DE60232430D1 - Lötvorrichtung - Google Patents

Lötvorrichtung

Info

Publication number
DE60232430D1
DE60232430D1 DE60232430T DE60232430T DE60232430D1 DE 60232430 D1 DE60232430 D1 DE 60232430D1 DE 60232430 T DE60232430 T DE 60232430T DE 60232430 T DE60232430 T DE 60232430T DE 60232430 D1 DE60232430 D1 DE 60232430D1
Authority
DE
Germany
Prior art keywords
soldering device
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60232430T
Other languages
English (en)
Inventor
Rie Aizawa
Hiroyuki Ota
Hiroaki Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE60232430D1 publication Critical patent/DE60232430D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE60232430T 2001-11-12 2002-11-12 Lötvorrichtung Expired - Lifetime DE60232430D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001345753 2001-11-12

Publications (1)

Publication Number Publication Date
DE60232430D1 true DE60232430D1 (de) 2009-07-09

Family

ID=19159040

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60232430T Expired - Lifetime DE60232430D1 (de) 2001-11-12 2002-11-12 Lötvorrichtung

Country Status (3)

Country Link
US (3) US20030102352A1 (de)
EP (1) EP1310317B1 (de)
DE (1) DE60232430D1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60232430D1 (de) * 2001-11-12 2009-07-09 Toshiba Kk Lötvorrichtung
DE102016118789A1 (de) * 2016-10-05 2018-04-05 Ersa Gmbh Lötvorrichtung
CN111128410B (zh) * 2019-12-31 2022-07-26 中国核动力研究设计院 一种热管反应堆系统及其能量转换方式

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3251302A (en) * 1963-09-16 1966-05-17 North American Aviation Inc Helical electromagnetic pump
US3685715A (en) * 1969-06-27 1972-08-22 Louis R F J Perrin Soldering apparatus
GB1325403A (en) * 1970-10-20 1973-08-01 Heberlein & Co Ag Soldering appliance
US3941088A (en) * 1972-10-31 1976-03-02 Csongradmengyei Tanacs Vegyesiparm Szolgaltato Vallalat Standing wave metallizing apparatus for coating a substrate with molten metal
BG29840A1 (en) * 1979-06-28 1981-02-16 Minchev Apparatus for soldering the winding to the collector of electric machines
BG31621A1 (en) * 1980-01-18 1982-02-15 Minchev Apparatus for soldering the winding to the collector of an electrical machines
US4568012A (en) * 1982-01-14 1986-02-04 Toshiba Seiki Co., Ltd. Soldering apparatus
SU1359089A1 (ru) * 1982-06-02 1987-12-15 Институт По Металлознание И Технология На Металите (Инопредприятие) Устройство дл пайки обмотки к коллектору электрических машин
BG38473A1 (en) * 1983-12-09 1985-12-16 Minchev Device for soldering a winding to the collector of the electric machine
US4828459A (en) * 1986-08-28 1989-05-09 The Dow Chemical Company Annular linear induction pump with an externally supported duct
CH690843A5 (de) * 1995-11-07 2001-02-15 Kirsten Kabeltechnik Ag Elektrodynamische Linearmotor-Pumpe für Wellenlötanlagen und Verfahren zu deren Betrieb.
US5981922A (en) * 1996-06-11 1999-11-09 Kabushiki Kaisha Tamura Seisakusho Brazing apparatus having electromagnetic induction pumps for moving a brazing filler metal in contact with a workpiece
JP3704158B2 (ja) * 1996-06-11 2005-10-05 株式会社タムラ製作所 ろう付け装置
DE69712719T2 (de) * 1996-06-11 2002-11-21 Tamura Seisakusho Tokio Tokyo Lötvorrichtung
US6726082B2 (en) * 2001-11-01 2004-04-27 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus
DE60232430D1 (de) * 2001-11-12 2009-07-09 Toshiba Kk Lötvorrichtung

Also Published As

Publication number Publication date
EP1310317A2 (de) 2003-05-14
US20060124692A1 (en) 2006-06-15
EP1310317B1 (de) 2009-05-27
US20040256436A1 (en) 2004-12-23
US20030102352A1 (en) 2003-06-05
EP1310317A3 (de) 2004-08-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition