DE60215841D1 - Flussmittelzusammensetzung für lot, lötpaste und lötverfahren - Google Patents

Flussmittelzusammensetzung für lot, lötpaste und lötverfahren

Info

Publication number
DE60215841D1
DE60215841D1 DE60215841T DE60215841T DE60215841D1 DE 60215841 D1 DE60215841 D1 DE 60215841D1 DE 60215841 T DE60215841 T DE 60215841T DE 60215841 T DE60215841 T DE 60215841T DE 60215841 D1 DE60215841 D1 DE 60215841D1
Authority
DE
Germany
Prior art keywords
lot
solder paste
fluid composition
soldering process
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60215841T
Other languages
English (en)
Other versions
DE60215841T2 (de
Inventor
Shun Saito
Katsumi Nakasato
Yukihiro Kato
Isao Nakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NOF Corp
Original Assignee
NOF Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NOF Corp filed Critical NOF Corp
Application granted granted Critical
Publication of DE60215841D1 publication Critical patent/DE60215841D1/de
Publication of DE60215841T2 publication Critical patent/DE60215841T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE60215841T 2001-09-26 2002-09-26 Flussmittelzusammensetzung für löt, lötpaste und lötverfahren Expired - Lifetime DE60215841T2 (de)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2001295165 2001-09-26
JP2001295165 2001-09-26
JP2002016302 2002-01-25
JP2002016301 2002-01-25
JP2002016302 2002-01-25
JP2002016301 2002-01-25
JP2002097483 2002-03-29
JP2002097483 2002-03-29
JP2002093702 2002-03-29
JP2002093702 2002-03-29
PCT/JP2002/009946 WO2003026835A1 (fr) 2001-09-26 2002-09-26 Composition de flux pour brasure, pate a braser, et procede de brasage

Publications (2)

Publication Number Publication Date
DE60215841D1 true DE60215841D1 (de) 2006-12-14
DE60215841T2 DE60215841T2 (de) 2007-05-16

Family

ID=27532011

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60215841T Expired - Lifetime DE60215841T2 (de) 2001-09-26 2002-09-26 Flussmittelzusammensetzung für löt, lötpaste und lötverfahren

Country Status (8)

Country Link
US (2) US20040250919A1 (de)
EP (1) EP1439025B1 (de)
JP (1) JP4192784B2 (de)
KR (1) KR100901149B1 (de)
CN (1) CN1276817C (de)
DE (1) DE60215841T2 (de)
TW (1) TWI228132B (de)
WO (1) WO2003026835A1 (de)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7182241B2 (en) * 2002-08-09 2007-02-27 Micron Technology, Inc. Multi-functional solder and articles made therewith, such as microelectronic components
JP2004214657A (ja) * 2003-01-07 2004-07-29 Internatl Business Mach Corp <Ibm> プリント回路板製造用水溶性保護ペースト
JP3797990B2 (ja) * 2003-08-08 2006-07-19 株式会社東芝 熱硬化性フラックス及びはんだペースト
WO2005091354A1 (ja) * 2004-03-22 2005-09-29 Tamura Corporation はんだ組成物及びこれを用いたバンプ形成方法
US7331500B2 (en) * 2004-06-25 2008-02-19 Intel Corporation Solder bumps formation using solder paste with shape retaining attribute
EP1786592A2 (de) * 2004-08-25 2007-05-23 Matsushita Electric Industrial Co., Ltd. Lötzusammensetzung, verbindungsverfahren mit lötmittel und verbindungsstruktur mit lötmittel
US7331503B2 (en) * 2004-10-29 2008-02-19 Intel Corporation Solder printing process to reduce void formation in a microvia
TW200633810A (en) * 2004-12-28 2006-10-01 Arakawa Chem Ind Lead-free solder flux and solder paste
TWI303854B (en) * 2005-03-23 2008-12-01 Siliconware Precision Industries Co Ltd Flip-chip semiconductor package and method for fabricating the same
JP4576270B2 (ja) * 2005-03-29 2010-11-04 昭和電工株式会社 ハンダ回路基板の製造方法
WO2007007865A1 (en) * 2005-07-11 2007-01-18 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
US20070023910A1 (en) * 2005-07-29 2007-02-01 Texas Instruments Incorporated Dual BGA alloy structure for improved board-level reliability performance
US20090041990A1 (en) * 2005-09-09 2009-02-12 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
US20080039542A1 (en) * 2006-08-11 2008-02-14 General Electric Company Composition and associated method
US20080039608A1 (en) * 2006-08-11 2008-02-14 General Electric Company Oxetane composition, associated method and article
US20080121845A1 (en) * 2006-08-11 2008-05-29 General Electric Company Oxetane composition, associated method and article
US20080039560A1 (en) * 2006-08-11 2008-02-14 General Electric Company Syneretic composition, associated method and article
JP2008062239A (ja) * 2006-09-04 2008-03-21 Harima Chem Inc はんだ付け用フラックスおよびはんだペースト組成物
JP2008062253A (ja) * 2006-09-05 2008-03-21 Denso Corp はんだ付け用フラックスおよびはんだペースト組成物
ES2614238T3 (es) 2006-12-12 2017-05-30 Senju Metal Industry Co., Ltd. Fundente para soldadura exenta de plomo
CN101784365B (zh) * 2007-11-27 2012-09-05 播磨化成株式会社 钎焊用焊剂、钎焊膏组合物及钎焊方法
CN101784366A (zh) * 2007-11-27 2010-07-21 播磨化成株式会社 钎焊用焊剂及钎焊膏组合物
JP5200662B2 (ja) * 2008-05-27 2013-06-05 藤倉化成株式会社 導電性接着剤および電子部品
JP2009302413A (ja) * 2008-06-16 2009-12-24 Sumitomo Electric Device Innovations Inc 電子装置及びその製造方法
KR100977163B1 (ko) * 2009-03-23 2010-08-20 덕산하이메탈(주) 솔더 접착제와 그 제조 방법 및 이를 포함하는 전자 장치
US8877697B2 (en) * 2009-09-03 2014-11-04 Arakawa Chemical Industries, Ltd. Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux
JP2011104638A (ja) * 2009-11-19 2011-06-02 Jsr Corp 水溶性フラックス、導電性ペーストおよび接合部品
TWI500467B (zh) * 2010-01-08 2015-09-21 Arakawa Chem Ind 無鉛焊劑用助熔劑組成物及無鉛焊劑膏
US9073153B2 (en) 2010-02-09 2015-07-07 Nordson Corporation Flux and solder material and method of making same
JP5482605B2 (ja) * 2010-09-27 2014-05-07 パナソニック株式会社 電子部品実装方法
JP5645592B2 (ja) 2010-10-21 2014-12-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8070046B1 (en) 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Amine flux composition and method of soldering
US8070047B1 (en) 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
US8070045B1 (en) 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable amine flux composition and method of soldering
US8070044B1 (en) 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Polyamine flux composition and method of soldering
US8070043B1 (en) 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US9815149B2 (en) 2011-02-25 2017-11-14 International Business Machines Corporation Flux composition and techniques for use thereof
US9579738B2 (en) 2011-02-25 2017-02-28 International Business Machines Corporation Flux composition and techniques for use thereof
MX345936B (es) * 2011-03-02 2017-02-27 Senju Metal Industry Co Fundente.
JP5415479B2 (ja) * 2011-05-25 2014-02-12 ハリマ化成株式会社 はんだペースト用フラックスおよびはんだペースト組成物
ES2820427T3 (es) * 2011-07-04 2021-04-21 Saint Gobain Procedimiento para la fabricación de una luna con un elemento de conexión eléctrico
JP2013048031A (ja) * 2011-08-29 2013-03-07 Shinko Electric Ind Co Ltd スプリング端子付き基板及びその製造方法
US8430294B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Amine, carboxylic acid flux composition and method of soldering
US8434666B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
US8434667B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Polyamine, carboxylic acid flux composition and method of soldering
US8430293B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable amine, carboxylic acid flux composition and method of soldering
US8430295B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US10784221B2 (en) * 2011-12-06 2020-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Method of processing solder bump by vacuum annealing
US9950393B2 (en) * 2011-12-23 2018-04-24 Intel Corporation Hybrid low metal loading flux
KR102018293B1 (ko) * 2012-01-31 2019-09-06 삼성전자주식회사 솔더 범프 형성용 플럭스 조성물 및 이를 이용한 반도체 장치의 제조 방법
WO2013153674A1 (ja) * 2012-04-14 2013-10-17 株式会社谷黒組 はんだ付け装置及び方法並びに製造された基板及び電子部品
JP2013224362A (ja) * 2012-04-20 2013-10-31 Nitto Denko Corp 接合シート、電子部品およびそれらの製造方法
CN102699569A (zh) * 2012-06-18 2012-10-03 北京有色金属研究总院 一种核工业用高温镍基膏状钎焊料及其制备方法
WO2014099614A1 (en) * 2012-12-17 2014-06-26 Promerus, Llc Thermally decomposable polymer composition for forming microelectric assemblies
JP5935947B2 (ja) * 2013-08-06 2016-06-15 千住金属工業株式会社 導電性接合剤およびはんだ継手
US9802275B2 (en) * 2013-12-31 2017-10-31 Alpha Assembly Solutions Inc. Rosin-free thermosetting flux formulations
CN104148821A (zh) * 2014-07-01 2014-11-19 宁国新博能电子有限公司 一种焊锡膏
CN104889605B (zh) * 2015-06-18 2017-09-01 山东大学 一种钎焊镁及镁合金用的钎剂及其应用
KR20190051893A (ko) * 2016-09-09 2019-05-15 세키스이가가쿠 고교가부시키가이샤 도전 재료, 접속 구조체 및 접속 구조체의 제조 방법
JP6566095B2 (ja) * 2017-07-28 2019-08-28 三菱マテリアル株式会社 はんだペースト用フラックス、はんだペースト、はんだペーストを用いたはんだバンプの形成方法及び接合体の製造方法
JP7176524B2 (ja) * 2017-09-28 2022-11-22 日本ゼオン株式会社 樹脂組成物及び樹脂膜
JP7217532B2 (ja) * 2017-11-14 2023-02-03 株式会社弘輝 補強用樹脂組成物及び電子部品装置
EP3805327A4 (de) * 2018-06-01 2022-01-05 Mitsubishi Chemical Corporation Nicht faulende farbzusammensetzung
CN108994485B (zh) * 2018-10-26 2021-01-05 众潮电科(深圳)有限公司 一种助焊剂及其制备方法
JP6764123B1 (ja) * 2019-10-04 2020-09-30 千住金属工業株式会社 ソルダペースト
JP2021194831A (ja) * 2020-06-12 2021-12-27 Ckd株式会社 スクリーンマスク検査方法及びスクリーンマスク検査装置
CN112605483B (zh) * 2020-11-21 2022-07-26 苏州柯仕达电子材料有限公司 一种电子封装用抗飞溅锡丝及其制备方法
JP7054035B1 (ja) * 2021-06-09 2022-04-13 千住金属工業株式会社 フラックス及びソルダペースト
CN113878260B (zh) * 2021-09-29 2022-10-18 江西小山新材料科技有限公司 一种水洗高铅焊锡膏及其制备方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4140554A (en) 1977-09-30 1979-02-20 Chevron Research Company Water-rinsable soldering fluid containing a polyamide dispersant
US4278479A (en) 1980-06-18 1981-07-14 Hughes Aircraft Company Organic acid activated liquid solder flux
GB8628916D0 (en) 1986-12-03 1987-01-07 Multicore Solders Ltd Solder composition
EP0345485A1 (de) 1988-06-08 1989-12-13 International Business Machines Corporation Weichlötpaste zum Verwenden in einer Reduktionsgasatmosphäre
JPH02290693A (ja) 1989-04-27 1990-11-30 Matsushita Electric Ind Co Ltd はんだペーストおよびそれを用いた印刷配線板のはんだ付け方法
US5064481A (en) 1990-05-17 1991-11-12 Motorola, Inc. Use or organic acids in low residue solder pastes
JPH05212584A (ja) * 1992-01-31 1993-08-24 Senju Metal Ind Co Ltd ソルダーペースト
JPH07164183A (ja) * 1993-12-17 1995-06-27 Nippon Genma:Kk フラックス組成物
US5417771A (en) 1994-02-16 1995-05-23 Takeda Chemical Industries, Ltd. Soldering flux
EP0774476A4 (de) * 1995-06-06 2002-01-16 Nof Corp Wärmehärtende zusammensetzung, verfahren zum endlackieren und damit beschichtete gegenstände
JP2718007B2 (ja) * 1995-06-06 1998-02-25 太陽インキ製造株式会社 アルカリ現像可能な一液型フォトソルダーレジスト組成物及びそれを用いたプリント配線板の製造方法
DE69621423T2 (de) * 1995-10-13 2002-10-10 Nof Corp Hitzehärtbare zusammensetzung, verfahren zum endlackieren und beschichtete gegenstände
JP3254572B2 (ja) * 1996-06-28 2002-02-12 バンティコ株式会社 光重合性熱硬化性樹脂組成物
US5820697A (en) 1997-04-18 1998-10-13 International Business Machines Corporation Fluorescent water soluble solder flux
JP3796669B2 (ja) * 1997-05-06 2006-07-12 日本アルミット株式会社 はんだ付用フラックス
US6214956B1 (en) 1997-10-02 2001-04-10 Isp Investments Inc. Solvent-free copolymers of maleic anhydride and alkyl vinyl ethers having a specific viscosity of 0.5 to 5 and method of making
US6059894A (en) 1998-04-08 2000-05-09 Hewlett-Packard Company High temperature flip chip joining flux that obviates the cleaning process
JP3750359B2 (ja) * 1998-07-24 2006-03-01 千住金属工業株式会社 はんだ付け用水溶性フラックス
KR100373962B1 (ko) * 1998-12-28 2003-02-26 니혼유시 가부시기가이샤 폴리헤미아세탈에스테르수지를 함유하는 열경화성 조성물 및 분체형 열경화성 조성물
US6211320B1 (en) * 1999-07-28 2001-04-03 Dexter Corporation Low viscosity acrylate monomers formulations containing same and uses therefor
ATE302666T1 (de) 1999-12-03 2005-09-15 Frys Metals Inc Dba Alpha Metals Inc Weichlotflussmittel
KR100634341B1 (ko) * 2000-02-14 2006-10-16 타이요 잉크 메뉴펙츄어링 컴퍼니, 리미티드 윤기를 없앤 피막 형성용 광경화성·열경화성 조성물
JP3816714B2 (ja) 2000-02-29 2006-08-30 Ｔｄｋ株式会社 熱硬化性フラックスおよびはんだ付け方法、ならびに電子部品搭載基板
US6667194B1 (en) * 2000-10-04 2003-12-23 Henkel Loctite Corporation Method of bonding die chip with underfill fluxing composition
TW574739B (en) * 2001-02-14 2004-02-01 Nitto Denko Corp Thermosetting resin composition and semiconductor device using the same
JP4202680B2 (ja) 2001-06-15 2008-12-24 日油株式会社 カラーフィルター用インクジェットインク組成物、インク組成物製造方法、及び、カラーフィルター製造方法
US7009009B1 (en) * 2001-10-09 2006-03-07 Henkel Corporation Fluxing underfill compositions
BR0214764B1 (pt) * 2001-12-06 2012-09-04 composição de resina e seu uso, circuito impresso e unidade de acondicionamento.
MY139328A (en) * 2002-05-20 2009-09-30 Nitto Denko Corp Thermosetting resin composition and semiconductor device obtained with the same
JP4010894B2 (ja) 2002-07-11 2007-11-21 横浜ゴム株式会社 空気入りタイヤ
US20040052748A1 (en) * 2002-09-06 2004-03-18 Vondruska Brian Jay Compositions of anionic polymeric rheology modifiers and cationic materials
US7059512B2 (en) 2002-11-06 2006-06-13 Ricoh Company, Ltd. Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductor device
GB0414847D0 (en) * 2004-07-02 2004-08-04 Avecia Ltd Process
US20060272747A1 (en) * 2005-06-03 2006-12-07 Renyi Wang Fluxing compositions
DE102005027567A1 (de) * 2005-06-14 2006-12-21 Basf Ag Verfahren zum Passivieren von metallischen Oberflächen mit Säuregruppen aufweisenden Polymeren
US20070095432A1 (en) * 2005-11-02 2007-05-03 National Starch And Chemical Investment Holding Corporation Fluxing compositions containing benzotriazoles

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TWI228132B (en) 2005-02-21
KR100901149B1 (ko) 2009-06-04
EP1439025B1 (de) 2006-11-02
CN1276817C (zh) 2006-09-27
JPWO2003026835A1 (ja) 2005-01-06
US7575150B2 (en) 2009-08-18
DE60215841T2 (de) 2007-05-16
EP1439025A1 (de) 2004-07-21
JP4192784B2 (ja) 2008-12-10
WO2003026835A1 (fr) 2003-04-03
EP1439025A4 (de) 2005-01-05
US20080073414A1 (en) 2008-03-27
CN1556738A (zh) 2004-12-22
US20040250919A1 (en) 2004-12-16
KR20040033034A (ko) 2004-04-17

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