DE69331654D1 - Vorrichtung mit lichtemittierender Diode - Google Patents

Vorrichtung mit lichtemittierender Diode

Info

Publication number
DE69331654D1
DE69331654D1 DE69331654T DE69331654T DE69331654D1 DE 69331654 D1 DE69331654 D1 DE 69331654D1 DE 69331654 T DE69331654 T DE 69331654T DE 69331654 T DE69331654 T DE 69331654T DE 69331654 D1 DE69331654 D1 DE 69331654D1
Authority
DE
Germany
Prior art keywords
light emitting
emitting diode
diode
light
emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69331654T
Other languages
English (en)
Other versions
DE69331654T2 (de
Inventor
Satoshi Ishii
Tetsuharu Nishimura
Koh Ishizuka
Hiroshi Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69331654D1 publication Critical patent/DE69331654D1/de
Publication of DE69331654T2 publication Critical patent/DE69331654T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/123—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
    • G11B7/126—Circuits, methods or arrangements for laser control or stabilisation
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/22—Apparatus or processes for the manufacture of optical heads, e.g. assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
DE69331654T 1992-11-30 1993-11-29 Vorrichtung mit lichtemittierender Diode Expired - Fee Related DE69331654T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34555392A JPH06169136A (ja) 1992-11-30 1992-11-30 発光装置と光半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
DE69331654D1 true DE69331654D1 (de) 2002-04-11
DE69331654T2 DE69331654T2 (de) 2002-09-12

Family

ID=18377378

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69331654T Expired - Fee Related DE69331654T2 (de) 1992-11-30 1993-11-29 Vorrichtung mit lichtemittierender Diode

Country Status (4)

Country Link
US (1) US5438586A (de)
EP (1) EP0600426B1 (de)
JP (1) JPH06169136A (de)
DE (1) DE69331654T2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3379814B2 (ja) * 1993-11-19 2003-02-24 オリンパス光学工業株式会社 光ヘッド
JP3438365B2 (ja) * 1994-11-29 2003-08-18 ソニー株式会社 複合光学装置およびその製造方法
US5661645A (en) 1996-06-27 1997-08-26 Hochstein; Peter A. Power supply for light emitting diode array
DE19640421A1 (de) * 1996-09-30 1998-04-23 Siemens Ag Optoelektronisches Modul zur bidirektionalen optischen Datenübertragung
US6097521A (en) * 1997-09-26 2000-08-01 Siemens Aktiengesellschaft Optoelectronic module for bidirectional optical data transmission
EP0934672B1 (de) 1996-10-23 2004-07-21 Siemens Aktiengesellschaft Verfahren zum ortsabhängigen anmelden eines mobilen endgerätes
US6150771A (en) * 1997-06-11 2000-11-21 Precision Solar Controls Inc. Circuit for interfacing between a conventional traffic signal conflict monitor and light emitting diodes replacing a conventional incandescent bulb in the signal
US6577658B1 (en) 1999-09-20 2003-06-10 E20 Corporation, Inc. Method and apparatus for planar index guided vertical cavity surface emitting lasers
US6366350B1 (en) * 2000-08-22 2002-04-02 Rockwell Collins, Inc. Apparatus for transmitting light source to a light detector
AUPR245601A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM09)
JP4778627B2 (ja) * 2001-04-04 2011-09-21 シチズンファインテックミヨタ株式会社 レーザダイオード用サブマウント及びその製造方法
JP2003132567A (ja) * 2001-10-23 2003-05-09 Funai Electric Co Ltd 光ディスク装置
US6975465B1 (en) * 2002-04-03 2005-12-13 University Of Central Florida Research Foundation, Inc. Method and apparatus for use of beam control prisms with diode laser arrays
US7248800B2 (en) 2003-05-30 2007-07-24 Canon Kabushiki Kaisha Optical receiver, optical transmitter and optical transceiver
DE10330945A1 (de) * 2003-07-08 2005-02-03 Deutsche Thomson-Brandt Gmbh Optischer Abtaster mit Mikrooptik zur Strahlkombination
EP1624541A1 (de) * 2004-08-06 2006-02-08 Arima Optoelectronics Corporation Diodenlaservorrichtung
JP2006351867A (ja) * 2005-06-16 2006-12-28 Sharp Corp 半導体レーザ装置
US9570648B2 (en) 2012-06-15 2017-02-14 Intersil Americas LLC Wafer level optical proximity sensors and systems including wafer level optical proximity sensors
JP2016134532A (ja) * 2015-01-20 2016-07-25 新日本無線株式会社 反射型センサ装置及びその製造方法
US9721837B2 (en) * 2015-04-16 2017-08-01 Intersil Americas LLC Wafer level optoelectronic device packages with crosstalk barriers and methods for making the same
JP2019016615A (ja) * 2015-12-01 2019-01-31 シャープ株式会社 光センサおよびそれを備えた電子機器
JP7032658B2 (ja) * 2018-10-10 2022-03-09 日亜化学工業株式会社 光学部品、その製造方法、及び、発光装置
JPWO2021033391A1 (de) * 2019-08-16 2021-02-25
US11616339B2 (en) 2019-12-02 2023-03-28 Nichia Corporation Light source device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4182977A (en) * 1978-06-01 1980-01-08 Trw Inc. Constant output light emitting device
JPS57149780A (en) * 1981-02-19 1982-09-16 Mitsubishi Electric Corp Photo transmission circuit and photo semiconductor
JPS6086887A (ja) * 1983-10-19 1985-05-16 Matsushita Electric Ind Co Ltd 半導体レ−ザ装置
JPS6171681A (ja) * 1984-09-17 1986-04-12 Sharp Corp 受光素子付き発光装置
JPS61219186A (ja) * 1985-03-25 1986-09-29 Toshiba Corp 発光装置
CA1258906A (en) * 1985-04-22 1989-08-29 Hiroshi Oinoue Semiconductor laser apparatus for optical head
JPS61292389A (ja) * 1985-06-19 1986-12-23 Fujitsu Ltd 半導体発光装置
JPS62126376A (ja) * 1985-11-28 1987-06-08 Toshiba Corp 反射型光結合素子
JPS62140488A (ja) * 1985-12-13 1987-06-24 Sharp Corp 半導体レ−ザ装置
JPH0728085B2 (ja) * 1986-02-24 1995-03-29 ソニー株式会社 半導体レ−ザ装置
JPH0810496B2 (ja) * 1986-11-17 1996-01-31 ソニー株式会社 光学ヘツドの製造方法
JPH0728092B2 (ja) * 1987-02-20 1995-03-29 三洋電機株式会社 半導体レ−ザ装置
JPH0263182A (ja) * 1988-08-29 1990-03-02 Mitsubishi Electric Corp 半導体レーザ装置
JPH02106989A (ja) * 1988-10-17 1990-04-19 Mitsubishi Electric Corp 半導体レーザ装置
JPH03192783A (ja) * 1989-12-21 1991-08-22 Mitsubishi Electric Corp 半導体レーザ装置
SU1748188A1 (ru) * 1990-10-03 1992-07-15 Военная академия им.Ф.Э.Дзержинского Способ записи и воспроизведени информации
JPH04162222A (ja) * 1990-10-26 1992-06-05 Olympus Optical Co Ltd 光ピックアップヘッド
JPH04199890A (ja) * 1990-11-29 1992-07-21 Mitsubishi Electric Corp 半導体レーザ装置

Also Published As

Publication number Publication date
EP0600426A2 (de) 1994-06-08
EP0600426B1 (de) 2002-03-06
JPH06169136A (ja) 1994-06-14
EP0600426A3 (de) 1995-12-13
DE69331654T2 (de) 2002-09-12
US5438586A (en) 1995-08-01

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee