびその形成方法、認識マークおよび発光部の形成の兼用マスク、位置合わせ用の認識マークを用いた位置合わせ方法

Publications (2)

Publication Number Publication Date
DE69607817D1 true DE69607817D1 (de) 2000-05-25
DE69607817T2 DE69607817T2 (de) 2000-11-16

Family

ID=18319870

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69607817T Expired - Lifetime DE69607817T2 (de) 1995-12-26 1996-12-19 Ausrichtung einer Leuchtdiodenanordnung

Country Status (4)

Country Link
US (2) US5943586A (de)
EP (1) EP0781660B1 (de)
JP (1) JP3258221B2 (de)
DE (1) DE69607817T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5821567A (en) * 1995-12-13 1998-10-13 Oki Electric Industry Co., Ltd. High-resolution light-sensing and light-emitting diode array
JP2000124158A (ja) * 1998-10-13 2000-04-28 Mitsubishi Electric Corp 半導体ウェハ及び半導体装置
CN1321339A (zh) * 1999-09-06 2001-11-07 日本板硝子株式会社 自扫描型发光装置的掩模图形设计方法
JP2003282939A (ja) * 2002-03-26 2003-10-03 Oki Degital Imaging:Kk 半導体発光装置及びその製造方法
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
GB2414214B (en) * 2004-05-19 2008-01-09 Intense Photonics Ltd Printing with laser activation
US7411601B2 (en) 2004-08-03 2008-08-12 Seiko Epson Corporation Exposure head
JP2006043987A (ja) * 2004-08-03 2006-02-16 Seiko Epson Corp 露光ヘッド
DE102004056252A1 (de) * 2004-10-29 2006-05-04 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung, Kfz-Scheinwerfer und Verfahren zur Herstellung einer Beleuchtungseinrichtung
JP2006339418A (ja) * 2005-06-02 2006-12-14 Seiko Epson Corp 光素子及びその製造方法
TWI397199B (zh) * 2005-06-21 2013-05-21 Japan Science & Tech Agency 用於製造經偏光發光二極體之封裝技術
US20070029555A1 (en) * 2005-08-04 2007-02-08 Lester Steven D Edge-emitting LED light source
US8748909B2 (en) * 2006-11-03 2014-06-10 Apple Inc. Display system
US8169388B2 (en) 2007-07-02 2012-05-01 Apple Inc. Color correction apparatus
TWI344687B (en) * 2007-07-30 2011-07-01 Advanced Semiconductor Eng Substrate for inspecting thickness of the contact and a inspecting method thereof
US9593810B2 (en) * 2007-09-20 2017-03-14 Koninklijke Philips N.V. LED package and method for manufacturing the LED package
JP5020137B2 (ja) * 2008-03-19 2012-09-05 株式会社沖データ 半導体装置の製造方法、ｌｅｄヘッドの製造方法及び画像形成装置の製造方法
US20100213869A1 (en) * 2009-02-24 2010-08-26 Andrew Locke Illumination device
AT513747B1 (de) 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Bestückungsverfahren für Schaltungsträger und Schaltungsträger
US8901715B1 (en) 2013-07-05 2014-12-02 Infineon Technologies Ag Method for manufacturing a marked single-crystalline substrate and semiconductor device with marking
JP6450923B2 (ja) * 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置
JP6293899B2 (ja) 2014-08-04 2018-03-14 富士機械製造株式会社 実装装置
JP6398443B2 (ja) * 2014-08-07 2018-10-03 富士ゼロックス株式会社 発光素子の相対位置の判断装置及び発光基板の製造装置並びに発光素子の相対位置の判断方法及び発光基板の製造装置
WO2018155089A1 (ja) * 2017-02-23 2018-08-30 株式会社村田製作所 電子部品、電子機器および電子部品の実装方法
US11296262B2 (en) 2017-12-21 2022-04-05 Lumileds Llc Monolithic segmented LED array architecture with reduced area phosphor emission surface

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59164161A (ja) * 1983-03-09 1984-09-17 Mitsubishi Electric Corp 発光ダイオ−ドアレイヘツド
JP2639646B2 (ja) * 1986-07-23 1997-08-13 京セラ株式会社 光プリンタヘツド
GB2210500A (en) * 1987-09-30 1989-06-07 Plessey Co Plc Method of alignment of led chips
US4893163A (en) * 1988-03-28 1990-01-09 International Business Machines Corporation Alignment mark system for electron beam/optical mixed lithography
US4942405A (en) * 1988-10-11 1990-07-17 Hewlett-Packard Company Light emitting diode print head assembly
US5173759A (en) * 1990-02-06 1992-12-22 Kyocera Corporation Array of light emitting devices or photo detectors with marker regions
US5042709A (en) * 1990-06-22 1991-08-27 International Business Machines Corporation Methods and apparatus for precise alignment of objects
EP0507599B1 (de) * 1991-04-03 1997-10-15 Sharp Kabushiki Kaisha Vorrichtung zur Montage optischer Geräte
JPH05190899A (ja) * 1992-01-14 1993-07-30 Rohm Co Ltd 半導体素子アレイチップ及びその製造方法
JPH06286218A (ja) * 1993-04-02 1994-10-11 Sanyo Electric Co Ltd 光プリントヘッド
JP3537881B2 (ja) * 1994-03-29 2004-06-14 株式会社リコー Ｌｅｄアレイヘッド
US5679588A (en) * 1995-10-05 1997-10-21 Integrated Device Technology, Inc. Method for fabricating P-wells and N-wells having optimized field and active regions

Also Published As

Publication number Publication date
JPH09174920A (ja) 1997-07-08
EP0781660B1 (de) 2000-04-19
EP0781660A1 (de) 1997-07-02
US6023104A (en) 2000-02-08
US5943586A (en) 1999-08-24
DE69607817T2 (de) 2000-11-16
JP3258221B2 (ja) 2002-02-18

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