DE69332570T2 - Lichtquelle und Verfahren zur Montage lichtemittierender Dioden - Google Patents

Lichtquelle und Verfahren zur Montage lichtemittierender Dioden

Info

Publication number
DE69332570T2
DE69332570T2 DE69332570T DE69332570T DE69332570T2 DE 69332570 T2 DE69332570 T2 DE 69332570T2 DE 69332570 T DE69332570 T DE 69332570T DE 69332570 T DE69332570 T DE 69332570T DE 69332570 T2 DE69332570 T2 DE 69332570T2
Authority
DE
Germany
Prior art keywords
emitting diodes
light source
light emitting
assembling
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE69332570T
Other languages
English (en)
Other versions
DE69332570D1 (de
Inventor
Shane Harrah
Trevor J Smith
John Uebbing
Thomas Fajardo
Jerry D Kreger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25462860&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69332570(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of DE69332570D1 publication Critical patent/DE69332570D1/de
Application granted granted Critical
Publication of DE69332570T2 publication Critical patent/DE69332570T2/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/385—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending at least partially onto a side surface of the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1768—Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
DE69332570T 1992-08-20 1993-08-02 Lichtquelle und Verfahren zur Montage lichtemittierender Dioden Revoked DE69332570T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/932,754 US5265792A (en) 1992-08-20 1992-08-20 Light source and technique for mounting light emitting diodes

Publications (2)

Publication Number Publication Date
DE69332570D1 DE69332570D1 (de) 2003-01-23
DE69332570T2 true DE69332570T2 (de) 2003-09-25

Family

ID=25462860

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69329522T Expired - Fee Related DE69329522T2 (de) 1992-08-20 1993-08-02 Verfahren zur Montage von Halbleiterchips
DE69331554T Revoked DE69331554T2 (de) 1992-08-20 1993-08-02 Lichtemittierende Diode
DE69332570T Revoked DE69332570T2 (de) 1992-08-20 1993-08-02 Lichtquelle und Verfahren zur Montage lichtemittierender Dioden

Family Applications Before (2)

Application Number Title Priority Date Filing Date
DE69329522T Expired - Fee Related DE69329522T2 (de) 1992-08-20 1993-08-02 Verfahren zur Montage von Halbleiterchips
DE69331554T Revoked DE69331554T2 (de) 1992-08-20 1993-08-02 Lichtemittierende Diode

Country Status (7)

Country Link
US (2) US5265792A (de)
EP (3) EP0588040B1 (de)
JP (1) JP3345124B2 (de)
KR (1) KR100297453B1 (de)
CN (1) CN1050936C (de)
DE (3) DE69329522T2 (de)
TW (1) TW243557B (de)

Families Citing this family (114)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6590502B1 (en) 1992-10-12 2003-07-08 911Ep, Inc. Led warning signal light and movable support
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
JP3127195B2 (ja) * 1994-12-06 2001-01-22 シャープ株式会社 発光デバイスおよびその製造方法
DE19549726B4 (de) * 1994-12-06 2010-04-22 Sharp K.K. Lichtemittierendes Bauelement und Herstellverfahren für dieses
KR100264424B1 (ko) * 1995-06-21 2000-08-16 사토 게니치로 발광 다이오드칩 및 이를 사용한 발광 다이오드
US6875620B1 (en) 1996-10-31 2005-04-05 Agilent Technologies, Inc. Tiling process for constructing a chemical array
CN1183024A (zh) * 1996-11-15 1998-05-27 太阳诱电株式会社 片状零件供给装置及其所使用的吸附盘
JPH10150223A (ja) * 1996-11-15 1998-06-02 Rohm Co Ltd チップ型発光素子
US5833903A (en) 1996-12-10 1998-11-10 Great American Gumball Corporation Injection molding encapsulation for an electronic device directly onto a substrate
JP3337405B2 (ja) * 1996-12-27 2002-10-21 シャープ株式会社 発光表示素子およびその電気配線基板への接続方法ならびに製造方法
US5812272A (en) * 1997-01-30 1998-09-22 Hewlett-Packard Company Apparatus and method with tiled light source array for integrated assay sensing
US6087680A (en) * 1997-01-31 2000-07-11 Siemens Aktiengesellschaft Led device
US6093940A (en) * 1997-04-14 2000-07-25 Rohm Co., Ltd. Light-emitting diode chip component and a light-emitting device
US6031958A (en) 1997-05-21 2000-02-29 Mcgaffigan; Thomas H. Optical light pipes with laser light appearance
AU747260B2 (en) 1997-07-25 2002-05-09 Nichia Chemical Industries, Ltd. Nitride semiconductor device
US6081243A (en) * 1997-09-09 2000-06-27 Micron Technology, Inc. Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices
GB2329756A (en) 1997-09-25 1999-03-31 Univ Bristol Assemblies of light emitting diodes
GB2330679B (en) 1997-10-21 2002-04-24 911 Emergency Products Inc Warning signal light
US6200134B1 (en) 1998-01-20 2001-03-13 Kerr Corporation Apparatus and method for curing materials with radiation
JP3770014B2 (ja) 1999-02-09 2006-04-26 日亜化学工業株式会社 窒化物半導体素子
EP1168539B1 (de) 1999-03-04 2009-12-16 Nichia Corporation Nitridhalbleiterlaserelement
JP4061005B2 (ja) 1999-03-31 2008-03-12 シャープ株式会社 発光ダイオードおよびその製造方法並びに発光ダイオードの電気配線基板への搭載方法
US6462669B1 (en) 1999-04-06 2002-10-08 E. P . Survivors Llc Replaceable LED modules
US6614359B2 (en) 1999-04-06 2003-09-02 911 Emergency Products, Inc. Replacement led lamp assembly and modulated power intensity for light source
US6380865B1 (en) 1999-04-06 2002-04-30 911 Emergency Products, Inc. Replacement led lamp assembly and modulated power intensity for light source
WO2000074973A1 (en) 1999-06-08 2000-12-14 911 Emergency Products, Inc. Rotational led reflector
US6705745B1 (en) 1999-06-08 2004-03-16 911Ep, Inc. Rotational led reflector
US6700502B1 (en) 1999-06-08 2004-03-02 911Ep, Inc. Strip LED light assembly for motor vehicle
US6547410B1 (en) 2000-07-28 2003-04-15 911 Emergency Products, Inc. LED alley/take-down light
US6367949B1 (en) 1999-08-04 2002-04-09 911 Emergency Products, Inc. Par 36 LED utility lamp
DE19945131A1 (de) * 1999-09-21 2001-04-12 Osram Opto Semiconductors Gmbh Elektronisches Bauelement und Beschichtungs-Mittel
US6885035B2 (en) * 1999-12-22 2005-04-26 Lumileds Lighting U.S., Llc Multi-chip semiconductor LED assembly
JP2001320168A (ja) * 2000-03-02 2001-11-16 Murata Mfg Co Ltd 配線基板およびその製造方法、ならびにそれを用いた電子装置
DE10164880B4 (de) * 2000-03-02 2005-11-03 Murata Mfg. Co., Ltd., Nagaokakyo Verdrahtungssubstrat, Verfahren zum Herstellen desselben und elektronische Vorrichtung, die dasselbe verwendet
US7320593B2 (en) 2000-03-08 2008-01-22 Tir Systems Ltd. Light emitting diode light source for curing dental composites
JP2001345485A (ja) * 2000-06-02 2001-12-14 Toyoda Gosei Co Ltd 発光装置
US6590343B2 (en) 2000-06-06 2003-07-08 911Ep, Inc. LED compensation circuit
CA2417172C (en) * 2000-07-07 2010-10-12 Cosmo Plant Co., Ltd. Plant cultivating method, cultivating device, and its lighting device
AT413062B (de) * 2000-07-12 2005-10-15 Tridonic Optoelectronics Gmbh Verfahren zur herstellung einer led-lichtquelle
DE10041328B4 (de) * 2000-08-23 2018-04-05 Osram Opto Semiconductors Gmbh Verpackungseinheit für Halbleiterchips
US7439847B2 (en) 2002-08-23 2008-10-21 John C. Pederson Intelligent observation and identification database system
US8188878B2 (en) * 2000-11-15 2012-05-29 Federal Law Enforcement Development Services, Inc. LED light communication system
WO2002041276A2 (en) 2000-11-15 2002-05-23 Snowy Village, Inc. Led warning light and communication system
JP2002222992A (ja) * 2001-01-25 2002-08-09 Rohm Co Ltd Ｌｅｄ発光素子、およびｌｅｄ発光装置
TW575652B (en) * 2001-03-07 2004-02-11 Matsushita Electric Ind Co Ltd Light-emitting device
US6576488B2 (en) * 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
US6888167B2 (en) * 2001-07-23 2005-05-03 Cree, Inc. Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
US6747298B2 (en) 2001-07-23 2004-06-08 Cree, Inc. Collets for bonding of light emitting diodes having shaped substrates
JP2003309292A (ja) * 2002-04-15 2003-10-31 Citizen Electronics Co Ltd 表面実装型発光ダイオードのメタルコア基板及びその製造方法
US7043881B2 (en) * 2002-06-14 2006-05-16 Tem-Pace, Inc. Insulated glass assembly with an internal lighting system
DE10228446A1 (de) * 2002-06-26 2004-01-15 Hella Kg Hueck & Co. Anordnung mit elektrischen Bauteilen
CA2493130A1 (en) 2002-07-25 2004-02-05 Jonathan S. Dahm Method and apparatus for using light emitting diodes for curing
US7182597B2 (en) * 2002-08-08 2007-02-27 Kerr Corporation Curing light instrument
AU2003298561A1 (en) * 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
JP4080843B2 (ja) 2002-10-30 2008-04-23 株式会社東芝 不揮発性半導体記憶装置
AU2003297588A1 (en) 2002-12-02 2004-06-23 3M Innovative Properties Company Illumination system using a plurality of light sources
US7541152B2 (en) * 2002-12-24 2009-06-02 Agilent Technologies, Inc. Integrated light source for diagnostic arrays
JP2004356506A (ja) * 2003-05-30 2004-12-16 Stanley Electric Co Ltd ガラス封止型発光ダイオード
US7280812B2 (en) * 2003-06-06 2007-10-09 Interdigital Technology Corporation Digital baseband receiver with DC discharge and gain control circuits
US7915085B2 (en) * 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US7157744B2 (en) * 2003-10-29 2007-01-02 M/A-Com, Inc. Surface mount package for a high power light emitting diode
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US20050278301A1 (en) * 2004-05-26 2005-12-15 Castellanos Maria G System and method for determining an optimized process configuration
MXPA06014522A (es) 2004-06-15 2007-03-23 Henkel Corp Montaje electro-optico de diodo electroluminico de gran potencia.
DE602005019384D1 (de) 2005-04-21 2010-04-01 Fiat Ricerche Durchsichtige LED-Anzeigevorrichtung
EP1715523B1 (de) 2005-04-21 2012-03-14 C.R.F. Società Consortile per Azioni Durchsichtige Head-up-LED-Anzeigevorrichtung
CN100452452C (zh) * 2005-05-17 2009-01-14 财团法人工业技术研究院 备有发光二极管的翻转侧置结构的发光装置
US8113830B2 (en) * 2005-05-27 2012-02-14 Kerr Corporation Curing light instrument
FR2892594B1 (fr) * 2005-10-21 2007-12-07 Saint Gobain Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications
TWI306652B (en) * 2005-10-28 2009-02-21 Chipmos Technologies Inc Light emitting diode package structure
JP2007234681A (ja) * 2006-02-27 2007-09-13 Apic Yamada Corp 半導体製造装置
TWI302043B (en) * 2006-06-27 2008-10-11 Everlight Electronics Co Ltd Base structure for ultra-thin light-emitting diode and manufacturing method thereof
TWI350409B (en) * 2006-07-06 2011-10-11 Nat Univ Chung Hsing Flexible and could be rolling-up area lights module and the method of producing thereof
US8047686B2 (en) 2006-09-01 2011-11-01 Dahm Jonathan S Multiple light-emitting element heat pipe assembly
WO2008069605A1 (en) * 2006-12-08 2008-06-12 Seoul Semiconductor Co., Ltd. Light emitting device
KR101456266B1 (ko) * 2006-12-08 2014-11-04 서울반도체 주식회사 발광소자
EP2111137A4 (de) * 2007-02-12 2013-03-06 Ge Lighting Solutions Llc Led-beleuchtungssysteme für produktvitrinen
US9294198B2 (en) 2007-05-24 2016-03-22 Federal Law Enforcement Development Services, Inc. Pulsed light communication key
US9455783B2 (en) 2013-05-06 2016-09-27 Federal Law Enforcement Development Services, Inc. Network security and variable pulse wave form with continuous communication
US9258864B2 (en) 2007-05-24 2016-02-09 Federal Law Enforcement Development Services, Inc. LED light control and management system
WO2008148022A2 (en) 2007-05-24 2008-12-04 Federal Law Enforcement Development Services, Inc. Building illumination apparatus with integrated communications, security and energy management
US9100124B2 (en) 2007-05-24 2015-08-04 Federal Law Enforcement Development Services, Inc. LED Light Fixture
US11265082B2 (en) 2007-05-24 2022-03-01 Federal Law Enforcement Development Services, Inc. LED light control assembly and system
US9414458B2 (en) 2007-05-24 2016-08-09 Federal Law Enforcement Development Services, Inc. LED light control assembly and system
EP2009344A1 (de) * 2007-06-25 2008-12-31 Alcan Technology & Management AG Flächige Beleuchtungseinrichtung, Herstellungsverfahren für eine flächige Beleuchtungseinrichtung
US8350499B2 (en) * 2008-02-06 2013-01-08 C. Crane Company, Inc. High efficiency power conditioning circuit for lighting device
US8274241B2 (en) * 2008-02-06 2012-09-25 C. Crane Company, Inc. Light emitting diode lighting device
TWI362769B (en) 2008-05-09 2012-04-21 Univ Nat Chiao Tung Light emitting device and fabrication method therefor
DE102008030843B4 (de) * 2008-06-30 2021-08-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Anordnung sowie Verfahren zur Herstellung einer optoelektronischen Anordnung
FR2937464B1 (fr) * 2008-10-21 2011-02-25 Commissariat Energie Atomique Assemblage d'une puce microelectronique a rainure avec un element filaire sous forme de toron et procede d'assemblage
US8890773B1 (en) 2009-04-01 2014-11-18 Federal Law Enforcement Development Services, Inc. Visible light transceiver glasses
US9066777B2 (en) 2009-04-02 2015-06-30 Kerr Corporation Curing light device
US9072572B2 (en) 2009-04-02 2015-07-07 Kerr Corporation Dental light device
TWI556696B (zh) * 2009-07-14 2016-11-01 蔡乃成 表面黏著型發光元件燈組之製造方法
US9329433B2 (en) 2010-03-12 2016-05-03 Sharp Kabushiki Kaisha Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device
JP2011211047A (ja) * 2010-03-30 2011-10-20 Sharp Corp 表示装置、表示装置の製造方法および表示装置の駆動方法
US9222645B2 (en) 2010-11-29 2015-12-29 RTC Industries, Incorporated LED lighting assembly and method of lighting for a merchandise display
US11274808B2 (en) 2010-06-17 2022-03-15 Rtc Industries, Inc. LED lighting assembly and method of lighting for a merchandise display
WO2012097291A1 (en) 2011-01-14 2012-07-19 Federal Law Enforcement Development Services, Inc. Method of providing lumens and tracking of lumen consumption
KR101824011B1 (ko) 2011-07-29 2018-01-31 엘지이노텍 주식회사 발광소자 패키지
US9194556B1 (en) 2012-02-22 2015-11-24 Theodore G. Nelson Method of producing LED lighting apparatus and apparatus produced thereby
TW201425795A (zh) * 2012-12-25 2014-07-01 Hon Hai Prec Ind Co Ltd Led燈條製作方法
US9265112B2 (en) 2013-03-13 2016-02-16 Federal Law Enforcement Development Services, Inc. LED light control and management system
US20150198941A1 (en) 2014-01-15 2015-07-16 John C. Pederson Cyber Life Electronic Networking and Commerce Operating Exchange
US9502625B2 (en) 2014-06-06 2016-11-22 Rohinni, LLC Electrophotographic deposition of unpackaged semiconductor device
US9989223B1 (en) * 2015-03-09 2018-06-05 Automated Assembly Corporation LED lighting apparatus with LEDs and wires attached to metal sheet member by adhesive
US20170046950A1 (en) 2015-08-11 2017-02-16 Federal Law Enforcement Development Services, Inc. Function disabler device and system
DE102016122810A1 (de) 2016-11-25 2018-05-30 Osram Opto Semiconductors Gmbh Bauteil mit einem lichtemittierenden halbleiterchip
US10566507B2 (en) 2017-01-12 2020-02-18 Rohinini, LLC Apparatus for high speed printing of semiconductor devices
EP3765896A1 (de) * 2018-03-13 2021-01-20 Apple Inc. Anzeigen mit direktbeleuchteten rückbeleuchtungseinheiten
US11526051B2 (en) 2021-04-16 2022-12-13 Apple Inc. Displays with direct-lit backlight units
US11592706B2 (en) 2021-04-16 2023-02-28 Apple Inc. Displays with direct-lit backlight units
US11513392B1 (en) 2021-09-23 2022-11-29 Apple Inc. Direct-lit backlight units with optical films

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1407908A (en) * 1972-04-14 1975-10-01 Sony Corp Alpha-numeric character display devices
US3911431A (en) * 1973-01-22 1975-10-07 Tokyo Shibaura Electric Co Light-emitting display device
US3877052A (en) * 1973-12-26 1975-04-08 Bell Telephone Labor Inc Light-emitting semiconductor apparatus for optical fibers
US3936694A (en) * 1973-12-28 1976-02-03 Sony Corporation Display structure having light emitting diodes
US4024627A (en) * 1974-04-29 1977-05-24 Amp Incorporated Package mounting of electronic chips, such as light emitting diodes
US4249299A (en) * 1979-03-05 1981-02-10 Hughes Aircraft Company Edge-around leads for backside connections to silicon circuit die
JPS553690A (en) * 1979-04-04 1980-01-11 Toshiba Corp Semiconductor luminous indicator
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
JPS5749284A (en) * 1980-09-09 1982-03-23 Matsushita Electric Ind Co Ltd Manufacture of light-emitting display device
US4843036A (en) * 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices
DE8711105U1 (de) * 1987-08-14 1987-11-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
US4850780A (en) * 1987-09-28 1989-07-25 Kulicke And Soffa Industries Inc. Pre-peel die ejector apparatus
GB2223429B (en) * 1988-08-24 1993-02-17 Tdk Corp Apparatus for and method of automatically mounting electronic component on printed circuit board
FR2637150B1 (fr) * 1988-09-23 1995-07-28 Neiman Sa Reseau de diodes electroluminescentes

Also Published As

Publication number Publication date
DE69332570D1 (de) 2003-01-23
DE69331554D1 (de) 2002-03-21
US5265792A (en) 1993-11-30
EP0739043A2 (de) 1996-10-23
KR940004877A (ko) 1994-03-16
CN1050936C (zh) 2000-03-29
JPH06177435A (ja) 1994-06-24
EP0843365B1 (de) 2002-12-11
CN1086046A (zh) 1994-04-27
EP0739043B1 (de) 2002-02-06
DE69329522T2 (de) 2001-05-17
US5475241A (en) 1995-12-12
EP0843365A2 (de) 1998-05-20
DE69331554T2 (de) 2002-07-11
EP0588040A2 (de) 1994-03-23
EP0588040A3 (de) 1994-04-06
DE69329522D1 (de) 2000-11-09
KR100297453B1 (ko) 2001-10-24
EP0588040B1 (de) 2000-10-04
TW243557B (de) 1995-03-21
EP0739043A3 (de) 1997-10-29
EP0843365A3 (de) 1998-11-11
JP3345124B2 (ja) 2002-11-18

Similar Documents

Publication Publication Date Title
DE69332570D1 (de) Lichtquelle und Verfahren zur Montage lichtemittierender Dioden
DE69623443T2 (de) Vielfarbige lichtemissionsvorrichtung und verfahren zur herstellung derselben
DE69333153D1 (de) Lichtquelle
DE69316055T2 (de) Lichtquelle
DE69327483T2 (de) Diode und Verfahren zur Herstellung
DE19680872T1 (de) Blaulicht emittierendes Element und Verfahren zur Herstellung desselben
DE69415965D1 (de) Verfahren und vorrichtung zur kontinuierlichen diffusen beleuchtung
DE69432353T2 (de) Flächenhafte lichtquelle
DE69125888T2 (de) Verfahren zur Lichtmodulation und optischer Modulator
DE69316033D1 (de) Linienförmige lichtquelle
DE69331654T2 (de) Vorrichtung mit lichtemittierender Diode
DE69402379D1 (de) Einrichtung und Verfahren zur Beleuchtung von Lichtleitern und von der Umgebung
DE69518407D1 (de) Verfahren und vorrichtung zur herstellung von leichten olefinen
DE69412946T2 (de) Lichtemittierende Halbleiterdiode und Herstellungsverfahren
DE69525361D1 (de) Vorrichtung zur emission von infrarot-strahlung
DE69313033D1 (de) Lichtemittierende Vorrichtung
DE69324386D1 (de) Mechanisch stabile Feldemissionsquelle
DE69314734D1 (de) Vorrichtung und Verfahren zur Herstellung von leichten Lebensmitteln
DE69322731T2 (de) Fluoreszierende Lichtquelle
DE69610963T2 (de) Bauelement mit enthaltender Lichtquelle
BR9301152A (pt) Luminaria
DE59309974D1 (de) Verfahren zur Verdeckung des Fahrgeräusches
DE69514304T2 (de) Lichtemittierende Vorrichtung
DE29504472U1 (de) Selbsttätig nachgeführte gerichtete Lichtquelle
DE9313877U1 (de) Vorrichtung zur Erzeugung von Lichteffekten

Legal Events

Date Code Title Description
8363 Opposition against the patent
8327 Change in the person/name/address of the patent owner

Owner name: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.,

8331 Complete revocation