DE60230441D1 - Ag-ZUSAMMENSETZUNGSPASTE - Google Patents
Ag-ZUSAMMENSETZUNGSPASTEInfo
- Publication number
- DE60230441D1 DE60230441D1 DE60230441T DE60230441T DE60230441D1 DE 60230441 D1 DE60230441 D1 DE 60230441D1 DE 60230441 T DE60230441 T DE 60230441T DE 60230441 T DE60230441 T DE 60230441T DE 60230441 D1 DE60230441 D1 DE 60230441D1
- Authority
- DE
- Germany
- Prior art keywords
- paste composition
- paste
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001335675 | 2001-10-31 | ||
JP2002111022A JP4301763B2 (ja) | 2001-10-31 | 2002-04-12 | 銀化合物ペースト |
PCT/JP2002/011394 WO2003038838A1 (fr) | 2001-10-31 | 2002-10-31 | Pate a compose ag |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60230441D1 true DE60230441D1 (de) | 2009-01-29 |
Family
ID=26624268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60230441T Expired - Lifetime DE60230441D1 (de) | 2001-10-31 | 2002-10-31 | Ag-ZUSAMMENSETZUNGSPASTE |
Country Status (6)
Country | Link |
---|---|
US (1) | US6942825B2 (de) |
EP (1) | EP1450376B1 (de) |
JP (1) | JP4301763B2 (de) |
CN (1) | CN1267934C (de) |
DE (1) | DE60230441D1 (de) |
WO (1) | WO2003038838A1 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040226620A1 (en) * | 2002-09-26 | 2004-11-18 | Daniel Therriault | Microcapillary networks |
KR100545288B1 (ko) * | 2003-03-28 | 2006-01-25 | 주식회사 잉크테크 | 유기은 조성물 및 그 제조방법, 그로부터 제조되는 잉크및 그 잉크를 이용한 도전배선 형성 방법 |
US7141617B2 (en) * | 2003-06-17 | 2006-11-28 | The Board Of Trustees Of The University Of Illinois | Directed assembly of three-dimensional structures with micron-scale features |
JP2005109247A (ja) * | 2003-09-30 | 2005-04-21 | Nippon Chemicon Corp | 固体電解コンデンサ及びその製造方法 |
JP3858902B2 (ja) | 2004-03-03 | 2006-12-20 | 住友電気工業株式会社 | 導電性銀ペーストおよびその製造方法 |
JP4538690B2 (ja) * | 2004-05-24 | 2010-09-08 | グンゼ株式会社 | 電磁波シールド材及びその製造方法 |
JP4628718B2 (ja) * | 2004-07-23 | 2011-02-09 | 株式会社フジクラ | 導電性被膜の形成方法 |
JP2006318711A (ja) * | 2005-05-11 | 2006-11-24 | Teikoku Tsushin Kogyo Co Ltd | スイッチ基板及びその製造方法 |
EP1950767B1 (de) * | 2005-09-21 | 2012-08-22 | Nihon Handa Co., Ltd. | Pastenartige silberpartikelzusammensetzung, prozess zur herstellung von festem silber, festes silber, verbindungsverfahren und prozess zum herstellen einer leiterplatte |
DE102007017005B4 (de) | 2006-04-11 | 2009-12-31 | The Yokohama Rubber Co., Ltd. | Elektrisch leitende Zusammensetzung, Verfahren zur Herstellung eines elektrisch leitenden Films |
WO2007135547A2 (en) * | 2006-05-22 | 2007-11-29 | Hormos Medical Ltd. | Selective estrogen receptor modulators or aromatase inhibitors for treating chronic nonbacterial prostatitis |
JP5028890B2 (ja) * | 2006-07-11 | 2012-09-19 | 横浜ゴム株式会社 | 導電性被膜付き基材の製造方法および導電性被膜付き基材 |
WO2008038976A1 (en) * | 2006-09-29 | 2008-04-03 | Lg Chem, Ltd. | Organic silver complex compound used in paste for conductive pattern forming |
US7956102B2 (en) * | 2007-04-09 | 2011-06-07 | The Board Of Trustees Of The University Of Illinois | Sol-gel inks |
DE102007040927A1 (de) | 2007-08-30 | 2009-03-05 | Bayer Materialscience Ag | Verfahren zur Herstellung schlagzähmodifizierter gefüllter Polycarbonat-Zusammensetzungen |
JP4339919B2 (ja) | 2007-10-02 | 2009-10-07 | 横浜ゴム株式会社 | 導電性組成物、導電性被膜の形成方法および導電性被膜 |
CN101903959B (zh) | 2007-12-18 | 2013-01-23 | 日立化成工业株式会社 | 铜导体膜及其制造方法、导电性基板及其制造方法、铜导体布线及其制造方法、以及处理液 |
US8968608B2 (en) * | 2008-01-17 | 2015-03-03 | Nichia Corporation | Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device |
WO2009107721A1 (ja) * | 2008-02-29 | 2009-09-03 | 東洋製罐株式会社 | 金属超微粒子形成用脂肪酸金属塩 |
US7922939B2 (en) * | 2008-10-03 | 2011-04-12 | The Board Of Trustees Of The University Of Illinois | Metal nanoparticle inks |
US8187500B2 (en) * | 2008-10-17 | 2012-05-29 | The Board Of Trustees Of The University Of Illinois | Biphasic inks |
JP5611537B2 (ja) * | 2009-04-28 | 2014-10-22 | 日立化成株式会社 | 導電性接合材料、それを用いた接合方法、並びにそれによって接合された半導体装置 |
JP4983869B2 (ja) * | 2009-07-14 | 2012-07-25 | 日本ケミコン株式会社 | 固体電解コンデンサ及びその製造方法 |
JP5327069B2 (ja) * | 2010-01-15 | 2013-10-30 | 横浜ゴム株式会社 | 太陽電池電極用ペーストおよび太陽電池セル |
EA025002B1 (ru) | 2010-07-07 | 2016-11-30 | Сэн-Гобэн Гласс Франс | Композитное оконное стекло с электрически нагреваемым покрытием |
EP2405708A1 (de) | 2010-07-07 | 2012-01-11 | Saint-Gobain Glass France | Transparente Scheibe mit heizbarer Beschichtung |
DE102010042702A1 (de) * | 2010-10-20 | 2012-04-26 | Robert Bosch Gmbh | Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung |
US9198288B2 (en) | 2013-05-15 | 2015-11-24 | Xerox Corporation | Method of making silver carboxylates for conductive ink |
US9283618B2 (en) | 2013-05-15 | 2016-03-15 | Xerox Corporation | Conductive pastes containing silver carboxylates |
US10711526B2 (en) | 2017-02-01 | 2020-07-14 | Baker Hughes, A Ge Company, Llc | Methods for forming or servicing a wellbore, and methods of coating surfaces of tools |
CN112712913A (zh) * | 2020-12-15 | 2021-04-27 | 陕西彩虹新材料有限公司 | 一种电子元器件用的氧化银浆料以及制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6146084A (ja) | 1984-08-10 | 1986-03-06 | Nippon Telegr & Teleph Corp <Ntt> | 光増幅器 |
JPS61203502A (ja) * | 1985-03-06 | 1986-09-09 | 同和鉱業株式会社 | 導電ペ−スト |
JPS61203504A (ja) * | 1985-03-06 | 1986-09-09 | 同和鉱業株式会社 | 導電ペ−スト |
JPS63278983A (ja) * | 1987-05-09 | 1988-11-16 | Toyota Autom Loom Works Ltd | 金属有機物インク |
JPH03155004A (ja) | 1989-11-10 | 1991-07-03 | Matsushita Electric Ind Co Ltd | 銀パターン形成組成物及び形成法 |
DE4004707A1 (de) | 1990-02-15 | 1991-08-22 | Thomson Brandt Gmbh | Schaltnetzteil |
JP2965759B2 (ja) * | 1991-08-28 | 1999-10-18 | エヌ・イーケムキャット株式会社 | 導電性薄膜形成用銀ペースト |
JPH05311103A (ja) | 1992-05-12 | 1993-11-22 | Tanaka Kikinzoku Kogyo Kk | 銀導体回路用印刷インキおよび銀導体回路の形成方法 |
JP2003309337A (ja) * | 2002-04-16 | 2003-10-31 | Fujikura Ltd | プリント回路基板 |
-
2002
- 2002-04-12 JP JP2002111022A patent/JP4301763B2/ja not_active Expired - Lifetime
- 2002-10-31 DE DE60230441T patent/DE60230441D1/de not_active Expired - Lifetime
- 2002-10-31 WO PCT/JP2002/011394 patent/WO2003038838A1/ja active Application Filing
- 2002-10-31 US US10/493,999 patent/US6942825B2/en not_active Expired - Lifetime
- 2002-10-31 CN CN02821013.1A patent/CN1267934C/zh not_active Expired - Lifetime
- 2002-10-31 EP EP02778021A patent/EP1450376B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP4301763B2 (ja) | 2009-07-22 |
CN1575497A (zh) | 2005-02-02 |
JP2003203522A (ja) | 2003-07-18 |
CN1267934C (zh) | 2006-08-02 |
EP1450376B1 (de) | 2008-12-17 |
EP1450376A4 (de) | 2007-10-17 |
EP1450376A1 (de) | 2004-08-25 |
US20040248998A1 (en) | 2004-12-09 |
US6942825B2 (en) | 2005-09-13 |
WO2003038838A1 (fr) | 2003-05-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |