DE69331554D1 - Lichtemittierende Diode - Google Patents

Lichtemittierende Diode

Info

Publication number
DE69331554D1
DE69331554D1 DE69331554T DE69331554T DE69331554D1 DE 69331554 D1 DE69331554 D1 DE 69331554D1 DE 69331554 T DE69331554 T DE 69331554T DE 69331554 T DE69331554 T DE 69331554T DE 69331554 D1 DE69331554 D1 DE 69331554D1
Authority
DE
Germany
Prior art keywords
light emitting
emitting diode
diode
light
emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE69331554T
Other languages
English (en)
Other versions
DE69331554T2 (de
Inventor
Shane Harrah
Trevor J Smith
John Uebbing
Thomas Fajardo
Jerry D Kreger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25462860&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69331554(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Application granted granted Critical
Publication of DE69331554D1 publication Critical patent/DE69331554D1/de
Publication of DE69331554T2 publication Critical patent/DE69331554T2/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/385—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending at least partially onto a side surface of the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1768—Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
DE69331554T 1992-08-20 1993-08-02 Lichtemittierende Diode Revoked DE69331554T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/932,754 US5265792A (en) 1992-08-20 1992-08-20 Light source and technique for mounting light emitting diodes

Publications (2)

Publication Number Publication Date
DE69331554D1 true DE69331554D1 (de) 2002-03-21
DE69331554T2 DE69331554T2 (de) 2002-07-11

Family

ID=25462860

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69332570T Revoked DE69332570T2 (de) 1992-08-20 1993-08-02 Lichtquelle und Verfahren zur Montage lichtemittierender Dioden
DE69331554T Revoked DE69331554T2 (de) 1992-08-20 1993-08-02 Lichtemittierende Diode
DE69329522T Expired - Fee Related DE69329522T2 (de) 1992-08-20 1993-08-02 Verfahren zur Montage von Halbleiterchips

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69332570T Revoked DE69332570T2 (de) 1992-08-20 1993-08-02 Lichtquelle und Verfahren zur Montage lichtemittierender Dioden

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69329522T Expired - Fee Related DE69329522T2 (de) 1992-08-20 1993-08-02 Verfahren zur Montage von Halbleiterchips

Country Status (7)

Country Link
US (2) US5265792A (de)
EP (3) EP0739043B1 (de)
JP (1) JP3345124B2 (de)
KR (1) KR100297453B1 (de)
CN (1) CN1050936C (de)
DE (3) DE69332570T2 (de)
TW (1) TW243557B (de)

Families Citing this family (114)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6590502B1 (en) 1992-10-12 2003-07-08 911Ep, Inc. Led warning signal light and movable support
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
JP3127195B2 (ja) * 1994-12-06 2001-01-22 シャープ株式会社 発光デバイスおよびその製造方法
DE19549726B4 (de) * 1994-12-06 2010-04-22 Sharp K.K. Lichtemittierendes Bauelement und Herstellverfahren für dieses
KR100264424B1 (ko) * 1995-06-21 2000-08-16 사토 게니치로 발광 다이오드칩 및 이를 사용한 발광 다이오드
US6875620B1 (en) * 1996-10-31 2005-04-05 Agilent Technologies, Inc. Tiling process for constructing a chemical array
JPH10150223A (ja) * 1996-11-15 1998-06-02 Rohm Co Ltd チップ型発光素子
KR100279368B1 (ko) 1996-11-15 2001-01-15 가와다 미쓰구 칩부품공급장치및이에사용되는흡착플레이트
US5833903A (en) * 1996-12-10 1998-11-10 Great American Gumball Corporation Injection molding encapsulation for an electronic device directly onto a substrate
JP3337405B2 (ja) * 1996-12-27 2002-10-21 シャープ株式会社 発光表示素子およびその電気配線基板への接続方法ならびに製造方法
US5812272A (en) * 1997-01-30 1998-09-22 Hewlett-Packard Company Apparatus and method with tiled light source array for integrated assay sensing
US6087680A (en) * 1997-01-31 2000-07-11 Siemens Aktiengesellschaft Led device
US6093940A (en) * 1997-04-14 2000-07-25 Rohm Co., Ltd. Light-emitting diode chip component and a light-emitting device
US6031958A (en) * 1997-05-21 2000-02-29 Mcgaffigan; Thomas H. Optical light pipes with laser light appearance
EP1014455B1 (de) 1997-07-25 2006-07-12 Nichia Corporation Halbleitervorrichtung aus einer nitridverbindung
US6081243A (en) * 1997-09-09 2000-06-27 Micron Technology, Inc. Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices
GB2329756A (en) 1997-09-25 1999-03-31 Univ Bristol Assemblies of light emitting diodes
GB2330679B (en) 1997-10-21 2002-04-24 911 Emergency Products Inc Warning signal light
US6200134B1 (en) 1998-01-20 2001-03-13 Kerr Corporation Apparatus and method for curing materials with radiation
JP3770014B2 (ja) 1999-02-09 2006-04-26 日亜化学工業株式会社 窒化物半導体素子
KR100683877B1 (ko) 1999-03-04 2007-02-15 니치아 카가쿠 고교 가부시키가이샤 질화물 반도체 레이저소자
JP4061005B2 (ja) 1999-03-31 2008-03-12 シャープ株式会社 発光ダイオードおよびその製造方法並びに発光ダイオードの電気配線基板への搭載方法
US6380865B1 (en) 1999-04-06 2002-04-30 911 Emergency Products, Inc. Replacement led lamp assembly and modulated power intensity for light source
US6614359B2 (en) 1999-04-06 2003-09-02 911 Emergency Products, Inc. Replacement led lamp assembly and modulated power intensity for light source
US6462669B1 (en) 1999-04-06 2002-10-08 E. P . Survivors Llc Replaceable LED modules
US6700502B1 (en) 1999-06-08 2004-03-02 911Ep, Inc. Strip LED light assembly for motor vehicle
WO2000074972A1 (en) 1999-06-08 2000-12-14 911 Emergency Products, Inc. Led light stick assembly
US6705745B1 (en) 1999-06-08 2004-03-16 911Ep, Inc. Rotational led reflector
US6367949B1 (en) 1999-08-04 2002-04-09 911 Emergency Products, Inc. Par 36 LED utility lamp
US6547410B1 (en) 2000-07-28 2003-04-15 911 Emergency Products, Inc. LED alley/take-down light
DE19945131A1 (de) * 1999-09-21 2001-04-12 Osram Opto Semiconductors Gmbh Elektronisches Bauelement und Beschichtungs-Mittel
US6885035B2 (en) * 1999-12-22 2005-04-26 Lumileds Lighting U.S., Llc Multi-chip semiconductor LED assembly
JP2001320168A (ja) 2000-03-02 2001-11-16 Murata Mfg Co Ltd 配線基板およびその製造方法、ならびにそれを用いた電子装置
DE10164879B4 (de) * 2000-03-02 2006-06-08 Murata Manufacturing Co., Ltd., Nagaokakyo Verdrahtungssubstrat
US7320593B2 (en) 2000-03-08 2008-01-22 Tir Systems Ltd. Light emitting diode light source for curing dental composites
JP2001345485A (ja) * 2000-06-02 2001-12-14 Toyoda Gosei Co Ltd 発光装置
US6590343B2 (en) 2000-06-06 2003-07-08 911Ep, Inc. LED compensation circuit
EP1300066A4 (de) * 2000-07-07 2008-05-21 Kinpara Shiro Verfahren zur pflanzenproduktion, pflanzenzuchtanlage und leuchttafeln
AT413062B (de) * 2000-07-12 2005-10-15 Tridonic Optoelectronics Gmbh Verfahren zur herstellung einer led-lichtquelle
DE10041328B4 (de) * 2000-08-23 2018-04-05 Osram Opto Semiconductors Gmbh Verpackungseinheit für Halbleiterchips
US6879263B2 (en) 2000-11-15 2005-04-12 Federal Law Enforcement, Inc. LED warning light and communication system
US7439847B2 (en) 2002-08-23 2008-10-21 John C. Pederson Intelligent observation and identification database system
US8188878B2 (en) 2000-11-15 2012-05-29 Federal Law Enforcement Development Services, Inc. LED light communication system
JP2002222992A (ja) * 2001-01-25 2002-08-09 Rohm Co Ltd Ｌｅｄ発光素子、およびｌｅｄ発光装置
TW575652B (en) * 2001-03-07 2004-02-11 Matsushita Electric Ind Co Ltd Light-emitting device
US6576488B2 (en) * 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
US6888167B2 (en) 2001-07-23 2005-05-03 Cree, Inc. Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
US6747298B2 (en) * 2001-07-23 2004-06-08 Cree, Inc. Collets for bonding of light emitting diodes having shaped substrates
JP2003309292A (ja) * 2002-04-15 2003-10-31 Citizen Electronics Co Ltd 表面実装型発光ダイオードのメタルコア基板及びその製造方法
US7043881B2 (en) * 2002-06-14 2006-05-16 Tem-Pace, Inc. Insulated glass assembly with an internal lighting system
DE10228446A1 (de) * 2002-06-26 2004-01-15 Hella Kg Hueck & Co. Anordnung mit elektrischen Bauteilen
AU2003265308A1 (en) 2002-07-25 2004-02-16 Jonathan S. Dahm Method and apparatus for using light emitting diodes for curing
US7182597B2 (en) * 2002-08-08 2007-02-27 Kerr Corporation Curing light instrument
WO2004038759A2 (en) 2002-08-23 2004-05-06 Dahm Jonathan S Method and apparatus for using light emitting diodes
JP4080843B2 (ja) 2002-10-30 2008-04-23 株式会社東芝 不揮発性半導体記憶装置
AU2003297588A1 (en) 2002-12-02 2004-06-23 3M Innovative Properties Company Illumination system using a plurality of light sources
US7541152B2 (en) * 2002-12-24 2009-06-02 Agilent Technologies, Inc. Integrated light source for diagnostic arrays
JP2004356506A (ja) * 2003-05-30 2004-12-16 Stanley Electric Co Ltd ガラス封止型発光ダイオード
US7280812B2 (en) * 2003-06-06 2007-10-09 Interdigital Technology Corporation Digital baseband receiver with DC discharge and gain control circuits
US7915085B2 (en) * 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US7157744B2 (en) * 2003-10-29 2007-01-02 M/A-Com, Inc. Surface mount package for a high power light emitting diode
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US20050278301A1 (en) * 2004-05-26 2005-12-15 Castellanos Maria G System and method for determining an optimized process configuration
ATE553505T1 (de) 2004-06-15 2012-04-15 Data Cloak Llc Elektro-optische hochleistungs-led-anordnung
ATE549745T1 (de) * 2005-04-21 2012-03-15 Fiat Ricerche Durchsichtige head-up-led-anzeigevorrichtung
EP1715522B1 (de) 2005-04-21 2010-02-17 C.R.F. Società Consortile per Azioni Durchsichtige LED-Anzeigevorrichtung
CN100452452C (zh) * 2005-05-17 2009-01-14 财团法人工业技术研究院 备有发光二极管的翻转侧置结构的发光装置
US8113830B2 (en) * 2005-05-27 2012-02-14 Kerr Corporation Curing light instrument
FR2892594B1 (fr) * 2005-10-21 2007-12-07 Saint Gobain Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications
TWI306652B (en) * 2005-10-28 2009-02-21 Chipmos Technologies Inc Light emitting diode package structure
JP2007234681A (ja) * 2006-02-27 2007-09-13 Apic Yamada Corp 半導体製造装置
TWI302043B (en) * 2006-06-27 2008-10-11 Everlight Electronics Co Ltd Base structure for ultra-thin light-emitting diode and manufacturing method thereof
TWI350409B (en) * 2006-07-06 2011-10-11 Nat Univ Chung Hsing Flexible and could be rolling-up area lights module and the method of producing thereof
US8047686B2 (en) 2006-09-01 2011-11-01 Dahm Jonathan S Multiple light-emitting element heat pipe assembly
WO2008069605A1 (en) * 2006-12-08 2008-06-12 Seoul Semiconductor Co., Ltd. Light emitting device
KR101456266B1 (ko) * 2006-12-08 2014-11-04 서울반도체 주식회사 발광소자
EP2111137A4 (de) * 2007-02-12 2013-03-06 Ge Lighting Solutions Llc Led-beleuchtungssysteme für produktvitrinen
US9455783B2 (en) 2013-05-06 2016-09-27 Federal Law Enforcement Development Services, Inc. Network security and variable pulse wave form with continuous communication
US11265082B2 (en) 2007-05-24 2022-03-01 Federal Law Enforcement Development Services, Inc. LED light control assembly and system
US9414458B2 (en) 2007-05-24 2016-08-09 Federal Law Enforcement Development Services, Inc. LED light control assembly and system
US9100124B2 (en) 2007-05-24 2015-08-04 Federal Law Enforcement Development Services, Inc. LED Light Fixture
US9258864B2 (en) 2007-05-24 2016-02-09 Federal Law Enforcement Development Services, Inc. LED light control and management system
US9294198B2 (en) 2007-05-24 2016-03-22 Federal Law Enforcement Development Services, Inc. Pulsed light communication key
US8687965B2 (en) 2007-05-24 2014-04-01 Federal Law Enforcement Development Services, Inc. LED light dongle communication system
EP2009344A1 (de) * 2007-06-25 2008-12-31 Alcan Technology & Management AG Flächige Beleuchtungseinrichtung, Herstellungsverfahren für eine flächige Beleuchtungseinrichtung
US8274241B2 (en) * 2008-02-06 2012-09-25 C. Crane Company, Inc. Light emitting diode lighting device
US8350499B2 (en) * 2008-02-06 2013-01-08 C. Crane Company, Inc. High efficiency power conditioning circuit for lighting device
TWI362769B (en) 2008-05-09 2012-04-21 Univ Nat Chiao Tung Light emitting device and fabrication method therefor
DE102008030843B4 (de) * 2008-06-30 2021-08-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Anordnung sowie Verfahren zur Herstellung einer optoelektronischen Anordnung
FR2937464B1 (fr) * 2008-10-21 2011-02-25 Commissariat Energie Atomique Assemblage d'une puce microelectronique a rainure avec un element filaire sous forme de toron et procede d'assemblage
US8890773B1 (en) 2009-04-01 2014-11-18 Federal Law Enforcement Development Services, Inc. Visible light transceiver glasses
US9066777B2 (en) 2009-04-02 2015-06-30 Kerr Corporation Curing light device
US9072572B2 (en) 2009-04-02 2015-07-07 Kerr Corporation Dental light device
TWI556696B (zh) * 2009-07-14 2016-11-01 蔡乃成 表面黏著型發光元件燈組之製造方法
JP2011211047A (ja) * 2010-03-30 2011-10-20 Sharp Corp 表示装置、表示装置の製造方法および表示装置の駆動方法
WO2011111516A1 (ja) 2010-03-12 2011-09-15 シャープ株式会社 発光装置の製造方法、発光装置、照明装置、バックライト、液晶パネル、表示装置、表示装置の製造方法、表示装置の駆動方法および液晶表示装置
US9222645B2 (en) 2010-11-29 2015-12-29 RTC Industries, Incorporated LED lighting assembly and method of lighting for a merchandise display
US11274808B2 (en) 2010-06-17 2022-03-15 Rtc Industries, Inc. LED lighting assembly and method of lighting for a merchandise display
WO2012097291A1 (en) 2011-01-14 2012-07-19 Federal Law Enforcement Development Services, Inc. Method of providing lumens and tracking of lumen consumption
KR101824011B1 (ko) * 2011-07-29 2018-01-31 엘지이노텍 주식회사 발광소자 패키지
US9194556B1 (en) 2012-02-22 2015-11-24 Theodore G. Nelson Method of producing LED lighting apparatus and apparatus produced thereby
TW201425795A (zh) * 2012-12-25 2014-07-01 Hon Hai Prec Ind Co Ltd Led燈條製作方法
US9265112B2 (en) 2013-03-13 2016-02-16 Federal Law Enforcement Development Services, Inc. LED light control and management system
US20150198941A1 (en) 2014-01-15 2015-07-16 John C. Pederson Cyber Life Electronic Networking and Commerce Operating Exchange
US9502625B2 (en) 2014-06-06 2016-11-22 Rohinni, LLC Electrophotographic deposition of unpackaged semiconductor device
US9989223B1 (en) * 2015-03-09 2018-06-05 Automated Assembly Corporation LED lighting apparatus with LEDs and wires attached to metal sheet member by adhesive
US20170048953A1 (en) 2015-08-11 2017-02-16 Federal Law Enforcement Development Services, Inc. Programmable switch and system
DE102016122810A1 (de) 2016-11-25 2018-05-30 Osram Opto Semiconductors Gmbh Bauteil mit einem lichtemittierenden halbleiterchip
US10566507B2 (en) 2017-01-12 2020-02-18 Rohinini, LLC Apparatus for high speed printing of semiconductor devices
WO2019177755A1 (en) * 2018-03-13 2019-09-19 Apple Inc. Displays with direct-lit backlight units
US11592706B2 (en) 2021-04-16 2023-02-28 Apple Inc. Displays with direct-lit backlight units
US11526051B2 (en) 2021-04-16 2022-12-13 Apple Inc. Displays with direct-lit backlight units
US11874559B2 (en) 2021-09-23 2024-01-16 Apple Inc. Display modules with direct-lit backlight units

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1407908A (en) * 1972-04-14 1975-10-01 Sony Corp Alpha-numeric character display devices
DE2402717A1 (de) * 1973-01-22 1974-08-08 Tokyo Shibaura Electric Co Lichtemittierende anzeigevorrichtung und verfahren zu ihrer herstellung
US3877052A (en) * 1973-12-26 1975-04-08 Bell Telephone Labor Inc Light-emitting semiconductor apparatus for optical fibers
US3936694A (en) * 1973-12-28 1976-02-03 Sony Corporation Display structure having light emitting diodes
US4024627A (en) * 1974-04-29 1977-05-24 Amp Incorporated Package mounting of electronic chips, such as light emitting diodes
US4249299A (en) * 1979-03-05 1981-02-10 Hughes Aircraft Company Edge-around leads for backside connections to silicon circuit die
JPS553690A (en) * 1979-04-04 1980-01-11 Toshiba Corp Semiconductor luminous indicator
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
JPS5749284A (en) * 1980-09-09 1982-03-23 Matsushita Electric Ind Co Ltd Manufacture of light-emitting display device
US4843036A (en) * 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices
DE8711105U1 (de) * 1987-08-14 1987-11-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
US4850780A (en) * 1987-09-28 1989-07-25 Kulicke And Soffa Industries Inc. Pre-peel die ejector apparatus
GB2223429B (en) * 1988-08-24 1993-02-17 Tdk Corp Apparatus for and method of automatically mounting electronic component on printed circuit board
FR2637150B1 (fr) * 1988-09-23 1995-07-28 Neiman Sa Reseau de diodes electroluminescentes

Also Published As

Publication number Publication date
EP0739043B1 (de) 2002-02-06
US5475241A (en) 1995-12-12
KR940004877A (ko) 1994-03-16
DE69331554T2 (de) 2002-07-11
CN1050936C (zh) 2000-03-29
EP0843365A3 (de) 1998-11-11
US5265792A (en) 1993-11-30
EP0588040B1 (de) 2000-10-04
CN1086046A (zh) 1994-04-27
EP0843365B1 (de) 2002-12-11
EP0739043A3 (de) 1997-10-29
DE69332570T2 (de) 2003-09-25
DE69329522D1 (de) 2000-11-09
EP0588040A2 (de) 1994-03-23
EP0739043A2 (de) 1996-10-23
KR100297453B1 (ko) 2001-10-24
EP0843365A2 (de) 1998-05-20
EP0588040A3 (de) 1994-04-06
TW243557B (de) 1995-03-21
DE69332570D1 (de) 2003-01-23
JPH06177435A (ja) 1994-06-24
DE69329522T2 (de) 2001-05-17
JP3345124B2 (ja) 2002-11-18

Similar Documents

Publication Publication Date Title
DE69331554D1 (de) Lichtemittierende Diode
DE69127677D1 (de) Lichtemittierende Halbleiterdioden
DE69737733D1 (de) Lichtemittierende Diode
GB9416117D0 (en) Light emitting diode
DE68925634T2 (de) Lichtemittierendes Element
ITMI932600A0 (it) Sorgenti luminose elettroluminescenti
DE69331654T2 (de) Vorrichtung mit lichtemittierender Diode
DE69314816D1 (de) Lichtemittierende Halbleitervorrichtung
DE69308045T2 (de) Lichtemittierende Halbleitervorrichtung
KR900012393A (ko) 발광소자
DE69313033T2 (de) Lichtemittierende Vorrichtung
DE59400463D1 (de) Lichtemittierendes Halbleiterbauelement
KR900003793U (ko) 발광 다이오드 어레이
DE69404911D1 (de) Lichtemittierende Halbleitervorrichtung
DE69512422D1 (de) Licht im mittelinfrarotbereich emittierende diode
KR970003715U (ko) 표면실장용 발광소자
KR900011056A (ko) 발광다이오드
KR940019666U (ko) 발광다이오드를 이용한 간판
KR950009711U (ko) 발광다이오드를 이용한 램프
KR930017411U (ko) 발광다이오드의 고정구조
KR970015681U (ko) 발광 다이오드
KR960013308U (ko) 발광 다이오드가 결합된 귀이개
KR920010799U (ko) 발광다이오드용 홀더
KR950034688U (ko) 발광다이오드 홀더
KR950034669U (ko) 발광 다이오드의 고정구조

Legal Events

Date Code Title Description
8363 Opposition against the patent
8331 Complete revocation