DE60239180D1 - Weichlötpaste - Google Patents
WeichlötpasteInfo
- Publication number
- DE60239180D1 DE60239180D1 DE60239180T DE60239180T DE60239180D1 DE 60239180 D1 DE60239180 D1 DE 60239180D1 DE 60239180 T DE60239180 T DE 60239180T DE 60239180 T DE60239180 T DE 60239180T DE 60239180 D1 DE60239180 D1 DE 60239180D1
- Authority
- DE
- Germany
- Prior art keywords
- soldering paste
- soldering
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001374752A JP3788335B2 (ja) | 2001-12-07 | 2001-12-07 | ソルダペースト |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60239180D1 true DE60239180D1 (de) | 2011-03-31 |
Family
ID=19183268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60239180T Expired - Lifetime DE60239180D1 (de) | 2001-12-07 | 2002-12-04 | Weichlötpaste |
Country Status (6)
Country | Link |
---|---|
US (1) | US6736907B2 (de) |
EP (1) | EP1317991B1 (de) |
JP (1) | JP3788335B2 (de) |
CN (1) | CN1267243C (de) |
DE (1) | DE60239180D1 (de) |
MY (1) | MY135124A (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3702418B2 (ja) * | 2002-03-07 | 2005-10-05 | 株式会社 東京第一商興 | ソルダペースト用フラックス及びソルダペースト |
JP3797990B2 (ja) * | 2003-08-08 | 2006-07-19 | 株式会社東芝 | 熱硬化性フラックス及びはんだペースト |
FR2864419B1 (fr) * | 2003-12-19 | 2006-04-28 | Hispano Suiza Sa | Procede pour braser un composant electronique sur une carte electronique, procede de reparation de la carte et installation pour la mise en oeuvre du procede |
US7167375B2 (en) * | 2004-01-16 | 2007-01-23 | Motorola, Inc. | Populated printed wiring board and method of manufacture |
JP4200325B2 (ja) * | 2004-11-04 | 2008-12-24 | パナソニック株式会社 | 半田接合用ペーストおよび半田接合方法 |
CN100445017C (zh) * | 2005-12-28 | 2008-12-24 | 梁树华 | 无铅焊锡膏及其制备方法 |
JP5468199B2 (ja) * | 2006-11-22 | 2014-04-09 | 日立化成株式会社 | 導電性接着剤組成物、電子部品搭載基板及び半導体装置 |
CN100455400C (zh) * | 2007-01-16 | 2009-01-28 | 大连理工大学 | 一种SnZn系无铅钎料用助焊剂及其制备方法 |
CN102131760B (zh) * | 2008-08-19 | 2014-03-19 | 可乐丽股份有限公司 | 金属配合物及其制造方法 |
CN101733588B (zh) * | 2010-01-08 | 2012-11-21 | 四川大学 | 电子工业用无铅无卤锡膏 |
EP2548678B1 (de) * | 2010-03-15 | 2018-07-11 | DOWA Electronics Materials Co., Ltd. | Bindematerial und binderverfahren damit |
JP5756933B2 (ja) * | 2010-09-29 | 2015-07-29 | 株式会社弘輝 | フラックス |
CN102240866B (zh) * | 2011-05-19 | 2013-03-27 | 哈尔滨工业大学 | 一种硼酸铝晶须增强低温无铅复合焊膏及其制备方法 |
CN102489899B (zh) * | 2011-12-16 | 2013-07-31 | 昆山成利焊锡制造有限公司 | 无铅助焊膏及其制备方法 |
KR101487654B1 (ko) * | 2012-04-05 | 2015-01-28 | 센주긴조쿠고교 가부시키가이샤 | 플럭스 및 솔더 페이스트 |
JP2015010214A (ja) * | 2013-07-01 | 2015-01-19 | 株式会社タムラ製作所 | はんだ組成物および熱硬化性樹脂組成物 |
CN105451929B (zh) * | 2013-08-12 | 2017-06-13 | 千住金属工业株式会社 | 助焊剂、焊膏和钎焊接头 |
US9431317B2 (en) * | 2013-11-07 | 2016-08-30 | Cisco Technology, Inc. | Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package |
JP5790862B1 (ja) | 2014-12-25 | 2015-10-07 | 千住金属工業株式会社 | やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ及びフラックスコートはんだ |
JP6383768B2 (ja) * | 2015-09-30 | 2018-08-29 | 株式会社タムラ製作所 | はんだ組成物および電子基板の製造方法 |
CN105921904A (zh) * | 2016-06-16 | 2016-09-07 | 深圳市唯特偶新材料股份有限公司 | 一种免清洗精密印刷手机专用无铅锡膏 |
CN107891232B (zh) * | 2017-12-06 | 2020-03-17 | 江苏广昇新材料有限公司 | 一种无铅无卤助焊膏及其制备方法 |
JP6439893B1 (ja) * | 2018-05-25 | 2018-12-19 | 千住金属工業株式会社 | ハンダボール、ハンダ継手および接合方法 |
WO2020083529A1 (en) * | 2018-10-24 | 2020-04-30 | Alpha Assembly Solutions Inc. | Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications |
CN110026710A (zh) * | 2019-04-02 | 2019-07-19 | 柳州光华科技有限公司 | 一种无铅焊锡材料的制备方法 |
EP3954794B1 (de) * | 2019-04-09 | 2024-07-31 | Ishikawa Technology Laboratory Co., Ltd. | Verfahren zur herstellung eines lötprodukts |
EP3834980B1 (de) * | 2019-12-10 | 2023-02-22 | Heraeus Deutschland GmbH & Co. KG | Lotpaste |
KR102489828B1 (ko) * | 2022-08-12 | 2023-01-18 | 오컴퍼니 주식회사 | 솔더 입자에 활성도막을 형성하는 방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3379679B2 (ja) * | 1996-06-10 | 2003-02-24 | 千住金属工業株式会社 | ソルダペースト |
US6059894A (en) * | 1998-04-08 | 2000-05-09 | Hewlett-Packard Company | High temperature flip chip joining flux that obviates the cleaning process |
US6440228B1 (en) * | 2000-02-04 | 2002-08-27 | Senju Metal Industry Co., Ltd. | Lead-free zinc-containing solder paste |
-
2001
- 2001-12-07 JP JP2001374752A patent/JP3788335B2/ja not_active Expired - Lifetime
-
2002
- 2002-12-03 US US10/308,167 patent/US6736907B2/en not_active Expired - Lifetime
- 2002-12-04 EP EP02292989A patent/EP1317991B1/de not_active Expired - Lifetime
- 2002-12-04 DE DE60239180T patent/DE60239180D1/de not_active Expired - Lifetime
- 2002-12-04 MY MYPI20024573A patent/MY135124A/en unknown
- 2002-12-06 CN CNB021545278A patent/CN1267243C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1317991A3 (de) | 2005-01-05 |
JP3788335B2 (ja) | 2006-06-21 |
EP1317991A2 (de) | 2003-06-11 |
US6736907B2 (en) | 2004-05-18 |
MY135124A (en) | 2008-02-29 |
US20030121564A1 (en) | 2003-07-03 |
CN1422723A (zh) | 2003-06-11 |
CN1267243C (zh) | 2006-08-02 |
EP1317991B1 (de) | 2011-02-16 |
JP2003170294A (ja) | 2003-06-17 |
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