JP6293899B2 - 実装装置 - Google Patents
実装装置 Download PDFInfo
- Publication number
- JP6293899B2 JP6293899B2 JP2016539710A JP2016539710A JP6293899B2 JP 6293899 B2 JP6293899 B2 JP 6293899B2 JP 2016539710 A JP2016539710 A JP 2016539710A JP 2016539710 A JP2016539710 A JP 2016539710A JP 6293899 B2 JP6293899 B2 JP 6293899B2
- Authority
- JP
- Japan
- Prior art keywords
- coordinates
- light
- emitting component
- mounting
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 102
- 238000003384 imaging method Methods 0.000 claims description 33
- 238000013461 design Methods 0.000 claims description 25
- 238000001514 detection method Methods 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 12
- 238000005070 sampling Methods 0.000 description 8
- 230000032258 transport Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 4
- 230000007175 bidirectional communication Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/14—Adjustable mountings
- F21V21/15—Adjustable mountings specially adapted for power operation, e.g. by remote control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
- G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40003—Move end effector so that image center is shifted to desired position
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30204—Marker
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75753—Means for optical alignment, e.g. sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Operations Research (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Quality & Reliability (AREA)
- Human Computer Interaction (AREA)
- Automation & Control Theory (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Led Device Packages (AREA)
Description
発光体を有する発光部品を基板上に実装する実装装置であって、
前記発光部品を保持可能な部品保持手段と、
前記部品保持手段を移動させる移動手段と、
前記発光部品のうち少なくとも前記発光体の一部を含む領域を撮像して発光部品画像を取得する撮像手段と、
前記発光部品画像に基づいて前記発光体の特定部位の座標を検出する発光体座標検出手段と、
前記発光部品画像に基づく発光部品の外形に関する情報を用いずに、前記検出された特定部位の座標に基づいて、前記発光部品を保持し該発光部品を前記基板上に移動して前記発光体の前記特定部位を前記基板上の所定座標に配置するように前記部品保持手段及び前記移動手段を制御して前記発光部品の実装を行う制御手段と、
を備えたものである。
発光体を有する発光部品を基板上に実装する実装装置であって、
前記発光部品を保持可能な部品保持手段と、
前記部品保持手段を移動させる移動手段と、
前記発光部品のうち少なくとも前記発光体の一部を含む領域を撮像して発光部品画像を取得する撮像手段と、
前記発光体の特定部位の座標と前記部品保持手段が該発光部品を保持する保持座標との位置関係を記憶する位置関係記憶手段と、
前記発光部品画像に基づいて前記発光体の前記特定部位の座標を検出する発光体座標検出手段と、
前記発光部品画像に基づく発光部品の外形に関する情報を用いずに、前記検出された特定部位の座標に対して前記位置関係にある実保持座標を導出し、前記発光部品を該実保持座標で保持し該保持した部分を所定の実装座標に配置するように前記部品保持手段及び前記移動手段を制御して前記発光部品の実装を行う制御手段と、
を備えたものである。
Claims (6)
- 発光体を有する発光部品を基板上に実装する実装装置であって、
前記発光部品を保持可能な部品保持手段と、
前記部品保持手段を移動させる移動手段と、
前記発光部品のうち少なくとも前記発光体の一部を含む領域を撮像して発光部品画像を取得する撮像手段と、
前記部品保持手段が前記発光部品を保持していない状態で撮像された前記発光部品画像に基づいて前記発光体の特定部位の座標を検出する発光体座標検出手段と、
前記発光部品画像に基づく発光部品の外形に関する情報を用いずに、前記検出された特定部位の座標に基づいて、前記発光部品を保持し該発光部品を前記基板上に移動して前記発光体の前記特定部位が前記基板上の所定座標に位置するように前記部品保持手段及び前記移動手段を制御して前記発光部品の実装を行う制御手段と、
を備えた実装装置。 - 発光体を有する発光部品を基板上に実装する実装装置であって、
前記発光部品を保持可能な部品保持手段と、
前記部品保持手段を移動させる移動手段と、
前記発光部品のうち少なくとも前記発光体の一部を含む領域を撮像して発光部品画像を取得する撮像手段と、
前記発光部品画像に基づいて前記発光体の特定部位の座標を検出する発光体座標検出手段と、
前記発光部品画像に基づく発光部品の外形に関する情報を用いずに、前記検出された特定部位の座標に基づいて、前記発光部品を保持し該発光部品を前記基板上に移動して前記発光体の前記特定部位が前記基板上の所定座標に位置するように前記部品保持手段及び前記移動手段を制御して前記発光部品の実装を行う制御手段と、
前記発光体の前記特定部位の設計上の座標と前記部品保持手段が該発光部品を保持する設計上の保持座標との位置関係を記憶する位置関係記憶手段と、
前記基板上の前記所定座標に対して前記位置関係と同じ位置関係にある前記基板上の実装座標を記憶する実装座標記憶手段と、
を備え、
前記制御手段は、前記検出された特定部位の座標と前記位置関係とに基づいて、該特定部位の座標に対して前記位置関係にある実保持座標を導出し、前記発光部品を該実保持座標で保持し該保持した部分を前記実装座標に配置するように前記部品保持手段及び前記移動手段を制御する、
実装装置。 - 前記位置関係は、前記発光部品中の前記発光体の位置が設計値通りであった場合における、前記発光体の前記特定部位と前記発光部品の中心との位置関係である、
請求項2に記載の実装装置。 - 発光体を有する発光部品を基板上に実装する実装装置であって、
前記発光部品を保持可能な部品保持手段と、
前記部品保持手段を移動させる移動手段と、
前記発光部品のうち少なくとも前記発光体の一部を含む領域を撮像して発光部品画像を取得する撮像手段と、
前記発光部品画像に基づいて前記発光体の特定部位の座標を検出する発光体座標検出手段と、
前記発光部品画像に基づく発光部品の外形に関する情報を用いずに、前記検出された特定部位の座標に基づいて、前記発光部品を保持し該発光部品を前記基板上に移動して前記発光体の前記特定部位が前記基板上の所定座標に位置するように前記部品保持手段及び前記移動手段を制御して前記発光部品の実装を行う制御手段と、
を備え、
前記制御手段は、前記検出された特定部位の座標と前記部品保持手段が前記発光部品を保持する所定の保持座標との位置関係を導出し、該位置関係に基づいて、前記発光体の前記特定部位が前記基板上の所定座標に位置するように前記部品保持手段及び前記移動手段を制御する、
実装装置。 - 前記撮像手段は、前記基板に付されたマークを撮像可能なマークカメラである、
請求項1〜4のいずれか1項に記載の実装装置。 - 発光体を有する発光部品を基板上に実装する実装装置であって、
前記発光部品を保持可能な部品保持手段と、
前記部品保持手段を移動させる移動手段と、
前記発光部品のうち少なくとも前記発光体の一部を含む領域を撮像して発光部品画像を取得する撮像手段と、
前記発光体の特定部位の設計上の座標と前記部品保持手段が該発光部品を保持する設計上の保持座標との位置関係を記憶する位置関係記憶手段と、
前記発光部品画像に基づいて前記発光体の前記特定部位の座標を検出する発光体座標検出手段と、
前記発光部品画像に基づく発光部品の外形に関する情報を用いずに、前記検出された特定部位の座標に対して前記位置関係にある実保持座標を導出し、前記発光部品を該実保持座標で保持し該保持した部分を所定の実装座標に配置するように前記部品保持手段及び前記移動手段を制御して前記発光部品の実装を行う制御手段と、
を備えた実装装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/070507 WO2016020975A1 (ja) | 2014-08-04 | 2014-08-04 | 実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016020975A1 JPWO2016020975A1 (ja) | 2017-05-18 |
JP6293899B2 true JP6293899B2 (ja) | 2018-03-14 |
Family
ID=55263281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016539710A Active JP6293899B2 (ja) | 2014-08-04 | 2014-08-04 | 実装装置 |
Country Status (5)
Country | Link |
---|---|
US (3) | US10634325B2 (ja) |
EP (1) | EP3179523B1 (ja) |
JP (1) | JP6293899B2 (ja) |
CN (1) | CN106537615B (ja) |
WO (1) | WO2016020975A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6263028B2 (ja) * | 2013-12-27 | 2018-01-17 | ヤマハ発動機株式会社 | 部品装着装置 |
WO2017187527A1 (ja) * | 2016-04-26 | 2017-11-02 | 富士機械製造株式会社 | 対基板作業機 |
US10863660B2 (en) * | 2016-11-14 | 2020-12-08 | Fuji Corporation | Stored image reclassification system and reclassification method |
WO2018134867A1 (ja) * | 2017-01-17 | 2018-07-26 | 株式会社Fuji | メンテナンス用基板 |
JP7178541B2 (ja) * | 2018-02-07 | 2022-11-28 | パナソニックIpマネジメント株式会社 | 発光部品実装装置および発光部品実装方法 |
EP3768059A4 (en) | 2018-03-13 | 2021-03-03 | Fuji Corporation | ASSEMBLY DEVICE, INFORMATION PROCESSING METHODS, AND ASSEMBLY METHODS |
EP3843519B1 (en) | 2018-08-24 | 2023-09-06 | Fuji Corporation | Component mounting machine and component collection method |
JP7348298B2 (ja) * | 2019-09-26 | 2023-09-20 | 株式会社Fuji | 画像処理装置 |
JP6830146B1 (ja) * | 2019-11-21 | 2021-02-17 | シークス株式会社 | 部品の表面実装方法及び表面実装システム |
CN112433428B (zh) * | 2020-08-18 | 2022-01-04 | 深圳市安华光电技术有限公司 | Dlp投影仪、光机和led光源装置校准方法 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55100514A (en) | 1979-01-26 | 1980-07-31 | Nippon Telegr & Teleph Corp <Ntt> | Optical communication apparatus |
JPS6012786A (ja) | 1983-07-01 | 1985-01-23 | Hitachi Ltd | 発光装置の製造方法 |
JPH01209578A (ja) | 1988-02-16 | 1989-08-23 | Nec Corp | Ledアレイチップの搭載装置 |
JPH0624040A (ja) | 1992-07-07 | 1994-02-01 | Oki Electric Ind Co Ltd | Ledアレイの基準パターン認識方法及びこの基準パターン認識方法を用いたledアレイの位置検出方法 |
JPH0645652A (ja) * | 1992-07-24 | 1994-02-18 | Matsushita Electric Ind Co Ltd | 光学ヘッドのダイボンディング装置及びダイボンディング方法 |
JP3258221B2 (ja) | 1995-12-26 | 2002-02-18 | 沖電気工業株式会社 | 位置合わせ用の認識マークおよびその形成方法、認識マークおよび発光部の形成の兼用マスク、位置合わせ用の認識マークを用いた位置合わせ方法 |
US6405094B1 (en) * | 1998-07-10 | 2002-06-11 | Tokyo Electron Limited | Apparatus and method of collecting substrates abnormally processed or processed previous to ordinary processing |
JP2000164626A (ja) | 1998-09-25 | 2000-06-16 | Fuji Photo Film Co Ltd | 部品のボンディング方法および装置 |
US6208419B1 (en) | 1998-11-18 | 2001-03-27 | Fuji Photo Film Co., Ltd. | Method of and apparatus for bonding light-emitting element |
JP2000150970A (ja) | 1998-11-18 | 2000-05-30 | Fuji Photo Film Co Ltd | 発光素子のボンディング方法および装置 |
JP2000183404A (ja) * | 1998-12-14 | 2000-06-30 | Fuji Photo Film Co Ltd | 発光素子アレイ、そのボンディング方法および装置 |
JP4328409B2 (ja) * | 1999-04-12 | 2009-09-09 | 富士フイルム株式会社 | 発光素子のボンディング装置 |
US6718626B2 (en) * | 2000-09-13 | 2004-04-13 | Fuji Machine Mfg. Co., Ltd. | Apparatus for detecting positioning error of a component with respect to a suction nozzle |
JP2002298132A (ja) * | 2001-04-02 | 2002-10-11 | Fuji Mach Mfg Co Ltd | 撮像システム,撮像システム制御プログラムおよび電気部品装着システム |
JP2002365019A (ja) | 2001-06-06 | 2002-12-18 | Fujitsu Ltd | 発光素子の発光点位置検出装置 |
JP2003152260A (ja) | 2001-11-09 | 2003-05-23 | Sharp Corp | 半導体レーザ装置およびそれを用いた光ピックアップ装置、ならびに半導体レーザ装置の製造装置および製造方法 |
JP4357168B2 (ja) | 2002-11-20 | 2009-11-04 | 株式会社東芝 | レーザダイオードの発光点位置の測定方法、測定装置、およびマウント装置 |
JP2004207655A (ja) | 2002-12-26 | 2004-07-22 | Matsushita Electric Ind Co Ltd | 金属ベース基板および発光ユニット |
JP4356383B2 (ja) | 2003-07-03 | 2009-11-04 | パナソニック電工株式会社 | 発光装置の製造方法 |
KR100758811B1 (ko) | 2003-09-22 | 2007-09-13 | 가부시키가이샤 무라타 세이사쿠쇼 | 발광소자의 장착방법 및 장착장치 |
DE102004056252A1 (de) | 2004-10-29 | 2006-05-04 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung, Kfz-Scheinwerfer und Verfahren zur Herstellung einer Beleuchtungseinrichtung |
JP2006310653A (ja) | 2005-04-28 | 2006-11-09 | Toyoda Gosei Co Ltd | Ledランプ、および基板搭載部品の実装方法 |
JP2007087608A (ja) | 2005-09-20 | 2007-04-05 | Sharp Corp | 光源装置および表示装置 |
EP2201615B8 (en) | 2007-09-20 | 2015-01-28 | Philips Intellectual Property & Standards GmbH | Led package and method for manufacturing the led package |
US7583284B2 (en) | 2008-01-29 | 2009-09-01 | Universal Scientific Industrial Co., Ltd. | Method for arranging print head chips |
JP5055193B2 (ja) | 2008-04-24 | 2012-10-24 | 日東電工株式会社 | 光電気混載基板の製造方法 |
US7791089B2 (en) | 2008-08-26 | 2010-09-07 | Albeo Technologies, Inc. | LED packaging methods and LED-based lighting products |
KR101537795B1 (ko) | 2009-03-31 | 2015-07-22 | 서울반도체 주식회사 | Led 패키지 제조 방법 및 그 led 패키지 |
TR201206796T1 (tr) * | 2009-12-16 | 2013-01-21 | Sharp Kabushiki Kaisha | Koordinat sensörü ve görüntüleme cihazı. |
KR20110060868A (ko) | 2011-01-25 | 2011-06-08 | 삼성엘이디 주식회사 | 방열 기판과 그 제조 방법, 방열 기판을 구비한 발광다이오드 패키지 모듈과 그 제조 방법 |
WO2012128094A1 (ja) | 2011-03-18 | 2012-09-27 | シャープ株式会社 | 発光装置の固定方法および発光装置 |
KR101248143B1 (ko) | 2011-06-24 | 2013-03-28 | 주식회사 에스에프이 | 영상 처리 모듈 및 이를 이용한 엘이디 칩 본딩 장치 |
DE112012003848T5 (de) * | 2011-09-16 | 2014-07-10 | Panasonic Corp. | System und Verfahren zur Herstellung lichtemittierender Elemente und System und Verfahren zur Herstellung von LED-Packages |
JP5566359B2 (ja) | 2011-09-29 | 2014-08-06 | 株式会社日立ハイテクインスツルメンツ | 部品装着装置 |
TW201339534A (zh) | 2012-03-16 | 2013-10-01 | Hon Hai Prec Ind Co Ltd | 發光二極體貼片機及其對位系統 |
-
2014
- 2014-08-04 WO PCT/JP2014/070507 patent/WO2016020975A1/ja active Application Filing
- 2014-08-04 JP JP2016539710A patent/JP6293899B2/ja active Active
- 2014-08-04 EP EP14899223.3A patent/EP3179523B1/en active Active
- 2014-08-04 US US15/501,689 patent/US10634325B2/en active Active
- 2014-08-04 CN CN201480080741.3A patent/CN106537615B/zh active Active
-
2020
- 2020-03-13 US US16/817,730 patent/US11262056B2/en active Active
-
2021
- 2021-12-30 US US17/646,649 patent/US11835207B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20220120419A1 (en) | 2022-04-21 |
US11835207B2 (en) | 2023-12-05 |
CN106537615A (zh) | 2017-03-22 |
CN106537615B (zh) | 2019-08-20 |
EP3179523A4 (en) | 2017-06-14 |
US10634325B2 (en) | 2020-04-28 |
EP3179523B1 (en) | 2020-09-23 |
US20170227199A1 (en) | 2017-08-10 |
EP3179523A1 (en) | 2017-06-14 |
WO2016020975A1 (ja) | 2016-02-11 |
US11262056B2 (en) | 2022-03-01 |
JPWO2016020975A1 (ja) | 2017-05-18 |
US20200208817A1 (en) | 2020-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6293899B2 (ja) | 実装装置 | |
JP6169712B2 (ja) | 実装装置 | |
JP6462000B2 (ja) | 部品実装機 | |
JP6752272B2 (ja) | 対基板作業機 | |
JP6231791B2 (ja) | 実装装置 | |
CN107926154B (zh) | 元件安装装置 | |
JP6412944B2 (ja) | 部品実装装置 | |
JP6828223B2 (ja) | 実装装置 | |
JPWO2016194136A1 (ja) | 部品実装装置及び吸着位置設定方法 | |
JPWO2015019487A1 (ja) | 実装装置及び部品検出方法 | |
US10932401B2 (en) | Component mounting machine | |
JP6577475B2 (ja) | 部品実装装置 | |
JP6475165B2 (ja) | 実装装置 | |
JP6624976B2 (ja) | 部品実装装置 | |
WO2016151797A1 (ja) | 実装装置及び実装方法 | |
JPWO2018055757A1 (ja) | 照明条件特定装置及び照明条件特定方法 | |
CN111788878B (zh) | 元件安装装置 | |
JP6423193B2 (ja) | 実装装置及び実装方法 | |
US11039559B2 (en) | Information processing apparatus, mounting apparatus, information processing method, and component gripper | |
JP7124126B2 (ja) | 部品実装装置 | |
US20220232747A1 (en) | Component mounting machine | |
JP2015032724A (ja) | 電子部品実装装置および電子部品実装装置における部品認識方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170602 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171114 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180111 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180123 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180214 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6293899 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |